CN113140352A - Conductive film and manufacturing method thereof - Google Patents
Conductive film and manufacturing method thereof Download PDFInfo
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- CN113140352A CN113140352A CN202010064402.3A CN202010064402A CN113140352A CN 113140352 A CN113140352 A CN 113140352A CN 202010064402 A CN202010064402 A CN 202010064402A CN 113140352 A CN113140352 A CN 113140352A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
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Abstract
A method for manufacturing a conductive film comprises the steps of forming a first adhesive layer on a conductive substrate, manufacturing a plurality of patterned through holes on the first adhesive layer to enable the conductive substrate to be exposed from the through holes, filling conductive materials into the through holes in a metal growth mode to form a patterned conductive layer grown on the conductive substrate, providing a base, forming a second adhesive layer on the base, transferring the conductive layer and the first adhesive layer through the second adhesive layer to enable the conductive layer and the first adhesive layer to be arranged on the second adhesive layer, and removing the conductive substrate. The conductive film manufacturing method of the invention deposits the conductive material on the conductive substrate by adopting the mode of electrodeposition, thereby obtaining the conductive layer with high surface evenness, meeting the performance requirements of electrode products and expanding the application field.
Description
Technical Field
The invention relates to the technical field of conductive films, in particular to a conductive film and a manufacturing method thereof.
Background
With the development of science and technology, more and more terminal devices with touch functions are developed towards flexibility, lightness and thinness. Transparent conductive films have high transmittance and good conductivity, and are widely applied to the field of touch screens, and in recent years, the demand of the transparent conductive films as essential conductive films of touch screens is increasing.
In the manufacture of the transparent conductive film, the embedded metal grid conductive film is usually completed by adopting a mode of 'stamping-scraping and filling conductive materials', a pattern groove is stamped on a curing adhesive layer, then the conductive materials are scraped and filled in the pattern groove, and then the conductive grid is formed by sintering, but in the sintering process, the phenomenon that the reject ratio of the conductive film is increased due to the shrinkage of the substrate size and the like is easily generated, the loss is high, the efficiency is low, the groove is not completely filled due to the volatilization of an organic solvent, the surface of the conductive film is not flat, and further, bubbles are easily generated when the conductive film is bonded with an FPC (flexible printed circuit) through the conductive adhesive, so that the conductive film is not easy to be applied to the conductive electrode due to the flatness problem, and the performance requirements of electrode products are not easy to meet.
Disclosure of Invention
The invention aims to provide a conductive film with high surface flatness and a manufacturing method thereof.
The invention provides a manufacturing method of a conductive film, which comprises the following steps:
providing a conductive substrate, and forming a first glue layer on the conductive substrate;
making a plurality of patterned through holes on the first adhesive layer so that the conductive substrate is exposed from the through holes;
filling a conductive material into the through holes in a metal growth mode to form a patterned conductive layer grown on the conductive substrate;
providing a substrate, and forming a second glue layer on the substrate;
transferring the conductive layer and the first adhesive layer by using the second adhesive layer so that the conductive layer and the first adhesive layer are arranged on the second adhesive layer;
and removing the conductive substrate.
Further, the step of forming a plurality of patterned through holes on the first adhesive layer comprises:
firstly, providing a mould, wherein the surface of the mould is provided with a plurality of bulges, and then stamping the mould on the first adhesive layer to form the first adhesive layer with a plurality of grooves, wherein the grooves correspond to the bulges;
etching the first glue layer with the plurality of grooves to form a plurality of through holes exposing the conductive substrate at the plurality of grooves.
Further, the step of etching the first glue layer with the plurality of grooves to form a plurality of through holes exposing the conductive substrate at the plurality of grooves comprises:
and integrally etching the first adhesive layer with the plurality of grooves by using oxygen reactive ions to convert the first adhesive layer with large thickness into the first adhesive layer with small thickness until a plurality of through holes exposing the conductive substrate are formed at the plurality of grooves.
Further, the step of transferring the conductive layer and the first adhesive layer by the second adhesive layer specifically comprises: the second adhesive layer is coated on the surface of the base in a coating mode, and then the surface, far away from the base, of the second adhesive layer is pressed on the surfaces, far away from the conductive substrate, of the conductive layer and the first adhesive layer.
Further, the conductive substrate is provided with a bottom surface and a top surface which are deviated from each other, the first glue layer and the conductive layer are arranged on the top surface, and the top surface is a plane.
Further, the conductive substrate is glass or a film made of metal or metal oxide material.
