CN211577806U - Electronic board card, integrated device and computing equipment - Google Patents
Electronic board card, integrated device and computing equipment Download PDFInfo
- Publication number
- CN211577806U CN211577806U CN201922481309.8U CN201922481309U CN211577806U CN 211577806 U CN211577806 U CN 211577806U CN 201922481309 U CN201922481309 U CN 201922481309U CN 211577806 U CN211577806 U CN 211577806U
- Authority
- CN
- China
- Prior art keywords
- chips
- heat dissipation
- chip
- electronic
- teeth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides an electron integrated circuit board, integrated device and computing equipment, the electron integrated circuit board includes a plurality of chips, and the correspondence is provided with a plurality of radiators on a plurality of chips, the radiator is formed with a plurality of heat dissipation teeth. The utility model firstly realizes the reduction of temperature difference and the adjustment of the first level through the size adjustment of a plurality of chip radiating teeth; and then the density of the radiating teeth is adjusted to realize more accurate adjustment of temperature difference. The utility model discloses a model of a plurality of chips founds, through the mode of thermodynamic simulation, adjusts the size of a plurality of chip radiators, and the density of adjustment heat dissipation tooth reduces the difference in temperature between a plurality of chips when the operation. The problem of short plate effect in the wooden barrel effect theory is solved, the front and back heat dissipation capacities are basically consistent, and a better design is realized, so that the temperature difference of a plurality of chips is reduced, and the energy efficiency is improved.
Description
Technical Field
The utility model belongs to electron, electrical apparatus field relate to an electron integrated circuit board, integrated device and computing equipment.
Background
As big data and deep learning get more and more applied, new requirements are also put on the underlying hardware and chips. Unlike traditional processors that emphasize "processing power," big data and deep learning applications tend to emphasize "computing power" as well as "energy efficiency ratio. Since feature extraction and processing in big data and deep learning application algorithms often use real-time computations, a high-computation-effort chip is required in order to complete the computation in as short a time as possible. On the other hand, the energy efficiency ratio is also an important index. The energy efficiency ratio refers to the energy required to complete a calculation, and the better the energy efficiency ratio, the less energy is consumed to complete the same calculation.
In the field of high-power chips, especially in the application scenario of chip array cascade, the heat dissipation optimization of chips is becoming more and more a focus of product design. For the condition that the working frequency and the power consumption of a double-chip board card or a multi-chip board card need to be adjusted to be consistent, accurate and quick adjustment is difficult, a complex algorithm is too complex, and the overall effect is not necessarily ideal.
The actual product condition is relatively complex, including installation and assembly processes, product manufacturing quality difference, distribution and layout of board cards in the whole machine, and the position of the whole machine in a system can influence the heat dissipation condition of chips in front of and behind the board cards.
In the case of a multi-chip large-scale cluster array, it is often desirable that the chips can work efficiently at the same frequency to exert the maximum advantage of the system, and how to optimize the temperature of the chips for heat dissipation as much as possible is always a problem how to fully exert the operational efficiency of each chip.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an electronic board card, integrated device and computing equipment.
The utility model firstly realizes the reduction of the temperature difference and the adjustment of the first level through the height adjustment of the front and the rear chip radiators, and can basically solve the optimization of the front and the rear chip temperatures within a certain range; the back is to the further optimization of front and back heat dissipation tooth density, realizes the adjustment of second grade, with the heat radiating area of system and system windage more optimized, can let the heat dissipation of system more balanced, the efficiency performance of chip is more excellent.
The utility model provides an electronic board card installs a plurality of chips on it, all is equipped with the radiator on every chip, and every radiator all includes the base that produces heat-conduction effect with the chip and sets up the heat dissipation tooth on the base, and the heat radiating area of the heat dissipation tooth of part or whole radiator and/or the density of heat dissipation tooth set up differently, make the heat dissipation of part or whole a plurality of chips realization difference to reduce the difference in temperature between a plurality of chips when the operation.
Preferably, the plurality of chips are sequentially arranged along a direction in which cooling air flows and gradually increase the heat dissipation area of the heat dissipation teeth of the corresponding heat sink.
Preferably, the heat dissipation teeth of the plurality of chips have the same width and different heights, and the heights of the heat dissipation teeth of the plurality of chips corresponding to the heat sink are gradually increased along the flowing direction of the cooling wind.
