CN113093944A - Circuit, preparation method thereof and touch screen - Google Patents
Circuit, preparation method thereof and touch screen Download PDFInfo
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- CN113093944A CN113093944A CN202110419324.9A CN202110419324A CN113093944A CN 113093944 A CN113093944 A CN 113093944A CN 202110419324 A CN202110419324 A CN 202110419324A CN 113093944 A CN113093944 A CN 113093944A
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- master
- circuit
- mother
- plate
- circuit pattern
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The application discloses a circuit, a preparation method of the circuit and a touch screen. The method comprises the following steps: acquiring a first mother board and a second mother board with magnetic force, wherein the first mother board is provided with a hollowed first line pattern, and the second mother board is provided with a hollowed second line pattern; and magnetically attracting the first master plate and the second master plate together, and preparing a circuit at the first circuit pattern and the second circuit pattern in a film coating or etching mode. The preparation method directly adopts the first mother plate and the second mother plate to prepare the circuit without using a dry film, so that the processes of film pressing, exposure, development and film stripping are correspondingly saved, the preparation method is simple, the material is less, the time consumption is short, the first mother plate and the second mother plate can be repeatedly recycled, and the preparation cost is lower.
Description
Technical Field
The application relates to the technical field of optical display, in particular to a circuit, a preparation method thereof and a touch screen.
Background
The existing touch screen circuit manufacturing usually adopts the modes of film coating, film pressing, exposure, etching and film stripping to manufacture the required circuit. In the process of implementing the present application, the inventors found that the following problems exist in the prior art: in the process of manufacturing the circuit, because the dry film is used as a transition material, materials such as a film, a photomask, a developing solution, an etching solution, a film stripping solution and the like are required, the manufacturing method is complex, the used process is multiple, the materials are multiple, and the time consumption is long.
Disclosure of Invention
In view of the above, it is necessary to provide a circuit, a method for manufacturing the same, and a touch screen to solve the above problems.
The embodiment of the application provides a preparation method of a circuit, which comprises the following steps:
acquiring a first mother board and a second mother board with magnetic force, wherein the first mother board is provided with a hollowed first line pattern, and the second mother board is provided with a hollowed second line pattern;
and magnetically attracting the first master plate and the second master plate together, and preparing a circuit at the first circuit pattern and the second circuit pattern in a film coating or etching mode.
According to the circuit preparation method, the first mother plate and the second mother plate are magnetically attracted together, the circuit is prepared at the first circuit graph and the second circuit graph in a film coating or etching mode, the first mother plate and the second mother plate are directly adopted to prepare the circuit without using a dry film, film pressing, exposure, development and film stripping processes are correspondingly omitted, the preparation method is simple, the material is less, the time consumption is short, the first mother plate and the second mother plate can be recycled, and the preparation cost is low.
In some embodiments, the magnetically attracting the first master and the second master together and preparing the lines at the first line pattern and the second line pattern by plating or etching specifically includes:
providing a base material;
magnetically attracting the first master plate and the second master plate on two opposite sides of the base material;
respectively plating films on the first circuit pattern and the second circuit pattern;
and removing the first master and the second master to obtain the circuit.
Therefore, a circuit can be formed by coating on two sides of the substrate respectively, the manufacturing process is simple, the used materials are few, the first mother plate and the second mother plate can be recycled, and the preparation cost is low.
In some embodiments, the magnetically attracting the first master and the second master together and preparing the lines at the first line pattern and the second line pattern by plating or etching specifically includes:
providing a base material;
respectively arranging metal layers on two opposite sides of the base material;
magnetically attracting the first mother plate and the second mother plate to one side of the two metal layers which are deviated from each other;
etching the corresponding metal layer at the first and second line patterns, respectively;
and removing the first master and the second master to obtain the circuit.
Therefore, the metal layers on the two sides of the substrate can be etched to form a circuit respectively, the manufacturing process is simple, the used materials are few, the first mother set and the second mother set can be recycled, and the preparation cost is low.
In some embodiments, the magnetically attracting the first master and the second master together and preparing the lines at the first line pattern and the second line pattern by plating or etching specifically includes:
bonding the first master plate and the second master plate together;
respectively plating films on the first circuit pattern and the second circuit pattern;
and removing the first master and the second master to obtain the circuit.
Therefore, the circuit with double surfaces and no base material can be prepared, the manufacturing process is simple, the used materials are few, the first mother plate and the second mother plate can be recycled, and the preparation cost is low.
In some embodiments, the step of removing the first reticle and the second reticle comprises:
and respectively magnetically attracting and removing the first mother plate and the second mother plate by adopting a magnetic attraction piece.
Therefore, the first mother plate and the second mother plate can be conveniently removed, the time consumption is short, and the first mother plate and the second mother plate can not be damaged when being removed.
In some embodiments, the step of acquiring the first master and the second master having magnetic force specifically includes:
arranging magnetic powder on the rubber material;
rolling and molding the rubber material;
and hollowing out the first line pattern and the second line pattern on the rubber material after the rolling forming so as to obtain the first mother plate and the second mother plate.
Therefore, the first mother plate and the second mother plate with magnetism can be obtained, the manufacturing process is simple, and the cost is lower.
In some embodiments, the first reticle and the second reticle each have a thickness in the range of 0.3mm to 2 mm.
Thus, the conductivity and strength of the prepared circuit can be ensured.
In some embodiments, the plating is performed by electroplating or evaporation.
Therefore, the circuit with uniform density can be prepared, and the circuit has better conductivity.
The embodiment of the application also provides a circuit which is prepared by adopting the method.
The circuit is prepared in a film coating or etching mode at the first circuit graph and the second circuit graph after the first mother board and the second mother board are magnetically attracted together during preparation, the first mother board and the second mother board are directly adopted to prepare the circuit without using a dry film, film pressing, exposure, development and film stripping processes are correspondingly omitted, the manufacturing method is simple, the material is less, the time consumption is short, the first mother board and the second mother board can be repeatedly recycled, and the preparation cost is lower.
The embodiment of the application also provides a touch screen which comprises the circuit.
According to the circuit in the touch screen, after the first mother board and the second mother board are magnetically attracted together, the double-sided substrate circuit and the double-sided substrate-free circuit are prepared at the first circuit pattern and the second circuit pattern in a coating or etching mode, so that the double-sided non-foldable screen and the double-sided foldable screen are prepared, the circuit is prepared by directly adopting the first mother board and the second mother board without using a dry film, and accordingly, film pressing, exposure, development and film stripping processes are omitted, the manufacturing method is simple, the material is less, the time consumption is short, the first mother board and the second mother board can be recycled, and the preparation cost is low.
Drawings
Fig. 1 is a flow chart of a method for manufacturing a circuit according to a first embodiment of the present application.
Fig. 2 is an exploded structural diagram of a first master, a second master and a substrate in a first embodiment of the present application.
Fig. 3 is a schematic cross-sectional structure diagram of the first master, the second master and the substrate after assembly in the first embodiment of the present application.
Fig. 4 is a flowchart of the specific steps of acquiring the first master and the second master with magnetic force in the first embodiment of the present application.
Fig. 5 is a flowchart of specific steps of magnetically attracting the first master and the second master together and preparing a circuit at the first circuit pattern and the second circuit pattern by plating or etching in the first embodiment of the present application.
Fig. 6 is a schematic cross-sectional view of a wire prepared in a first embodiment of the present application.
Fig. 7 is a flowchart of specific steps of magnetically attracting the first master and the second master together and preparing a circuit at the first circuit pattern and the second circuit pattern by plating or etching in a second embodiment of the present application.
Fig. 8 is an exploded structural diagram of the first master, the second master, the metal layer and the substrate in the second embodiment of the present application.
Fig. 9 is a schematic cross-sectional view of a wire made in a second embodiment of the present application.
Fig. 10 is a flowchart of the specific steps of magnetically attracting the first master and the second master together and preparing the circuit at the first circuit pattern and the second circuit pattern by plating or etching in the third embodiment of the present application.
Fig. 11 is an exploded structural diagram of a first reticle and a second reticle in a third embodiment of the present application.
Fig. 12 is a schematic cross-sectional structure of the first master and the second master after assembly in the third embodiment of the present application.
Fig. 13 is a schematic cross-sectional view of a wire made in a third embodiment of the present application.
Description of the main elements
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the application and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and thus should not be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly above and obliquely above the second feature, or simply meaning that the first feature is at a lesser level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Referring to fig. 1, a first embodiment of the present application provides a method for manufacturing a circuit, which includes the following steps:
s10: referring to fig. 2 and fig. 3, a first mother plate 10 and a second mother plate 20 with magnetic force are obtained, wherein the first mother plate 10 is provided with a hollowed first circuit pattern 12, and the second mother plate 20 is provided with a hollowed second circuit pattern 22.
Specifically, referring to fig. 4, the step of acquiring the first master 10 and the second master 20 having magnetic force specifically includes:
s11: the rubber material is provided with magnetic powder.
Wherein the rubber material is soft material for rolling.
The magnetic powder is a hard magnetic monodomain particle, which is also the core component of the magnetic coating, and it is made into a magnetic slurry with a binder, a solvent, etc., and coated on the surface of a plastic or metal substrate (support). The magnetic powder in this embodiment is coated on a rubber material so that the first master 10 and the second master 20 are prepared to have magnetism.
S12: and rolling and forming the rubber material.
Because the rubber material is soft material, the rubber material can be formed into a plate-shaped structure by rolling so as to be convenient for hollow manufacturing.
S13: and hollowing out the first line pattern 12 and the second line pattern 22 on the rubber material after the rolling forming so as to obtain the first mother set 10 and the second mother set 20.
The shapes of the first circuit pattern 12 and the second circuit pattern 22 may be the same or different, and the shapes of the first circuit pattern 12 and the second circuit pattern 22 may be set according to actual needs, and are not particularly limited herein.
Wherein the thickness of the first master 10 and the second master 20 both range from 0.3mm to 2 mm. Thus, the conductivity and strength of the prepared circuit can be ensured.
S20: the first master 10 and the second master 20 are magnetically attracted together, and lines are prepared at the first line patterns 12 and the second line patterns 22 by means of plating or etching.
Referring to fig. 5, the steps of magnetically attracting the first master 10 and the second master 20 together and preparing the circuit at the first circuit pattern 12 and the second circuit pattern 22 by plating or etching specifically include:
s21: magnetically attracting the first master plate 10 and the second master plate 20 on two opposite sides of a substrate 30;
the substrate 30 is PET (Polyethylene terephthalate, commonly called polyester resin, which is the most important variety of thermoplastic polyester) or COP (optical material).
S22: the first and second wiring patterns 12 and 14 are plated with a film, respectively.
The plating method is electroplating or evaporating copper on the first circuit pattern 12 and the second circuit pattern 22, so that a circuit with uniform density can be prepared, and the circuit has good conductivity.
S23: referring to fig. 6, the first mother substrate 10 and the second mother substrate 20 are removed, and the circuit 40 is obtained.
Specifically, the first master 10 and the second master 20 are magnetically attracted by a magnetic attraction member respectively to remove the first master 10 and the second master 20, wherein the magnetic attraction member is opposite to the magnetism of the first master 10 and the second master 20.
It is understood that the magnetic element can be a magnet, an energized coil, but is not limited thereto. Wherein the lines 40 are substantially of a grid-like structure. In some embodiments, the line 40 may have other shapes.
According to the circuit preparation method, after the first mother board 10 and the second mother board 20 are magnetically attracted together, the circuit 40 is prepared at the first circuit pattern 12 and the second circuit pattern 22 in a coating or etching mode, the circuit 40 is prepared by directly adopting the first mother board 10 and the second mother board 20 without using a dry film, film pressing, exposure, development and film stripping processes are correspondingly omitted, the preparation method is simple, the materials are few, the time consumption is short, punching is not needed, the first mother board 10 and the second mother board 20 can be recycled, and the preparation cost is low.
Referring to fig. 7, a second embodiment of the present application provides a method for manufacturing a circuit, which is substantially the same as the method for manufacturing the circuit in the first embodiment, except that:
the steps of magnetically attracting the first master and the second master together and preparing the circuit at the first circuit pattern and the second circuit pattern by coating or etching specifically comprise:
s21: referring to fig. 8, metal layers 50 are respectively disposed on two opposite sides of the substrate 30;
the substrate 30 is PET (Polyethylene terephthalate, commonly called polyester resin, which is the most important variety of thermoplastic polyester) or COP (optical material).
The metal layer 50 is a copper layer. In some embodiments, the metal layer 50 is also an aluminum layer, a silver layer, but is not limited thereto.
S22: the first master 10 and the second master 20 are magnetically attracted to the sides of the two metal layers 50 facing away from each other.
Wherein the first mother plate 10 and the second mother plate 20 can be fixed by means of magnetic attraction.
S23: etching the corresponding metal layers at the first line pattern 12 and the second line pattern 22, respectively;
wherein the etching solution is used to etch the metal layer 50 corresponding to the first circuit pattern 12 and the second circuit pattern 22 until the substrate 30 is etched.
S24: referring to fig. 9, the first mother substrate 10 and the second mother substrate 20 are removed, and the circuit 40 is obtained.
Specifically, the first master 10 and the second master 20 are magnetically attracted by a magnetic attraction member respectively to remove the first master 10 and the second master 20, wherein the magnetic attraction member is opposite to the magnetism of the first master 10 and the second master 20. It is understood that the magnetic element can be a magnet, an energized coil, but is not limited thereto.
According to the circuit preparation method, after the first mother board 10 and the second mother board 20 are magnetically attracted together, the circuit 40 is prepared at the first circuit pattern 12 and the second circuit pattern 22 in a coating or etching mode, the circuit 40 is prepared by directly adopting the first mother board 10 and the second mother board 20 without using a dry film, film pressing, exposure, development and film stripping processes are correspondingly omitted, the preparation method is simple, the materials are few, the time consumption is short, punching is not needed, the first mother board and the second mother board can be recycled, and the preparation cost is low.
Referring to fig. 10, a third embodiment of the present application provides a method for manufacturing a circuit, which is substantially the same as the method for manufacturing the circuit in the first embodiment, except that:
the steps of magnetically attracting the first master and the second master together and preparing the circuit at the first circuit pattern and the second circuit pattern by coating or etching specifically comprise:
s21: referring to fig. 11 and 12, the first master 10 and the second master 20 are bonded together;
wherein the first master 10 and the second master 20 are attracted together by magnetic force.
S22: plating films on the first circuit pattern 12 and the second circuit pattern 22, respectively;
the plating method is electroplating or evaporating copper on the first circuit pattern 12 and the second circuit pattern 22, so that a circuit with uniform density can be prepared, and the circuit has good conductivity.
S23: referring to fig. 13, the first master 10 and the second master 20 are removed, and the circuit 40 is obtained.
Specifically, the first master 10 and the second master 20 are magnetically attracted by a magnetic attraction member respectively to remove the first master 10 and the second master 20, wherein the magnetic attraction member is opposite to the magnetism of the first master 10 and the second master 20. It is understood that the magnetic element can be a magnet, an energized coil, but is not limited thereto.
According to the circuit preparation method, after the first mother board 10 and the second mother board 20 are magnetically attracted together, the circuit 40 is prepared at the first circuit pattern 12 and the second circuit pattern 22 in a coating or etching mode, the circuit 40 is prepared by directly adopting the first mother board 10 and the second mother board 20 without using a dry film, film pressing, exposure, development and film stripping processes are correspondingly omitted, the preparation method is simple, the materials are few, the time consumption is short, punching is not needed, the first mother board 10 and the second mother board 20 can be recycled, and the preparation cost is low.
The embodiment of the application also provides a touch screen which comprises the circuit 40 prepared by the method.
After the circuit 40 in the touch screen is magnetically attracted together by the first mother board 10 and the second mother board 20, double-sided circuits with base materials and double-sided circuits without base materials are prepared at the positions of the first circuit pattern 12 and the second circuit pattern 22 in a film coating or etching mode, so that double-sided non-foldable screens and double-sided foldable screens are prepared, the circuit is prepared by directly adopting the first mother board 10 and the second mother board 20 without using a dry film, and accordingly, film pressing, exposure, development and film stripping processes are omitted, the manufacturing method is simple, materials are few, time consumption is short, punching is not needed, the first mother board 10 and the second mother board 20 can be recycled, and the preparation cost is low.
It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.
Claims (10)
1. A method for manufacturing a circuit, comprising the steps of:
acquiring a first mother board and a second mother board with magnetic force, wherein the first mother board is provided with a hollowed first line pattern, and the second mother board is provided with a hollowed second line pattern;
and magnetically attracting the first master plate and the second master plate together, and preparing a circuit at the first circuit pattern and the second circuit pattern in a film coating or etching mode.
2. The method for preparing the circuit according to claim 1, wherein the steps of magnetically attracting the first master and the second master together and preparing the circuit at the first circuit pattern and the second circuit pattern by plating or etching specifically comprise:
providing a base material;
magnetically attracting the first master plate and the second master plate on two opposite sides of the base material;
respectively plating films on the first circuit pattern and the second circuit pattern;
and removing the first master and the second master to obtain the circuit.
3. The method for preparing the circuit according to claim 1, wherein the steps of magnetically attracting the first master and the second master together and preparing the circuit at the first circuit pattern and the second circuit pattern by plating or etching specifically comprise:
providing a base material;
respectively arranging a metal layer on two opposite sides of the substrate;
magnetically attracting the first mother plate and the second mother plate to one side of the two metal layers which are deviated from each other;
etching the corresponding metal layer at the first and second line patterns, respectively;
and removing the first master and the second master to obtain the circuit.
4. The method for preparing the circuit according to claim 1, wherein the steps of magnetically attracting the first master and the second master together and preparing the circuit at the first circuit pattern and the second circuit pattern by plating or etching specifically comprise:
bonding the first master plate and the second master plate together;
respectively plating films on the first circuit pattern and the second circuit pattern;
and removing the first master and the second master to obtain the circuit.
5. The method of preparing a wire of any of claims 2-4, wherein the step of removing the first reticle and the second reticle comprises:
and respectively magnetically attracting and removing the first mother plate and the second mother plate by adopting a magnetic attraction piece.
6. The method for preparing a circuit according to any of claims 1 to 4, wherein the step of obtaining a first master and a second master having magnetic forces comprises in particular:
arranging magnetic powder on the rubber material;
rolling and molding the rubber material;
and hollowing out the first line pattern and the second line pattern on the rubber material after the rolling forming so as to obtain the first mother plate and the second mother plate.
7. The method of preparing the circuitry of any of claims 1-4, wherein the first master and the second master each have a thickness in the range of 0.3mm to 2 mm.
8. The method for manufacturing a wiring according to any one of claims 1 to 4, wherein the plating is performed by plating or evaporation.
9. A wire produced by the method of any one of claims 1 to 8.
10. A touch screen comprising the circuitry of claim 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110419324.9A CN113093944A (en) | 2021-04-19 | 2021-04-19 | Circuit, preparation method thereof and touch screen |
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| CN202110419324.9A CN113093944A (en) | 2021-04-19 | 2021-04-19 | Circuit, preparation method thereof and touch screen |
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| CN109471559A (en) * | 2018-11-02 | 2019-03-15 | 合肥鑫晟光电科技有限公司 | Touch base plate and preparation method thereof, display device |
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