CN113131784A - Piezoelectric ceramic driving device - Google Patents
Piezoelectric ceramic driving device Download PDFInfo
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- CN113131784A CN113131784A CN202110332323.0A CN202110332323A CN113131784A CN 113131784 A CN113131784 A CN 113131784A CN 202110332323 A CN202110332323 A CN 202110332323A CN 113131784 A CN113131784 A CN 113131784A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 56
- 230000003321 amplification Effects 0.000 claims abstract description 54
- 238000003199 nucleic acid amplification method Methods 0.000 claims abstract description 54
- 230000001105 regulatory effect Effects 0.000 claims description 11
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000000087 stabilizing effect Effects 0.000 description 6
- 230000003044 adaptive effect Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000010354 integration Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
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- 239000004744 fabric Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000003071 parasitic effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
- H02N2/06—Drive circuits; Control arrangements or methods
- H02N2/062—Small signal circuits; Means for controlling position or derived quantities, e.g. for removing hysteresis
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/02—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing linear motion, e.g. actuators; Linear positioners ; Linear motors
- H02N2/04—Constructional details
- H02N2/043—Mechanical transmission means, e.g. for stroke amplification
Abstract
The invention is suitable for the technical field of piezoelectric ceramic driving and provides a piezoelectric ceramic driving device which comprises a voltage amplification module and a stabilized voltage power supply module, wherein the voltage amplification module and the stabilized voltage power supply module are connected to a circuit board in an upright and pluggable mode. Therefore, the density of the hundred-channel piezoelectric ceramic driving device can be improved, and the volume of the driving device is greatly reduced while the control circuit is clear and ordered. In the using process, the board cards can be configured according to engineering requirements, the system practicability is enhanced, the single channel can be independently maintained when a fault occurs, and the maintenance cost is reduced; if the driven element is changed greatly in the later period, only the voltage amplification module needs to be changed independently, so that upgrading and updating are facilitated, and the design cost is greatly reduced.
Description
Technical Field
The invention belongs to the technical field of piezoelectric ceramic power supply driving, and particularly relates to a piezoelectric ceramic driving device.
Background
In recent years, piezoelectric ceramics have been widely used in the fields of precision manufacturing, optical instruments, robots, and the like, because of their advantages of small weight, high displacement accuracy, high resolution, large thrust, fast frequency response, no heat generation, no noise generation, and the like. Particularly, in a scientific-grade adaptive deformable mirror control structure, piezoelectric ceramics become a preferred element of an adaptive deformable mirror mechanical execution unit due to the advantages of small volume, large bandwidth, high resolution and the like.
The piezoelectric ceramic deforms under the action of an external electric field, and the output force or displacement and the input voltage present an approximately linear relationship. However, whether a piezoelectric ceramic mechanism can work normally and effectively, especially the dynamic characteristics thereof, mainly depend on the performance of a driving device thereof. Generally, a driving device of piezoelectric ceramics is generally composed of a voltage amplifying module and a voltage stabilizing power supply module, which are fixedly and flatly arranged in a case of the driving device.
The voltage amplification module can be divided into a power driving circuit formed based on discrete components and a driving circuit formed based on an integrated device in a series-parallel connection mode on the basis of a circuit design principle structure. The use of the integrated device not only reduces the volume of the circuit board and increases the integration level of the device, but also reduces the parasitic capacitance in the discrete device, reduces the generation of self-excitation phenomenon and enhances the reliability of the amplifying module.
The voltage-stabilized power supply module is mainly used for providing a power-level direct-current stabilized power supply for the voltage amplification module. Generally, for voltage amplification modules of several channels, when the required power is small, the voltage-stabilized power supply module and the voltage amplification module can be drawn on the same circuit board and directly laid out flatly or separately laid out flatly on two bottom boards, and the voltage-stabilized power supply module supplies power to the voltage amplification module through a lead. However, in general, the design indexes and structures of the conventional voltage-stabilized power supply module are designed correspondingly according to the functional structure and the channel number of the voltage amplification module, and only the voltage-stabilized power supply module can be used in a corresponding specific system, cannot be expanded and is not easy to adjust. For a multi-channel voltage amplification module, when the required power is large, a device is often externally provided with a voltage-stabilized power supply, and the voltage amplification module and the voltage-stabilized power supply module are changed into two separate devices.
Although the above driving structure is adequate in the piezoelectric ceramic driving of several or dozens of channels, the simple fixed flat-cloth type structure based on the integrated device in the scientific grade adaptive deformable mirror piezoelectric system of hundreds or even thousands of channels can not meet the actual scientific research and engineering requirements. Firstly, in a hundred-channel-level driving device, a voltage amplification module is flatly arranged, large in size, bulky in structure and not easy to apply in engineering; secondly, the hundred-channel voltage amplification modules are uniformly arranged on the same circuit board, so that wiring is very complex, and once the wiring is finished, the wiring cannot be changed, and the design cost is increased; thirdly, the scientific grade adaptive deformable mirror may need to repeatedly modify the number and specification of the execution units in the development process, the fixed tiled structure is not easy to change, the voltage-stabilized power supply module cannot be correspondingly designed along with a circuit board, even if the design is not easy to adjust, external supply can only be adopted, the mechanical structure of the whole device cannot be determined, the development process is influenced, and meanwhile, the design cost is increased and resources are wasted.
Disclosure of Invention
The invention aims to provide a piezoelectric ceramic driving device, and aims to solve the technical problems that a hundred-channel piezoelectric ceramic driving device cannot be realized simply and conveniently at low design cost in the prior art and the like.
The invention provides a piezoelectric ceramic driving device which comprises a voltage amplification module and a stabilized voltage power supply module, wherein the voltage amplification module and the stabilized voltage power supply module are connected to a circuit board in an upright and pluggable mode.
Specifically, the device comprises a plurality of piezoelectric ceramic driving array units, and each piezoelectric ceramic driving array unit comprises a voltage amplification module and a voltage stabilizing power supply module.
Specifically, the piezoelectric ceramic driving array unit further comprises a driving array base plate, the driving array base plate is electrically connected with the circuit board, and the voltage amplification module and the voltage stabilizing power supply module are connected to the driving array base plate in a plug-in card manner and are electrically connected with each other through wiring in the driving array base plate.
Specifically, the voltage amplification module comprises a voltage amplification module plug card and a voltage amplification module plug interface, the voltage-stabilized power supply module comprises a voltage-stabilized power supply module plug card and a voltage-stabilized power supply module plug interface, and the driving array base plate comprises a base plate plug interface.
Specifically, the voltage amplification module plug-in card and the PCB of the voltage-stabilized power supply module plug-in card adopt a 4-layer single-side layout structure.
Specifically, the voltage amplification module plug interface and the voltage-stabilized power supply module plug interface are flat pin-out type plug interfaces, and the bottom plate plug interface is a straight hole-out type plug interface.
Specifically, the flat pin-out type plug interface and the straight hole-out type plug interface are packaged by double rows of pins with buckles.
Specifically, the number ratio of the voltage amplification modules to the voltage-stabilized power supply modules in the piezoelectric ceramic driving array unit is 10:2 or 10: 1.
Specifically, the piezoceramic driving array unit further comprises an electrical interface, and the electrical interface comprises a DA signal input interface, an analog power input interface, a primary power input interface and a driving signal output interface.
Specifically, the plurality of piezoelectric ceramic drive array units are packaged in the control cabinet side by side, and the control cabinet further comprises an interface board which is electrically connected with each piezoelectric ceramic drive array unit.
Because the voltage amplification module and the voltage-stabilized power supply module in the piezoelectric ceramic driving device are connected to the circuit board in an upright and pluggable mode, the density of the hundred-channel piezoelectric ceramic driving device can be improved, and the volume of the driving device is greatly reduced while the control circuit is clear and ordered. In the using process, the board cards can be configured according to engineering requirements, the system practicability is enhanced, the single channel can be independently maintained when a fault occurs, and the maintenance cost is reduced; if the driven element is changed greatly in the later period, only the voltage amplification module needs to be changed independently, so that upgrading and updating are facilitated, and the design cost is greatly reduced.
Drawings
Fig. 1 is a mechanical structure diagram of a piezoelectric ceramic driving device according to an embodiment of the present invention.
Fig. 2 is an electrical block diagram of a piezoelectric ceramic driving device according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a piezoelectric ceramic driving array unit in a piezoelectric ceramic driving device according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of a voltage amplification module plug interface, a voltage-stabilized power supply module plug interface, and a bottom plate plug interface in the piezoelectric ceramic driving device according to the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description of specific implementations of the present invention is provided in conjunction with specific embodiments:
fig. 1 is a mechanical structure diagram of a piezoceramic driving device according to an embodiment. The piezoelectric ceramic driving device is suitable for piezoelectric ceramics. For convenience of explanation, only portions related to the embodiments of the present invention are shown.
As shown in fig. 1, the piezoelectric ceramic driving device includes: the device comprises a front panel 1, a rear panel 2, a right panel 3, a left panel 4, a combined driving array 5, a display screen 6, an interface board 7, a heat exchange fan 8, a primary switching power supply 9, an analog switching power supply 10 and a ventilating board 11. The electrical block diagram of the whole device is shown in fig. 2.
In fig. 1, the piezoelectric ceramic driving device includes a voltage amplifying module and a regulated power supply module, and the voltage amplifying module and the regulated power supply module are connected to a circuit board in an upright and pluggable manner.
