CN110119371B - High-density server management network device and system - Google Patents
High-density server management network device and system Download PDFInfo
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- CN110119371B CN110119371B CN201910378588.7A CN201910378588A CN110119371B CN 110119371 B CN110119371 B CN 110119371B CN 201910378588 A CN201910378588 A CN 201910378588A CN 110119371 B CN110119371 B CN 110119371B
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
- G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
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Abstract
The invention discloses a high-density server management network device, which comprises a PCB (printed Circuit Board) and a power panel, and further comprises an integrated network management chip arranged on the power panel, a plurality of computing nodes and a power module, wherein the I2C data end of each computing node is connected with the I2C data end of the PCB, and the I2C data end of the PCB is connected with the I2C data end of the integrated network management chip. A high-density server management network system is also disclosed. Through the integrated management network on power module, greatly save design space, ensure that the product supports bigger specification in limited space, promote product competitiveness.
Description
Technical Field
The invention relates to the technical field of server design, in particular to a high-density server management network device and a high-density server management network system.
Background
With the rapid development of computer technology, computing technology and platforms are continuously updated, the market puts higher demands on high-density servers, and in a limited space, the specification is improved to the maximum extent to obtain better performance, so that the space of external interfaces is greatly compressed, and the function of centralized management of network ports is sacrificed for the specification of part of products.
Disclosure of Invention
The invention aims to provide a high-density server management network device and a high-density server management network system, which improve the integration design level of a server.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a high-density server management network device, which comprises a PCB (printed circuit board) and a power panel, and further comprises an integrated network management chip arranged on the power panel, a plurality of computing nodes and a power module, wherein the I2C data end of each computing node is connected with the I2C data end of the PCB, and the I2C data end of the PCB is connected with the I2C data end of the integrated network management chip.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the PCB board and the computing node are connected through a gold finger or a high-density interface.
With reference to the first aspect, in a second possible implementation manner of the first aspect, the PCB board is connected to the power board through a gold finger or a high-density interface.
With reference to the first aspect, in a third possible implementation manner of the first aspect, the integrated network management chip is AST 1250.
The invention provides a high-density server management network system in a second aspect, which comprises a network management unit, a power management unit, a plurality of computing nodes and a power module, wherein the network management unit is used for managing the power of the computing nodes; the power management unit acquires the working state information of the power module and is in communication connection with the network management unit; the computing node is in communication connection with the network management unit.
With reference to the second aspect, in a first possible implementation manner of the second aspect, the network management unit includes: the system comprises a node monitoring module, an I2C communication module and a network management module; the node monitoring module completes the work state analysis of the computing node; the I2C communication module completes data communication between the node monitoring module and the network management module and data communication between the node monitoring module and the computing node; and the network management module completes communication connection between the computing node and an external network.
The effect provided in the summary of the invention is only the effect of the embodiment, not all the effects of the invention, and one of the above technical solutions has the following advantages or beneficial effects:
the invention integrates the management network port on the circuit board of the power module and transmits the management network signal of each computing node to the network port, thereby achieving the purpose of integrating the management network to the power module. According to the invention, the management network is integrated on the power supply module, so that the design space is greatly saved, the product is ensured to support a larger specification in a limited space, and the product competitiveness is improved.
Drawings
FIG. 1 is a schematic diagram of a high-density server management network apparatus according to the present invention;
FIG. 2 is a schematic diagram of an embodiment of a high-density server management network system according to the invention;
FIG. 3 is a schematic diagram of a high-density server management network system according to an embodiment of the present invention.
Detailed Description
In order to clearly explain the technical features of the present invention, the following detailed description of the present invention is provided with reference to the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and procedures are omitted so as to not unnecessarily limit the invention.
As shown in fig. 1, the high-density server management network device includes a PCB board, a power board, an integrated network management chip disposed on the power board, a plurality of computing nodes and a power module, wherein the PCB board is connected to the computing nodes and the power board via cables or connectors for transmitting signals and supplying power; the power panel distributes voltage and current transmitted from the power module, and distributes the electric energy input by the power module to the PCB for supplying power to the modules of the server, wherein the modules comprise the PCB and the computing nodes; the computing node is a subsystem which can independently run in the server; the power supply module comprises a switching power supply which is used for supplying power to the whole system.
The I2C data terminal of the computation node is connected with the I2C data terminal of the PCB, and the I2C data terminal of the PCB is connected with the I2C data terminal of the integrated network management chip. The PCB board is connected with the computing node through a golden finger or a high-density interface. The PCB board is connected with the power supply board through a golden finger or a high-density interface. The integrated network management chip is AST 1250.