Preferably, the plurality of chips comprise a first chip and a second chip, the first chip is arranged close to the air inlet end of the cooling air of the board card, and the second chip is arranged close to the air outlet end of the cooling air of the board card; the height of the heat dissipation teeth of the first chip is smaller than that of the heat dissipation teeth of the second chip.
Preferably, the heights of the heat dissipation teeth of some or all of the heat sinks are different, and the density of the heat dissipation teeth of some or all of the heat sinks is different.
Preferably, the electronic board card is formed into a box shape, the plurality of chips and the plurality of heat sinks are located in the box, and the box is formed with an air inlet and an air outlet.
Preferably, the plurality of chips are chips operating at the same frequency.
Preferably, the electronic board card is a PCIe card.
Preferably, the heat sinks of the plurality of chips have the same width and different heights, and the heights of the heat sinks corresponding to the plurality of chips are gradually increased along the flowing direction of the cooling wind.
Preferably, the heat sinks of the plurality of chips have the same height and different widths, and the heat sinks of the plurality of chips are from narrow to wide in the direction in which the cooling wind flows.
Preferably, the heat sinks of the plurality of chips are stepped from low to high along the flowing direction of the cooling wind; the air guide parts of the plurality of chips form a step shape from low to high along the flowing direction of the cooling air.
Preferably, the air guiding components of the plurality of chips are arranged on at least one side of the heat sink and are in a strip-shaped structure, the length direction of the strip-shaped structure is transverse to the flowing direction of the cooling air, and the length of the strip-shaped structure is from narrow to wide along the flowing direction of the cooling air.
Additionally the utility model provides an electronic integration device, which comprises a plurality of the utility model discloses arbitrary one the electronic board card, and will a plurality of electronic board cards are integrated together.
In addition the utility model provides a computing device, including above-mentioned arbitrary electron integrated device or electron integrated device.
Has the advantages that:
according to the setting method of the PCIe board chip radiator and the PCIe board, provided by the disclosure, the difference of temperature is reduced by adjusting the sizes of the plurality of chip radiating teeth, and the first level of adjustment is realized; and then the density of the radiating teeth is adjusted to realize more accurate adjustment of temperature difference. According to the method, the sizes of the plurality of chip radiators are adjusted, the density of the radiating teeth is adjusted, the temperature difference between the plurality of chips during operation is reduced, and the energy efficiency is improved by constructing a model of the plurality of chips and in a thermodynamic simulation mode.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent by describing in detail exemplary embodiments thereof with reference to the attached drawings. The drawings described below are merely some embodiments of the present disclosure, and other drawings may be derived from those drawings by those of ordinary skill in the art without inventive effort.
Fig. 1 the utility model discloses a PCIe integrated circuit board schematic diagram.
Fig. 2 the utility model discloses a temperature curve schematic diagram of PCIe integrated circuit board chip.
Fig. 3 is a schematic diagram of multiple PCIe board cards cascaded together.
Wherein: the heat dissipation structure comprises 1-PCIe board card, 2-first radiator, 3-second radiator, 4-air inlet end, 5-air outlet end, 6-connection interface, 21-first heat dissipation tooth and 31-second heat dissipation tooth.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals denote the same or similar parts in the drawings, and thus, a repetitive description thereof will be omitted.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the subject matter of the present disclosure can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and so forth. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the disclosure.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various structures, these structures should not be limited by these terms. These terms are used to distinguish one structure from another structure. Thus, a first structure discussed below may be termed a second structure without departing from the teachings of the disclosed concept. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It is to be understood by those skilled in the art that the drawings are merely schematic representations of exemplary embodiments, and that the blocks or processes shown in the drawings are not necessarily required to practice the present disclosure and are, therefore, not intended to limit the scope of the present disclosure.
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings 1-3:
as shown in fig. 1, in order to fully exert system performance in a limited device space during a specific product design process of the electronic board card, the PCIe board card 1 may adopt a layout manner of front and rear dual chips, where the front and rear dual chips are distributed front and rear in a flow direction of cooling air, for example. In the layout mode of the double chips, because the front chip is already cooled by cooling air entering the rear chip, the temperature of the front chip is higher, so that the rear chip always bears the heat of the front chip in the aspect of heat dissipation, the temperatures of the two chips are inconsistent, the temperature of the rear chip is far higher than that of the front chip, and the front temperature and the rear temperature are always different.