The invention also provides a conductive film which is formed by the manufacturing method of the conductive film, the conductive film comprises a substrate, and a second adhesive layer and a first adhesive layer which are sequentially arranged on the substrate, the first adhesive layer is provided with a plurality of through holes for exposing the second adhesive layer, conductive materials are filled in the through holes to form a patterned conductive layer, the conductive layer is provided with a first surface and a second surface which are mutually deviated, the first surface is a surface far away from the second adhesive layer, and the first surface and the surface of the first adhesive layer far away from the second adhesive layer are positioned on the same plane.
Furthermore, the depth of the perforation is 1-30 μm, and the width is 0.5-30 μm.
Further, the conductive material adopts one or more of silver, copper or nickel.
Further, the substrate is made of glass, quartz, polymethyl methacrylate, polycarbonate or polyethylene terephthalate.
According to the manufacturing method of the conductive film, the conductive material is grown on the conductive substrate from the through hole of the first adhesive layer in a metal growth mode to obtain the conductive layer with high surface flatness, then the conductive layer and the first adhesive layer are transferred by utilizing the substrate and the second adhesive layer to transfer the conductive layer and the first adhesive layer onto the second adhesive layer, the conductive substrate is removed, and the conductive film with high surface flatness is further obtained.
Drawings
FIG. 1 is a schematic structural diagram of a conductive film according to an embodiment of the present invention;
fig. 2 a-2 g are schematic flow charts of methods for manufacturing conductive films according to embodiments of the present invention.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
As shown in fig. 1 and fig. 2a to fig. 2g, an embodiment of the present invention provides a method for manufacturing a conductive film, including:
s1: providing a conductive substrate 1, and coating a layer of curing adhesive on the conductive substrate 1 to form a first adhesive layer 2.
S2: a plurality of through holes 20 are patterned on the first glue layer 2, so that the conductive substrate 1 is exposed from the through holes 20.
The step of forming a plurality of patterned through holes 20 in the first glue layer 2 comprises:
providing a mold 3, and then stamping the mold 3 on the first glue layer 2 to form a plurality of grooves 21, wherein the mold 3 has a plurality of protrusions 31 and pattern grooves (not shown) corresponding to the protrusions 31 on the surface thereof, and the cross section of the pattern grooves may be rectangular, trapezoidal or irregular. Pressing down the surface of one side of the mold 3 having a plurality of protrusions 31 and pattern grooves toward the conductive substrate 1, so that the protrusions 31 are pressed on the first adhesive layer 2, thereby forming the first adhesive layer 2 having a plurality of grooves 21, wherein the plurality of grooves 21 correspond to the plurality of protrusions 31 and have the same depth, and forming a conductive circuit pattern corresponding to the pattern grooves, and then curing, wherein the curing manner for the first adhesive layer 2 may be an ultraviolet curing manner or a thermal curing manner, depending on the first adhesive layer 2 using UV glue or thermosetting glue, but not limited thereto.
Further, since the protrusions 31 of the mold 3 are imprinted on the first adhesive layer 2, a residual first adhesive layer 2 may be left between the protrusions 31 of the mold 3 and the conductive substrate 1, which may affect the deposition of the conductive material, so that the residual first adhesive layer 2 needs to be removed. Specifically, the first glue layer 2 having the plurality of grooves 21 is etched, and the bottoms of the grooves 21 are etched to form a plurality of through holes 20 exposing the surface of the conductive substrate 1.
The entire first glue layer 2 may be etched to be thinner using a dry or wet etching process. In this embodiment, the thinning process is an oxygen reactive ion etching process, the directionality is provided in the gas etching process, the first glue layer 2 with the plurality of grooves 21 is etched integrally by the oxygen reactive ions, the first glue layer 2 with large thickness is converted into the first glue layer 2 with small thickness, and the conductive substrate 1 at the bottom of the groove 21 is exposed until the plurality of through holes 20 exposing the conductive substrate 1 are formed at the plurality of grooves 21. The etching process only acts on the polymer and there is no need to worry about damaging the conductive layer 4 on the surface of the conductive substrate 1.
S3: a conductive material is filled into the through holes 20 by means of metal growth to form a patterned conductive layer 4 grown on the conductive substrate 1.
Specifically, the conductive layer 4 has a first surface and a second surface which are away from each other, the surface of the conductive layer 4 grown on the conductive substrate 1 is the first surface, and the first surface of the conductive layer 4 and the surface of the first glue layer 2 on the conductive substrate 1 are in the same plane.
