CN113126667A - Semiconductor device and temperature control method thereof - Google Patents
Semiconductor device and temperature control method thereof Download PDFInfo
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- CN113126667A CN113126667A CN202010048886.2A CN202010048886A CN113126667A CN 113126667 A CN113126667 A CN 113126667A CN 202010048886 A CN202010048886 A CN 202010048886A CN 113126667 A CN113126667 A CN 113126667A
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1931—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of one space
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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Abstract
A semiconductor device comprises a cooling system, wherein the cooling system comprises a cooling device and a supply module, the cooling device comprises a containing cavity, an outlet end and a feeding end; the accommodating cavity is used for storing the coolant, the outlet end outputs the coolant stored in the accommodating cavity, and the inlet end is used for receiving the coolant supplemented into the accommodating cavity; the supply module comprises a feed valve, a control module and a first sensing module, the first sensing module is used for sensing a first parameter of the coolant in the supply module, and the control module is used for judging whether the coolant in the supply module can be mixed with the coolant in the accommodating cavity according to the first parameter and controlling the feed valve to be opened and closed according to a judgment result; the feed valve is connected to the feed end, and when the feed valve is opened, the coolant in the supply module is injected into the receiving cavity through the feed end. The invention can improve the stability of temperature control of the semiconductor device. The invention also provides a temperature control method of the semiconductor equipment.
Description
Technical Field
The present invention relates to a semiconductor device and a temperature control method thereof.
Background
Temperature control of wafers (wafers) is important in the processing of semiconductors. In processing a wafer, the wafer is typically positioned on an Electrostatic chuck (Electrostatic chuck) of a processing chamber. As shown in fig. 1, the conventional cooling apparatus 1 removes heat generated during a process by supplying a coolant to an electrostatic chuck 400. The coolant is vaporized during the circulation process, and therefore, the coolant needs to be replenished periodically. The coolant is directly supplied to the coolant accommodating chamber 11 in the conventional manner, but this affects the stability of temperature control of the wafer.
Disclosure of Invention
In view of the above, it is desirable to provide a cooling system and a method for supplying coolant to solve the above problems.
A semiconductor device comprising a cooling system, the cooling system comprising:
a cooling device comprising a containment chamber, an outlet end, and a feed end; the accommodating cavity is used for storing the coolant, the outlet end is used for conveying the coolant stored in the accommodating cavity, and the inlet end is used for receiving the coolant supplemented into the accommodating cavity;
the cooling system further comprises a supply module for supplying a coolant, the supply module comprising a feed valve and a control system;
the control system comprises a control module and a first sensing module, wherein the first sensing module is used for sensing a first parameter of the coolant in the supply module, the control module is used for judging whether the coolant in the supply module can be mixed with the coolant in the accommodating cavity or not according to the first parameter, and controlling the opening and closing of the feeding valve according to the judgment result;
the feed valve is connected to the feed end, and when the feed valve is opened, the coolant in the supply module is injected into the accommodation chamber through the feed end.
A temperature control method of a semiconductor device is applied to the semiconductor device, and comprises the following steps:
a sensing step: sensing a parameter of the coolant in the supply module with the feed valve closed;
a feeding step: under the condition that the judgment parameter reaches a preset value, controlling the feeding valve to open so that the coolant in the supply module can be supplied into the accommodating cavity and mixed with the coolant in the accommodating cavity; and under the condition that the judgment parameter does not reach the preset value, the closing of the feed valve is maintained; and
and (3) cooling: and controlling the circulation pump to be started, so that the coolant in the accommodating cavity flows to the device to be cooled, takes away heat generated at the device to be cooled and then returns to the accommodating cavity.
Compared with the prior art, the cooling system of the semiconductor equipment, provided by the invention, has the advantages that the first sensing module is arranged in the supply module, the first parameter of the coolant in the supply module is sensed, and the control module judges whether the first parameter reaches the preset value or not to control the opening and closing of the feeding valve, so that the coolant with different cooling characteristics and overlarge temperature difference is prevented from being supplemented into the accommodating cavity, and the stability of temperature control of the semiconductor equipment is ensured.
Drawings
Fig. 1 is a schematic diagram of a conventional semiconductor apparatus with some elements omitted.
Fig. 2 is a schematic diagram of a cooling system according to a first embodiment of the present invention.
Fig. 3 is a schematic diagram of a cooling system according to a second embodiment of the present invention.
Fig. 4 is a schematic diagram of a cooling system according to a preferred embodiment of the present invention.
Fig. 5 is a flowchart of a method for controlling the temperature of a semiconductor device according to the present invention.
Description of the main elements
The second sensing module 10
Second specific gravity sensor 101
Second Low level sensor 105
Accommodating chamber 11
An outlet end 12
Feed end 13
Inlet end 14
Circulating pump 15
Feed valve 21
The first sensing module 222
The first low level sensor 205
Wafer 300
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element or component is referred to as being "connected" to another element or component, it can be directly connected to the other element or component or intervening elements or components may also be present. When an element or component is referred to as being "disposed on" another element or component, it can be directly on the other element or component or intervening elements or components may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 2, a first embodiment of the invention provides a semiconductor apparatus 500 for performing various semiconductor processes on a wafer 300. It is understood that fig. 2 is only a schematic diagram of the semiconductor device 500, and some functional elements of the semiconductor device are omitted to highlight the focus of the present invention. The semiconductor apparatus 500 includes a cooling system 100 and an electrostatic chuck 400. The electrostatic chuck 400 is used to carry the wafer 300. The cooling system 100 is used to deliver a coolant to the electrostatic chuck 400 to remove heat generated during the process.
The cooling system 100 includes a cooling device 1. The cooling device 1 comprises a containing chamber 11, an outlet end 12, a feed end 13, an inlet end 14 and a circulation pump 15. The accommodating chamber 11 is pre-filled with a coolant. The outlet port 12 serves to output the coolant stored in the receiving chamber 11 to the electrostatic chuck 400. The feed end 13 is for receiving a supply of coolant into the receiving cavity 11. The inlet port 14 is used to recover the used coolant, that is, the coolant taking away heat generated at the electrostatic chuck 400. A circulation pump 15 is connected to the outlet port 12 and the inlet port 14, respectively, for providing motive force for the coolant to the electrostatic chuck 400.
In the present embodiment, the cooling apparatus 1 delivers the coolant to the electrostatic chuck 400 where the wafer 300 is positioned, but is not limited thereto, and in other embodiments, the cooling apparatus 1 may deliver the coolant to any component or device within the semiconductor apparatus 500 that requires temperature control.
Stability of temperature control of the wafer is affected due to direct supply of the coolant to the receiving chamber 11. Also, one of the factors analyzed to affect the stability of the temperature control is the mixing of different coolants, which will change the temperature response curve of the electrostatic chuck 400.
The cooling system 100 of the present invention further comprises a supply module 2. The supply module 2 is capable of sensing and determining a first parameter of the coolant in the supply module 2, and controlling whether to supplement the coolant to the cooling device 1 according to the determination result.
The supply module 2 comprises a feed valve 21, a control system 22 and a discharge valve 23. The feed valve 21 is connected to the feed end 13, and when the feed valve 21 is opened, the coolant in the supply module 2 is injected into the housing chamber 11 through the feed end 13. The discharge valve 23 is used to discharge the coolant in the supply module 2. The supply accommodating chamber 24 is used to store coolant.
The control system 22 includes a control module 221 and a first sensing module 222. The first sensing module 222 is used for sensing a first parameter of the coolant in the supply module 2, wherein the first parameter is a parameter capable of indicating whether the two coolants change the cooling characteristic after being mixed. In the present embodiment, the first parameter includes the specific gravity and the resistance value of the coolant. The control module 221 is configured to determine whether the coolant in the supply module 2 is suitable for mixing with the coolant in the accommodating chamber 11 according to the first parameter, and control the opening and closing of the feed valve 21 according to the determination result.
The first sensing module 222 includes a first ratio sensor 201 and a first resistance sensor 202. The first specific gravity sensor 201 is used for sensing the specific gravity of the coolant in the supply module 2. The first resistance value sensor 202 is used for sensing the resistance value of the coolant in the supply module 2. The control module 221 determines whether the specific gravity and the resistance of the coolant in the supply module 2, which are respectively sensed by the first specific gravity sensor 201 and the first resistance sensor 202, reach predetermined values. If not, the discharge valve 23 is controlled to discharge the coolant in the supply module 2; if so, the feed valve 21 is controlled to open. It will be appreciated that the predetermined value has a certain tolerable error.
The cooling device 1 further comprises a second sensing module 10, wherein the second sensing module 10 is used for sensing a second parameter of the coolant in the accommodating cavity 11. Correspondingly, the second parameter is a parameter that can characterize whether the two coolants change the cooling characteristic after being mixed. The control module 221 receives the second parameter and controls the feed valve 21 according to the second parameter.
Specifically, the second parameter includes at least one of a temperature value, a specific gravity, and a resistance value. Accordingly, the second sensing module 10 includes at least one of a second specific gravity sensor 101, a second resistance sensor 102 and a second temperature sensor 103. The second temperature sensor 103 is used to sense the temperature of the coolant in the accommodating chamber 11. The second specific gravity sensor 101 is for sensing the specific gravity of the coolant in the accommodating chamber 11. The second resistance value sensor 102 is for sensing the resistance value of the coolant in the accommodating chamber 11. The cooling apparatus 1 further includes a second temperature regulator 104, and the second temperature regulator 104 is configured to regulate the temperature of the coolant injected into the accommodating chamber 11 so that the temperature of the coolant injected into the accommodating chamber 11 reaches a temperature required to be mixed with the coolant in the accommodating chamber 11.
Further, the control module 221 determines whether the specific gravity and the resistance of the coolant in the supply module 2 sensed by the first specific gravity sensor 201 and the first resistance sensor 202, respectively, are equal to or close to the specific gravity and the resistance of the coolant in the accommodating chamber 11 sensed by the second specific gravity sensor 101 and the second resistance sensor 102, respectively. The approach here means that the specific gravity and the resistance of the coolant in the supply module 2, which are respectively sensed by the first specific gravity sensor 201 and the first resistance value sensor 202, fall within a certain range of values before and after the specific gravity and the resistance of the coolant in the accommodating chamber 11, which are respectively sensed by the second specific gravity sensor 101 and the second resistance value sensor 102, where the range of values meets the property requirement of mutual mixing of the coolants; if not, the discharge valve 23 is controlled to discharge the coolant in the supply module 2; if so, the feed valve 21 is controlled to open.
In some embodiments, the second sensing module 10 further comprises a second low level sensor 105, the second low level sensor 105 being used for sensing the amount of the coolant in the accommodating chamber 11. The control module 221 further determines whether the amount of the coolant stored in the accommodating chamber 11 is sensed to be lower than a preset value before determining that the first parameter controls the opening and closing of the feed valve 21. If it is sensed that the amount of the coolant stored in the accommodating chamber 11 is lower than a preset value, the feed valve 21 is controlled to be opened; if not, the closed state of the feed valve 21 is maintained.
The supply module 2 further comprises a reminding element (not shown) for giving a reminder when the judgment result indicates that the coolant in the supply module 2 and the coolant in the accommodating chamber 11 are not suitable for mixing. In some embodiments, the first sensing module 222 further comprises a first low level sensor 205, the first low level sensor 205 being used for sensing the amount of coolant in the supply module 2. The control module 221 also determines whether the amount of coolant in the supply module 2 is sensed to be lower than a preset value. If the amount of the coolant in the supply module 2 is sensed to be lower than the preset value, the reminding element is controlled to give a reminder to remind that the supply module needs to be supplemented with the coolant.
Since there is a problem that the temperature response curve of the electrostatic chuck 400 is changed due to the mixing of the coolants with different specific gravities and resistances when the accommodating chamber 11 is replenished with the coolant, the cooling system 100 according to the first embodiment of the present invention is configured to sense the specific gravities and resistances of the coolants in the supply module 2 by disposing the first sensing module 222 in the supply module 2, determine whether the specific gravities and resistances reach predetermined values by the control module 221, and then control the opening and closing of the feed valve 21, thereby preventing the coolants with different cooling characteristics from being replenished into the accommodating chamber 11 of the cooling apparatus 1, and ensuring the stability of temperature control of the wafer 300 on the electrostatic chuck 400.
Referring to fig. 3, a semiconductor device 500 is provided according to a second embodiment of the present invention. Factors that influence the stability of the temperature control by the analysis include a temperature difference between the coolant in the accommodating chamber 11 and the coolant to be replenished into the accommodating chamber 11, and specifically, the larger the temperature difference is, the larger the influence on the stability of the temperature control is. Therefore, the second embodiment differs from the first embodiment in that the first parameter includes a temperature value of the coolant. The first sensing module 222 includes a first temperature sensor 203. The first temperature sensor 203 is used for sensing the temperature of the coolant in the supply module 2. The first sensing module 222 further includes a first temperature regulator 204 for regulating the temperature of the coolant in the supply module 2. The control module 221 controls the first temperature regulator 204 to regulate the temperature of the coolant in the supply module 2 according to the temperature value of the coolant in the supply module 2 sensed by the first temperature sensor 203. The control module 221 determines whether the temperature value of the coolant in the supply module 2 sensed by the first temperature sensor 203 reaches a predetermined value, and if so, controls the feed valve 21 to open; if not, the first temperature regulator 204 is controlled to regulate the temperature of the coolant in the supply module 2 to a predetermined value, and then the feed valve 21 is controlled to open.
The cooling system 100 according to the second embodiment of the present invention is configured to sense the temperature of the coolant in the supply module 2 by disposing the first sensing module 222 in the supply module 2, adjust the temperature of the coolant in the supply module 2 to a predetermined value, and control the opening of the inlet valve 21 when the control module 221 determines that the temperature of the coolant reaches the predetermined value, so as to prevent the coolant with an excessive temperature difference from being supplemented into the accommodating cavity 11 of the cooling apparatus 1, and ensure the stability of temperature control of the wafer 300 on the electrostatic chuck 400.
Further, the control module 221 determines whether the temperature of the coolant in the supply module 2 sensed by the first temperature sensor 203 is equal to or close to the temperature value of the coolant in the accommodation chamber 11 sensed by the second temperature sensor 103. The approach here means that the temperature value of the coolant in the supply module 2 sensed by the first temperature sensor 203 falls within a certain range of values before and after the temperature value in the accommodating chamber 11 sensed by the second temperature sensor 103, where the range of values meets the requirement of the mutual mixing property of the coolants.
Referring to fig. 4, a semiconductor device 500 is provided according to a preferred embodiment of the present invention. The preferred embodiment differs from the first embodiment in that the first parameter also comprises a temperature value of the coolant. The first sensing module 222 further includes a first temperature sensor 203. The first temperature sensor 203 is used for sensing the temperature of the coolant in the supply module 2. The first sensing module 222 further includes a first temperature regulator 204 for regulating the temperature of the coolant in the supply module 2. The control module 221 controls the first temperature regulator 204 to regulate the temperature of the coolant in the supply module 2 according to the temperature value of the coolant in the supply module 2 sensed by the first temperature sensor 203.
The control module 221 determines whether the specific gravity and the resistance of the coolant in the supply module 2, which are respectively sensed by the first specific gravity sensor 201 and the first resistance sensor 202, reach predetermined values. Specifically, if not, the discharge valve 23 is controlled to discharge the coolant in the supply module 2; if so, the control module 221 further determines whether the temperature value of the coolant in the supply module 2 sensed by the first temperature sensor 203 reaches a predetermined value. If yes, controlling the feeding valve 21 to be opened; if not, the first temperature regulator 204 is controlled to regulate the temperature of the coolant in the supply module 2 to a predetermined value, and then the feed valve 21 is controlled to open.
Further, the control module 221 determines whether the specific gravity, the resistance value and the temperature value of the coolant in the supply module 2 sensed by the first specific gravity sensor 201, the first resistance value sensor 202 and the first temperature sensor 203 are respectively equal to or close to the specific gravity, the resistance value and the temperature value of the coolant in the accommodating chamber 11 sensed by the second specific gravity sensor 101, the second resistance value sensor 102 and the second temperature sensor 103. The approach here means that the specific gravity, the resistance value and the temperature value of the coolant in the supply module 2, which are respectively sensed by the first specific gravity sensor 201, the first resistance value sensor 202 and the first temperature sensor 203, fall within a certain range of values before and after the specific gravity, the resistance value and the temperature value of the coolant in the accommodating cavity 11, which are respectively sensed by the second specific gravity sensor 101, the second resistance value sensor 102 and the second temperature sensor 103, where the range of values meets the property requirement of mutual mixing of the coolants; if not, the discharge valve 23 is controlled to discharge the coolant in the supply module 2; if so, the feed valve 21 is controlled to open. Specifically, the first temperature regulator 204 and the second temperature regulator 104 may be peltier cooling devices, or may be devices that perform temperature regulation by means of heat exchange, a refrigerant method, or the like.
In some embodiments, the cooling device 1 and the supply module 2 may be integrated in the same equipment housing, and for cost control, the first temperature regulator 204 and the second temperature regulator 104 are preferably temperature-regulated by heat exchange, refrigerant method, or the like. In some embodiments, the supply module 2 may also be disposed outside the cooling device 1, and the supply module 2 further includes a plurality of inlet valves 21, and the supply module 2 may supply the coolant in the supply module 2 to the plurality of cooling devices 1 via different inlet valves 21. When the supply module 2 is disposed outside the cooling device 1, the first temperature regulator 204 is preferably a peltier cooler in order to reduce the overall occupied space.
The cooling system 100 according to the preferred embodiment of the present invention is configured to sense the specific gravity, the resistance value and the temperature value of the coolant in the supply module 2 by disposing the first sensing module 222 in the supply module 2, and control the opening of the feed valve 21 when the control module 221 determines that the specific gravity, the resistance value and the temperature value of the coolant all reach the predetermined values, so as to avoid the influence of different coolant mixtures and coolant mixtures with excessive temperature differences on the stability of the temperature control of the wafer 300 on the electrostatic chuck 400.
Referring to fig. 5, the present invention provides a temperature control method for a semiconductor device, which is applied to a semiconductor device 500, the temperature control method comprising the following steps:
step S201: sensing the specific gravity and the resistance value of the coolant in the supply module 2 in a state where the feed valve 21 is closed, performing step S3 when sensing that the specific gravity and the resistance value of the coolant in the supply module 2 do not reach predetermined values, and performing step S202 when sensing that the specific gravity and the resistance value of the coolant in the supply module 2 reach predetermined values;
step S202: sensing the temperature value of the coolant in the supply module 2 in a state where the feed valve 21 is closed, performing step S4 when the temperature value does not reach the predetermined value, and performing step S203 when the temperature value reaches the predetermined value;
step S203: the amount of coolant in the supply module 2 is sensed in a state where the feed valve 21 is closed, and when it is sensed that the amount of coolant in the supply module 2 is lower than a preset value, step S5 is performed, and when it is sensed that the amount of coolant in the supply module 2 is not lower than the preset value, step S204 is performed.
Step S204: the amount of the coolant in the accommodating chamber 11 is sensed, and when it is detected that the amount of the coolant stored in the accommodating chamber 11 is lower than the preset value, step S6 is performed to maintain the closing of the inlet valve when it is detected that the amount of the coolant stored in the accommodating chamber 11 is not lower than the preset value.
Step S3: in the state where the feed valve 21 is closed, the coolant in the supply module 2 is discharged to the outside.
Step S4: the temperature of the coolant in the supply module 2 is regulated.
Step S5: the supply module 2 is replenished with coolant.
Step S6: the feed valve 21 is controlled to open so that the coolant in the supply module 2 can be supplied into the housing chamber 11 to be mixed with the coolant in the housing chamber 11.
Step S7: the circulation pump 15 is controlled to be turned on, so that the coolant in the accommodating chamber 11 is led to the electrostatic chuck 400 and takes away heat generated at the electrostatic chuck 400 and then returns to the accommodating chamber 11.
In some embodiments, the order of step S201, step S202, and step S203 may be interchanged. For example, step S203 may be performed before step S201, and step S204 is continued after step S202. One of step S201 and step S202 may be skipped. In the case where step S202 is skipped, step S4 may be skipped. In the case where step S201 is skipped, step S3 may be skipped. Step S203 may be skipped, and in the case where step S203 is skipped, step S5 may be skipped. In some embodiments, step S7 may be skipped while circulation pump 15 remains on all the time.
In the present embodiment, the coolant is delivered to the electrostatic chuck 400 where the wafer 300 is positioned, but is not limited thereto, and in other embodiments, the coolant may be delivered to any component or device within the semiconductor apparatus 500 that requires temperature control.
The temperature control method of the semiconductor device of the present invention controls the opening and closing of the feed valve 21 by sensing and judging whether the parameter of the coolant in the supply module 2 reaches a predetermined value before replenishing the housing chamber 11 of the cooling apparatus 1 with the coolant, thereby preventing the replenishment of the coolant having different cooling characteristics into the housing chamber 11 of the cooling apparatus 1 and the replenishment of the coolant having a temperature difference with the excessive coolant in the housing chamber 11 into the housing chamber 11, and ensuring the stability of the temperature control of the semiconductor device.
Finally, it should be noted that the above embodiments are only intended to illustrate the technical solutions of the present invention and not to limit the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. A semiconductor device comprising a cooling system, the cooling system comprising:
a cooling device comprising a containment chamber, an outlet end, and a feed end; the accommodating cavity is used for storing the coolant, the outlet end is used for conveying the coolant stored in the accommodating cavity, and the inlet end is used for receiving the coolant supplemented into the accommodating cavity;
characterized in that the cooling system further comprises a supply module for supplying a coolant, the supply module comprising a feed valve and a control system;
the control system comprises a control module and a first sensing module, wherein the first sensing module is used for sensing a first parameter of the coolant in the supply module, the control module is used for judging whether the coolant in the supply module can be mixed with the coolant in the accommodating cavity or not according to the first parameter, and controlling the opening and closing of the feeding valve according to the judgment result;
the feed valve is connected to the feed end, and when the feed valve is opened, the coolant in the supply module is injected into the accommodation chamber through the feed end.
2. The semiconductor device according to claim 1, wherein the first parameter includes a specific gravity and a resistance value; the first sensing module comprises a first proportion sensor and a first resistance value sensor, the first proportion sensor is used for sensing the proportion of the coolant in the supply module, and the first resistance value sensor is used for sensing the resistance value of the coolant in the supply module.
3. The semiconductor device according to claim 1 or 2, wherein the first parameter further includes a temperature value;
the first sensing module further comprises a first temperature sensor for sensing a temperature value of the coolant in the supply module;
the first sensing module further comprises a first temperature regulator for regulating the temperature of the coolant in the supply module;
the control module adjusts the temperature of the coolant in the supply module through the first temperature regulator according to the sensed temperature value of the coolant in the supply module, and controls the opening and closing of the feed valve.
4. The semiconductor device of claim 1, wherein: the cooling device comprises a second sensing module used for sensing a second parameter of the coolant in the accommodating cavity;
the control module receives the second parameter and controls the supply module according to the second parameter, wherein the second parameter comprises at least one of a temperature value, a specific gravity and a resistance value;
the second sensing module comprises at least one of a second temperature sensor, a second specific gravity sensor and a second resistance value sensor; the second temperature sensor is used for sensing the temperature of the coolant in the accommodating cavity, the second specific gravity sensor is used for sensing the specific gravity of the coolant in the accommodating cavity, and the second resistance value sensor is used for sensing the resistance value of the coolant in the accommodating cavity.
5. The semiconductor device of claim 1, wherein:
the first sensing module comprises a first low level sensor for sensing an amount of coolant in the supply module;
the cooling device includes a second low level sensor for sensing an amount of coolant in the receiving cavity.
6. The semiconductor apparatus of claim 1, wherein the supply module further comprises a drain valve for draining coolant from the supply module.
7. A semiconductor device temperature control method applied to the semiconductor device according to claim 1, characterized by comprising:
a sensing step: sensing a parameter of the coolant in the supply module with the feed valve closed;
a feeding step: under the condition that the judgment parameter reaches a preset value, controlling the feeding valve to open so that the coolant in the supply module can be supplied into the accommodating cavity and mixed with the coolant in the accommodating cavity; and under the condition that the judgment parameter does not reach the preset value, the closing of the feed valve is maintained; and
and (3) cooling: and controlling the circulation pump to be started, so that the coolant in the accommodating cavity flows to the device to be cooled, takes away heat generated at the device to be cooled and then returns to the accommodating cavity.
8. The semiconductor device temperature control method according to claim 7, wherein: sensing a parameter of the coolant in the supply module includes: the specific gravity and resistance of the coolant in the supply module,
and when the specific gravity and the resistance value of the coolant in the supply module are not sensed to reach the preset values, the coolant in the supply module is discharged outwards under the condition that the feed valve is kept closed.
9. The semiconductor device temperature control method according to claim 7 or 8, characterized in that: sensing a parameter of the coolant in the supply module includes: sensing a temperature value of the coolant in the supply module; a step of adjusting the temperature of the coolant in the supply module when the temperature value does not reach the predetermined value.
10. The semiconductor device temperature control method according to claim 7 or 8, characterized in that: the method further comprises the steps of sensing the amount of the coolant in the accommodating cavity and supplementing the accommodating cavity with the coolant when the amount of the coolant stored in the accommodating cavity is detected to be lower than a preset value.
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| JPH09157846A (en) * | 1995-12-01 | 1997-06-17 | Teisan Kk | Temperature controller |
| CN104339057A (en) * | 2013-08-07 | 2015-02-11 | 宁波市慧金金属制品有限公司 | Intelligent filtering water tank for linear cutting machine tool |
| CN105374657A (en) * | 2014-07-18 | 2016-03-02 | 中微半导体设备(上海)有限公司 | Plasma processing device and temperature control method thereof |
| CN105810544A (en) * | 2016-04-07 | 2016-07-27 | 上海华力微电子有限公司 | Cooling unit of ion injection device |
| TWI591305B (en) * | 2016-08-22 | 2017-07-11 | 協順工業股份有限公司 | Central cooling system |
-
2020
- 2020-01-16 CN CN202010048886.2A patent/CN113126667B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09157846A (en) * | 1995-12-01 | 1997-06-17 | Teisan Kk | Temperature controller |
| CN104339057A (en) * | 2013-08-07 | 2015-02-11 | 宁波市慧金金属制品有限公司 | Intelligent filtering water tank for linear cutting machine tool |
| CN105374657A (en) * | 2014-07-18 | 2016-03-02 | 中微半导体设备(上海)有限公司 | Plasma processing device and temperature control method thereof |
| CN105810544A (en) * | 2016-04-07 | 2016-07-27 | 上海华力微电子有限公司 | Cooling unit of ion injection device |
| TWI591305B (en) * | 2016-08-22 | 2017-07-11 | 協順工業股份有限公司 | Central cooling system |
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