CN113126723A - Method for setting chip radiator of electronic board card and electronic board card - Google Patents

Method for setting chip radiator of electronic board card and electronic board card Download PDF

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Publication number
CN113126723A
CN113126723A CN201911414325.3A CN201911414325A CN113126723A CN 113126723 A CN113126723 A CN 113126723A CN 201911414325 A CN201911414325 A CN 201911414325A CN 113126723 A CN113126723 A CN 113126723A
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chips
heat dissipation
temperature difference
chip
during operation
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王健伟
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Beijing Lynxi Technology Co Ltd
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Beijing Lynxi Technology Co Ltd
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Priority to CN201911414325.3A priority Critical patent/CN113126723A/en
Priority to PCT/CN2020/141311 priority patent/WO2021136356A1/en
Publication of CN113126723A publication Critical patent/CN113126723A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185—Mounting of expansion boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention provides a method for setting a chip radiator of an electronic board card (PCIe board card) and the electronic board card. According to the invention, the size of the heat dissipation teeth of the plurality of chips is adjusted to reduce the difference of temperature and realize the adjustment of a first level; and then the density of the radiating teeth is adjusted to realize more accurate adjustment of temperature difference. According to the invention, the sizes of the heat radiators of the chips are adjusted by constructing models of the chips and in a thermodynamic simulation mode, the density of the heat radiating teeth is adjusted, and the temperature difference between the chips during operation is reduced. The problem of short plate effect in the wooden barrel effect theory is solved, the front and back heat dissipation capacities are basically consistent, and a better design is realized, so that the temperature difference of a plurality of chips is reduced, and the energy efficiency is improved.

Description

Method for setting chip radiator of electronic board card and electronic board card
Technical Field
The invention belongs to the field of electronics and electric appliances, and relates to a method for arranging a chip radiator of an electronic board card and the electronic board card.
Background
As big data and deep learning get more and more applied, new requirements are also put on the underlying hardware and chips. Unlike traditional processors that emphasize "processing power," big data and deep learning applications tend to emphasize "computing power" as well as "energy efficiency ratio. Since feature extraction and processing in big data and deep learning application algorithms often use real-time computations, a high-computation-effort chip is required in order to complete the computation in as short a time as possible. On the other hand, the energy efficiency ratio is also an important index. The energy efficiency ratio refers to the energy required to complete a calculation, and the better the energy efficiency ratio, the less energy is consumed to complete the same calculation.
In the field of high-power chips, especially in the application scenario of chip array cascade, the heat dissipation optimization of chips is becoming more and more a focus of product design. For the condition that the working frequency and the power consumption of a double-chip board card or a multi-chip board card need to be adjusted to be consistent, accurate and quick adjustment is difficult, a complex algorithm is too complex, and the overall effect is not necessarily ideal.
The actual product condition is relatively complex, including installation and assembly processes, product manufacturing quality difference, distribution and layout of board cards in the whole machine, and the position of the whole machine in a system can influence the heat dissipation condition of chips in front of and behind the board cards.
In the case of a multi-chip large-scale cluster array, it is often desirable that the chips can work efficiently at the same frequency to exert the maximum advantage of the system, and how to optimize the temperature of the chips for heat dissipation as much as possible is always a problem how to fully exert the operational efficiency of each chip.
Disclosure of Invention
In view of this, the present disclosure provides a method for setting a PCIe board chip heat sink and a PCIe board: according to the method, firstly, the difference of the temperature is reduced through the height adjustment of the front and rear chip radiators, the adjustment of a first level is realized, and the optimization of the front and rear temperature of the chip within a certain range can be basically solved; the back is to the further optimization of front and back heat dissipation tooth density, realizes the adjustment of second grade, with the heat radiating area of system and system windage more optimized, can let the heat dissipation of system more balanced, the efficiency performance of chip is more excellent.
Specifically, the method comprises the following steps: the utility model provides a setting method of chip radiator of electron integrated circuit board, install a plurality of chips on the integrated circuit board, all be equipped with the radiator on every chip, every radiator all includes the base that produces heat conduction with the chip and sets up the heat dissipation tooth on the base, its characterized in that: the method comprises the following steps:
s01: first-stage heat dissipation adjustment: the size of the heat dissipation teeth of part or all of the radiators is adjusted, so that different heat dissipation of the chips is realized, and the temperature difference between the chips during operation is reduced; s02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the density of the radiating teeth of part or all of the radiators.