The metal may be grown by electrodeposition, and specifically, the step of filling the conductive material into the through holes 20 by electrodeposition includes: placing the conductive substrate 1 exposed from the through hole 20 in an electroforming deposition tank, placing the conductive substrate 1 at the cathode of the electroforming deposition tank, placing a conductive material in the anode or an electrolyte of the electroforming deposition tank, and depositing a conductive layer 4 in the through hole 20 after electrifying.
Preferably, the conductive substrate 1 has a bottom surface and a top surface which are away from each other, the first glue layer 2 and the conductive layer 4 are arranged on the top surface, and the top surface is a plane, so that the surface flatness of the conductive film is better satisfied.
In this embodiment, the conductive layer 4 formed by metal growth is made of conductive material such as silver, copper or nickel, the height of the conductive layer can be lower than the depth of the groove 21 or higher than the depth of the groove 21 by controlling the concentration of the electrolyte or controlling the magnitude of the current, and the conductive layer 4 at the opening of the groove 21 is aligned with the first glue layer 2 by stamping.
The conductive substrate 1 is made of glass or a thin film made of a metal or metal oxide material. For example, a metal thin film such as copper foil, or a material such as Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO) is used.
S4: providing a substrate 5, and coating a curing adhesive on the substrate 5 to form a second adhesive layer 6.
The substrate 5 is made of glass, quartz, polymethyl methacrylate, polycarbonate or poly-p-phthalic plastic.
S5: the conductive layer 4 and the first glue layer 2 are transferred by means of the second glue layer 6, so that the conductive layer 4 and the first glue layer 2 are transferred onto the second glue layer 6.
The steps of transferring the conductive layer 4 and the first adhesive layer 2 by the second adhesive layer 6 are as follows: the second adhesive layer 6 is coated on the surface of the base 5 by a coating method, and then the surface of the second adhesive layer 6 away from the base 5 is pressed on the surfaces of the conductive layer 4 and the first adhesive layer 2 away from the conductive substrate 1, that is, the second adhesive layer 6 covers the conductive layer 4 and the first adhesive layer 2, and the second surface of the conductive layer 4 and the surface of the first adhesive layer 2 away from the conductive substrate 1 are in the same plane. In other embodiments, the second glue layer 6 may also be directly coated on the surfaces of the conductive layer 4 and the first glue layer 2 away from the conductive substrate 1, and then the substrate 5 is pressed on the surfaces of the second glue layer 6 away from the conductive layer 4 and the first glue layer 2.
Preferably, the first adhesive layer 2 and the second adhesive layer 6 are made of a polymer such as an acrylic system, a siloxane system, etc., and have light transmittance of more than 90%, and the first adhesive layer 2 and the second adhesive layer 6 may be made of the same material or different materials, such as UV glue or thermosetting glue, but not limited thereto.
S6: the conductive substrate 1 is removed.
Specifically, in order not to disturb the conductivity of the conductive line, it is necessary to separate the conductive substrate 1 from the conductive layer 4, and the separation method may be physical peeling or separation by dissolving the conductive substrate 1 with a chemical solvent, for example, etching away the conductive substrate 1 with an etching solution to retain the conductive film.
The embodiment of the invention also provides a conductive film, which is manufactured by the manufacturing method of the conductive film, and comprises a substrate 5, and a second adhesive layer 6 and a first adhesive layer 2 which are sequentially arranged on the substrate 5, wherein the first adhesive layer 2 is provided with a plurality of through holes 20 exposing the second adhesive layer 6, conductive materials are filled in the through holes 20 through electrodeposition so as to form a patterned conductive layer 4, the conductive layer 4 is provided with a first surface and a second surface which are mutually deviated, the first surface is a surface far away from the second adhesive layer 6, and the first surface and the surface of the first adhesive layer 2 far away from the second adhesive layer 6 are in the same plane.
Specifically, the width of the through hole 20 is 0.5 to 30 μm, the depth of the through hole 20 is the same as the thickness of the conductive layer 4, and the depth of the through hole 20 is 1 to 30 μm.
The method for manufacturing the conductive film provided by the invention abandons the existing scraping and filling mode, grows the conductive material on the conductive substrate 1 from the through hole 20 of the first glue layer 2 by adopting a metal growth mode, avoids the condition that the defect rate of the conductive film is increased due to the working procedures such as sintering and the like, optimizes the manufacturing process, greatly improves the yield of the manufacturing process, obtains the conductive layer 4 with high surface evenness by utilizing the adsorption force of the conductive substrate 1 on the conductive material during the metal growth, wherein the surface of the conductive layer 4 deposited on the conductive substrate 1 is the first surface, the first surface of the conductive layer 4 and the surface of the first glue layer 2 positioned on the conductive substrate 1 are positioned on the same plane, then transfers the conductive layer 4 and the first glue layer 2 by utilizing the substrate 5 and the second glue layer 6 to ensure that the conductive layer 4 and the first glue layer 2 are arranged on the second glue layer 6, removes the conductive substrate 1, and further obtains the conductive film with high surface evenness, the performance of the product is improved, the effect of high surface flatness is achieved, the performance requirements of the electrode product are met, and the application field is expanded.
