CN113097194B - Radio frequency module and preparation method thereof - Google Patents

Radio frequency module and preparation method thereof Download PDF

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Publication number
CN113097194B
CN113097194B CN202110341325.6A CN202110341325A CN113097194B CN 113097194 B CN113097194 B CN 113097194B CN 202110341325 A CN202110341325 A CN 202110341325A CN 113097194 B CN113097194 B CN 113097194B
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substrate
radio frequency
frequency module
substrates
filter
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CN113097194A (en
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唐滨
赖志国
唐兆云
刘海瑞
杨清华
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Suzhou Huntersun Electronics Co Ltd
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Suzhou Huntersun Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/111—Manufacture and pre-treatment of the bump connector preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13005—Structure
    • H01L2224/13009—Bump connector integrally formed with a via connection of the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

The invention discloses a radio frequency module and a preparation method thereof, wherein the radio frequency module comprises at least two layers of substrates arranged along the thickness direction of the radio frequency module, and adjacent substrates have a distance and are in bonding connection; a filter is disposed on at least one of the first surface and the second surface of the substrate. The filters in the radio frequency module are arranged in the thickness direction of the radio frequency module in a vertical structure instead of a flat structure, so that the area of a plane occupied by the radio frequency module is reduced. Each filter in the radio frequency module can use the outermost substrate in the radio frequency module with a vertical structure as a cover plate substrate, so that the number of the substrates for each filter can be reduced, the cost of the radio frequency module is further reduced, and the thickness of the radio frequency module can be reduced. In addition, the first surface and the second surface of at least one substrate are both provided with filters, so that two filters can be arranged on the same substrate, the number of the substrates can be further reduced, and the cost of the radio frequency module is reduced.

Description

Radio frequency module and preparation method thereof
Technical Field
The embodiment of the invention relates to the technical field of communication, in particular to a radio frequency module and a preparation method thereof.
Background
The radio frequency module is widely applied in the communication field, and with the recent trend of miniaturization and high performance of communication equipment, higher challenges are provided for a radio frequency front end, and how to reduce the chip size becomes a problem to be solved urgently.
The rf module usually includes a plurality of filters, and each of the filters in the prior art rf module is distributed at different positions on the surface of the substrate, i.e. each of the filters is tiled on the surface of the substrate.
In the existing radio frequency module, each filter is tiled on the surface of the substrate, so that the radio frequency module has a larger size. And each radio frequency module needs an independent device substrate and a cover plate substrate, so that the cost of the conventional radio frequency module is high.
Disclosure of Invention
The invention provides a radio frequency module and a preparation method thereof, which are used for reducing the area of the radio frequency module, realizing the miniaturization of the radio frequency module and reducing the cost.
In a first aspect, an embodiment of the present invention provides a radio frequency module, including:
at least two layers of substrates are arranged along the thickness direction of the radio frequency module, and adjacent substrates have a distance and are in bonding connection; the substrate comprises a first surface and a second surface which are perpendicular to the thickness direction of the radio frequency module, a filter is arranged on at least one of the first surface and the second surface of the substrate, and the first surface and the second surface of at least one substrate are both provided with filters.
Optionally, the radio frequency module includes at least three layers of substrates arranged in the thickness direction of the radio frequency module, wherein filters are arranged on both the first surface and the second surface of the substrate in the middle layer, and the substrate in the middle layer is located between the two outermost substrates in the thickness direction of the radio frequency module;
and the surfaces of the two outermost substrates close to each other in the thickness direction of the radio frequency module are provided with filters.
Optionally, a pad is further disposed on the surface of the substrate on which the filter is disposed, and the pad is electrically connected to the filter on the same surface of the same substrate;
the radio frequency module further comprises a conductive lead, the conductive lead is arranged in a direction perpendicular to the first surface and the second surface, the conductive lead is connected with at least one bonding pad and extends to a set surface through a through hole penetrating through a substrate between the bonding pad and the set surface, and the set surface is the outer side surface of at least one substrate on the outermost layer of the radio frequency module;
optionally, the adjacent substrates are connected by conductive wire bonding;
optionally, the conductive lead is used as an inductor;
optionally, the setting surface is provided with a wiring layer and a connection terminal, and the conductive lead is electrically connected with the connection terminal through the wiring layer; the side of the filter of the setting surface remote from the substrate further comprises a base plate.
Optionally, projections of the pads on different substrates in the thickness direction of the radio frequency module coincide, and projections of the via holes penetrating through different substrates in the thickness direction of the radio frequency module coincide.
Optionally, a plurality of pads are arranged on the surface of at least one substrate provided with the filter; the conductive lead comprises a plurality of strips;
the projections of different conductive leads in the thickness direction of the radio frequency module are mutually separated, and the bonding pads connected with different conductive leads are not identical.
Optionally, the conductive leads in the vias are hollow.
Optionally, the radio frequency module further includes a sealing ring, the sealing ring is located between adjacent substrates, the sealing ring between the adjacent substrate and the adjacent substrate forms a sealing structure, and the filter and the conductive lead between the adjacent substrates are located in the sealing structure;
optionally, the adjacent substrates are bonded together by a seal ring.
Optionally, the filtering frequency bands of at least two filters are different.
Optionally, the thickness of the substrate is greater than or equal to 10 micrometers and less than or equal to 200 micrometers.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a radio frequency module, including:
preparing filters on the surfaces of at least two substrates respectively, wherein the filters are prepared on the first surface and the second surface which are opposite to each other of at least one substrate;
at least two substrates are bonded in a direction perpendicular to the surface on which the filter is to be formed.
Optionally, before bonding the at least two substrates in a direction perpendicular to the surface on which the filter is prepared, the method further includes:
preparing a bonding pad and a conductive lead for connecting the bonding pad on the same surface of the substrate for preparing the filter,
bonding at least two substrates in a direction perpendicular to a surface on which the filter is to be formed, comprising:
at least two substrates are bonded by conductive wires.
Optionally, the preparing the filters on the surfaces of at least two substrates respectively includes:
preparing a filter, a bonding pad and a conductive lead on one surface of the first substrate and the second substrate respectively;
bonding one sides of the first substrate and the second substrate, which are provided with the filter and the conductive leads, through the conductive leads;
preparing a filter on the surface of the first substrate far away from the second substrate and a frame-shaped bonding pad with a projection in the thickness direction of the radio frequency module as a frame-shaped structure;
etching the first substrate in the frame-shaped structure of the frame-shaped bonding pad to form a via hole penetrating through the first substrate so as to expose the conductive lead between the first substrate and the second substrate;
and connecting the frame-shaped bonding pad with the conductive lead between the first substrate and the second substrate to enable the through hole to be of a hollow structure.
Optionally, before the filters are respectively prepared on the surfaces of at least two substrates, the method further includes:
at least one of the substrates is thinned.
The embodiment of the invention provides a radio frequency module and a preparation method thereof, wherein the radio frequency module comprises at least two layers of substrates arranged along the thickness direction of the radio frequency module, and adjacent substrates have a distance and are in bonding connection; a filter is disposed on at least one of the first surface and the second surface of the substrate. The filters in the radio frequency module are arranged in the thickness direction of the radio frequency module in a vertical structure instead of a flat structure, so that the area of a plane occupied by the radio frequency module is reduced. Each filter in the radio frequency module can use the outermost substrate in the radio frequency module with a vertical structure as a cover plate substrate, namely, each filter in the radio frequency module can share the cover plate substrate, so that the number of the substrates for each filter can be reduced, the cost of the radio frequency module is reduced, and the thickness of the radio frequency module is reduced. In addition, the first surface and the second surface of at least one substrate are both provided with the filter, so that two filters can be arranged on the same substrate, namely the two filters can share the same device substrate, the number of the substrates can be further reduced, and the cost of the radio frequency module is reduced. In addition, the two filters can share the same device substrate, so that the thickness of the radio frequency module can be further reduced, and the radio frequency module is favorable for realizing lightness and thinness.
Drawings
Fig. 1 is a schematic structural diagram of a radio frequency module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another radio frequency module according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another radio frequency module according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another rf module according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another rf module according to an embodiment of the present invention;
fig. 6 is a flowchart illustrating a method for manufacturing a radio frequency module according to an embodiment of the present invention;
fig. 7 is a flowchart illustrating another method for manufacturing a radio frequency module according to an embodiment of the invention;
fig. 8 is a flowchart illustrating another method for manufacturing a radio frequency module according to an embodiment of the invention;
fig. 9 is a schematic structural diagram of the filter and the frame-shaped bonding pads formed on the surface of the first substrate away from the second substrate according to the embodiment of the present invention;
FIG. 10 is a top view of a frame-shaped pad;
FIG. 11 is a schematic structural diagram illustrating a first substrate in a frame-shaped structure of a frame-shaped bonding pad after etching to form a via penetrating through the first substrate according to an embodiment of the present invention;
fig. 12 is a schematic structural diagram of a frame-shaped bonding pad connected to a conductive wire between a first substrate and a second substrate according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
An embodiment of the present invention provides a radio frequency module, fig. 1 is a schematic structural diagram of a radio frequency module provided in an embodiment of the present invention, and referring to fig. 1, the radio frequency module includes: at least two layers of substrates 110 arranged along the thickness direction z of the radio frequency module, wherein the adjacent substrates 110 have a distance and are in bonding connection; the substrate 110 includes a first surface 111 and a second surface 112 perpendicular to the thickness direction z of the rf module, at least one of the first surface 111 and the second surface 112 of the substrate 110 is provided with a filter 120, and the first surface 111 and the second surface 112 of at least one of the substrates 110 are provided with the filter 120.
The material of the substrate 110 may be silicon, gallium arsenide, silicon carbide, gallium nitride, or a mixture of at least two of the above materials, which is not limited in this embodiment.
Referring to fig. 1, in the present embodiment, the rf module includes at least two layers of substrates 110 disposed along a thickness direction z thereof, and the substrates 110 of adjacent layers have a gap therebetween and are bonded to each other. The substrate 110 includes a first surface 111 and a second surface 112 perpendicular to the thickness direction z of the rf module, and at least one of the first surface 111 and the second surface 112 of the substrate 110 is provided with a filter 120. The filter 120 may have the same structure as the filter 120 in the prior art, and specifically, the filter 120 includes a lower electrode layer 121, a piezoelectric layer 122, and an upper electrode layer 123 stacked from a side of the base to a side away from the base, where the surface of the substrate 110 on which the filter 120 is disposed may include a groove, and the filter 120 is located at a position corresponding to the groove, and the groove serves as a cavity of the filter 120. Optionally, the material of the upper electrode layer 123 and the material of the lower electrode layer 121 may be at least one of metals such as molybdenum, aluminum, tungsten, or other alloy materials, or may be non-metal materials such as doped polysilicon. Alternatively, the deposited material of the piezoelectric layer 122 may be at least one of aluminum nitride, silicon oxide, and piezoelectric ceramic.
Compared with the structure in which the filter 120 is tiled on the surface of the substrate in the rf module in the prior art, the filter 120 on the at least two layers of substrates 110 of the embodiment forms a vertical structure rather than a tiled structure, so that the area of the plane occupied by the rf module is reduced. Moreover, in the radio frequency module structure in which the filters 120 are laid on the surface of the base plate in the prior art, each filter 120 needs to be provided with the independent device substrate 110 and the independent cover substrate 110, that is, each filter 120 needs two substrate 110 structures, so that the number of substrates 110 needed for the whole radio frequency module is large, and the cost of the radio frequency module is increased. Compared with the prior art, the radio frequency module in the embodiment includes at least two layers of substrates 110 in the thickness direction, so that each filter 120 in the radio frequency module can use the outermost substrate 110 in the radio frequency module with a vertical structure as the cover substrate 110, that is, each filter 120 in the radio frequency module can share the cover substrate 110, and further the number of the substrates 110 can be reduced, so that the cost of the radio frequency module is reduced, and the thickness of the radio frequency module can be reduced. In addition, in this embodiment, the first surface 111 and the second surface 112 of at least one substrate 110 are both provided with the filter 120, so that two filters 120 can be disposed on the same substrate 110, that is, the two filters 120 can share the same device substrate 110, which can further reduce the number of substrates 110 and reduce the cost of the rf module. In addition, the two filters 120 may share the same device substrate 110, which may further reduce the thickness of the rf module, thereby facilitating the implementation of the rf module to be light and thin.
The above is the core idea of the present invention, and the following will clearly and completely describe the technical solution in the embodiment of the present invention with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative work belong to the protection scope of the present invention.
Fig. 2 is a schematic structural diagram of another radio frequency module according to an embodiment of the present invention, and referring to fig. 2, optionally, the radio frequency module includes at least three layers of substrates 110 arranged along a thickness direction z of the radio frequency module (fig. 2 schematically illustrates a case where the radio frequency module includes three layers of substrates 110), wherein a first surface 111 and a second surface 112 of each of the substrates 110 of an intermediate layer are provided with a filter 120, and the substrate 110 of the intermediate layer is located between two outermost substrates 110 along the thickness direction z of the radio frequency module;
the filter 120 is disposed on the surface of the outermost two substrates 110 close to each other in the thickness direction z of the rf module.