In the PCIe board 1, if the temperature difference between the front chip and the rear chip is large and the temperature of the rear chip is too high, calculation power needs to be fully exerted, and the calculation power needs to be exerted by designing a more complex algorithm at different frequencies of the chips; however, for the situation that the chip is connected in a matrix and needs to work at the same frequency, even if the chip is optimized through a complex algorithm, the lowest frequency can be used as a reference, and the computational power and the energy efficiency ratio of the chip are greatly reduced.
As shown in fig. 1, the electronic board card of the present disclosure has a plurality of chips mounted thereon, and the plurality of chips are all provided with a heat sink. All be equipped with the radiator on every chip, every radiator all includes the base that produces heat conduction effect with the chip and sets up the heat dissipation tooth on the base, and a plurality of chips include first chip and second chip, and first chip is equipped with first radiator 2, and first radiator 2 includes first heat dissipation tooth 21, and the second chip is equipped with second radiator 3, and second radiator 3 includes second heat dissipation tooth 31, and the height of the second heat dissipation tooth 31 that highly is less than the second chip of first heat dissipation tooth 21. The first chip is close to the air inlet end 4 setting of the cooling air of integrated circuit board, and the second chip is close to the air outlet end 5 setting of integrated circuit board cooling air.
The electronic board card is a PCIe board card 1. The electronic board card is formed into a box shape, the plurality of chips and the plurality of radiators are located in the box, and the box is formed with an air inlet and an air outlet.
The radiators of the chips have the same width and different heights, and the heights of the radiators corresponding to the chips are gradually increased along the flowing direction of the cooling air.
The heat sinks of the plurality of chips have the same height and different widths, and are narrow to wide in the direction in which the cooling wind flows.
The radiators of the chips form a step shape from low to high along the flowing direction of the cooling air; the air guide parts of the plurality of chips form a step shape from low to high along the flowing direction of the cooling air.
The air guide parts of the chips are arranged on at least one side of the radiator and are of strip-shaped structures, the length direction of each strip-shaped structure is transverse to the flowing direction of cooling air and along the flowing direction of the cooling air, and the length of each strip-shaped structure is from narrow to wide. The foregoing situation is applicable to the situation where the widths of the heat sinks are different, for example, the width of the heat sink corresponding to the first chip is smaller than the width of the heat sink corresponding to the second chip, and the elongated structure is disposed on at least one side of the heat sink corresponding to the first chip, so that the cooling air of the latter heat sink can be affected.
The utility model provides a method for setting chip radiator of electronic board card, install a plurality of chips on the integrated circuit board, all be equipped with the radiator on a plurality of chips, the radiator is formed with a plurality of heat dissipation teeth, includes following step: s01: first-stage heat dissipation adjustment: the size of the heat dissipation teeth of part or all of the radiators is adjusted, so that different heat dissipation of the chips is realized, and the temperature difference between the chips during operation is reduced; s02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the density of the radiating teeth of part or all of the radiators.
Similarly, the present invention can also adopt the following method to reduce the temperature difference between chips: n01: first-stage heat dissipation adjustment: through the adjustment of the density of the radiating teeth of part or all of the radiators, different radiating of the chips is realized, and the temperature difference between the chips during operation is reduced; n02: and (3) second-stage heat dissipation adjustment: the temperature difference between a plurality of chips during operation is further reduced by adjusting the sizes of the radiating teeth of part or all of the radiators.
First-stage heat dissipation adjustment: the sizes of the heat dissipation teeth of part or all of the radiators are adjusted by constructing models of a plurality of chips and in a thermodynamic simulation mode, so that the temperature difference between the plurality of chips during operation is reduced; and (3) second-stage heat dissipation adjustment: by constructing a model of the chips, and adjusting the density of the radiating teeth of part or all of the radiators in a thermodynamic simulation mode, the temperature difference between the chips during operation is further reduced. In step S01, the temperature difference between the chips during operation is reduced by adjusting the height, length, or width of the heat dissipation teeth; in step S02, the temperature difference between the chips during operation is reduced by adjusting the number of the heat dissipation teeth.
The temperature difference between the plurality of chips during operation is as follows: the temperature difference between the multiple chips when the multiple chips operate at the preset frequency.
As shown in fig. 3, the present disclosure also provides an electronic integrated device, which includes a plurality of electronic boards of the present disclosure, and integrates the plurality of electronic boards together.
