CN211507894U - Ceramic antenna device and terminal - Google Patents
Ceramic antenna device and terminal Download PDFInfo
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- CN211507894U CN211507894U CN201922328087.6U CN201922328087U CN211507894U CN 211507894 U CN211507894 U CN 211507894U CN 201922328087 U CN201922328087 U CN 201922328087U CN 211507894 U CN211507894 U CN 211507894U
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Abstract
The utility model provides a ceramic antenna device and terminal relates to the communication technology field. The ceramic antenna device includes: a Printed Circuit Board (PCB); the shielding cover covers one surface of the PCB; the antenna welding spot is positioned on the PCB; the ceramic antenna is connected with the antenna welding spot and is adhered to the other surface of the PCB through a heat-conducting adhesive; the external signal receiving module is connected with the antenna welding spot; and the temperature control component is welded on the PCB. The utility model discloses a scheme ceramic antenna has the temperature control function, forces the heat transfer to make ceramic antenna be in and predetermine the stable operation of temperature range through controlling the temperature control assembly, guarantees ceramic antenna's signal reception ability; and an insulating heat dissipation layer is added to prevent the ceramic antenna from losing efficacy due to the short circuit caused by the contact of the antenna welding spot and the shielding case.
Description
Technical Field
The utility model relates to the field of communication technology, in particular to ceramic antenna device and terminal.
Background
Some vehicle-mounted Positioning terminals in the prior art receive GPS signals through a GPS (Global Positioning System) active antenna. Because the terminal equipment is generally installed in areas such as a vehicle interior and a central control area, the environments of the areas are complex, the areas are shielded by a metal vehicle body, GPS signals in the vehicle are poor, and the terminal can be connected to a longer shielding wire only through a connecting device and finally reaches an active antenna installed at the top of the vehicle to achieve GPS signal receiving. The performance of the ceramic antenna can be influenced by various weather influences when the ceramic antenna is arranged on the top of a vehicle, for example, the temperature of the top of the vehicle can reach 70 ℃ to 80 ℃ at the highest under the direct incidence of the sun, and the temperature of the top of the vehicle can reach 20 ℃ at the lowest in cold winter. The existing ceramic antenna device does not have a temperature control technology, so that the ceramic antenna is easy to generate frequency drift, and the signal receiving capability is poor. Moreover, in the production process of the existing ceramic antenna device, the situation that the contact between the antenna welding spot and the shielding case is short-circuited may occur, so that the ceramic antenna fails.
SUMMERY OF THE UTILITY MODEL
The utility model provides a ceramic antenna device and terminal for solve ceramic antenna because the not good received signal ability variation that leads to of temperature control and ceramic antenna's antenna solder joint easily with the problem of shield cover contact short circuit.
In order to solve the above technical problem, an embodiment of the present invention provides a ceramic antenna device, including:
a Printed Circuit Board (PCB);
the shielding cover covers one surface of the PCB;
the antenna welding spot is positioned on the PCB;
the ceramic antenna is connected with the antenna welding spot and is adhered to the other surface of the PCB through a heat-conducting adhesive;
the external signal receiving module is connected with the antenna welding spot;
the temperature control assembly is welded on the PCB and used for acquiring the temperature of the PCB and controlling the temperature of the PCB to be reduced to a preset temperature range when the temperature of the PCB is higher than a first threshold value; and when the temperature of the PCB is lower than a second threshold value, controlling the temperature of the PCB to rise to be within the preset temperature range.
Optionally, the temperature control assembly comprises:
a temperature sensor for collecting the temperature of the PCB;
at least two thermoelectric modules connected in series therebetween;
the control module is respectively electrically connected with the temperature sensor and the at least two thermoelectric modules, and drives the at least two thermoelectric modules to dissipate heat when the temperature of the PCB is higher than a first threshold value, so as to control the temperature of the PCB to be reduced to a preset temperature range; and when the temperature of the PCB is lower than a second threshold value, driving the at least two thermoelectric modules to heat, and controlling the temperature of the PCB to rise to the preset temperature range.