In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the purpose of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.
As used herein, the meaning of "a plurality" or "a plurality" is two or more unless otherwise specified.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A method for manufacturing a conductive film, the method comprising:
providing a conductive substrate, and forming a first glue layer on the conductive substrate;
making a plurality of patterned through holes on the first adhesive layer so that the conductive substrate is exposed from the through holes;
filling a conductive material into the through holes in a metal growth mode to form a patterned conductive layer grown on the conductive substrate;
providing a substrate, and forming a second glue layer on the substrate;
transferring the conductive layer and the first adhesive layer by using the second adhesive layer so that the conductive layer and the first adhesive layer are arranged on the second adhesive layer;
and removing the conductive substrate.
2. The method of claim 1, wherein the step of forming a plurality of patterned through holes in the first adhesive layer comprises:
firstly, providing a mould, wherein the surface of the mould is provided with a plurality of bulges, and then stamping the mould on the first adhesive layer to form the first adhesive layer with a plurality of grooves, wherein the grooves correspond to the bulges;
etching the first glue layer with the plurality of grooves to form a plurality of through holes exposing the conductive substrate at the plurality of grooves.
3. The method of claim 2, wherein the etching the first glue layer having the plurality of recesses to form the plurality of through holes exposing the conductive substrate at the plurality of recesses comprises:
and integrally etching the first adhesive layer with the plurality of grooves by using oxygen reactive ions to convert the first adhesive layer with large thickness into the first adhesive layer with small thickness until a plurality of through holes exposing the conductive substrate are formed at the plurality of grooves.
4. The method for manufacturing the conductive film according to claim 1, wherein the step of transferring the conductive layer and the first adhesive layer by the second adhesive layer specifically comprises: the second adhesive layer is coated on the surface of the base in a coating mode, and then the surface, far away from the base, of the second adhesive layer is pressed on the surfaces, far away from the conductive substrate, of the conductive layer and the first adhesive layer.
5. The method of manufacturing a conductive film according to claim 1, wherein the conductive substrate has a bottom surface and a top surface that are away from each other, the first adhesive layer and the conductive layer are provided on the top surface, and the top surface is a flat surface.
6. The method for manufacturing a conductive film according to claim 1, wherein the conductive substrate is a glass or a thin film made of a metal or a metal oxide material.
7. A conductive film, characterized in that the conductive film is formed by the method of any one of claims 1 to 6, the conductive film includes a substrate, and a second adhesive layer and a first adhesive layer sequentially disposed on the substrate, the first adhesive layer has a plurality of through holes exposing the second adhesive layer, the plurality of through holes are filled with a conductive material to form a patterned conductive layer, the conductive layer has a first surface and a second surface that are away from each other, the first surface is a surface far away from the second adhesive layer, and the first surface and the surface of the first adhesive layer far away from the second adhesive layer are in the same plane.
8. The conductive film according to claim 7, wherein the through-holes have a depth of 1 to 30 μm and a width of 0.5 to 30 μm.
9. The conductive film of claim 7, wherein the conductive material is one or more of silver, copper, or nickel.
10. The conductive film according to claim 7, wherein the substrate is glass, quartz, polymethyl methacrylate, polycarbonate, or polyethylene terephthalate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010064402.3A CN113140352A (en) | 2020-01-20 | 2020-01-20 | Conductive film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010064402.3A CN113140352A (en) | 2020-01-20 | 2020-01-20 | Conductive film and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113140352A true CN113140352A (en) | 2021-07-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010064402.3A Pending CN113140352A (en) | 2020-01-20 | 2020-01-20 | Conductive film and manufacturing method thereof |
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|---|---|
| CN (1) | CN113140352A (en) |
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- 2020-01-20 CN CN202010064402.3A patent/CN113140352A/en active Pending
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Address after: No.68 Xinchang Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Applicant after: Suzhou Weiyeda Technology Co.,Ltd. Applicant after: Weiyeda Technology (Jiangsu) Co.,Ltd. Address before: No.68 Xinchang Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Applicant before: IVTOUCH Co.,Ltd. Applicant before: Weiyeda Technology (Jiangsu) Co.,Ltd. |