CN113097685B - Ceramic antenna device, temperature control method and terminal - Google Patents

Ceramic antenna device, temperature control method and terminal Download PDF

Info

Publication number
CN113097685B
CN113097685B CN201911336487.XA CN201911336487A CN113097685B CN 113097685 B CN113097685 B CN 113097685B CN 201911336487 A CN201911336487 A CN 201911336487A CN 113097685 B CN113097685 B CN 113097685B
Authority
CN
China
Prior art keywords
control
switch circuit
temperature
pcb
control switch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201911336487.XA
Other languages
Chinese (zh)
Other versions
CN113097685A (en
Inventor
张方宇
薛海
黄鹏飞
苟珑林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China Mobile Communications Group Co Ltd
China Mobile IoT Co Ltd
Original Assignee
China Mobile Communications Group Co Ltd
China Mobile IoT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Mobile Communications Group Co Ltd, China Mobile IoT Co Ltd filed Critical China Mobile Communications Group Co Ltd
Priority to CN201911336487.XA priority Critical patent/CN113097685B/en
Publication of CN113097685A publication Critical patent/CN113097685A/en
Application granted granted Critical
Publication of CN113097685B publication Critical patent/CN113097685B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

The invention provides a ceramic antenna device, a temperature control method and a terminal, and relates to the technical field of communication. The ceramic antenna device includes: a Printed Circuit Board (PCB); the shielding cover covers one surface of the PCB; the antenna welding spot is positioned on the PCB; the ceramic antenna is connected with the antenna welding spot and is adhered to the other surface of the PCB through a heat-conducting adhesive; the external signal receiving module is connected with the antenna welding spot; and the temperature control component is welded on the PCB. The ceramic antenna device has a temperature control function, and the ceramic antenna can stably operate within a preset temperature range by controlling the temperature control assembly to forcibly exchange heat, so that the signal receiving capacity of the ceramic antenna is ensured; and an insulating heat dissipation layer is added to prevent the ceramic antenna from losing efficacy due to the contact short circuit of the antenna welding spot and the shielding case.