Optionally, the at least two thermoelectric modules comprise a plurality of thermoelectric semiconductor fins connected in series, wherein, of the plurality of thermoelectric semiconductor fins, one P-type semiconductor fin and one N-type semiconductor fin are alternately connected in series.
Optionally, the control module comprises:
a control circuit;
a first control switch circuit;
a second control switch circuit;
a third control switch circuit;
a fourth control switch circuit;
the control circuit is respectively connected with the first control switch circuit and the second control switch circuit through a first control channel;
the control circuit is respectively connected with the third control switch circuit and the fourth control switch circuit through a second control channel;
when the temperature of the PCB is higher than a first threshold value, the control circuit controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, current flows through the at least two thermoelectric modules in the forward direction, the at least two thermoelectric modules are enabled to dissipate heat, and the temperature of the PCB is controlled to be reduced to be within a preset temperature range;
when the temperature of the PCB is lower than a second threshold value, the control circuit controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are controlled to be closed, and current reversely flows through the at least two thermoelectric modules to heat the at least two thermoelectric modules and control the temperature of the PCB to rise to a preset temperature range.
Optionally, the temperature sensor, the at least two thermoelectric modules, and the control module are soldered to the PCB.
Optionally, an insulating heat dissipation layer is filled between the antenna bonding pad and the shielding case.
Optionally, surfaces of the at least two thermoelectric modules are in contact with the insulating heat sink.
The embodiment of the utility model provides a still provide a terminal, include as above ceramic antenna device.
The utility model has the advantages that:
the ceramic antenna device provided by the embodiment of the utility model is welded on a PCB through a temperature control component, so that the ceramic antenna has the functions of self-regulating temperature and temperature control, the temperature control component acquires the temperature of the PCB, and when the temperature of the PCB is higher than a first threshold value, the temperature of the PCB is controlled to be reduced to a preset temperature range; when the temperature of the PCB is lower than a second threshold value, controlling the temperature of the PCB to rise to the preset temperature range, and enabling the PCB to work in a stable temperature range through forced heat exchange, so that the ceramic antenna is ensured to stably receive signals; an insulating heat dissipation layer is filled between the antenna welding spots and the shielding case, so that short circuit caused by contact of the antenna welding spots and the shielding case can be prevented, and a heat conduction effect can be achieved.
Drawings
Fig. 1 is a cross-sectional view of a ceramic antenna device according to an embodiment of the present invention;
fig. 2 shows a side view of a ceramic antenna device according to an embodiment of the present invention;
fig. 3 is a plan view of a ceramic antenna device according to an embodiment of the present invention;
fig. 4 is a cross-sectional view of a ceramic antenna device according to an embodiment of the present invention;
FIG. 5 is a schematic view of a thermoelectric module according to an embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating the operation of a thermoelectric module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a control module according to an embodiment of the present invention;
fig. 8 shows an operation schematic diagram of a control module according to an embodiment of the present invention.
Description of reference numerals:
1-an antenna solder joint; 2-a temperature sensor; 3-a thermoelectric module; 4-insulating heat dissipation layer; 5-printed circuit board PCB; 6-a shielding case; 7-a ceramic antenna; 8-a control module; 9-external signal receiving module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
The utility model discloses ceramic antenna does not have the temperature control function among the prior art, can't guarantee the problem of received signal ability, provides a ceramic antenna device and terminal.
As shown in fig. 1 to 4, an embodiment of the present invention provides a ceramic antenna device, including:
a printed circuit board PCB 5;
a shielding case 6, wherein the shielding case 6 covers one surface of the PCB 5;
a ceramic antenna 7, wherein the ceramic antenna 7 is connected with the antenna pad 1, and the ceramic antenna 7 is bonded to the other surface of the PCB5 by a heat conductive adhesive;
the external signal receiving module 9 is connected with the antenna welding spot 1, and the external signal receiving module 9 is connected with the antenna welding spot 1;
the temperature control component is welded on the PCB5, acquires the temperature of the PCB5, and controls the temperature of the PCB5 to be reduced to a preset temperature range when the temperature of the PCB5 is higher than a first threshold value; controlling the temperature of the PCB5 to increase to be within the preset temperature range when the temperature of the PCB5 is lower than a second threshold.
Here, the temperature control assembly includes:
a temperature sensor 2 for collecting the temperature of the PCB 5;
at least two thermoelectric modules 3, the at least two thermoelectric modules 3 being connected in series;
the control module 8 is electrically connected with the temperature sensor 2 and the at least two thermoelectric modules 3, respectively, and when the temperature of the PCB5 is higher than a first threshold, the control module 8 drives the at least two thermoelectric modules 3 to dissipate heat, so as to control the temperature of the PCB5 to be reduced to a preset temperature range; when the temperature of the PCB5 is lower than a second threshold, the at least two thermoelectric modules 3 are driven to heat, and the temperature of the PCB5 is controlled to rise to be within the preset temperature range.
As shown in fig. 5 to 6, in order to maximize the thermal contact area, the at least two thermoelectric modules 3 include a plurality of thermoelectric semiconductor fins connected in series, wherein one P-type semiconductor fin and one N-type semiconductor fin are alternately connected in series among the plurality of thermoelectric semiconductor fins.
It is known from the peltier effect that when a current flows through a circuit composed of different conductors, heat absorption and heat release phenomena occur at the joints of the different conductors, respectively, depending on the direction of the current, in addition to irreversible joule heat generation. Under the action of an external electric field, electrons move directionally, and a part of internal energy is brought to the other end of the electric field.
When the temperature of the PCB5 is higher than a first threshold, the control module 8 drives a current to flow in a forward direction to start a cooling function, the current flows from the N-type semiconductor end to the P-type semiconductor end of the thermoelectric module, the joint of the two ends absorbs heat, the PCB5 is connected with the joint of the two ends, and the heat of the PCB5 is absorbed through heat conduction; the current continues to flow to the other end of the P-type semiconductor, then flows to the next N-type semiconductor from the joint of the two ends, at the moment, the joint of the two ends can release heat, the joint of the two ends is connected with the insulating heat dissipation layer 4, the heat is released to the insulating heat dissipation layer 4 through heat conduction, then the heat is conducted to the shielding case 6 through heat conduction, the heat is conducted out, and the temperature of the PCB5 is reduced to a preset temperature range.
When the temperature of the PCB5 is lower than a second threshold, the control module 8 drives current to reversely flow, and starts a temperature rise function, the current flows from the P-type semiconductor end to the N-type semiconductor end of the thermoelectric module, the joint of the two ends releases heat, and the joint of the two ends is connected with the PCB5 to transfer the heat to the PCB 5; the current continues to flow to the other end of the N-type semiconductor and then to the next P-type semiconductor from the junction of the two ends, where the junction of the two ends absorbs heat, raising the temperature of the PCB5 to within a predetermined temperature range.
As shown in fig. 7 to 8, the control module 8 includes:
a control circuit;
a first control switch circuit;
a second control switch circuit;
a third control switch circuit;
a fourth control switch circuit;
the control circuit is respectively connected with the first control switch circuit and the second control switch circuit through a first control channel;
the control circuit is respectively connected with the third control switch circuit and the fourth control switch circuit through a second control channel;
when the temperature of the PCB5 is higher than a first threshold value, the control circuit controls the first control channel to output a connection signal and controls the second control channel to output an open signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, a current flows through the at least two thermoelectric modules 3 in a forward direction, the at least two thermoelectric modules 3 dissipate heat, and the temperature of the PCB5 is reduced to a preset temperature range;
when the temperature of the PCB5 is lower than a second threshold value, the control circuit controls the first control channel to output an open signal, controls the second control channel to output a connection signal, opens the first control switch circuit and the third control switch circuit, controls the second control switch circuit and the fourth control switch circuit to be closed, and controls the current to reversely flow through the at least two thermoelectric modules 3, so that the at least two thermoelectric modules 3 are heated, and controls the temperature of the PCB5 to rise to a preset temperature range.
When the temperature detected by the temperature sensor 2 is higher than a set first threshold value, the first control channel outputs a connection signal, the second control channel outputs an off signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, and the current flows through at least two thermoelectric modules 3 in the forward direction to start the cooling function.
When the temperature detected by the temperature sensor 2 is lower than a set second threshold value, the first control channel outputs a disconnection signal, the second control channel outputs a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are connected, current reversely flows through the at least two thermoelectric modules 3, and the temperature rise function is started.
It should be noted that, when the temperature of the temperature sensor 2 of the detection PCB5 is within the preset temperature range, the first control channel outputs an off signal, the second control channel outputs an off signal, the first control switch circuit and the third control switch circuit are turned off, the second control switch circuit and the fourth control switch circuit are turned off, and at least two thermoelectric modules 3 stop operating.
Here, the temperature sensor 2, the at least two thermoelectric modules 3, and the control module 8 are soldered to the PCB 5.
Here, an insulating heat dissipation layer 4 is filled between the antenna pad 1 and the shield can 6.
Here, the surfaces of the at least two thermoelectric modules 3 are in contact with the insulating heat dissipation layer 4.
It should be noted that, the temperature sensor 2 detects the temperature of the PCB5, when the temperature detected by the temperature sensor 2 is higher than a first threshold preset in the control module 8, the control module 8 drives at least two thermoelectric modules 3 to dissipate heat, the heat of the PCB5 is conducted to the insulating heat dissipation layer 4 and then transferred to the shielding case 6, and the shielding case 6 dissipates heat by convection with air, so as to achieve the purpose of cooling; during the cooling operation, the temperature sensor 2 detects the feedback temperature of the PCB5, and when the temperature reaches a preset temperature range of the control module 8, the control module 8 controls the at least two thermoelectric modules 3 to stop the cooling operation.
On the contrary, when the temperature sensor 2 detects that the temperature of the PCB5 is lower than the temperature threshold preset in the control module 8, the control module 8 drives the thermoelectric module 3 to dissipate heat, and drives current to flow reversely, so as to achieve the purpose of temperature rise; during the temperature rising operation, the temperature sensor 2 detects the feedback temperature of the PCB5, and when the temperature reaches the preset temperature range of the control module 8, the control module 8 controls at least two thermoelectric modules 3 to stop the temperature rising operation.
The temperature of the ceramic antenna is regulated by forcibly heating and cooling for heat exchange, so that the ceramic antenna is stabilized within a preset temperature range.
It should be further noted that the insulating heat dissipation layer 4 may be a heat conductive silicone grease, so as to prevent the antenna solder joint 1 from contacting and short-circuiting with the shielding case 6, which may cause failure of the ceramic antenna, and at the same time, the insulating heat dissipation layer 4 may also be used to conduct heat of the at least two thermoelectric modules 3 to the shielding case 6, or conduct heat of the shielding case 6 to the at least two thermoelectric modules 3.
The embodiment of the utility model provides a still provide a terminal, still include as above-mentioned ceramic antenna device.
It should be noted that all the implementation manners of the ceramic antenna device are applicable to the embodiment of the terminal, and the ceramic antenna operates at a proper temperature through the forced heat exchange of the temperature control component, so that the signal receiving effect of the ceramic antenna device is ensured, the performance of the ceramic antenna is enhanced, and the working effect of the terminal is ensured; meanwhile, the insulating heat dissipation layer 4 blocks the antenna welding spots 1 and the shielding case 6, so that the situation that the antenna welding spots 1 are in contact with the shielding case 6 in the production process of the ceramic antenna is avoided, a heat conduction effect can be achieved, and the terminal can stably operate.
The foregoing is directed to the preferred embodiments of the present invention, and it will be understood by those skilled in the art that various changes and modifications may be made without departing from the principles of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
Claims (8)
1. A ceramic antenna device, comprising:
a printed circuit board, PCB, (5);
the shielding cover (6), the shielding cover (6) coats one surface of the PCB (5);
the antenna welding spot (1), the antenna welding spot (1) is positioned on the PCB (5);
a ceramic antenna (7), wherein the ceramic antenna (7) is connected with the antenna welding spot (1), and the ceramic antenna (7) is adhered to the other surface of the PCB (5) through a heat conduction adhesive;
the external signal receiving module (9), the external signal receiving module (9) is connected with the antenna welding spot (1);
the temperature control assembly is welded on the PCB (5), acquires the temperature of the PCB (5), and controls the temperature of the PCB (5) to be reduced to a preset temperature range when the temperature of the PCB (5) is higher than a first threshold value; when the temperature of the PCB (5) is lower than a second threshold value, controlling the temperature of the PCB (5) to be increased to be within the preset temperature range.
2. The ceramic antenna device of claim 1, wherein the temperature control assembly comprises:
a temperature sensor (2) for acquiring the temperature of the PCB (5);
at least two thermoelectric modules (3), the at least two thermoelectric modules (3) being connected in series;
the control module (8) is electrically connected with the temperature sensor (2) and the at least two thermoelectric modules (3) respectively, and when the temperature of the PCB (5) is higher than a first threshold value, the control module (8) drives the at least two thermoelectric modules (3) to dissipate heat and controls the temperature of the PCB (5) to be reduced to a preset temperature range; when the temperature of the PCB (5) is lower than a second threshold value, the at least two thermoelectric modules (3) are driven to heat, and the temperature of the PCB (5) is controlled to rise to be within the preset temperature range.
3. The ceramic antenna device according to claim 2, wherein the at least two thermoelectric modules (3) comprise a plurality of thermoelectric semiconductor tiles connected in series, wherein one P-type semiconductor tile and one N-type semiconductor tile of the plurality of thermoelectric semiconductor tiles are alternately connected in series.
4. Ceramic antenna device according to claim 2, characterized in that the control module (8) comprises:
a control circuit;
a first control switch circuit;
a second control switch circuit;
a third control switch circuit;
a fourth control switch circuit;
the control circuit is respectively connected with the first control switch circuit and the second control switch circuit through a first control channel;
the control circuit is respectively connected with the third control switch circuit and the fourth control switch circuit through a second control channel;
when the temperature of the PCB (5) is higher than a first threshold value, the control circuit controls the first control channel to output a connection signal and controls the second control channel to output a disconnection signal, the first control switch circuit and the third control switch circuit are closed, the second control switch circuit and the fourth control switch circuit are opened, current flows through the at least two thermoelectric modules (3) in the forward direction, the at least two thermoelectric modules (3) are enabled to dissipate heat, and the temperature of the PCB (5) is controlled to be reduced to be within a preset temperature range;
when the temperature of the PCB (5) is lower than a second threshold value, the control circuit controls the first control channel to output a disconnection signal and controls the second control channel to output a connection signal, the first control switch circuit and the third control switch circuit are disconnected, the second control switch circuit and the fourth control switch circuit are controlled to be closed, current reversely flows through the at least two thermoelectric modules (3), the at least two thermoelectric modules (3) are heated, and the temperature of the PCB (5) is controlled to rise to a preset temperature range.
5. Ceramic antenna device according to claim 2, characterized in that the temperature sensor (2), the at least two thermo electric modules (3) and the control module (8) are soldered onto the PCB (5).
6. Ceramic antenna device according to claim 1, characterized in that an insulating heat sink layer (4) is filled between the antenna solder joint (1) and the shielding cage (6).
7. Ceramic antenna device according to claim 6, characterized in that the surfaces of at least two thermo-electric modules (3) in the temperature control assembly are in contact with the insulating heat sink layer (4).
8. A terminal, characterized in that it comprises a ceramic antenna device according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922328087.6U CN211507894U (en) | 2019-12-23 | 2019-12-23 | Ceramic antenna device and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922328087.6U CN211507894U (en) | 2019-12-23 | 2019-12-23 | Ceramic antenna device and terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211507894U true CN211507894U (en) | 2020-09-15 |
Family
ID=72418394
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922328087.6U Active CN211507894U (en) | 2019-12-23 | 2019-12-23 | Ceramic antenna device and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211507894U (en) |
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2019
- 2019-12-23 CN CN201922328087.6U patent/CN211507894U/en active Active
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