In the piezoelectric ceramic driving device in fig. 1, because the voltage amplification module and the voltage-stabilized power supply module are independently plugged, the density of the piezoelectric ceramic driving device with hundreds of channels can be improved, and the volume of the driving device is greatly reduced while the control circuit is clear and ordered. In the using process, the board cards can be configured according to engineering requirements, the system practicability is enhanced, the single channel can be independently maintained when a fault occurs, and the maintenance cost is reduced; if the driven element is changed greatly in the later period, only the voltage amplification module needs to be changed independently, so that upgrading and updating are facilitated, and the design cost is greatly reduced.
Specifically, the piezoelectric ceramic driving device comprises a plurality of piezoelectric ceramic driving array units. The number of the piezoelectric ceramic driving array units and the volume of the case can be flexibly adjusted to adapt to repeated modification in the research and development process of the deformable mirror, the research and development progress is accelerated, and resource waste is avoided.
As shown in fig. 3, each piezoelectric ceramic driving array unit includes a voltage amplifying module, a voltage stabilizing power supply module, a driving array substrate and an electrical interface. The driving array base plate is electrically connected with the circuit board, and the voltage amplification module and the voltage stabilizing power supply module are connected to the driving array base plate in a plug-in card mode and are electrically connected with each other through wiring in the driving array base plate. Through the electric interface, the piezoelectric ceramic driving array unit receives signal input and outputs the signal after signal processing.
Specifically, the voltage amplification module comprises a voltage amplification module plug card and a voltage amplification module plug interface, the voltage-stabilized power supply module comprises a voltage-stabilized power supply module plug card and a voltage-stabilized power supply module plug interface, and the driving array base plate comprises a base plate plug interface. As shown in fig. 3, 1 is a separate drive array base plate, 2 is an integrated voltage-stabilized power supply module plug board card, 3 is a voltage amplification module plug board card, and 4 is an electrical interface. Therefore, in each piezoelectric ceramic drive array unit, the voltage amplification module plug card is plugged into the bottom plate plug interface through the overvoltage amplification module plug interface, and the voltage-stabilizing power supply module plug card is plugged into the bottom plate plug interface through the voltage-stabilizing power supply module plug interface.
Preferably, as shown in fig. 4, 1 is a PCB board of a plug board of the voltage amplification module or a plug board of the regulated power supply module, 2 is a flat pin type plug interface, and 3 is a straight hole type plug interface of the bottom plate. The voltage amplification module plug interface and the voltage-stabilized power supply module plug interface are flat pin-out type plug interfaces, the bottom plate plug interface is a straight hole-out type plug interface, and the flat pin-out type plug interface can ensure that a PCB (printed circuit board) is connected vertically and is convenient to plug. Besides the electric connectivity of the corresponding plate, the flat-pin type plugging and unplugging structure can be used as a mechanical connection structure of the corresponding plate, the 90-degree mechanical connection structure of the interface connection pin and the plate can be guaranteed, the plugging and unplugging plate is made to be vertical, and the device density is improved. Meanwhile, the interface of the bottom plate is designed into a hole type in consideration of power supply of the interface of the bottom plate so as to ensure electrical safety.
In order to ensure the complete electrical connectivity and the connection strength of the system, the flat pin-out type plug interface and the straight hole-out type plug interface are packaged by double rows of pins with buckles. For example, a 16 × 2 2.54mil interface package is used.
Preferably, in order to meet the requirement of good electrical signal integrity of the integrated amplification circuit and ensure the heat dissipation performance of the power operational amplifier IC, the PCBs of the voltage amplification module plug-in card and the voltage-stabilized power supply module plug-in card both adopt a 4-layer single-sided layout structure, that is, each chip of the integrated amplification circuit is placed on the front side of the PCB. The 2 nd layer of PCB inboard layer is for complete ground flat to guarantee signal integrality and heat dispersion. If necessary, an area right below the power operational amplifier IC is subjected to resistance-removing layout on the back face of the PCB, the ground plane copper foil is exposed, and the IC heat dissipation tile for the computer with the same size is welded to the exposed ground plane copper foil, so that good heat dissipation performance of the power operational amplifier IC during high-frequency output is guaranteed.