Alternatively, N01: first-stage heat dissipation adjustment: through the adjustment of the density of the radiating teeth of part or all of the radiators, different radiating of the chips is realized, and the temperature difference between the chips during operation is reduced; n02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the sizes of the radiating teeth of part or all of the radiators.
Preferably, the first stage heat dissipation adjustment: the sizes of the heat dissipation teeth of part or all of the radiators are adjusted by constructing models of a plurality of chips and in a thermodynamic simulation mode, so that the temperature difference between the plurality of chips during operation is reduced;
and (3) second-stage heat dissipation adjustment: by constructing a model of the chips, and adjusting the density of the radiating teeth of part or all of the radiators in a thermodynamic simulation mode, the temperature difference between the chips during operation is further reduced.
Preferably, in step S01, the temperature difference between the chips during operation is reduced by adjusting the height or length or width of the heat dissipation teeth;
in step S02, the temperature difference between the chips during operation is reduced by adjusting the number of the heat dissipation teeth.
Preferably, the temperature difference between the plurality of chips during operation is: the temperature difference between the multiple chips when the multiple chips operate at the preset frequency.
In addition this disclosure provides an electronic board card, install a plurality of chips on the integrated circuit board, all be equipped with the radiator on every chip, every radiator all includes the base that produces heat conduction with the chip and sets up the heat dissipation tooth on the base, and the height and/or the size of the heat dissipation tooth of part or whole radiator and/or the density of heat dissipation tooth set up differently, makes part or whole a plurality of chips realize different heat dissipations to reduce the difference in temperature between a plurality of chips when the operation.
Preferably, the heights and/or sizes of the radiating teeth of part or all of the radiators are different, so that the temperature difference between the chips during operation is reduced; the radiating teeth of part or all of the radiators are arranged in different densities, so that the temperature difference between a plurality of chips during operation is further reduced.
Preferably, the plurality of chips include first chip and second chip, and the air inlet end setting of cooling air that first chip is close to the integrated circuit board, and the air-out end setting that the second chip is close to the integrated circuit board cooling air.
Preferably, the electronic board is a PCIe board.
Preferably, the electronic board card is formed into a box shape, the plurality of chips and the plurality of heat sinks are located in the box, and the box is formed with an air inlet and an air outlet.
Preferably, the temperature difference between the plurality of chips during operation is: the temperature difference between the multiple chips when the multiple chips operate at the preset frequency.
Preferably, the plurality of chips are chips which need to work at the same frequency.
Preferably, the heat sinks of the plurality of chips have the same width and different heights, and the heights of the heat sinks corresponding to the plurality of chips are gradually increased along the flowing direction of the cooling wind.
Preferably, the heat sinks of the plurality of chips have the same height and different widths, and the heat sinks of the plurality of chips are from narrow to wide in the direction in which the cooling wind flows.
Preferably, the heat sinks of the plurality of chips are stepped from low to high along the flowing direction of the cooling wind; the air guide parts of the plurality of chips form a step shape from low to high along the flowing direction of the cooling air.
Preferably, the air guiding components of the plurality of chips are arranged on at least one side of the heat sink and are in a strip-shaped structure, the length direction of the strip-shaped structure is transverse to the flowing direction of the cooling air, and the length of the strip-shaped structure is from narrow to wide along the flowing direction of the cooling air.
In addition the present disclosure provides an electronic integrated device, characterized in that: the electronic card assembly comprises a plurality of electronic cards and integrates the electronic cards together.
Has the advantages that:
according to the setting method of the PCIe board chip radiator and the PCIe board, provided by the disclosure, the difference of temperature is reduced by adjusting the sizes of the plurality of chip radiating teeth, and the first level of adjustment is realized; and then the density of the radiating teeth is adjusted to realize more accurate adjustment of temperature difference. According to the method, the sizes of the plurality of chip radiators are adjusted, the density of the radiating teeth is adjusted, the temperature difference between the plurality of chips during operation is reduced, and the energy efficiency is improved by constructing a model of the plurality of chips and in a thermodynamic simulation mode.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. The drawings described below are merely some embodiments of the present disclosure, and other drawings may be derived from those drawings by those of ordinary skill in the art without inventive effort.
FIG. 1 is a schematic diagram of a PCIe card of the present invention.
Fig. 2 is a schematic diagram of a temperature curve of the PCIe board chip of the present invention.
FIG. 3 is a schematic diagram of multiple stages of PCIe cards of the present invention cascaded together.
Wherein: the heat dissipation structure comprises 1-PCIe board card, 2-first radiator, 3-second radiator, 4-air inlet end, 5-air outlet end, 6-connection interface, 21-first heat dissipation tooth and 31-second heat dissipation tooth.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar parts in the drawings, and thus, a repetitive description thereof will be omitted.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and so forth. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the disclosure.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various structures, these structures should not be limited by these terms. These terms are used to distinguish one structure from another structure. Thus, a first structure discussed below may be termed a second structure without departing from the teachings of the disclosed concept. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It is to be understood by those skilled in the art that the drawings are merely schematic representations of exemplary embodiments, and that the blocks or processes shown in the drawings are not necessarily required to practice the present disclosure and are, therefore, not intended to limit the scope of the present disclosure.
The following detailed description of embodiments of the invention is provided in conjunction with the accompanying figures 1-3:
as shown in fig. 1, in order to fully exert system performance in a limited device space during a specific product design process of the electronic board card, the PCIe board card 1 may adopt a layout manner of front and rear dual chips, where the front and rear dual chips are distributed front and rear in a flow direction of cooling air, for example. In the layout mode of the double chips, because the front chip is already cooled by cooling air entering the rear chip, the temperature of the front chip is higher, so that the rear chip always bears the heat of the front chip in the aspect of heat dissipation, the temperatures of the two chips are inconsistent, the temperature of the rear chip is far higher than that of the front chip, and the front temperature and the rear temperature are always different.
In the PCIe board 1, if the temperature difference between the front chip and the rear chip is large and the temperature of the rear chip is too high, calculation power needs to be fully exerted, and the calculation power needs to be exerted by designing a more complex algorithm at different frequencies of the chips; however, for the situation that the chip is connected in a matrix and needs to work at the same frequency, even if the chip is optimized through a complex algorithm, the lowest frequency can be used as a reference, and the computational power and the energy efficiency ratio of the chip are greatly reduced.
As shown in fig. 1, the electronic board card of the present disclosure has a plurality of chips mounted thereon, and the plurality of chips are all provided with a heat sink. All be equipped with the radiator on every chip, every radiator all includes the base that produces heat conduction effect with the chip and sets up the heat dissipation tooth on the base, and a plurality of chips include first chip and second chip, and first chip is equipped with first radiator 2, and first radiator 2 includes first heat dissipation tooth 21, and the second chip is equipped with second radiator 3, and second radiator 3 includes second heat dissipation tooth 31, and the height of the second heat dissipation tooth 31 that highly is less than the second chip of first heat dissipation tooth 21. The first chip is close to the air inlet end 4 setting of the cooling air of integrated circuit board, and the second chip is close to the air outlet end 5 setting of integrated circuit board cooling air.
The electronic board card is a PCIe board card 1. The electronic board card is formed into a box shape, the plurality of chips and the plurality of radiators are located in the box, and the box is formed with an air inlet and an air outlet.
The radiators of the chips have the same width and different heights, and the heights of the radiators corresponding to the chips are gradually increased along the flowing direction of the cooling air.
The heat sinks of the plurality of chips have the same height and different widths, and are narrow to wide in the direction in which the cooling wind flows.
The radiators of the chips form a step shape from low to high along the flowing direction of the cooling air; the air guide parts of the plurality of chips form a step shape from low to high along the flowing direction of the cooling air.
The air guide parts of the chips are arranged on at least one side of the radiator and are of strip-shaped structures, the length direction of each strip-shaped structure is transverse to the flowing direction of cooling air and along the flowing direction of the cooling air, and the length of each strip-shaped structure is from narrow to wide. The foregoing situation is applicable to the situation where the widths of the heat sinks are different, for example, the width of the heat sink corresponding to the first chip is smaller than the width of the heat sink corresponding to the second chip, and the elongated structure is disposed on at least one side of the heat sink corresponding to the first chip, so that the cooling air of the latter heat sink can be affected.
The utility model provides a method for setting chip radiator of electronic board card, install a plurality of chips on the integrated circuit board, all be equipped with the radiator on a plurality of chips, the radiator is formed with a plurality of heat dissipation teeth, includes following step: s01: first-stage heat dissipation adjustment: the size of the heat dissipation teeth of part or all of the radiators is adjusted, so that different heat dissipation of the chips is realized, and the temperature difference between the chips during operation is reduced; s02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the density of the radiating teeth of part or all of the radiators.
Likewise, the present invention may also be used to reduce temperature differences between chips as follows: n01: first-stage heat dissipation adjustment: through the adjustment of the density of the radiating teeth of part or all of the radiators, different radiating of the chips is realized, and the temperature difference between the chips during operation is reduced; n02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the sizes of the radiating teeth of part or all of the radiators.
First-stage heat dissipation adjustment: the sizes of the heat dissipation teeth of part or all of the radiators are adjusted by constructing models of a plurality of chips and in a thermodynamic simulation mode, so that the temperature difference between the plurality of chips during operation is reduced; and (3) second-stage heat dissipation adjustment: by constructing a model of the chips, and adjusting the density of the radiating teeth of part or all of the radiators in a thermodynamic simulation mode, the temperature difference between the chips during operation is further reduced. In step S01, the temperature difference between the chips during operation is reduced by adjusting the height, length, or width of the heat dissipation teeth; in step S02, the temperature difference between the chips during operation is reduced by adjusting the number of the heat dissipation teeth.
The temperature difference between the plurality of chips during operation is as follows: the temperature difference between the multiple chips when the multiple chips operate at the preset frequency.
As shown in fig. 3, the present disclosure also provides an electronic integrated device, which includes a plurality of electronic boards of the present disclosure, and integrates the plurality of electronic boards together.
In the disclosure, through two-stage gradual control, firstly, the height of the heat dissipation teeth is adjusted by analyzing the heat productivity of the chip, so as to realize the optimization of the first stage, and then, through the optimization of the heat dissipation teeth, the number of different heat dissipation teeth is optimized for secondary optimization, so as to realize the further optimization of the heat dissipation effect.
As shown in fig. 2 and table one, illustrating the temperature condition of the optimized chip of the first stage using the heat sink of the present disclosure, the optimal temperature position and heat sink tooth height are found by first through the height difference of the front and rear heat sink teeth and through simulation. Specifically, as shown in table one:
Figure BDA0002350788940000081
watch 1
The results of the temperature profile of the optimized chip of the first stage of the heat spreader of the present disclosure are shown in table two.
Figure BDA0002350788940000082
Figure BDA0002350788940000091
Watch two
The temperature control method and the temperature control device solve the problem that when two chips or a plurality of chips work at the same frequency, the temperature control can be more accurate for the multi-chip array cascade condition, and the superior system level working effect is realized. Compared with the traditional mode, the scheme has two-stage control, can carry out finer quantization control, and can solve the problem that each chip can relatively exert the effect of maximum performance when multiple chips work at the same frequency.
Under the condition of not increasing the cost of the vapor chamber or the heat pipe, the operation performance of the multiple chips can be effectively optimized, the barrel effect during the same-frequency work can be effectively avoided, and the comprehensive operation performance of the chips of the whole system can achieve better effect.
In the use of a product with interconnected multi-stage chip arrays, the temperature balance between front and rear chips is realized through the height optimization of the first-stage radiating teeth and the density optimization of the second-stage radiating teeth, so that the performance of a chip array system is more optimized.
The chip heat dissipation device mainly focuses on heat dissipation of high-power chips, particularly, the chips are expected to work at similar temperature at the same frequency, the chips are mutually cascaded, the chip heat dissipation device can be expanded to other product forms, the design ideas are similar, in a multi-stage chip array or similar conditions, the temperatures of front and rear chips or heating modules are required to be similar as much as possible, the heat dissipation problem of a system level is solved, the heat dissipation teeth of a heat radiator can be further optimized through adjusting the height, width or length of the heat radiator, on the basis, the temperature of the heat dissipation teeth of the heat radiator can be further optimized, and finally the chips or the heating modules can be similar in temperature, so that.
In the present disclosure, the applicable scenarios are not only the same, but also optimized and solved by adopting the idea in order to solve the difference of the heating temperatures of the chips with different sequencing in the scenarios with different power consumptions and different chips, and the product form is not only as shown in the legend, and mainly adopts the related idea to optimize the radiator and optimize the system heat dissipation.
Has the advantages that:
the PCIe board 1 comprises a plurality of chips, a plurality of radiators are correspondingly arranged on the chips, and a plurality of radiating teeth are formed on the radiators. According to the method, the size of a plurality of chip radiating teeth is adjusted, so that the difference of temperature is reduced, and the adjustment of a first level is realized; and then the density of the radiating teeth is adjusted to realize more accurate adjustment of temperature difference. According to the method, the sizes of the plurality of chip radiators are adjusted by constructing models of the plurality of chips and in a thermodynamic simulation mode, the density of the radiating teeth is adjusted, and the temperature difference between the plurality of chips during operation is reduced. The problem of short plate effect in the wooden barrel effect theory is solved, the front and back heat dissipation capacities are basically consistent, and a better design is realized, so that the temperature difference of a plurality of chips is reduced, and the energy efficiency is improved.
Exemplary embodiments of the present disclosure are specifically illustrated and described above. It is to be understood that the present disclosure is not limited to the precise arrangements, instrumentalities, or instrumentalities described herein; on the contrary, the disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (11)

1. A method for setting a chip radiator of an electronic board card is characterized in that a plurality of chips are mounted on the board card, a radiator is arranged on each chip, each radiator comprises a base and radiating teeth, the base and the radiating teeth are arranged on the base, the base and the radiating teeth generate heat conduction effects with the chips, and the method comprises the following steps:
s01: first-stage heat dissipation adjustment: the size of the heat dissipation teeth of part or all of the radiators is adjusted, so that different heat dissipation of the chips is realized, and the temperature difference between the chips during operation is reduced;
s02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the density of the radiating teeth of part or all of the radiators;
alternatively, N01: first-stage heat dissipation adjustment: through the adjustment of the density of the radiating teeth of part or all of the radiators, different radiating of the chips is realized, and the temperature difference between the chips during operation is reduced; n02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the sizes of the radiating teeth of part or all of the radiators.
2. The setting method according to claim 1, characterized in that: first-stage heat dissipation adjustment: the sizes of the heat dissipation teeth of part or all of the radiators are adjusted by constructing models of a plurality of chips and in a thermodynamic simulation mode, so that the temperature difference between the plurality of chips during operation is reduced;
and (3) second-stage heat dissipation adjustment: by constructing a model of the chips, and adjusting the density of the radiating teeth of part or all of the radiators in a thermodynamic simulation mode, the temperature difference between the chips during operation is further reduced.
3. The setting method according to claim 2, characterized in that: in S01 or N02, the temperature difference between a plurality of chips during operation is reduced by adjusting the height, length or width of the heat dissipation teeth;
and in the S02 or N01, the temperature difference between a plurality of chips during operation is reduced by adjusting the number of the heat dissipation teeth.
4. The setting method according to any one of claims 1 to 3, characterized in that: the temperature difference between the plurality of chips during operation is as follows: the temperature difference between the multiple chips when the multiple chips operate at the preset frequency.
5. The utility model provides an electronic board card, install a plurality of chips on the integrated circuit board, all be equipped with the radiator on every chip, every radiator all includes the base that produces heat conduction with the chip and sets up the heat dissipation tooth on the base, its characterized in that: the height and/or size of the radiating teeth of part or all of the radiators and/or the density of the radiating teeth are different, so that different heat radiation of part or all of the chips is realized, and the temperature difference between the chips during operation is reduced.
6. The electronic board of claim 5, wherein: the heights and/or sizes of the radiating teeth of part or all of the radiators are different, so that the temperature difference between the multiple chips during operation is reduced;
the radiating teeth of part or all of the radiators are arranged in different densities, so that the temperature difference between a plurality of chips during operation is further reduced.
7. The electronic board of claim 6, wherein: the plurality of chips comprise a first chip and a second chip, the first chip is arranged close to the air inlet end of the cooling air of the board card, and the second chip is arranged close to the air outlet end of the cooling air of the board card.
8. The electronic board card of any of claims 5-7, wherein: the electronic board card is a PCIe board card.
9. The electronic board of claim 8, wherein: the electronic board card is formed into a box shape, the plurality of chips and the plurality of radiators are located in the box, and the box is formed with an air inlet and an air outlet.
10. An electronic integrated device, comprising: comprising a plurality of electronic boards according to any of claims 5-9 and integrating said plurality of electronic boards together.
11. A method of arranging a chip heat sink for an electronic card according to any of claims 1 to 4, or an electronic card according to any of claims 5 to 9, or an electronic integrated device according to claim 10, characterized in that: the plurality of chips are chips which need to work at the same frequency.
CN201911414325.3A 2019-12-31 2019-12-31 Method for setting chip radiator of electronic board card and electronic board card Pending CN113126723A (en)

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CN201911414325.3A CN113126723A (en) 2019-12-31 2019-12-31 Method for setting chip radiator of electronic board card and electronic board card
PCT/CN2020/141311 WO2021136356A1 (en) 2019-12-31 2020-12-30 Electronic board card and method for arranging chip heat sink of electronic board card

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023109411A1 (en) * 2021-12-13 2023-06-22 北京比特大陆科技有限公司 Chip array and electronic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023109411A1 (en) * 2021-12-13 2023-06-22 北京比特大陆科技有限公司 Chip array and electronic device

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