CN211293539U

CN211293539U - Anti-corrosion structure for ODF (optical distribution film) process

Info

Publication number: CN211293539U
Application number: CN202020179504.5U
Authority: CN
Inventors: 王欢; 陈海雷; 韦培海; 张泽鹏
Original assignee: Truly Renshou High end Display Technology Ltd
Current assignee: Truly Renshou High end Display Technology Ltd
Priority date: 2020-02-18
Filing date: 2020-02-18
Publication date: 2020-08-18
Anticipated expiration: 2030-02-18

Abstract

The utility model discloses an anti-corrosion structure for ODF process, which comprises a substrate base plate, a first metal layer, an insulating layer, a second metal layer and a protective layer, wherein the first metal layer, the insulating layer, the second metal layer and the protective layer are sequentially formed on the substrate base plate; the first metal layer comprises a plurality of first metal units arranged at intervals; the second metal layer comprises a plurality of second metal units arranged at intervals; the projection of the second metal unit on the substrate base plate is smaller than the projection of the first metal unit on the substrate base plate. Through the arrangement, when the second metal layer is covered on the outermost protective layer from the concave surface, the outermost protective layer can form covering along with the step, because the step is laminated, the height of the protective layer covering the slope surface is reduced, the protective layer of the slope surface cannot become very thin, and the phenomenon of corrosion caused by breakage is not easy to occur.

Description

Anti-corrosion structure for ODF (optical distribution film) process

Technical Field

The utility model relates to a show technical field, especially relate to an anticorrosion structure for ODF technology.

Background

With the continuous development of Display technology, a Thin Film transistor liquid Crystal Display (TFT-LCD) has a dominant position in the field of flat panel Display due to its advantages of small volume, low power consumption, no radiation, and the like.

In the TFT-LCD manufacturing process, the formation of liquid crystal cells is a critical part, and has a significant influence on the display quality of the liquid crystal panel. In the prior art, the formation of a liquid crystal box mainly comprises two processes, one is a vacuum infusion process, which is to attach an array substrate and a color film substrate and then infuse liquid, and then seal the liquid crystal box by using frame glue after the liquid is infused to obtain the liquid crystal box; the other is a liquid crystal dropping process, also called ODF (one drop filling) process, which mainly comprises four parts of liquid crystal dropping, frame glue coating, vacuum attaching and frame glue curing, because ODF has its unique advantages: (1) the liquid crystal display panel is not limited by factors such as the thickness of a box, the property of an oriented film, the size of a panel and the like, and the liquid crystal injection time is greatly shortened; (2) the process steps are reduced, and the Cell process is simplified; (3) the utilization rate of the liquid crystal material is greatly improved; (4) the production can be automated, so that the method is widely popularized and successfully applied to the TFT-LCD industry.

Because the metal wiring of the Array substrate can shield the UV light, the UV light cannot be directly irradiated to the frame glue and is cured, the liquid crystal material is contacted with the frame glue which is not assimilated, ion pollution is generated, and the voltage holding ratio is reduced and the liquid crystal orientation is poor. Therefore, in the ODF process, it is usually necessary to perform grooving on the metal layer in the common electrode metal ring, and perform light transmission for UV illumination and frame glue fixation.

As shown in fig. 1-2, it is a schematic structural diagram of using two metal layers for a common electrode metal ring in the prior art, in the conventional design scheme, the grooves of the two metal layers of the common electrode are designed according to the same shape and size, and the slope surface of the P-point position is very steep and high, when the outermost protective layer is covered by the concave surface, the protective layer is very thin and easy to break at the slope surface because of the slope surface with high height, so that contaminants such as water vapor can permeate into the upper metal layer from the broken position of the protective layer, causing corrosion, and causing abnormal display of the TFT-LCD.

SUMMERY OF THE UTILITY MODEL

In order to solve the defects of the prior art, the utility model provides an anti-corrosion structure for ODF process.