It should be noted that the electrical interface in each piezoelectric ceramic driving array unit is, from left to right, a DA signal input interface, an analog power input interface, a primary power input interface, and a driving signal output interface in sequence. The DA signal is an analog signal to be amplified which is provided by a front-end upper computer and is driven by piezoelectric ceramics, the analog power input interface is used for supplying power to the operational amplifier of the voltage amplification module, the primary power input interface is used for supplying a low-voltage input power supply to the voltage-stabilized power supply module, and the low-voltage input power supply is converted into a high-voltage driving power supply by the voltage-stabilized power supply module to supply power to the voltage amplification module. DA signals and driving signals of each piezoelectric ceramic driving array unit are connected to an interface board 7 of a rear panel of the control cabinet through a bus. The different piezoelectric ceramic driving array units do not have direct electrical connection, work independently and are arranged in the control cabinet in parallel on a mechanical structure. Different piezoelectric ceramic drive array units are connected with the interface board 7 through the electrical interface 4 in a cluster mode through buses, the design can guarantee the drive capability of a hundred-channel level, the cost of wiring layout is reduced, and the flexibility of the number is enhanced during use.
Preferably, in the piezoelectric ceramic driving array unit, the number ratio of the voltage amplifying modules to the voltage stabilizing power supply modules is 10:2 or 10: 1.
In order to ensure high-density integration of a driving array, an integrated IC is suitable for being used for driving power operational amplifier of an integrated amplifying circuit, single-channel, double-channel and four-channel packaging is adopted in common power level integrated operational amplifier products on the market, in order to ensure integration level and good signal integrity and avoid excessively complicated layout wiring, the power operational amplifier IC is suitable for adopting double-channel output and bottom heat dissipation type surface mounting packaging. The offset voltage of the existing power-stage integrated drive operational amplifier is large, and in order to realize the control precision below the 10mV level of the scientific-grade self-adaptive deformable mirror, a two-stage composite amplification structure is preferably adopted, the front stage adopts a high-gain ultra-low offset voltage high-precision operational amplifier, and the rear stage adopts a high-power drive operational amplifier.
The load capacity and specification size of the existing analog devices and power devices on the market and the design cost of PCB wiring layout are comprehensively considered, and a voltage amplification module plug-in card is adopted to complete 2-path driving by combining the driving requirements of a scientific grade deformable mirror, 10 plug-in cards are 20-path driving, and the combination of 5 piezoelectric ceramic driving array units is 100-path driving. The power and size of the power supply is selected according to different load sizes and drive response frequencies. The power supply designed according to the conventional power device on the market can meet the requirement of the distribution ratio of 10:1, and the distribution ratio of 10:2 is a redundancy design, so that the stability is ensured and the upgrading and updating are convenient.
Generally, a piezoelectric ceramic drive device using an analog drive method supplies power to an analog power supply of ± 12V or ± 15V and a dc power supply of 100V or more, respectively. The external power supply of the device only needs 220V mains supply, and only needs to leave a universal power interface at the rear end of the device case, so that the integration level of the system is greatly increased. The 220V power supply supplies power for the 9-stage switching power supply and the 10-stage analog switching power supply.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The piezoelectric ceramic driving device is characterized by comprising a voltage amplification module and a stabilized voltage power supply module, wherein the voltage amplification module and the stabilized voltage power supply module are connected to a circuit board in an upright and pluggable mode.
2. The apparatus of claim 1, wherein the apparatus comprises a plurality of piezo ceramic drive array units, each piezo ceramic drive array unit comprising a voltage amplification module and a regulated power supply module.
3. The apparatus of claim 2, wherein the piezo ceramic drive array unit further comprises a drive array backplane, the drive array backplane being electrically connected to the circuit board, the voltage amplification module and the regulated power supply module being connected to the drive array backplane in a plug-and-play card and electrically connected to each other via wiring in the drive array backplane.
4. The apparatus of claim 3, wherein the voltage amplification module comprises a voltage amplification module plug card and a voltage amplification module plug interface, the regulated power supply module comprises a regulated power supply module plug card and a regulated power supply module plug interface, and the drive array backplane comprises a backplane plug interface.
5. The apparatus of claim 4, wherein the PCBs of the voltage amplification module plug card and the regulated power supply module plug card are in a 4-board single-sided layout.
6. The apparatus of claim 4, wherein the voltage amplification module plug interface and the regulated power supply module plug interface are flat pin-out type plug interfaces, and the backplane plug interface is a straight-out hole type plug interface.
7. The device of claim 6, wherein the pin-out flat plug interface and the straight-out hole plug interface are packaged with double rows of pins with snaps.
8. The apparatus of claim 2, wherein the ratio of the number of voltage amplification modules to the number of regulated power supply modules in the piezoceramic drive array unit is 10:2 or 10: 1.
9. The apparatus of claim 2, wherein the piezo ceramic driven array unit further comprises electrical interfaces comprising a DA signal input interface, an analog power input interface, a primary power input interface, a drive signal output interface.
10. The apparatus of claim 2, wherein a plurality of the piezo ceramic drive array units are packaged side by side in a control chassis, the control chassis further comprising an interface board electrically connected to each piezo ceramic drive array unit.
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