CN213584231U

CN213584231U - Optical module test board

Info

Publication number: CN213584231U
Application number: CN202022414617.1U
Authority: CN
Inventors: 黄士争; 关鹤林; 吴天书; 杨现文; 李林科; 张健
Original assignee: Wuhan Linktel Technologies Co Ltd
Current assignee: Wuhan Linktel Technologies Co Ltd
Priority date: 2020-10-27
Filing date: 2020-10-27
Publication date: 2021-06-29
Anticipated expiration: 2030-10-27

Abstract

An optical module test board comprises a test board, a main circuit printed on the test board and a sub-circuit easy to damage, wherein the main circuit is electrically connected with the sub-circuit; the test daughter board comprises a second connector and a third connector, the second connector is used for being electrically connected with the first connector, and the third connector is used for being electrically connected with an optical module to be tested. The utility model discloses, when the damage appears, only need the lower test daughter board of replacement cost, can resume the whole normal function who surveys the board to can reduce the cost that the test was changed.

Description

Optical module test board

Technical Field

The utility model relates to an optical module test field, concretely relates to optical module test panel.

Background

At present, a matched test board is used in an optical module test to simulate the use of the optical module on a switch, and the test board comprises a main circuit and a connector used for being connected with the optical module. The optical module and the test board are electrically connected through the connectors defined by SFF 8436. However, in the actual use process, the connector can cause the component to be damaged due to frequent plugging and unplugging operations, the current processing scheme is that the whole test board is scrapped, and the waste of the scheme is very serious.

Therefore, a detachable test board is designed, the part which is easy to damage in the original scheme is separated out, and a switching sub-board is separately manufactured and connected through a stud and a switching port. If the problem of port damage appears, only need to change the daughter board, and most circuit on the test panel need not change. Thereby reducing the cost and the difficulty of maintenance.

SUMMERY OF THE UTILITY MODEL

In view of technical defect and the technical drawback that exist among the prior art, the embodiment of the utility model provides a overcome above-mentioned problem or solve an optical module of above-mentioned problem at least partially and survey test panel, concrete scheme is as follows:

the main circuit is electrically connected with the sub-circuit, the testing board comprises a testing mother board and a testing daughter board, the testing mother board and the testing daughter board are both printed circuit boards, the main circuit is printed on the testing mother board, the sub-circuit is printed on the testing daughter board, and the testing mother board and the testing daughter board are connected in a laminated mode in an up-and-down combined mode.

Furthermore, a first connection port and a USB port used for being connected with a PC end are arranged on the test motherboard, the USB port and the first connection port are both electrically connected with the test motherboard, the test daughter board includes a second connection port used for being electrically connected with the first connection port and a third connection port used for being electrically connected with an optical module to be tested, and the first connection port and the third connection port are both electrically connected with the second connection port.

Furthermore, the first connecting port and the second connecting port and the optical module to be tested are electrically connected in a plug-in manner.

Furthermore, the first connector and the second connector both adopt QSFP standard adapters.

Further, the third connection port adopts a connector defined by SFF 8436.

Further, the test daughter board is mounted on the test mother board in a stacked manner and connected to each other by bolts.

Furthermore, a plurality of first threaded holes are formed in the test daughter board, a plurality of second threaded holes which are one-to-one opposite to the first threaded holes are formed in the test mother board, and the test mother board is connected with the test daughter board through the first threaded holes, the second threaded holes and matched bolts.

The utility model discloses following beneficial effect has:

the utility model provides a pair of survey test panel independently comes out the part of easy damage in with current scheme, does a test daughter board alone, and two survey test panels are connected through double-screw bolt and switching mouth, if the problem that the port damaged has appeared, only need change the daughter board, and survey most circuits on the test panel and need not change. Thereby reducing the cost and the difficulty of maintenance.

Drawings

Fig. 1 is a structural diagram of an optical module test board provided in an embodiment of the present invention;

fig. 2 is a structural diagram of a test motherboard according to an embodiment of the present invention;

fig. 3 is a structural diagram of a test daughter board according to an embodiment of the present invention;

fig. 4 is a schematic diagram of a circuit on a test motherboard according to an embodiment of the present invention;

fig. 5 is a schematic diagram of a circuit on the test daughter board according to an embodiment of the present invention.

In the figure: 1. the test device comprises a test mother board, 2, a second threaded hole, 3, a test daughter board, 4, a first threaded hole, 5, a USB interface, 6, a main circuit, 7, a first connecting interface, 8, a second connecting port, 9 and a third connecting port.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1, the embodiment of the utility model provides a test panel is surveyed to optical module, including surveying test panel and printing in the main circuit 6 on surveying the test panel and the easy sub-circuit who damages, main circuit 6 and sub-circuit electricity are connected, survey the test panel including test mother board 1 and test daughter board 3, test mother board 1 and test daughter board 3 are printed circuit board, main circuit 6 print in on the test mother board 1, the sub-circuit prints on test daughter board 3, test mother board 1 with adopt the tandem system from top to bottom built-up connection between the test daughter board 3, promptly test mother board 1 with test daughter board 3 forms the double-deck test panel that surveys.

The testing daughter board 3 comprises a second connector 8 and a third connector 9, the second connector 8 is used for being electrically connected with the first connector 7, the third connector 9 is used for being electrically connected with an optical module to be tested, and the first connector 7 and the third connector 9 are both electrically connected with the second connector 8.

The first connection port 7 and the second connection port 8 both adopt QSFP standard adapters, preferably, plug-in type electrical connection is adopted between the two connectors, the third connection port 9 adopts a connector defined by SFF8436, and the second connection port 8 and the optical module to be tested are also in plug-in type electrical connection.

The testing daughter board 3 is provided with a plurality of first threaded holes 4, the testing mother board 1 is provided with a plurality of second threaded holes 2 which are one-to-one opposite to the first threaded holes 4, and the testing mother board 1 and the testing daughter board 3 are connected with each other through the first threaded holes 4, the second threaded holes 2 and matched bolts.

The utility model discloses, through the hardware design, the design of an adapter plate daughter board has been increased on original test panel's basis, test daughter board 3 promptly, adopt stromatolite mode to combine together from top to bottom between test mother board 1 and the test daughter board 3, structural through the double-screw bolt together fixed, the test mother board provides the basic circuit design that the test needs, the test daughter board is the fragile part in the in-service use process, only need the lower daughter board of replacement cost when the damage appears, can resume whole normal function of testing panel, thereby can reduce the cost of test change.

As shown in fig. 4, the schematic diagram of the circuit printed on the test motherboard 1 can be functionally divided into:

the power supply slow start part: when the test board is electrified at one moment, the voltage does not reach 3.3V instantly, but passes through a series of capacitance and inductance circuits, so that the slow rise of the voltage is realized, and the function of electrification protection is achieved;

DDM moiety: the test board uses MCU of silicon lab, through USB interface 5, transmit the data of optical module to user's computer in real time;

high-speed electrical signal transmission part: there are 16 coaxial connector interfaces to realize the conversion of high speed electric signal between test board and test equipment.

As shown in fig. 4, a schematic diagram of a circuit printed on the test daughter board 3 is shown, where J1 is a second connector, which is an electrical connection port between the motherboard of the test board and the daughter board, and J2 is a third connector, which is a connection portion between the daughter board of the test board and the optical module.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. The test board is characterized in that the test board comprises a test mother board and a test daughter board, the test mother board and the test daughter board are both printed circuit boards, the main circuit is printed on the test mother board, the daughter circuit is printed on the test daughter board, and the test mother board and the test daughter board are connected in a laminated mode in a vertical combined mode.

2. The test board for testing optical modules according to claim 1, wherein the test motherboard has a first connection port and a USB port for connecting to a PC terminal, the USB port and the first connection port are both electrically connected to the test motherboard, the test daughter board includes a second connection port for electrically connecting to the first connection port and a third connection port for electrically connecting to an optical module to be tested, and the first connection port and the third connection port are both electrically connected to the second connection port.

3. The test board for testing optical modules as claimed in claim 2, wherein the first and second connectors are electrically connected to each other by a plug-in connector, and the second connector is electrically connected to the optical module to be tested.

4. The test board for testing optical modules as claimed in claim 2, wherein the first and second connectors are QSFP standard adapters.

5. The test board for testing light modules as claimed in claim 2, wherein said third connection port is a connector defined by SFF 8436.

6. The test board for testing optical modules as claimed in claim 1, wherein the test daughter boards are mounted on the test mother board in a stacked manner and are connected to each other by bolts.

7. The test board for testing optical modules as claimed in claim 6, wherein the test daughter board has a plurality of first threaded holes, the test mother board has a plurality of second threaded holes corresponding to the plurality of first threaded holes, and the test mother board and the test daughter board are connected to each other via the first threaded holes, the second threaded holes and the matching bolts.