The utility model discloses the technical problem that will solve realizes through following technical scheme:

an anti-corrosion structure for an ODF process comprises a substrate, and a first metal layer, an insulating layer, a second metal layer and a protective layer which are sequentially formed on the substrate; the first metal layer comprises a plurality of first metal units arranged at intervals; the second metal layer comprises a plurality of second metal units arranged at intervals; the projection of the second metal unit on the substrate base plate is smaller than the projection of the first metal unit on the substrate base plate.

Further, the first metal layer is formed on the substrate base plate; the insulating layer is formed on the substrate base plate and covers the first metal layer; the second metal layer is formed on the insulating layer; the protective layer is formed on the second metal layer and covers the insulating layer.

Further, the first metal layer comprises at least two first metal units arranged at intervals; the second metal layer comprises at least two second metal units arranged at intervals; the second metal unit is arranged above the corresponding area of the first metal unit.

Further, the first metal units are arranged at equal intervals, and the second metal units are arranged at equal intervals.

Further, the insulating layer is G-SiN_xAnd (3) a membrane.

Further, the protective layer is P-SiN_xAnd (3) a membrane.

Further, the substrate base plate is a glass base plate.

The utility model discloses following beneficial effect has:

the utility model discloses in, the second metal unit is in projection on the substrate base plate is less than first metal unit is in projection on the substrate base plate, through this kind of setting for when the concave surface covers the second metal level, can cover along with the ladder formation from outermost protective layer, because the ladder stromatolite, the protective layer covers the high reduction at the slope, and the protective layer of slope can not become very thin, is difficult to appear the fracture and causes corrosion.

Drawings

FIG. 1 is a schematic diagram of a common electrode metal ring used in an ODF process in the prior art;

FIG. 2 is a cross-sectional view of FIG. 1;

FIG. 3 is a schematic structural view of an anti-corrosion structure for ODF process of the present invention;

fig. 4 is a cross-sectional view of fig. 3.

In the figure: 10. the structure comprises a substrate base plate 20, a first metal layer 21, a first metal unit 30, an insulating layer 40, a second metal layer 41, a second metal unit 50 and a protective layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it is to be understood that the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention; unless expressly limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that a connection may be fixed or removable or integral; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases for a person of ordinary skill in the art; the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless otherwise specified; "plurality" means two or more. The terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

As described in the background art, in the prior art, the grooves of the two metal layers of the common electrode are designed according to the same shape and size, the two metal layers have the same shape and size, and the outermost protective layer is easy to break, so that pollutants such as water vapor and the like permeate into the upper metal layer from the broken part of the protective layer to cause corrosion, thereby causing abnormal display of the TFT-LCD. The embodiment of the application solves the problem that the liquid crystal display used in the ODF process in the prior art is easy to corrode by providing the anti-corrosion structure used in the ODF process.

In order to solve the technical problems, the general idea of the embodiment of the application is as follows:

Specifically, the first metal layer is formed on the substrate base plate; the insulating layer is formed on the substrate base plate and covers the first metal layer; the second metal layer is formed on the insulating layer; the protective layer is formed on the second metal layer and covers the insulating layer.

In an embodiment of the present application, the first metal layer includes at least two first metal units disposed at intervals; the second metal layer comprises at least two second metal units arranged at intervals; the second metal unit is arranged above the corresponding area of the first metal unit. It will be appreciated that the projection of the first metal element onto the substrate base plate covers the projection of the second metal element onto the substrate base plate.

In the embodiment of the application, the first metal units are arranged at equal intervals, and the second metal units are arranged at equal intervals.

In the embodiment of the application, a first digging groove is formed between two adjacent first metal units, and a second digging groove is formed between two adjacent second metal units.

The first digging groove and the second digging groove are in a centrosymmetric pattern or an axisymmetric pattern.

In the prior art, the grooves of two metal layers of a common electrode are designed according to the same shape and size, the first metal layer and the second metal layer have the same shape and size, and the projections of the second metal unit and the first metal unit on the substrate are completely overlapped. The utility model discloses in, creatively with the grooving of the two-layer metal level of common electrode according to the grooving on the second metal level on than the grooving on the first metal level in contract, the size of first metal level and second metal level is inequality, the second metal unit is in projection on the substrate base plate is less than first metal unit is in projection on the substrate base plate. Through the arrangement, as shown in fig. 4, a step similar to the point P is arranged, so that when the outermost protective layer covers the second metal layer from the concave surface, the outermost protective layer can cover along with the step, because of the step lamination, the height of the protective layer covering the slope surface is reduced, the protective layer of the slope surface cannot be very thin, and the protective layer is not easy to break to cause corrosion.

In the embodiment of the present application, specific materials of the insulating layer and the protective layer are not limited, and may be selected according to actual application requirements. Preferably, in this embodiment, the insulating layer is G-SiN_xA film, the protective layer is P-SiN_xAnd (3) a membrane.

In the present embodiment, the material of the first metal layer is not particularly limited, and various materials known to those skilled in the art may be used, and preferably, the material of the first metal layer is one or more of molybdenum, titanium, aluminum, and copper, but is not limited thereto, and may be other materials which are not listed in the present embodiment but are known to those skilled in the art.

The method for forming the first metal layer in the embodiment of the present application is not particularly limited, and may be implemented by using the prior art, for example, the method includes depositing the metal layer by a physical vapor deposition process, and then performing a patterning process on the metal layer, where the step of performing the patterning process includes, but is not limited to, photoresist coating, exposing, developing, wet etching, and photoresist stripping, which are performed in sequence.

In the embodiments of the present application, the material of the second metal layer is not particularly limited, and various materials known to those skilled in the art may be used, and preferably, the material of the second metal layer is one or more of molybdenum, titanium, aluminum, and copper, but is not limited thereto, and may be other materials which are not listed in the embodiments but are known to those skilled in the art.

The method for forming the second metal layer in the embodiment of the present application is not particularly limited, and may be implemented by using the prior art, for example, the method includes depositing the metal layer by a physical vapor deposition process, and then performing a patterning process on the metal layer, where the step of performing the patterning process includes, but is not limited to, photoresist coating, exposing, developing, wet etching, and photoresist stripping, which are performed in sequence.

In the embodiment of the present application, the substrate base plate is a glass base plate, but is not limited thereto.

The above-mentioned embodiments only express the embodiments of the present invention, and the description thereof is specific and detailed, but the invention can not be understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by adopting the equivalent substitution or equivalent transformation should fall within the protection scope of the present invention.

Claims

1. An anti-corrosion structure for an ODF process comprises a substrate, and a first metal layer, an insulating layer, a second metal layer and a protective layer which are sequentially formed on the substrate; the first metal layer comprises a plurality of first metal units arranged at intervals; the second metal layer comprises a plurality of second metal units arranged at intervals; wherein a projection of the second metal unit on the substrate base plate is smaller than a projection of the first metal unit on the substrate base plate.

2. The corrosion protection structure for ODF process according to claim 1, wherein said first metal layer is formed on said base substrate; the insulating layer is formed on the substrate base plate and covers the first metal layer; the second metal layer is formed on the insulating layer; the protective layer is formed on the second metal layer and covers the insulating layer.

3. The corrosion protection structure for ODF processes according to claim 1, wherein said first metal layer comprises at least two first metal units disposed at intervals; the second metal layer comprises at least two second metal units arranged at intervals; the second metal unit is arranged above the corresponding area of the first metal unit.

4. The anti-corrosion structure for ODF process according to claim 1, wherein said first metal units are arranged at equal intervals therebetween and said second metal units are arranged at equal intervals therebetween.

5. The anti-corrosion structure for ODF process of claim 1, wherein said insulating layer is G-SiN_xAnd (3) a membrane.

6. The anti-corrosion structure for ODF process of claim 1, wherein said protective layer is P-SiN_xAnd (3) a membrane.

7. The anti-corrosion structure for ODF processes according to claim 1, wherein said substrate base plate is a glass base plate.