The I2C signal of the computing node is sent to an integrated network management chip arranged on a power panel through a PCB, and bidirectional communication between the computing node and an external network is completed through a network port of the integrated network management chip. The management network is integrated to the power module by integrating the management network port on the circuit board of the power module and transmitting the management network signal of each computing node to the network port. Through the integrated management network on power module, greatly save design space, ensure that the product supports bigger specification in limited space, promote product competitiveness.
Example one
As shown in fig. 2, the high-density server management network system includes a network management unit, a power management unit, a plurality of computing nodes, and a power module; the power management unit acquires the working state information of the power module and is in communication connection with the network management unit; the computing node is in communication connection with the network management unit.
Specifically, the power management unit sends the acquired working state information of the power module to the network management unit through an external golden finger or a high-density interface, and the network management unit is in communication connection with an external network through an external network port; the network management unit acquires node monitoring information and I2C information of the computing node through an external golden finger or a high-density interface, and the network management unit sends the node monitoring information and the I2C information to an external network through an external network port.
Example two
As shown in fig. 3, the high-density server management network system includes a network management unit, a power management unit, a plurality of computing nodes, and a power module; the power management unit acquires the working state information of the power module and is in communication connection with the network management unit; the computing node is in communication connection with the network management unit. The network management unit includes: the system comprises a node monitoring module, an I2C communication module and a network management module; the node monitoring module completes the work state analysis of the computing node; the I2C communication module completes data communication between the node monitoring module and the network management module and data communication between the node monitoring module and the computing node; and the network management module completes communication connection between the computing node and an external network.
The computing nodes send the node monitoring information and the I2C information to the node monitoring module through the I2C communication module, and the node monitoring module collects the node monitoring information and the I2C information of the computing nodes and then sends the collected information to the network management module through the I2C communication module; the power management unit sends the acquired working state information of the power module to the network management module, and the network management unit sends the centralized node monitoring information, the I2C information and the working information of the power module to an external network through an external network port.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present invention, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive efforts by those skilled in the art based on the technical solution of the present invention.
Claims (3)
1. The high-density server management network device comprises a PCB (printed Circuit Board) and a power panel, and is characterized by also comprising an integrated network management chip arranged on the power panel, a plurality of computing nodes and a power module; the PCB is connected with the computing node and the power panel through cables or connectors; the power panel distributes voltage and current transmitted from the power module, and distributes the electric energy input by the power module to the PCB for supplying power to the modules of the server, wherein the modules comprise the PCB and the computing nodes; the computing node is a subsystem which runs independently in the server; the power supply module comprises a switching power supply and is used for supplying power to the server; the I2C data end of the computing node is connected with the I2C data end of the PCB, and the I2C data end of the PCB is connected with the I2C data end of the integrated network management chip; the PCB is connected with the power panel through a golden finger or a high-density interface, the power panel provides electric energy for the PCB, and the PCB sends node monitoring signals and I2C signals of each computing node to a network integrated chip arranged on the power panel.
2. The device of claim 1, wherein the PCB board is connected to the computing nodes via a gold finger or a high-density interface, and the PCB board obtains node monitoring signals and I2C signals of the computing nodes and supplies power to the computing nodes.
3. The high-density server management network device according to claim 1, wherein the integrated network management chip is a chip AST1250, a data communication terminal of the chip AST1250 is connected with an upper module through a network, and a data terminal acquires a node monitoring signal of each computing node transferred in the PCB board, I2C signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910378588.7A CN110119371B (en) | 2019-05-08 | 2019-05-08 | High-density server management network device and system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910378588.7A CN110119371B (en) | 2019-05-08 | 2019-05-08 | High-density server management network device and system |
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| CN110119371A CN110119371A (en) | 2019-08-13 |
| CN110119371B true CN110119371B (en) | 2021-02-09 |
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| CN201910378588.7A Active CN110119371B (en) | 2019-05-08 | 2019-05-08 | High-density server management network device and system |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102799225A (en) * | 2012-07-20 | 2012-11-28 | 浪潮电子信息产业股份有限公司 | High density server design method |
| CN105094699B (en) * | 2015-07-15 | 2018-10-02 | 浪潮(北京)电子信息产业有限公司 | A kind of Cloud Server storage system |
| CN106528463A (en) * | 2016-11-08 | 2017-03-22 | 郑州云海信息技术有限公司 | Four-subnode star server system capable of realizing hard disk sharing |
| CN107102699A (en) * | 2017-04-20 | 2017-08-29 | 广东浪潮大数据研究有限公司 | A kind of high-density rack formula server centered management system |
| CN107391428B (en) * | 2017-07-31 | 2024-02-13 | 郑州云海信息技术有限公司 | Novel framework four-way server |
| US10667326B2 (en) * | 2017-08-02 | 2020-05-26 | Veniam, Inc. | Systems and methods to use fixed access points as delay-tolerant nodes in a network of moving things including autonomous vehicles |
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