The two outermost substrates 110 in the thickness direction z of the rf module are the uppermost substrate 110 and the lowermost substrate 110 in fig. 3, respectively, and the middle substrate 110 is the substrate 110 between the uppermost substrate 110 and the lowermost substrate 110. The first surface 111 and the second surface 112 of the middle layer substrate 110 are both provided with the filters 120, so that the number of the filters 120 included in the radio frequency module can be increased under the condition that the number of layers of the substrate 110 included in the radio frequency module is limited. In addition, the filters 120 on the first surface 111 and the second surface 112 of each interlayer substrate 110 share the same device substrate 110, which is beneficial to further reducing the thickness of the radio frequency module.
The outer surface of the outermost substrate 110 is usually exposed in the air, in this embodiment, the filter 120 may be disposed on the surface of the rf module, which is close to the two outermost substrates 110 in the thickness direction, and the filter 120 is not disposed on the two surfaces of the rf module, which are away from the two outermost substrates 110 in the thickness direction, so as to avoid the influence of the contact with the air on the working performance of the rf module when the filter 120 is disposed on the outer surface of the outermost substrate 110.
It should be noted that, when the outer surface of the outermost substrate 110 in the thickness direction z of the rf module is not exposed to the air, the filter 120 may be disposed on the outer surface of the outermost substrate 110 in the thickness direction z of the rf module, and the embodiment itself is not limited thereto.
Fig. 3 is a schematic structural diagram of another radio frequency module according to an embodiment of the present invention, and referring to fig. 3, optionally, a pad 130 is further disposed on a surface of the substrate 110 on which the filter 120 is disposed, and the pad 130 is electrically connected to the filter 120 located on the same surface of the same substrate 110;
the radio frequency module further comprises a conductive lead 140, the conductive lead 140 is arranged along a direction perpendicular to the first surface 111 and the second surface 112, the conductive lead 140 is connected with the at least one pad 130 and extends to the setting surface 113 through a via hole penetrating through the substrate 110 between the pad 130 and the setting surface, wherein the setting surface 113 is an outer side surface of the at least one substrate 110 at the outermost layer of the radio frequency module.
Optionally, adjacent substrates 110 are bonded by conductive leads 140 therebetween. Specifically, one filter 120 in the rf module may have a connection relationship with other filters 120 in the rf module, and the filter 120 in the rf module may also have a connection relationship with other components (such as an inductor and/or a capacitor) in the rf module. The filters 120 located on the same surface of the same substrate 110 are electrically connected by providing the surface of the substrate 110 of the filters 120 with pads 130, and the electrical connection between the different filters 120 is achieved by connecting the pads 130 of the different filters 120 through conductive leads 140. The connection of the filter 120 to other components in the radio frequency module may be accomplished by connecting the pads 130 of the filter 120 to other components of the radio frequency module by conductive leads 140. Compared with the prior art in which the conductive leads 140 are tiled on the surface of the substrate 110, the arrangement mode in which the conductive leads 140 are perpendicular to the first surface 111 and the second surface 112 reduces the planar area occupied by the conductive leads, thereby further reducing the area of the radio frequency module.
On the basis of the above technical solution, the conductive lead 140 may be used as an inductor. When the conductive leads 140 function as inductors, the magnitude of the inductance value is related to the length of the conductive leads 140. In this embodiment, the conductive leads 140 are perpendicular to the first surface 111 and the second surface 112 of the substrate 110, that is, the extending direction of the conductive leads 140 is parallel to the thickness direction of the display panel. The conductive lead 140 extends to the setting surface 113 through a via hole of the substrate 110 between the pad 130 and the setting surface 113 connected thereto, and the setting surface 113 may be one of the first surface 111 and the second surface 112 of the substrate 110. The case where the setting surface 113 is the outer side surface of the uppermost substrate 110 is schematically shown in fig. 3. In the process of manufacturing the rf module, the length of the conductive lead 140 passing through the substrate 110 can be adjusted by controlling the thickness of the substrate 110, so as to adjust the inductance value. As can be seen from the above analysis, by providing the rf module including at least two layers of the substrate 110 in the thickness direction thereof, providing the filter 120 on at least one of the first surface 111 and the second surface 112 of the substrate 110, and providing the conductive leads 140 perpendicular to the first surface 111 and the second surface 112, compared to the structure in which the filter 120 is tiled in the rf module in the prior art, the adjustment of the inductance value can be achieved by adjusting the thickness of the substrate 110.
With continued reference to fig. 3, optionally, the setting surface 113 is an outer side surface of one substrate 110 of the two outermost substrates 110 in the thickness direction z of the radio frequency module; the outermost substrate 110 (i.e., the lowermost substrate 110 in fig. 3) excluding the setting surface 113 is not penetrated by the conductive leads 140, i.e., there is no need to adjust the inductance value by adjusting the thickness of the lowermost substrate 110. Therefore, when the thickness of the other substrates 110 in the rf module is small, the overall strength of the rf module can be ensured by setting the thickness of the lowest substrate 110 to be large.
Fig. 4 is a schematic structural diagram of another rf module according to an embodiment of the present invention, and referring to fig. 4, optionally, a setting surface 113 is provided with a wiring layer 150 and a connection terminal 160, and the conductive lead 140 is electrically connected to the connection terminal 160 through the wiring layer 150; the side of the setting surface 113 facing away from the filter 120 of the substrate 110 further includes a base plate 101.
Specifically, by providing the wiring layer 150 and the connection terminal 160 on the setting surface 113, the connection of the filter 120 to other elements in the radio frequency module can be realized. The connection terminal 160 may be used for other devices that form an integrated circuit with the rf module. The arrangement of the substrate 101 can protect the wiring layer 150 and the connection terminal 160, and prevent the wiring layer 150 and the connection terminal 160 from being damaged due to collision with an external object.
With continued reference to fig. 3 and fig. 4, optionally, projections of the pads 130 on different substrates 110 in the thickness direction z of the radio frequency module coincide, and projections of the vias penetrating through different substrates 110 in the thickness direction z of the radio frequency module coincide.
Specifically, for the rf module shown in fig. 3, the projections of the pads 130 on the substrates 110 in the thickness direction z of the rf module are all overlapped, that is, the positions of the pads 130 on the substrates 110 in the thickness direction z of the rf module correspond to each other. The projections of the vias on the substrates 110 in the thickness direction z of the rf module are all overlapped, that is, the positions of the vias on the substrates 110 in the thickness direction z of the rf module are corresponding. In this embodiment, one conductive lead 140 is electrically connected to each pad 130 on the surface of the substrate 110 where the filter 120 is located. The arrangement of the bonding pad 130 and the via hole can further reduce the planar occupied area of the conductive lead 140, thereby further reducing the area of the rf module.
In practical applications, the connection relationship between the filters 120 in some rf modules may be complicated, rather than being connected to each other through a conductive lead 140. In an alternative embodiment of the present invention, the rf module may have a structure as shown in fig. 5. Fig. 5 is a schematic structural diagram of another radio frequency module according to an embodiment of the present invention, and referring to fig. 5, optionally, a plurality of pads 130 are disposed on a surface of at least one substrate 110 on which the filter 120 is disposed; the conductive lead 140 includes a plurality of bars; the projections of the different conductive leads 140 in the thickness direction z of the rf module are separated from each other, and the pads 130 connected to the different conductive leads 140 are not identical.
Specifically, for a substrate 110 provided with a filter 120 and a plurality of pads 130 on the same surface, the plurality of pads 130 may all be connected to the filter 120 on the same surface, but different pads 130 on the same surface of the same substrate 110 may be electrically connected to different filters 120 through different conductive leads 140. In this embodiment, the rf module includes a plurality of conductive leads 140, where fig. 4 schematically illustrates a case that two conductive leads 140 are included, the pads 130 connected by different conductive leads 140 are not completely the same, and the pads 130 are electrically connected to the filters 120 located on the same surface of the same substrate 110, so as to implement that different conductive leads 140 are connected to the filters 120 that are not completely the same, thereby implementing a more complex connection between the filters 120 in the rf module.
With continued reference to fig. 3-5, optionally, the conductive leads 140 within the vias are hollow structures.
Specifically, the substrate 110 expands at higher ambient temperatures and contracts at lower ambient temperatures. In this embodiment, the conductive lead 140 in the through hole is a hollow structure, so that when the substrate 110 expands or contracts, the hollow structure of the conductive lead 140 in the through hole can play a role in buffering, and further the substrate 110 is not prone to crack generation, so that the filter 120 on the substrate 110 is not damaged, and the normal working performance of the radio frequency module is ensured.
On the basis of the above embodiments, the conductive leads 140 may be located on at least one side of the filter 120, for example, fig. 3 and 4 schematically show the case where the conductive leads 140 are located on the right side of the filter 120, and fig. 5 shows the case where the conductive leads 140 are located on the left and right sides of the filter 120.
With continued reference to fig. 1-5, optionally, the rf module further includes a seal ring 170, the seal ring 170 being located between adjacent substrates 110, the adjacent substrates 110 forming a sealed structure with the seal ring 170 between the adjacent substrates 110, the filter 120 and the conductive leads 140 being located within the sealed structure between the adjacent substrates 110.
Alternatively, the adjacent substrates 110 may be bonded together with the sealing ring 170 therebetween. The sealing ring 170 can seal the filter 120 and the conductive lead 140, thereby preventing water and oxygen from contacting the filter 120 and the conductive lead 140 and ensuring good working performance of the filter 120.
Optionally, the perpendicular projections of the seal rings 170 located on different layers in the thickness direction z of the rf module coincide. Wherein the seal ring 170 of a different layer refers to the seal ring 170 located between two different adjacent layers of the substrate 110. Through setting up the perpendicular projection coincidence of the sealing washer 170 that is located different layers on radio frequency module thickness direction z for the plane area that the shared of multilayer sealing washer 170 is equal with the plane area that the shared of one deck sealing washer 170, for the structure that the wave filter 120 of radio frequency module among the prior art tiled on the base plate (then the plane area that the sealing washer 170 that every wave filter 120 set up alone in a plurality of wave filters 120 can form the stack), further reduces the area of radio frequency module.
On the basis of the above embodiments, optionally, the filtering frequency bands of at least two filters are different.
Specifically, the filtering frequency bands of at least two filters are different, so that filtering of different frequency bands can be realized through the radio frequency module.
In other optional embodiments of the present invention, the filters included in the rf module include at least one transmit filter and at least one receive filter, so as to implement a duplexer or a multiplexer structure.
On the basis of the above embodiments, the thickness of the substrate is optionally greater than or equal to 10 micrometers and less than or equal to 200 micrometers.
Specifically, in the process of preparing the radio frequency module, the substrate can be thinned. When the thickness of the substrate is less than 10 micrometers, the overall strength of the radio frequency module may be weak; when the thickness of the rf module is greater than 200 μm, the thickness of the rf module may be too large. In this embodiment, by setting the thickness of the substrate to be greater than or equal to 10 micrometers and less than or equal to 200 micrometers, on one hand, the overall strength of the radio frequency module can be ensured to be large enough, and on the other hand, the thickness of the radio frequency module is not too thick. Further, the thickness of the substrate can be greater than or equal to 25 micrometers and less than or equal to 100 micrometers.
An embodiment of the present invention further provides a method for manufacturing a radio frequency module, fig. 6 is a flowchart of the method for manufacturing a radio frequency module according to the embodiment of the present invention, and referring to fig. 6, the method for manufacturing a radio frequency module includes:
step 210, fabricating filters on the surfaces of at least two substrates, respectively, wherein the filters are fabricated on both the first and second opposing surfaces of at least one substrate.
Specifically, when the filter is manufactured on the surface of the substrate, a groove may be formed on the surface of the substrate, then the groove is filled with the sacrificial material, then the lower electrode layer, the piezoelectric layer, and the upper electrode layer are sequentially formed at positions corresponding to the groove, and then the sacrificial material in the groove is released.
Step 220 bonds at least two substrates in a direction perpendicular to the surface on which the filter is to be fabricated.
In the above steps, when the radio frequency module including more than two substrates is to be prepared, the filters may be prepared on the surfaces of the two substrates, respectively, and then the two substrates are bonded to the side where the filters are prepared. Then, the filter is continuously prepared on the surface of one of the substrates far away from the other substrate, the preparation of the filter is also carried out on the surface of the third layer of substrate, and then the surface of the two layers of substrates which are bonded together and provided with the filter is bonded with the side of the third layer of substrate provided with the filter. When the radio frequency module comprises a structure with more than three layers of substrates, the preparation can be carried out according to the steps, and then the radio frequency module comprising the multilayer substrates and the multilayer filter is obtained.
Optionally, before the filters are respectively prepared on the surfaces of at least two substrates, the method further includes: thinning at least one substrate; thereby ensuring the whole radio frequency module to be lighter and thinner.
The filters in the radio frequency module prepared by the preparation method of the radio frequency module of the embodiment are in a vertical structure arranged in the thickness direction of the radio frequency module, but not in a tiled structure, so that the area of a plane occupied by the radio frequency module is reduced. Each filter in the radio frequency module can use the outermost substrate in the radio frequency module with a vertical structure as a cover plate substrate, namely, each filter in the radio frequency module can share the cover plate substrate, so that the number of the substrates can be reduced, the cost of the radio frequency module is reduced, and the thickness of the radio frequency module is reduced. In addition, in this embodiment, the first surface and the second surface of at least one substrate are both provided with a filter, so that two filters can be arranged on the same substrate, that is, the two filters can share the same device substrate, the number of substrates can be further reduced, and the cost of the radio frequency module can be reduced. In addition, the two filters can share the same device substrate, so that the thickness of the radio frequency module can be further reduced, and the radio frequency module is light and thin.
Fig. 7 is a flowchart of another method for manufacturing a radio frequency module according to an embodiment of the present invention, and referring to fig. 7, optionally, the method for manufacturing a radio frequency module includes:
step 310, preparing filters on the surfaces of at least two substrates respectively; this step is the same as step 210 in the above embodiment, and is not described herein again.
Step 320, preparing a bonding pad and a conductive lead connected with the bonding pad on the same surface of the substrate prepared filter; this step may be performed after the step 310, or may be performed simultaneously with the step 310, and this embodiment is not limited in this respect.
Step 330, bonding at least two substrates through conductive wires.
In the embodiment, different substrates are bonded through the conductive lead, so that a bonding structure is not required to be additionally arranged, and the size of the radio frequency module is favorably reduced. And the conductive leads are perpendicular to the first surface and the second surface, so that the area of a plane occupied by the conductive leads is reduced, and the size of the radio frequency module is further reduced.
Fig. 8 is a flowchart of another method for manufacturing a radio frequency module according to an embodiment of the present invention, and referring to fig. 8, optionally, the method for manufacturing a radio frequency module includes:
step 410, preparing a filter, a bonding pad and a conductive lead on one surface of the first substrate and the second substrate respectively. The first substrate and the second substrate may be two adjacent substrates in the radio frequency module.
And step 420, bonding the first substrate and the second substrate with the filter and one side of the conductive lead through the conductive lead.
Step 430, preparing a filter on the surface of the first substrate far from the second substrate and a frame-shaped bonding pad with a frame-shaped structure projected in the thickness direction of the radio frequency module.
Fig. 9 is a schematic structural diagram of a filter and a frame-shaped bonding pad formed on a surface of a first substrate away from a second substrate according to an embodiment of the present invention, and fig. 10 is a top view of the frame-shaped bonding pad. Therein, the first substrate 114 is schematically shown in fig. 9 to be located on the upper side of the second substrate 115. Alternatively, the sealing ring may be formed at the same time when the frame-shaped pad 130 is prepared.
Step 440, etching the first substrate in the frame-like structure of the frame-like bonding pad to form a via hole penetrating through the first substrate, so as to expose the conductive lead between the first substrate and the second substrate.
Fig. 11 is a schematic structural diagram after etching the first substrate in the frame-shaped structure of the frame-shaped bonding pad to form a via penetrating through the first substrate according to the embodiment of the present invention. Specifically, after the via hole penetrating through the first substrate is formed, the conductive lead 140 between the first substrate and the second substrate is exposed, thereby facilitating the connection between the frame-shaped bonding pad 130 and the conductive lead 140 between the first substrate and the second substrate.
And step 450, connecting the frame-shaped bonding pad with a conductive lead between the first substrate and the second substrate so as to enable the through hole to be of a hollow structure.
When the conductive lead 140 between the first substrate and the second substrate is connected to the frame-shaped pad 130, the conductive lead 140 may be connected only to the frame-shaped pad 130 by using the existing process, and fig. 12 is a schematic structural diagram after the frame-shaped pad is connected to the conductive lead between the first substrate and the second substrate according to an embodiment of the present invention. After the connection, the inside of the frame-like structure may be filled with a sacrificial material at a corresponding position, and then the formation of the conductive leads 140 on the side of the first substrate 114 away from the second substrate 115 is continued, and then the sacrificial material in the groove below the filter 120 on the side of the first substrate away from the second substrate and the sacrificial material in the hollow structure are simultaneously released.
Then, a filter may be formed on the third substrate, and the third substrate is bonded to the first substrate to form the rf module structure shown in fig. 2.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims (12)

1. A radio frequency module, comprising:
at least two layers of substrates are arranged along the thickness direction of the radio frequency module, and the adjacent substrates have a distance and are in bonding connection; the substrate comprises a first surface and a second surface which are perpendicular to the thickness direction of the radio frequency module, a filter is arranged on at least one of the first surface and the second surface of the substrate, and the filter is arranged on the first surface and the second surface of at least one of the substrates;
the surface of the substrate of the filter is also provided with a bonding pad which is electrically connected with the filter positioned on the same surface of the same substrate;
the radio frequency module further comprises a conductive lead, the conductive lead is arranged in a direction perpendicular to the first surface and the second surface, the conductive lead is connected with at least one bonding pad and extends to a set surface through a through hole penetrating through a substrate between the bonding pad and the set surface, and the set surface is the outer side surface of at least one substrate on the outermost layer of the radio frequency module;
adjacent substrates are connected through the conductive wire bonding;
the conductive lead is used as an inductor;
the setting surface is provided with a wiring layer and a connecting terminal, and the conductive lead is electrically connected with the connecting terminal through the wiring layer; the side of the setting surface, which is far away from the filter of the substrate, further comprises a base plate.
2. The radio frequency module according to claim 1, comprising at least three layers of substrates disposed along a thickness direction of the radio frequency module, wherein the first surface and the second surface of the substrate of an intermediate layer are each provided with the filter thereon, and the substrate of the intermediate layer is located between two outermost substrates along the thickness direction of the radio frequency module;
the filter is arranged on the surface, close to each other, of the two substrates on the outermost layer in the thickness direction of the radio frequency module.
3. The radio frequency module of claim 1, wherein projections of the pads on different ones of the substrates in a thickness direction of the radio frequency module coincide, and projections of the vias through different ones of the substrates in the thickness direction of the radio frequency module coincide.
4. The radio frequency module according to claim 1, wherein a surface of at least one of the substrates on which the filter is provided with a plurality of the pads; the conductive lead includes a plurality of strips;
different projections of the conductive leads in the thickness direction of the radio frequency module are mutually separated, and the bonding pads connected with different conductive leads are not identical.
5. The RF module of claim 1 wherein the conductive leads within the vias are hollow.
6. The radio frequency module of claim 1, further comprising a seal ring positioned between adjacent ones of the substrates, the seal ring between adjacent ones of the substrates and adjacent ones of the substrates forming a sealed structure, the filter and the conductive leads between adjacent ones of the substrates being positioned within the sealed structure.
7. The radio frequency module of claim 6, wherein adjacent substrates are further bonded together by the seal ring.
8. The RF module of claim 1, wherein at least two of the filters have different filtering bands.
9. The rf module of claim 1, wherein the substrate has a thickness greater than or equal to 10 microns and less than or equal to 200 microns.
10. A method for manufacturing a radio frequency module is characterized by comprising the following steps:
preparing filters on the surfaces of at least two substrates respectively, wherein the filters are prepared on the first surface and the second surface which are opposite to each other of at least one substrate;
bonding at least two of the substrates in a direction perpendicular to a surface on which the filter is to be prepared;
before bonding at least two of the substrates in a direction perpendicular to a surface on which the filter is to be formed, the method further comprises:
preparing a bonding pad and a conductive lead for connecting the bonding pad on the same surface of the substrate on which the filter is prepared,
the surface of the substrate of the filter is also provided with a bonding pad which is electrically connected with the filter positioned on the same surface of the same substrate; the conductive lead is arranged along a direction perpendicular to the first surface and the second surface, is connected with at least one bonding pad and extends to a set surface through a through hole penetrating through a substrate between the bonding pad and the set surface, wherein the set surface is the outer side surface of at least one substrate on the outermost layer of the radio frequency module;
bonding at least two of said substrates in a direction perpendicular to a surface on which said filter is fabricated, comprising:
bonding at least two of the substrates through the conductive leads;
adjacent substrates are connected through the conductive wire bonding;
the conductive lead is used as an inductor;
the setting surface is provided with a wiring layer and a connecting terminal, and the conductive lead is electrically connected with the connecting terminal through the wiring layer; the side of the setting surface far away from the filter of the substrate further comprises a base plate.
11. The method of claim 10, wherein the step of forming the filters on the surfaces of the at least two substrates respectively comprises:
preparing the filter, the bonding pad and the conductive lead on one surface of a first substrate and a second substrate respectively;
bonding the first substrate and the second substrate on the side provided with the filter and the conductive leads through the conductive leads;
preparing the filter on the surface of the first substrate far away from the second substrate and a frame-shaped bonding pad with a projection in the thickness direction of the radio frequency module as a frame-shaped structure;
etching a first substrate in a frame-shaped structure of the frame-shaped bonding pad to form a via hole penetrating through the first substrate so as to expose the conductive lead between the first substrate and the second substrate;
and connecting the frame-shaped bonding pad with the conductive lead between the first substrate and the second substrate so as to enable the through hole to be of a hollow structure.
12. The method of claim 10, further comprising, before the step of forming the filters on the surfaces of the at least two substrates, respectively:
and thinning at least one substrate.
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