In the disclosure, through two-stage gradual control, firstly, the height of the heat dissipation teeth is adjusted by analyzing the heat productivity of the chip, so as to realize the optimization of the first stage, and then, through the optimization of the heat dissipation teeth, the number of different heat dissipation teeth is optimized for secondary optimization, so as to realize the further optimization of the heat dissipation effect.
As shown in fig. 2 and table one, illustrating the temperature condition of the optimized chip of the first stage using the heat sink of the present disclosure, the optimal temperature position and heat sink tooth height are found by first through the height difference of the front and rear heat sink teeth and through simulation. Specifically, as shown in table one:
The results of the temperature profile of the optimized chip of the first stage of the heat spreader of the present disclosure are shown in table two.
Watch two
The temperature control method and the temperature control device solve the problem that when two chips or a plurality of chips work at the same frequency, the temperature control can be more accurate for the multi-chip array cascade condition, and the superior system level working effect is realized. Compared with the traditional mode, the scheme has two-stage control, can carry out finer quantization control, and can solve the problem that each chip can relatively exert the effect of maximum performance when multiple chips work at the same frequency. Under the condition of not increasing the cost of the vapor chamber or the heat pipe, the operation performance of the multiple chips can be effectively optimized, the barrel effect during the same-frequency work can be effectively avoided, and the comprehensive operation performance of the chips of the whole system can achieve better effect.
In the use of a product with interconnected multi-stage chip arrays, the temperature balance between front and rear chips is realized through the height optimization of the first-stage radiating teeth and the density optimization of the second-stage radiating teeth, so that the performance of a chip array system is more optimized.
The chip heat dissipation device mainly focuses on heat dissipation of high-power chips, particularly, the chips are expected to work at similar temperature at the same frequency, the chips are mutually cascaded, the chip heat dissipation device can be expanded to other product forms, the design ideas are similar, in a multi-stage chip array or similar conditions, the temperatures of front and rear chips or heating modules are required to be similar as much as possible, the heat dissipation problem of a system level is solved, the heat dissipation teeth of a heat radiator can be further optimized through adjusting the height, width or length of the heat radiator, on the basis, the temperature of the heat dissipation teeth of the heat radiator can be further optimized, and finally the chips or the heating modules can be similar in temperature, so that.
The present disclosure also provides a computing device including the electronic board card or the electronic integrated device of the present disclosure.
In the present disclosure, the applicable scenario is not only the same, but also the idea can be adopted to optimize and solve the problem of different heating temperatures of chips with different power consumptions and different chips, and the product form is not only as shown in the figure, and the related idea is mainly adopted to optimize the radiator and optimize the system heat dissipation.
Has the advantages that:
the PCIe board 1 comprises a plurality of chips, a plurality of radiators are correspondingly arranged on the chips, and a plurality of radiating teeth are formed on the radiators. According to the method, the size of a plurality of chip radiating teeth is adjusted, so that the difference of temperature is reduced, and the adjustment of a first level is realized; and then the density of the radiating teeth is adjusted to realize more accurate adjustment of temperature difference. According to the method, the sizes of the plurality of chip radiators are adjusted by constructing models of the plurality of chips and in a thermodynamic simulation mode, the density of the radiating teeth is adjusted, and the temperature difference between the plurality of chips during operation is reduced. The problem of short plate effect in the wooden barrel effect theory is solved, the front and back heat dissipation capacities are basically consistent, and a better design is realized, so that the temperature difference of a plurality of chips is reduced, and the energy efficiency is improved.
Exemplary embodiments of the present disclosure are specifically illustrated and described above. It is to be understood that the present disclosure is not limited to the precise arrangements, instrumentalities, or instrumentalities described herein; on the contrary, the disclosure is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (10)
1. The utility model provides an electron integrated circuit board, install a plurality of chips on the electron integrated circuit board, all be equipped with the radiator on every chip, every radiator all includes the base that produces heat conduction with the chip and sets up the heat dissipation tooth on the base, its characterized in that: the heat dissipation area of the heat dissipation teeth of part or all of the heat radiators is different from the density of the heat dissipation teeth, so that different heat dissipation of part or all of the chips is realized, and the temperature difference between the chips during operation is reduced.
2. The electronic board of claim 1, wherein: the plurality of chips are sequentially arranged along the flowing direction of cooling air and gradually increase the heat dissipation area of the heat dissipation teeth of the corresponding heat radiator.
3. The electronic board of claim 2, wherein: the heat dissipation teeth of the plurality of chips have the same width and different heights, and the heights of the heat dissipation teeth of the plurality of chips corresponding to the radiator are gradually increased along the flowing direction of the cooling air.
4. The electronic board of claim 3, wherein: the plurality of chips comprise a first chip and a second chip, the first chip is arranged close to the air inlet end of the cooling air of the board card, and the second chip is arranged close to the air outlet end of the cooling air of the board card; the height of the heat dissipation teeth of the first chip is smaller than that of the heat dissipation teeth of the second chip.
5. The electronic board of claim 2, wherein: the heights of the heat dissipation teeth of part or all of the radiators are different, and the density of the heat dissipation teeth of part or all of the radiators is different.
6. The electronic board card of any of claims 1-4, wherein: the electronic board card is formed into a box shape, the plurality of chips and the plurality of radiators are located in the box, and the box is formed with an air inlet and an air outlet.
7. The electronic board card of any of claims 1-4, wherein: the chips are same-frequency working chips.
8. The electronic board card of any of claims 1-4, wherein: the electronic board card is a PC ie card.
9. An electronic integrated device, comprising: comprising a plurality of electronic boards according to any of claims 1-8 and integrating said plurality of electronic boards together.
10. A computing device, comprising: the electronic card of any one of claims 1-8 or the electronic integrated device of claim 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922481309.8U CN211577806U (en) | 2019-12-31 | 2019-12-31 | Electronic board card, integrated device and computing equipment |
| PCT/CN2020/141311 WO2021136356A1 (en) | 2019-12-31 | 2020-12-30 | Electronic board card and method for arranging chip heat sink of electronic board card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922481309.8U CN211577806U (en) | 2019-12-31 | 2019-12-31 | Electronic board card, integrated device and computing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211577806U true CN211577806U (en) | 2020-09-25 |
Family
ID=72553591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922481309.8U Active CN211577806U (en) | 2019-12-31 | 2019-12-31 | Electronic board card, integrated device and computing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211577806U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021136356A1 (en) * | 2019-12-31 | 2021-07-08 | 北京灵汐科技有限公司 | Electronic board card and method for arranging chip heat sink of electronic board card |
-
2019
- 2019-12-31 CN CN201922481309.8U patent/CN211577806U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021136356A1 (en) * | 2019-12-31 | 2021-07-08 | 北京灵汐科技有限公司 | Electronic board card and method for arranging chip heat sink of electronic board card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112151478B (en) | Micro-channel radiator and preparation method and application thereof | |
| WO2013167203A1 (en) | Cooling system and method for cooling radio unit | |
| CN108256272B (en) | S-shaped flow passage layout optimization design method for liquid cooling radiator | |
| CN211577806U (en) | Electronic board card, integrated device and computing equipment | |
| US9837956B2 (en) | Heat exchanger for photovoltaic panels | |
| CN114141733A (en) | Hierarchical formula manifold microchannel heat abstractor | |
| CN113126723A (en) | Method for setting chip radiator of electronic board card and electronic board card | |
| CN211577832U (en) | Electronic board card and electronic integrated device | |
| CN213987154U (en) | Heat dissipation module and projection device | |
| Elnaggar | Heat transfer enhancement by heat sink fin arrangement in electronic cooling | |
| CN113126722A (en) | Method for setting chip radiator of electronic board card and electronic board card | |
| Ji et al. | Layout design of conductive heat channel by emulating natural branch systems | |
| WO2021136356A1 (en) | Electronic board card and method for arranging chip heat sink of electronic board card | |
| CN103413007A (en) | Optimization design method for semiconductor cooling module | |
| CN212084098U (en) | Computer hardware heat abstractor | |
| CN210402260U (en) | Radiating fin with good radiating efficiency | |
| CN216795614U (en) | Fin radiator | |
| CN112437590A (en) | Novel heat dissipation device | |
| CN219105446U (en) | Portable computer cooling fin | |
| CN212901933U (en) | Electric control heat radiation structure of photovoltaic air conditioner | |
| CN217116738U (en) | Polyhedral heat dissipation device | |
| CN214046465U (en) | Automatically controlled box heat abstractor | |
| CN219352226U (en) | Heat radiation structure of motor controller | |
| CN217278680U (en) | Test tool capable of meeting standard module air cooling | |
| CN113905589B (en) | Radiator module suitable for electronic circuit observes and controls field |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |