CN113130329A - Multidirectional leading-out method for single-row in-line extending pins of IC packaging body and power integrated circuit component manufactured by applying same - Google Patents
Multidirectional leading-out method for single-row in-line extending pins of IC packaging body and power integrated circuit component manufactured by applying same Download PDFInfo
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- CN113130329A CN113130329A CN202010070177.4A CN202010070177A CN113130329A CN 113130329 A CN113130329 A CN 113130329A CN 202010070177 A CN202010070177 A CN 202010070177A CN 113130329 A CN113130329 A CN 113130329A
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- pins
- packaging body
- integrated circuit
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- conducting strips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/89—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
Abstract
The invention discloses a multidirectional leading-out method of a single-row in-line extending pin of an IC packaging body, which comprises the following steps: step one, bending at least 1 pin of an Integrated Circuit (IC) packaging body with pins extending out of a single row of straight lines upwards and bending the pins again at a position higher than the upper surface of the packaging body, wherein the tip part of the bent pin is parallel to the upper surface of the packaging body; preparing a plurality of metal conducting strips or preparing a plastic bracket embedded with the metal conducting strips, wherein at least one of the metal conducting strips is a metal conducting strip bent in the horizontal direction; and step three, the metal conducting strips and the pins of the packaging body are all connected in a welding mode, so that the pins extending out of the single-row straight lines of the integrated circuit packaging body are led out in multiple directions through the conducting strips. The invention also discloses a power integrated circuit component manufactured by adopting the multidirectional leading-out method. Compared with the prior art, the invention can lead out the pins of the package body with more pins in multiple directions, and the process of manufacturing the power integrated circuit component by adopting the lead-out method is easy and simple.
Description
Technical Field
The invention relates to the technical field of power integrated circuit components, in particular to a multidirectional leading-out method for single-row in-line extending pins of an IC (integrated circuit) packaging body and a power integrated circuit component manufactured by applying the method.
Background
Common power integrated circuit components are automotive voltage regulators, motor controllers, power regulators, power modules, electronic switches, rectifiers, and the like. The manufacture of power integrated circuit components has begun to be assembled and manufactured using packages, for example, a conventional automotive voltage regulator is assembled using a package having 8 pins. In order to adapt to the assembly of a package body with 8 pins, the space layout of conducting strips of the automobile voltage regulator bracket adopts a three-dimensional crossing mode, the conducting strips are bent in the horizontal direction and also bent in the vertical direction (as shown in figure 1), and the pins of the package body are led out by means of the complex three-dimensional crossing mode of the conducting strips. In other words, if the number of pins extending in a single row and in a straight line is slightly larger, it is impossible to lead out the leads of all the pins by the conductive sheet solid-crossing manner described above, which restricts the use of packages having a larger number of pins and having more functions. In addition, the manufacturing process of the plastic bracket with the conductive sheet crossing three-dimensionally is complicated.
Disclosure of Invention
The invention aims to provide a multidirectional leading-out method of a single-row in-line extending pin of an IC packaging body and a power integrated circuit component manufactured by applying the method, which can lead out the pin of the IC packaging body with more pins in a multidirectional way, can manufacture the power integrated circuit component by using the packaging body with more pins, realizes the diversification of functions and enables the process of manufacturing the power integrated circuit component to be easy and simple.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a multi-direction lead-out method of a single-row and in-line extending pin of an IC package comprises the following steps:
step one, preparing an IC packaging body with pins extending out in a single row of straight lines, bending at least 1 pin of the IC packaging body upwards, and bending the pin again at a position higher than the upper surface of the IC packaging body, wherein the angle of the first bending is smaller than or equal to 90 degrees, and the tip of the second bent pin is parallel to the upper surface of the IC packaging body. The pins extend out from one side of the IC packaging body in a single row and in line, and the part of the pins welded with the metal conducting plate is a pin tip part;
preparing a plurality of metal conducting strips or preparing a plastic bracket embedded with the metal conducting strips, wherein the metal conducting strips embedded in the plastic bracket are distributed in an upper layer and a lower layer;
and step three, welding the metal conducting strips and the pins of the IC packaging body together in a welding mode, so that the pins extending out of the single-row straight lines of the IC packaging body are led out in multiple directions through the conducting strips.
Furthermore, at least 1 of the plurality of metal conducting strips in the second step is a metal conducting strip bent in the horizontal direction, and the bent metal conducting strip is in an L shape or an arc shape, or a multi-segment line shape or a spline curve shape.
Furthermore, at least 1 of the upper metal conductive sheets embedded in the plastic support in the second step is a metal conductive sheet bent in the horizontal direction, and the bent metal conductive sheet is in an L shape or an arc shape.
Another object of the present invention is to provide a power IC device manufactured by the multi-direction lead-out method using a single row of in-line protruding pins of an IC package. The method comprises the following steps:
a power integrated circuit component is manufactured by applying the multidirectional leading-out method of the single-row in-line extending pins of the IC packaging body and adopting an assembly process. Preparing an IC package with pins extending in a single row, bending at least 1 pin of the IC package upwards, and bending the pin again at a position higher than the upper surface of the IC package, wherein the tip part of the bent pin is parallel to the upper surface of the IC package. And preparing a plastic support embedded with a metal conducting strip, wherein the plastic support is provided with a cavity capable of accommodating the IC packaging body, and the embedded metal conducting strip is arranged in an upper layer and a lower layer. And (3) placing the IC packaging body bent for 2 times into a plastic support cavity, and welding the conductive sheet and the pins of the IC packaging body together in a welding mode. If more than 1 conducting strip in the upper layer metal conducting strip embedded in the plastic support is a metal conducting strip bent in the horizontal direction, the leading-out direction of the pins of the IC packaging body is more, namely the multi-direction leading-out effect is more obvious.
A power integrated circuit component is also prepared by applying the multidirectional leading-out method of the single-row in-line extending pins of the IC packaging body and adopting an injection molding process. Preparing an IC packaging body with pins extending out in a single row of straight lines, bending at least 1 pin of the IC packaging body upwards, and bending the pin again at a position higher than the upper surface of the IC packaging body, wherein the tip part of the bent pin is parallel to the upper surface of the IC packaging body; preparing a plurality of metal conducting strips; and welding the conducting strips and the pins of the IC packaging body together in a welding mode, putting the welded conducting strips and the pins into an injection mold, and manufacturing the power integrated circuit component by adopting an injection molding process. If more than 1 of the prepared metal conducting strips are horizontally bent, the lead-out directions of the pins of the IC package body are more, namely the multi-direction lead-out effect is more obvious.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts a pin multi-direction leading-out method to replace a vertical crossing method of a conducting plate in the prior art, under the same condition, the invention can lead out more pins in multiple directions, and can use a package body with more pins and more functions to manufacture a power integrated circuit part through an assembly process or an injection molding process.
2. The metal conducting strips of the plastic bracket adopted by the invention are arranged in an upper layer and a lower layer, most of the conducting strips are extended in a straight line, only a small number of the conducting strips are horizontally bent, and compared with the complex three-dimensional crossing mode of the metal conducting strips of the traditional bracket, namely the conducting strips bent in the horizontal direction and the conducting strips bent in the up-and-down direction, the manufacturing process of the bracket adopted by the invention is easy and simple. In addition, the processing yield of the plastic bracket with the complex three-dimensional crossed metal connecting sheet is not high, and the processing yield of the plastic bracket can be greatly improved.
Drawings
FIG. 1 is a prior art bracket for a voltage regulator of a vehicle
Fig. 2 is a schematic diagram of the pins of the IC package and the conductive pads of the support not yet connected together.
FIG. 3 is a schematic diagram of an IC package
FIG. 4 is a schematic view of a stent
FIG. 5 is a schematic diagram of the leads of the IC package being connected to the conductive pads of the carrier
FIG. 6 is a schematic view of a multidirectional lead-out method with 2 horizontally bent metal connecting sheets
FIG. 7 is a partial enlarged view of FIG. 6
Wherein:
1. a cavity; 2. the existing automobile voltage regulator bracket with a stereo crossing mode; 3. conductive strips extending in a row; 4. a bent pin; 5. pins in a row; 6. an IC package; 7, a bracket; reference numeral 3' denotes a horizontally bent conductive sheet.
The specific implementation mode is as follows:
the technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings and embodiments, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: as shown in fig. 2, 3, 4 and 5, a motor controller is assembled using an IC package having 8 pins. The used bracket 7 is provided with 8 conducting strips which are distributed on the upper and lower 2 layers of the bracket, 8 pins all extend out from one side of the IC packaging body, 4 pins in the 8 pins are bent upwards by 90 degrees and then bent again to 90 degrees in the horizontal direction at the position higher than the upper surface of the IC packaging body, the 4 pins are the bent pins 4, the rest 4 pins are pins 5 in the straight line, the bent pins 4 are welded with the conducting strips 3 extending from the straight line on the upper layer, the rest 4 pins are welded with the conducting strips 3 extending from the straight line on the same layer, and the IC packaging body 6 used for assembly is positioned in a cavity of the bracket 7.
Example 2: as shown in fig. 6 and 7, an automotive voltage regulator is assembled using an IC package having 8 pins. The used bracket 7 is provided with 8 conducting strips distributed on the upper and lower 2 layers of the bracket, 4 conducting strips in the 8 conducting strips are positioned at the lower layer of the bracket, 2 conducting strips positioned at the upper layer extend out in a straight line (the reference number in figure 6 is 3), 2 conducting strips extend out from the side surface of the bracket and are horizontally bent (the identification serial number in figure 6 is 3'), 4 pins in the 8 pins are bent upwards by 70 degrees and are bent towards the horizontal direction at the position higher than the upper surface of the IC packaging body by 70 degrees, and the 4 pins are the bent pins 4, the other 4 pins are straight pins 5, 8 pins all extend out from one side of the packaging body, the bent pin 4 is welded with 2 conductive sheets 3 extending in straight line and 2 horizontally bent conductive sheets 3' on the upper layer, the remaining 4 non-bent pins are soldered to the same layer of in-line projecting conductive strips 3.
Example 3: an automotive voltage regulator is applied with an IC package having 8 pins and is manufactured by injection molding. Bending 4 pins of the 8 pins upwards by 90 degrees and bending the pins to the horizontal direction again at positions higher than the upper surface of the IC packaging body by 90 degrees, wherein the tips of the 4 bent pins are parallel to the upper surface of the IC packaging body, all the other 4 pins extend in line, preparing 8 metal conducting plates, welding the 4 in-line conducting plates and the pins extending in the 4 in-line, all the other 4 metal conducting plates are bent in the horizontal direction, welding the 4 bent metal conducting plates and the bent 4 pins together, putting the packaging body welded with the conducting plates on the pins into an injection mold, and adopting an injection molding process to manufacture the automobile voltage regulator.
Claims (5)
1. A multi-direction lead-out method for a single-row in-line extending pin of an IC packaging body is characterized by comprising the following steps:
preparing an IC packaging body with pins extending out of a single row of straight lines, bending at least 1 pin of the IC packaging body upwards, and bending the pin again at a position higher than the upper surface of the IC packaging body, wherein the tip part of the bent pin is parallel to the upper surface of the packaged IC packaging body;
preparing a plurality of metal conducting strips or preparing a plastic bracket embedded with the metal conducting strips, wherein the metal conducting strips embedded in the plastic bracket are distributed in an upper layer and a lower layer;
and step three, welding the metal conducting plate and the pins of the IC packaging body together in a welding mode.
2. The method as claimed in claim 1, wherein at least 1 of the plurality of conductive metal strips in step two is a conductive metal strip bent in a horizontal direction.
3. The method as claimed in claim 1, wherein at least 1 of the upper metal conductive sheets embedded in the plastic frame in step two is a metal conductive sheet bent in the horizontal direction.
4. A power integrated circuit device fabricated by applying the multi-directional lead-out method and assembly process of the IC package of claim 1 or 3 to a single row of in-line protruding pins.
5. A power integrated circuit device, wherein the power integrated circuit device is manufactured by applying the multi-direction lead-out method and the injection molding process of the IC package of claim 1 or 2 to the single-row and in-line lead-out pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010070177.4A CN113130329A (en) | 2020-01-15 | 2020-01-15 | Multidirectional leading-out method for single-row in-line extending pins of IC packaging body and power integrated circuit component manufactured by applying same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010070177.4A CN113130329A (en) | 2020-01-15 | 2020-01-15 | Multidirectional leading-out method for single-row in-line extending pins of IC packaging body and power integrated circuit component manufactured by applying same |
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| Publication Number | Publication Date |
|---|---|
| CN113130329A true CN113130329A (en) | 2021-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010070177.4A Pending CN113130329A (en) | 2020-01-15 | 2020-01-15 | Multidirectional leading-out method for single-row in-line extending pins of IC packaging body and power integrated circuit component manufactured by applying same |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040155540A1 (en) * | 2003-02-12 | 2004-08-12 | Denso Corporation | Vehicle ac generator |
| JP2011004536A (en) * | 2009-06-19 | 2011-01-06 | Hitachi Automotive Systems Ltd | Ac generator for vehicle |
| WO2011040499A1 (en) * | 2009-10-01 | 2011-04-07 | 矢崎総業株式会社 | Connector with built-in function |
| CN105048721A (en) * | 2015-06-05 | 2015-11-11 | 上海法雷奥汽车电器系统有限公司 | Regulator for motor, and assembling method |
| CN205914866U (en) * | 2016-08-03 | 2017-02-01 | 徐州翔跃电子有限公司 | Vehicle controller IC welded structure that misplaces |
| CN107275295A (en) * | 2017-06-05 | 2017-10-20 | 深圳市力生美半导体股份有限公司 | A kind of power IC device, method for packing and supply unit |
-
2020
- 2020-01-15 CN CN202010070177.4A patent/CN113130329A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040155540A1 (en) * | 2003-02-12 | 2004-08-12 | Denso Corporation | Vehicle ac generator |
| JP2011004536A (en) * | 2009-06-19 | 2011-01-06 | Hitachi Automotive Systems Ltd | Ac generator for vehicle |
| WO2011040499A1 (en) * | 2009-10-01 | 2011-04-07 | 矢崎総業株式会社 | Connector with built-in function |
| CN105048721A (en) * | 2015-06-05 | 2015-11-11 | 上海法雷奥汽车电器系统有限公司 | Regulator for motor, and assembling method |
| CN205914866U (en) * | 2016-08-03 | 2017-02-01 | 徐州翔跃电子有限公司 | Vehicle controller IC welded structure that misplaces |
| CN107275295A (en) * | 2017-06-05 | 2017-10-20 | 深圳市力生美半导体股份有限公司 | A kind of power IC device, method for packing and supply unit |
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Application publication date: 20210716 |