Description

Ceramic antenna device, temperature control method and terminal
Technical Field
The invention relates to the technical field of communication, in particular to a ceramic antenna device, a temperature control method and a terminal.
Background
Some vehicle-mounted Positioning terminals in the prior art receive GPS signals through a GPS (Global Positioning System) active antenna. Because the terminal equipment is generally installed in the areas such as the interior of a vehicle and a central control, the environments of the areas are complex and the areas are shielded by a metal vehicle body, so that the GPS signal in the vehicle is poor, and the terminal can be connected to a longer shielding wire only through a connecting device and finally reaches an active antenna installed at the top of the vehicle to realize GPS signal receiving. The performance of the ceramic antenna can be influenced by various weather influences when the ceramic antenna is arranged on the top of a vehicle, for example, the temperature of the top of the vehicle can reach 70 ℃ to 80 ℃ at the highest under the direct incidence of the sun, and the temperature of the top of the vehicle can reach 20 ℃ at the lowest in cold winter. The existing ceramic antenna device does not have a temperature control technology, so that the ceramic antenna is easy to generate frequency drift, and the signal receiving capability is poor. Moreover, in the production process of the existing ceramic antenna device, the situation that the contact between the antenna welding spot and the shielding case is short-circuited may occur, so that the ceramic antenna fails.
Disclosure of Invention
The embodiment of the invention provides a ceramic antenna device, a temperature control method and a terminal, which are used for solving the problems that the signal receiving capacity of a ceramic antenna is poor due to poor temperature control and an antenna welding spot of the ceramic antenna is easy to contact with a shielding case for short circuit.
In order to solve the above technical problem, an embodiment of the present invention provides a ceramic antenna device, including:
a Printed Circuit Board (PCB);
the shielding cover covers one surface of the PCB;
the antenna welding spot is positioned on the PCB;
the ceramic antenna is connected with the antenna welding spot and is adhered to the other surface of the PCB through a heat-conducting adhesive;
the external signal receiving module is connected with the antenna welding spot;
the temperature control assembly is welded on the PCB and used for acquiring the temperature of the PCB and controlling the temperature of the PCB to be reduced to a preset temperature range when the temperature of the PCB is higher than a first threshold value; and when the temperature of the PCB is lower than a second threshold value, controlling the temperature of the PCB to rise to be within the preset temperature range.
Optionally, the temperature control assembly comprises:
a temperature sensor for collecting the temperature of the PCB;
at least two thermoelectric modules connected in series therebetween;
the control module is respectively electrically connected with the temperature sensor and the at least two thermoelectric modules, and drives the at least two thermoelectric modules to dissipate heat when the temperature of the PCB is higher than a first threshold value, so that the temperature of the PCB is controlled to be reduced to a preset temperature range; and when the temperature of the PCB is lower than a second threshold value, driving the at least two thermoelectric modules to heat, and controlling the temperature of the PCB to rise to the preset temperature range.
Optionally, the at least two thermoelectric modules comprise a plurality of thermoelectric semiconductor fins connected in series, wherein, of the plurality of thermoelectric semiconductor fins, one P-type semiconductor fin and one N-type semiconductor fin are alternately connected in series.
Optionally, the control module comprises:
a control circuit;
a first control switch circuit;
a second control switch circuit;
a third control switch circuit;
a fourth control switch circuit;
the control circuit is respectively connected with the first control switch circuit and the second control switch circuit through a first control channel;
the control circuit is respectively connected with the third control switch circuit and the fourth control switch circuit through a second control channel;
when the temperature of the PCB is higher than a first threshold value, the control circuit controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, current flows through the at least two thermoelectric modules in the forward direction, the at least two thermoelectric modules are enabled to dissipate heat, and the temperature of the PCB is controlled to be reduced to be within a preset temperature range;
when the temperature of the PCB is lower than a second threshold value, the control circuit controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are controlled to be closed, and current reversely flows through the at least two thermoelectric modules to heat the at least two thermoelectric modules and control the temperature of the PCB to rise to a preset temperature range.
Optionally, the temperature sensor, the at least two thermoelectric modules, and the control module are soldered to the PCB.
Optionally, an insulating heat dissipation layer is filled between the antenna bonding pad and the shielding case.
Optionally, surfaces of the at least two thermoelectric modules are in contact with the insulating heat sink.
The embodiment of the invention also provides a temperature control method of the ceramic antenna, which comprises the following steps:
acquiring the temperature of a Printed Circuit Board (PCB) where the ceramic antenna is located;
when the temperature of the PCB is higher than a first threshold value, controlling the temperature of the PCB to be reduced to a preset temperature range;
when the temperature of the PCB is lower than a second threshold value, controlling the temperature of the PCB to rise to be within the preset temperature range;
optionally, obtaining the temperature of the printed circuit board PCB on which the ceramic antenna is located includes:
and acquiring the temperature of the PCB through a temperature sensor arranged on the PCB.
Optionally, when the temperature of the PCB is higher than the first threshold, controlling the temperature of the PCB to decrease to a preset temperature range includes:
when the temperature of the PCB is higher than a first threshold value, the control module arranged on the PCB drives at least two thermoelectric modules arranged on the PCB to dissipate heat, and controls the temperature of the PCB to be reduced to a preset temperature range.
Optionally, when the temperature of the PCB is lower than a second threshold, controlling the temperature of the PCB to rise to the preset temperature range includes:
when the temperature of the PCB is lower than a second threshold value, the control module arranged on the PCB drives at least two thermoelectric modules arranged on the PCB to heat, and the temperature of the PCB is controlled to rise to a preset temperature range.
Optionally, when the temperature of the PCB is higher than the first threshold, controlling the temperature of the PCB to decrease to a preset temperature range, further comprising:
the control circuit controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are controlled to be disconnected, and current flows through the at least two thermoelectric modules in the forward direction, so that the at least two thermoelectric modules dissipate heat and the temperature of the PCB is controlled to be reduced to a preset temperature range.
Optionally, when the temperature of the PCB is lower than a second threshold, controlling the temperature of the PCB to rise to the preset temperature range, further comprising:
the first control channel is controlled to output a disconnection signal, the second control channel is controlled to output a connection signal, the first control switch circuit and the third control switch circuit are switched off, the second control switch circuit and the fourth control switch circuit are controlled to be switched on, and current reversely flows through the at least two thermoelectric modules to heat the at least two thermoelectric modules and control the temperature of the PCB to rise to a preset temperature range.
The embodiment of the invention also provides a terminal which comprises the ceramic antenna device.
The technical scheme of the invention at least has the following beneficial effects:
according to the ceramic antenna device disclosed by the embodiment of the invention, the temperature control assembly is welded on the PCB, so that the ceramic antenna has the functions of self-regulating temperature and temperature control, the temperature control assembly acquires the temperature of the PCB, and when the temperature of the PCB is higher than a first threshold value, the temperature of the PCB is controlled to be reduced to a preset temperature range; when the temperature of the PCB is lower than a second threshold value, controlling the temperature of the PCB to rise to the preset temperature range, and enabling the PCB to work in a stable temperature range through forced heat exchange, so that the ceramic antenna is ensured to stably receive signals; an insulating heat dissipation layer is filled between the antenna welding spot and the shielding case, so that the antenna welding spot can be prevented from being in contact with the shielding case to cause short circuit, and the heat conduction effect can be achieved.
Drawings
Fig. 1 shows a cross-sectional view of a ceramic antenna device according to an embodiment of the present invention;
FIG. 2 shows a side view of a ceramic antenna arrangement according to an embodiment of the invention;
FIG. 3 shows a top view of a ceramic antenna device according to an embodiment of the present invention;
fig. 4 shows a cross-sectional view of a ceramic antenna device according to an embodiment of the present invention;
FIG. 5 is a flow chart of a method for controlling temperature of a ceramic antenna according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a thermoelectric module according to an embodiment of the present invention;
FIG. 7 illustrates a schematic diagram of the operation of a thermoelectric module in accordance with an embodiment of the present invention;
FIG. 8 is a block diagram of a control module according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of the operation of the control module of an embodiment of the present invention.
Description of reference numerals:
1-an antenna solder joint; 2-a temperature sensor; 3-a thermoelectric module; 4-insulating heat dissipation layer; 5-printed circuit board PCB; 6-a shielding case; 7-a ceramic antenna; 8-a control module; 9-external signal receiving module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
The invention provides a ceramic antenna device, a temperature control method and a terminal, aiming at the problems that the ceramic antenna device in the prior art does not have a temperature control function and cannot ensure the signal receiving capability.
As shown in fig. 1 to 4, an embodiment of the present invention provides a ceramic antenna device, including:
a printed circuit board PCB5;
the shielding case 6, the shielding case 6 coats one surface of the PCB5;
the antenna welding spot 1 is positioned on the PCB5;
the ceramic antenna 7 is connected with the antenna welding spot 1, and the ceramic antenna 7 is adhered to the other surface of the PCB5 through a heat conduction adhesive;
the external signal receiving module 9 is connected with the antenna welding spot 1, and the external signal receiving module 9 is connected with the antenna welding spot 1;
the temperature control assembly is welded on the PCB5 and used for acquiring the temperature of the PCB5 and controlling the temperature of the PCB5 to be reduced to a preset temperature range when the temperature of the PCB5 is higher than a first threshold value; and when the temperature of the PCB5 is lower than a second threshold value, controlling the temperature of the PCB5 to rise to be within the preset temperature range.
Here, the temperature control assembly includes:
a temperature sensor 2 for collecting the temperature of the PCB5;
at least two thermoelectric modules 3, the at least two thermoelectric modules 3 being connected in series;
the control module 8 is electrically connected with the temperature sensor 2 and the at least two thermoelectric modules 3 respectively, and when the temperature of the PCB5 is higher than a first threshold value, the control module 8 drives the at least two thermoelectric modules 3 to dissipate heat, so as to control the temperature of the PCB5 to be reduced to a preset temperature range; when the temperature of the PCB5 is lower than a second threshold value, the at least two thermoelectric modules 3 are driven to heat, and the temperature of the PCB5 is controlled to rise to be within the preset temperature range.
As shown in fig. 6 to 7, in order to maximize the thermal contact area, the at least two thermoelectric modules 3 include a plurality of thermoelectric semiconductor fins connected in series, wherein one P-type semiconductor fin and one N-type semiconductor fin are alternately connected in series among the plurality of thermoelectric semiconductor fins.
It is known from the peltier effect that when a current flows through a circuit composed of different conductors, heat absorption and heat release phenomena occur at the joints of the different conductors, respectively, depending on the direction of the current, in addition to irreversible joule heat generation. Under the action of an external electric field, electrons move directionally, and a part of internal energy is brought to the other end of the electric field.
When the temperature of the PCB5 is higher than a first threshold value, the control module 8 drives current to flow in the forward direction, a cooling function is started, the current flows from the N-type semiconductor end to the P-type semiconductor end of the thermoelectric module, the joint of the two ends can absorb heat, the PCB5 is connected with the joint of the two ends, and the heat of the PCB5 is absorbed through heat conduction; the current continues to flow to the other end of the P-type semiconductor, then flows to the next N-type semiconductor from the joint of the two ends, at the moment, the joint of the two ends can release heat, the joint of the two ends is connected with the insulating heat dissipation layer 4, the heat is released to the insulating heat dissipation layer 4 through heat conduction, then the heat is conducted to the shielding cover 6 through heat conduction, the heat is conducted out, and the temperature of the PCB5 is reduced to a preset temperature range.
When the temperature of the PCB5 is lower than the second threshold, the control module 8 drives the current to reversely flow, and starts the temperature-raising function, the current flows from the P-type semiconductor end to the N-type semiconductor end of the thermoelectric module, the joint of the two ends releases heat, and the joint of the two ends is connected with the PCB5 to transfer the heat to the PCB5; the current continues to flow to the other end of the N-type semiconductor and then flows to the next P-type semiconductor from the junction of the two ends, at this time, the junction of the two ends absorbs heat, and the temperature of the PCB5 is raised to within a preset temperature range.
As shown in fig. 8 to 9, the control module 8 includes:
a control circuit;
a first control switch circuit;
a second control switch circuit;
a third control switch circuit;
a fourth control switch circuit;
the control circuit is respectively connected with the first control switch circuit and the second control switch circuit through a first control channel;
the control circuit is respectively connected with the third control switch circuit and the fourth control switch circuit through a second control channel;
when the temperature of the PCB5 is higher than a first threshold value, the control circuit controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, a current flows through the at least two thermoelectric modules 3 in a forward direction, the at least two thermoelectric modules 3 dissipate heat, and the temperature of the PCB5 is controlled to be reduced to a preset temperature range;
when the temperature of the PCB5 is lower than a second threshold value, the control circuit controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected to control the second control switch circuit and the fourth control switch circuit to be closed, and current reversely flows through the at least two thermoelectric modules 3 to heat the at least two thermoelectric modules 3 and control the temperature of the PCB5 to rise to a preset temperature range.
When the temperature detected by the temperature sensor 2 is higher than a set first threshold value, the first control channel outputs a connection signal, the second control channel outputs an off signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, and the current flows through at least two thermoelectric modules 3 in the forward direction to start the cooling function.
When the temperature detected by the temperature sensor 2 is lower than a set second threshold value, the first control channel outputs a disconnection signal, the second control channel outputs a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are connected, current reversely flows through the at least two thermoelectric modules 3, and the temperature rise function is started.
It should be further noted that, when the temperature of the temperature sensor 2 of the PCB5 is detected to be within the preset temperature range, the first control channel outputs an off signal, the second control channel outputs an off signal, the first control switch circuit and the third control switch circuit are turned off, the second control switch circuit and the fourth control switch circuit are turned off, and at least two thermoelectric modules 3 stop operating.
Here, the temperature sensor 2, the at least two thermoelectric modules 3, and the control module 8 are soldered to the PCB 5.
Here, an insulating heat dissipation layer 4 is filled between the antenna pad 1 and the shield 6.
Here, the surfaces of the at least two thermoelectric modules 3 are in contact with the insulating heat dissipation layer 4.
It should be noted that the temperature sensor 2 detects the temperature of the PCB5, when the temperature detected by the temperature sensor 2 is higher than a first threshold preset in the control module 8, the control module 8 drives the at least two thermoelectric modules 3 to dissipate heat, the heat of the PCB5 is conducted to the insulating heat dissipation layer 4 and then transferred to the shielding case 6, and the shielding case 6 dissipates heat by convection with air, so as to achieve the purpose of cooling; during the cooling work period, the temperature sensor 2 detects the feedback temperature of the PCB5, and when the temperature reaches a preset temperature range of the control module 8, the control module 8 controls the at least two thermoelectric modules 3 to stop the cooling work.
On the contrary, when the temperature sensor 2 detects that the temperature of the PCB5 is lower than the temperature threshold preset in the control module 8, the control module 8 drives the thermoelectric module 3 to dissipate heat, and drives current to flow in the opposite direction, so as to achieve the purpose of temperature rise; during the heating operation, the temperature sensor 2 detects the feedback temperature of the PCB5, and when the temperature reaches the preset temperature range of the control module 8, the control module 8 controls the at least two thermoelectric modules 3 to stop heating operation.
The temperature of the ceramic antenna is adjusted by forcibly heating and cooling for heat exchange, so that the temperature of the ceramic antenna is maintained within a preset temperature range.
It should be further noted that the insulating heat dissipation layer 4 may be a heat conductive silicone grease, so as to prevent the antenna solder joint 1 from contacting and short-circuiting with the shielding case 6, which may cause failure of the ceramic antenna, and at the same time, the insulating heat dissipation layer 4 may also be used to conduct heat of the at least two thermoelectric modules 3 to the shielding case 6, or conduct heat of the shielding case 6 to the at least two thermoelectric modules 3.
As shown in fig. 5, an embodiment of the present invention further provides a method for controlling a temperature of a ceramic antenna, including:
acquiring the temperature of a Printed Circuit Board (PCB) 5 where the ceramic antenna is located;
when the temperature of the PCB5 is higher than a first threshold value, controlling the temperature of the PCB5 to be reduced to a preset temperature range;
and when the temperature of the PCB5 is lower than a second threshold value, controlling the temperature of the PCB5 to rise to be within the preset temperature range.
Here, the step S1 of acquiring the temperature of the printed circuit board PCB5 where the ceramic antenna is located includes:
the temperature of the PCB5 is acquired through the temperature sensor 2 provided on the PCB 5.
Here, the step S2, when the temperature of the PCB5 is higher than the first threshold, controlling the temperature of the PCB5 to be decreased to a preset temperature range, includes:
and when the temperature of the PCB5 is higher than a first threshold value, the control module 8 arranged on the PCB5 drives at least two thermoelectric modules 3 arranged on the PCB5 to dissipate heat, and controls the temperature of the PCB5 to be reduced to a preset temperature range.
It should be noted that, as shown in fig. 7, when the temperature of the PCB5 is higher than the first threshold, the control module 8 drives the current to flow in the forward direction, and starts the cooling function, the current flows from the N-type semiconductor end to the P-type semiconductor end of the thermoelectric module, the connection between the two ends absorbs heat, the PCB5 is connected to the connection between the two ends, and the heat of the PCB5 is absorbed through heat conduction; the current continues to flow to the other end of the P-type semiconductor, then flows to the next N-type semiconductor from the joint of the two ends, at the moment, the joint of the two ends releases heat, the joint of the two ends is connected with the insulating heat dissipation layer 4, heat is released through heat conduction, and the temperature of the PCB5 is reduced to a preset temperature range.
Here, the step S3, when the temperature of the PCB5 is lower than the second threshold, controlling the temperature of the PCB5 to rise to the preset temperature range, includes:
and when the temperature of the PCB5 is lower than a second threshold value, the control module 8 arranged on the PCB5 drives at least two thermoelectric modules 3 arranged on the PCB5 to heat, and controls the temperature of the PCB5 to rise to a preset temperature range.
It should be noted that, as shown in fig. 7, when the temperature of the PCB5 is lower than the second threshold, the control module 8 drives the current to flow in the reverse direction, and starts the temperature raising function, the current flows from the P-type semiconductor end to the N-type semiconductor end of the thermoelectric module, the connection between the two ends will release heat, and the connection between the two ends is connected to the PCB5, so as to transfer the heat to the PCB5; the current continues to flow to the other end of the N-type semiconductor and then flows to the next P-type semiconductor from the joint of the two ends, and at the moment, the joint of the two ends absorbs heat, so that the temperature of the PCB5 is increased to be within a preset temperature range.
Here, the step S2, when the temperature of the PCB5 is higher than the first threshold, controlling the temperature of the PCB5 to be reduced to a preset temperature range, further includes:
as shown in fig. 8 to 9, the control circuit controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, and a current flows through at least two thermoelectric modules 3 in a forward direction, so that the at least two thermoelectric modules 3 dissipate heat, and the temperature of the PCB5 is controlled to be reduced to a preset temperature range.
Here, the step S3, when the temperature of the PCB5 is lower than a second threshold, controlling the temperature of the PCB5 to rise to the preset temperature range, further includes:
as shown in fig. 8 to 9, the first control channel is controlled to output an off signal, the second control channel is controlled to output a connection signal, the first control switch circuit and the third control switch circuit are turned off, the second control switch circuit and the fourth control switch circuit are controlled to be turned on, and current reversely flows through the at least two thermoelectric modules 3, so that the at least two thermoelectric modules 3 are heated, and the temperature of the PCB5 is controlled to rise to a preset temperature range.
It should be further noted that, when the temperature of the temperature sensor 2 of the PCB5 is detected to be within the preset temperature range, the first control channel outputs an off signal, the second control channel outputs an off signal, the first control switch circuit and the third control switch circuit are turned off, the second control switch circuit and the fourth control switch circuit are turned off, and the at least two thermoelectric modules 3 are controlled to stop working.
The embodiment of the invention also provides a terminal, which further comprises the ceramic antenna device.
It should be noted that all implementation manners of the ceramic antenna device are applicable to the embodiment of the terminal, the ceramic antenna device is provided with the temperature control component, and the ceramic antenna operates at a proper temperature through forced heat exchange of the temperature control component, so that stable signal receiving of the ceramic antenna device is ensured, the performance of the ceramic antenna is enhanced, and the working effect of the terminal is ensured; meanwhile, the insulating heat dissipation layer 4 separates the antenna welding spot 1 from the shielding case 6, so that the condition that the antenna welding spot 1 is in contact with the shielding case 6 in the production process of the ceramic antenna is avoided, a heat conduction effect can be achieved, and the terminal can stably operate.
While the preferred embodiments of the present invention have been described, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims.

Claims (14)

1. A ceramic antenna device, comprising:
a Printed Circuit Board (PCB) (5);
the shielding cover (6), the shielding cover (6) coats one surface of the PCB (5);
the antenna welding spot (1), the antenna welding spot (1) is positioned on the PCB (5);
a ceramic antenna (7), wherein the ceramic antenna (7) is connected with the antenna welding spot (1), and the ceramic antenna (7) is adhered to the other surface of the PCB (5) through a heat conduction adhesive;
the external signal receiving module (9), the external signal receiving module (9) is connected with the antenna welding spot (1);
the temperature control assembly is welded on the PCB (5), the temperature control assembly acquires the temperature of the PCB (5), when the temperature of the PCB (5) is higher than a first threshold value, a control module (8) in the temperature control assembly controls a first control channel in the control module (8) to output a connection signal and controls a second control channel in the control module (8) to output a disconnection signal, a first control switch circuit and a third control switch circuit in the control module (8) are closed, the second control switch circuit and a fourth control switch circuit in the control module (8) are disconnected, and the temperature of the PCB (5) is reduced to a preset temperature range; when the temperature of the PCB (5) is lower than a second threshold value, the control module (8) controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are closed, and the temperature of the PCB (5) is increased to be within the preset temperature range.
2. The ceramic antenna device of claim 1, wherein the temperature control assembly comprises:
a temperature sensor (2) for acquiring the temperature of the PCB (5);
at least two thermoelectric modules (3), the at least two thermoelectric modules (3) being connected in series;
the temperature sensor (2) and the at least two thermoelectric modules (3) are respectively electrically connected with the control module (8), and when the temperature of the PCB (5) is higher than a first threshold value, the control module (8) drives the at least two thermoelectric modules (3) to dissipate heat, so as to control the temperature of the PCB (5) to be reduced to a preset temperature range; when the temperature of the PCB (5) is lower than a second threshold value, the at least two thermoelectric modules (3) are driven to heat, and the temperature of the PCB (5) is controlled to rise to be within the preset temperature range.
3. The ceramic antenna device according to claim 2, wherein the at least two thermoelectric modules (3) comprise a plurality of thermoelectric semiconductor tiles connected in series, wherein one P-type semiconductor tile and one N-type semiconductor tile of the plurality of thermoelectric semiconductor tiles are alternately connected in series.
4. Ceramic antenna device according to claim 2, characterized in that the control module (8) further comprises:
a control circuit;
the control circuit is respectively connected with the first control switch circuit and the second control switch circuit through the first control channel;
the control circuit is respectively connected with the third control switch circuit and the fourth control switch circuit through the second control channel;
when the temperature of the PCB (5) is higher than a first threshold value, the control circuit controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, current flows through the at least two thermoelectric modules (3) in the forward direction, the at least two thermoelectric modules (3) are enabled to dissipate heat, and the temperature of the PCB (5) is controlled to be reduced to a preset temperature range;
when the temperature of the PCB (5) is lower than a second threshold value, the control circuit controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are closed, current reversely flows through the at least two thermoelectric modules (3), the at least two thermoelectric modules (3) are heated, and the temperature of the PCB (5) is controlled to rise to a preset temperature range.
5. Ceramic antenna device according to claim 2, characterized in that the temperature sensor (2), the at least two thermo electric modules (3) and the control module (8) are soldered onto the PCB (5).
6. Ceramic antenna device according to claim 1, characterized in that an insulating heat sink layer (4) is filled between the antenna solder joint (1) and the shielding cage (6).
7. Ceramic antenna device according to claim 6, characterized in that the surfaces of at least two thermo electric modules (3) are in contact with the insulating heat sink layer (4).
8. A ceramic antenna temperature control method is characterized by comprising the following steps:
a control module (8) arranged on the printed circuit board PCB (5) acquires the temperature of the PCB (5) where the ceramic antenna is located;
when the temperature of the PCB (5) is higher than a first threshold value, the control module (8) controls a first control channel in the control module (8) to output a connection signal and controls a second control channel in the control module (8) to output a disconnection signal, a first control switch circuit and a third control switch circuit in the control module (8) are closed, a second control switch circuit and a fourth control switch circuit in the control module (8) are opened, and the temperature of the PCB (5) is reduced to be within a preset temperature range;
when the temperature of the PCB (5) is lower than a second threshold value, the control module (8) controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are closed, and the temperature of the PCB (5) is increased to be within the preset temperature range.
9. The method for controlling the temperature of the ceramic antenna according to claim 8, wherein the step of obtaining the temperature of the PCB (5) where the ceramic antenna is located by a control module (8) arranged on the PCB (5) comprises the steps of:
the control module (8) acquires the temperature of the PCB (5) through a temperature sensor (2) arranged on the PCB (5).
10. The ceramic antenna temperature control method according to claim 8, wherein the control module (8) controls a second control channel in the control module (8) to output an open signal by controlling a first control channel in the control module (8) to output a connection signal and a second control channel in the control module (8) to output an open signal when the temperature of the PCB (5) is higher than a first threshold, a first control switch circuit and a third control switch circuit in the control module (8) are closed, a second control switch circuit and a fourth control switch circuit in the control module (8) are opened, and the temperature of the PCB (5) is reduced to a preset temperature range, and the method comprises:
control module (8) are in when the temperature of PCB (5) is higher than first threshold value, through control first control channel output connection signal, control second control channel output disconnection signal, first control switch circuit with third control switch circuit is closed, second control switch circuit with fourth control switch circuit disconnection, the drive set up in two at least thermoelectric module (3) heat dissipations on PCB (5), the temperature of PCB (5) reduces to a preset temperature range.
11. The ceramic antenna temperature control method according to claim 8, wherein the controlling module (8) controls the first control channel to output an open signal and the second control channel to output a connect signal when the temperature of the PCB (5) is lower than a second threshold, the first control switch circuit and the third control switch circuit are opened, the second control switch circuit and the fourth control switch circuit are closed, and the temperature of the PCB (5) is increased to be within the preset temperature range, and the method comprises the following steps:
when the temperature of the PCB (5) is lower than a second threshold value, the control module (8) controls the first control channel to output a disconnection signal and control the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are closed, the drive is arranged on at least two thermoelectric modules (3) on the PCB (5) to heat, and the temperature of the PCB (5) is increased to a preset temperature range.
12. The ceramic antenna temperature control method according to claim 8, wherein the control module (8) controls a second control channel in the control module (8) to output an open signal by controlling a first control channel in the control module (8) to output a connection signal and a second control channel in the control module (8) to output an open signal when the temperature of the PCB (5) is higher than a first threshold, a first control switch circuit and a third control switch circuit in the control module (8) are closed, a second control switch circuit and a fourth control switch circuit in the control module (8) are opened, and the temperature of the PCB (5) is reduced to a preset temperature range, further comprising:
the control module (8) controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are disconnected, and current flows through at least two thermoelectric modules (3) in the forward direction, so that the at least two thermoelectric modules (3) dissipate heat and control the temperature of the PCB (5) to be reduced to a preset temperature range.
13. The method for controlling the temperature of a ceramic antenna according to claim 8, wherein the control module (8) controls a second control channel in the control module (8) to output an open signal by controlling a first control channel in the control module (8) to output a connection signal and a second control channel in the control module (8) to output a disconnection signal when the temperature of the PCB (5) is lower than a second threshold value, the first control switch circuit and the third control switch circuit are opened, the second control switch circuit and the fourth control switch circuit are closed, and the temperature of the PCB (5) is raised to be within the preset temperature range, further comprising:
the control module (8) controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are closed, current reversely flows through at least two thermoelectric modules (3), the at least two thermoelectric modules (3) are heated, and the temperature of the PCB (5) is controlled to rise to a preset temperature range.
14. A terminal, characterized in that it comprises a ceramic antenna device according to any one of claims 1 to 7.
CN201911336487.XA 2019-12-23 2019-12-23 Ceramic antenna device, temperature control method and terminal Active CN113097685B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911336487.XA CN113097685B (en) 2019-12-23 2019-12-23 Ceramic antenna device, temperature control method and terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911336487.XA CN113097685B (en) 2019-12-23 2019-12-23 Ceramic antenna device, temperature control method and terminal

Publications (2)

Publication Number Publication Date
CN113097685A CN113097685A (en) 2021-07-09
CN113097685B true CN113097685B (en) 2022-11-08

Family

ID=76662968

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911336487.XA Active CN113097685B (en) 2019-12-23 2019-12-23 Ceramic antenna device, temperature control method and terminal

Country Status (1)

Country Link
CN (1) CN113097685B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004056065A (en) * 2002-05-30 2004-02-19 Hitachi Ltd Manufacturing method for electronic substrate
CN201199528Y (en) * 2008-04-03 2009-02-25 无锡职业技术学院 Novel semiconductor refrigeration heat-production apparatus
CN201234438Y (en) * 2008-08-05 2009-05-06 深圳华为通信技术有限公司 Communication equipment
CN104813758A (en) * 2012-11-21 2015-07-29 株式会社钟化 Heat dissipation structure
CN104834331A (en) * 2015-04-07 2015-08-12 北京上品爱网络技术有限公司 Method and device for temperature control of wearable device
CN105067133A (en) * 2015-08-26 2015-11-18 中北大学 Wireless high-temperature temperature sensor and manufacturing method thereof
CN106992351A (en) * 2015-12-14 2017-07-28 福特全球技术公司 Vehicle antenna assembly with cooling
CN105264455B (en) * 2013-04-22 2019-08-06 华为终端(深圳)有限公司 A kind of device for preventing communication card from deforming

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004056065A (en) * 2002-05-30 2004-02-19 Hitachi Ltd Manufacturing method for electronic substrate
CN201199528Y (en) * 2008-04-03 2009-02-25 无锡职业技术学院 Novel semiconductor refrigeration heat-production apparatus
CN201234438Y (en) * 2008-08-05 2009-05-06 深圳华为通信技术有限公司 Communication equipment
CN104813758A (en) * 2012-11-21 2015-07-29 株式会社钟化 Heat dissipation structure
CN105264455B (en) * 2013-04-22 2019-08-06 华为终端(深圳)有限公司 A kind of device for preventing communication card from deforming
CN104834331A (en) * 2015-04-07 2015-08-12 北京上品爱网络技术有限公司 Method and device for temperature control of wearable device
CN105067133A (en) * 2015-08-26 2015-11-18 中北大学 Wireless high-temperature temperature sensor and manufacturing method thereof
CN106992351A (en) * 2015-12-14 2017-07-28 福特全球技术公司 Vehicle antenna assembly with cooling

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
基于陶瓷的无线无源高温压力与温度传感器的设计、制备及测试;丁利琼;《中国优秀硕士学位论文全文数据库（电子期刊）信息科技辑》;20140815;全文 *

Also Published As

Publication number Publication date
CN113097685A (en) 2021-07-09

Similar Documents

Publication Publication Date Title
US8995134B2 (en) Electrically-cooled power module
JP4378239B2 (en) A semiconductor device, a power conversion device using the semiconductor device, and a hybrid vehicle using the power conversion device.
WO2021082962A1 (en) Vehicle-mounted antenna module and vehicle-mounted communication terminal
JP2003204087A (en) Heating/cooling device using thermoelectric element
US10199904B2 (en) Cooling a heat-generating electronic device
CN105091399A (en) Refrigeration circuit, terminal and terminal refrigeration method
CN116153883B (en) IGBT packaging method and IGBT packaging structure
CN113097685B (en) Ceramic antenna device, temperature control method and terminal
KR20170087502A (en) Thermal management in the field of e-mobility
CN211507894U (en) Ceramic antenna device and terminal
CN109698179B (en) Semiconductor device and method for manufacturing semiconductor device
CN106463602B (en) Insulator and connector for thermoelectric device in thermoelectric components
US5837928A (en) Thermoelectric radiator
JP7065687B2 (en) Thermoelectric converter
CN201638139U (en) PC chip cooling device
JP2013084874A (en) Thermoelectric module
CN208508320U (en) Cooling device for power distribution cabinet
US10714670B2 (en) Thermoelectric conversion module
CN220357474U (en) Temperature control device, electronic control unit and vehicle
EP2403026A2 (en) Connection structure of elements and connection method
CN214626834U (en) Overheat self-protection circuit for power electronic circuit of thyristor
CN216213539U (en) Multilayer thermoelectric semiconductor module with special connection mode
CN210805758U (en) Double-sided hybrid heat dissipation structure of high-power-density IGBT module
RU6470U1 (en) THERMOELECTRIC COOLING MODULE
CN218728748U (en) Temperature adjusting device and electronic equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant