CN113091347A

CN113091347A - Refrigerating device and range hood

Info

Publication number: CN113091347A
Application number: CN201911342704.6A
Authority: CN
Inventors: 江晨钟; 刘文洁; 岳宝; 郑防震
Original assignee: Midea Group Co Ltd; Guangdong Midea White Goods Technology Innovation Center Co Ltd
Current assignee: Midea Group Co Ltd; Guangdong Midea White Goods Technology Innovation Center Co Ltd
Priority date: 2019-12-23
Filing date: 2019-12-23
Publication date: 2021-07-09

Abstract

The application discloses refrigerating plant and cigarette machine, this refrigerating plant includes: the semiconductor refrigeration chip comprises a heating end and a refrigeration end; the first heat exchange assembly comprises a first heat exchanger and a first fan, the first heat exchanger is in heat conduction connection with the heating end, and the first fan is used for generating heat dissipation airflow flowing through the first heat exchanger; the cold accumulation assembly is in heat conduction connection with the refrigerating end and is used for storing cold energy generated by the refrigerating end of the semiconductor refrigerating chip; the second heat exchange assembly comprises a second heat exchanger and a second fan, the second heat exchanger is in heat conduction connection with the cold accumulation assembly, and the second fan is used for generating refrigerating airflow flowing through the second heat exchanger; and the controller is used for controlling the delayed start of the second fan relative to the first fan and the semiconductor refrigeration chip. The refrigerating device provided by the application can reduce cost.

Description

Refrigerating device and range hood

Technical Field

The application relates to the technical field of electric appliances, in particular to a refrigerating device and a range hood.

Background

The kitchen environment is sultry in summer, which easily causes human discomfort, aiming at the condition, the cigarette machine carrying the refrigerating system appears at present, the cigarette machine carrying the refrigerating system is easy to accept in product form, and can be mutually beneficial and complementary in function realization, so the direction is an important direction for future kitchen environment refrigeration. At present, a refrigerating system carried on the cigarette machine comprises a compressor refrigerating system and a semiconductor refrigerating system, wherein the semiconductor refrigerating system has the advantages of simple structure, light overall weight and the like.

The inventor of the present application finds that although there are many advantages, the semiconductor refrigeration system also has the problems of high cost and large volume, so how to reduce the cost and the volume is the key to whether the semiconductor refrigeration system can be widely applied.

Disclosure of Invention

The technical problem that this application mainly solved provides a refrigerating plant and cigarette machine, can reduce cost.

In order to solve the technical problem, the application adopts a technical scheme that: there is provided a refrigeration device comprising: the semiconductor refrigeration chip comprises a heating end and a refrigeration end; the first heat exchange assembly comprises a first heat exchanger and a first fan, the first heat exchanger is in heat conduction connection with the heating end, and the first fan is used for generating heat dissipation airflow flowing through the first heat exchanger; the cold accumulation assembly is in heat conduction connection with the refrigerating end and is used for storing cold energy generated by the refrigerating end of the semiconductor refrigerating chip; the second heat exchange assembly comprises a second heat exchanger and a second fan, the second heat exchanger is in heat conduction connection with the cold accumulation assembly, and the second fan is used for generating refrigerating airflow flowing through the second heat exchanger; and the controller is used for controlling the delayed start of the second fan relative to the first fan and the semiconductor refrigeration chip.

In order to solve the above technical problem, another technical solution adopted by the present application is: a range hood is provided comprising the range hood described above.

The beneficial effect of this application is: the refrigerating plant of this application postpones for first fan and semiconductor refrigeration chip to start through setting up controller control second fan, can make refrigerating plant refrigerate again after cold-storage in advance, the temperature difference between the end of heating and the refrigeration end of semiconductor refrigeration chip is great when comparing in prior art refrigerate immediately, this defect can be avoided in this application, thereby improve the refrigeration efficiency of semiconductor refrigeration chip, reduce the quantity of semiconductor refrigeration chip by time multiple, reach the purpose of saving volume and cost.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic structural view of an embodiment of a refrigeration unit of the present application;

FIG. 2 is a schematic view of the construction of the conductor of FIG. 1;

FIG. 3 is a schematic view of the first heat exchanger of FIG. 1;

FIG. 4 is a schematic structural view of another embodiment of a refrigeration unit of the present application;

figure 5 is a schematic structural diagram of an embodiment of a cigarette making machine of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that the refrigeration device in the present application can be used in various refrigeration equipments requiring refrigeration, such as a range hood, and is not limited herein.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a refrigeration device according to the present application. The refrigeration device 1000 includes a semiconductor refrigeration chip 1100, a first heat exchange assembly 1200, a cold storage assembly 1300, a second heat exchange assembly 1400, and a controller (not shown).

The semiconductor cooling chip 1100 includes a heating end 1101 and a cooling end 1102, and in the present embodiment, the heating end 1101 and the cooling end 1102 are disposed opposite to each other, so that when the semiconductor cooling chip 1100 operates, heat is transferred between the heating end 1101 and the cooling end 1102: heat is transferred from the cold side 1102 to the hot side 1101 so that the temperature of the cold side 1102 decreases and the temperature of the hot side 1101 increases.

The first heat exchange assembly 1200 includes a first heat exchanger 1210 and a first fan 1220, the first heat exchanger 1210 is in heat conduction connection with the heating end 1101, and the first fan 1220 is used for generating a heat dissipation airflow flowing through the first heat exchanger 1210. Specifically, heat generated by the heating end 1101 of the semiconductor refrigeration chip 1100 is transferred to the first heat exchanger 1210 to raise the temperature of the first heat exchanger 1210, and after the first fan 1220 works, heat of the first heat exchanger 1210 is taken away by heat exchange between the heat dissipation airflow generated by the first fan 1220 and the first heat exchanger 1210, so that heat dissipation is performed on the heating end 1101.

The cold accumulation assembly 1300 is in heat conduction connection with the refrigeration end 1102 and is used for storing cold generated by the refrigeration end 1102 of the semiconductor refrigeration chip 1100. Specifically, the cold storage assembly 1300 can store the cold generated by the refrigeration end 1102 without losing the cold.

The second heat exchange assembly 1400 comprises a second heat exchanger 1410 and a second fan 1420, the second heat exchanger 1410 is in heat conduction connection with the cold storage assembly 1300, and the second fan 1420 is used for generating a cooling air flow passing through the second heat exchanger 1410. Specifically, the cold energy stored in the cold storage module 1300 is transferred to the second heat exchanger 1410 to reduce the temperature of the second heat exchanger 1410, after the second fan 1420 works, the cooling airflow generated by the second fan 1420 exchanges heat with the second heat exchanger 1410 to take away the cold energy, the temperature of the cooling airflow is reduced, and finally the cooling airflow with the reduced temperature is blown to the external space, so as to achieve the purpose of reducing the ambient temperature.

The controller is used to control the second fan 1420 to delay start-up relative to the first fan 1220 and the semiconductor cooling chip 1100. Specifically, the controller controls the second fan 1420 to operate after controlling the first fan 1220 and the semiconductor cooling chip 1100 to operate.

In this embodiment, before the second fan 1420 is started, the cooling capacity generated by the cooling end 1102 can only be transmitted to the second heat exchanger 1410 but cannot be transmitted to the outside, that is, the cooling capacity generated by the cooling end 1102 is always stored in the cold storage assembly 1300, at this time, the cooling device 1000 is in the cold storage state, and after the second fan 1420 is started, the cooling airflow generated by the second fan 1420 can only absorb the cooling capacity on the second heat exchanger 1410 and blow to the outside, so as to achieve the purpose of cooling, at this time, the cooling device 1000 is in the cooling state.

That is to say, the refrigeration device 1000 controls the second fan 1420 to delay starting relative to the first fan 1220 and the semiconductor refrigeration chip 1100 by setting the controller, so that the refrigeration device 1000 can refrigerate after cold accumulation in advance, compared with the prior art in which the temperature difference between the heating end 1101 and the refrigeration end 1102 of the semiconductor refrigeration chip 1100 is large when immediately refrigerating, in the present application, since the cooling end 1102 is in contact with the cold accumulation assembly 1300, compared with direct contact with the wind to be cooled, the temperature of the refrigeration end 1102 is not immediately reduced, so that the defects in the prior art can be avoided, thereby improving the refrigeration efficiency of the semiconductor refrigeration chip 1100, reducing the number of the semiconductor refrigeration chips 1100 by time multiples, and achieving the purpose of saving volume and cost.

With continued reference to fig. 1, the cold storage assembly 1300 includes a cold storage tank 1310, a conducting element 1320, a conduit 1330, and a circulation pump 1340.

The cold storage box 1310 is used for storing cold storage agent; the conductive element 1320 is in thermal contact with the cold end 1102; the pipe 1330 connects the cold storage tank 1310 and the conduction member 1320; the circulation pump 1340 is used to pump coolant to circulate between the coolant tank 1310 and the conductive member 1320 along the conduit 1330.

After the semiconductor refrigeration chip 1100 and the first fan 1220 are started and before the second fan 1420 is started, the cold energy generated by the refrigeration end 1102 is transferred to the conduction member 1320, and the circulation pump 1340 pumps the cold storage agent to circulate between the cold storage tank 1310 and the conduction member 1320 along the pipeline 1330 so that the cold storage agent absorbs the cold energy on the conduction member 1320, thereby achieving the purpose of storing the cold energy.

The coolant may be water, and the inside and/or outside of the coolant storage 1310 and the pipe 1330 are/is covered by a heat insulating material to reduce heat leakage of the coolant.

With continued reference to fig. 1, a second heat exchanger 1410 is disposed on line 1330. Specifically, the second heat exchanger 1410 is provided therein with a liquid flow passage (not shown) through which a coolant flows, and the coolant can flow through the second heat exchanger 1410. In other embodiments, the second heat exchanger 1410 may not be disposed on the conduit 1330, and may be in heat conduction connection with the cold storage tank 1310 or the conducting element 1320, for example, in which case the cold storage agent cannot flow through the second heat exchanger 1410, but the second heat exchanger 1410 may also output the cold energy in the cold storage assembly 1300.

With continued reference to fig. 1, the conduit 1330 includes a first conduit 1331 for delivering the coolant from the cold storage tank 1310 to the conductive element 1320 and a second conduit 1332 for delivering the coolant from the conductive element 1320 to the cold storage tank 1310, wherein the circulation pump 1340 is disposed on the first conduit 1331 and the second heat exchanger 1410 is disposed on the second conduit 1332.

When the refrigeration device 1000 is in the cold storage state, the cold storage agent starts from the cold storage tank 1310 under the driving of the circulating pump 1340, sequentially passes through the circulating pump 1340, the conducting element 1320 and the second heat exchanger 1410, and finally returns to the cold storage tank 1310, and when the refrigeration device 1000 is in the refrigeration state, the cold storage agent flows in the same direction as before.

Referring to fig. 2, the conductive member 1320 includes a conductive body 1321, a first connector 1322 and a second connector 1323, which are disposed in a block shape, wherein the conductive body 1321 is in thermal contact with the cooling end 1102, a liquid flow channel (not shown) is disposed inside the conductive body 1321, and the first connector 1322 and the second connector 1323 are disposed at two ends of the liquid flow channel and are respectively connected to the cold storage tank 1310 through a first pipe 1331 and a second pipe 1332.

The conductive member 1320 is made of a material having an excellent thermal conductivity, such as metal (e.g., copper, aluminum, etc.). Meanwhile, in order to ensure a life span, the surface of the conduction member 1320 may be coated with an anti-corrosion material. Meanwhile, in order to ensure good thermal contact between the semiconductor refrigeration chip 1100 and the conductive element 1320, the refrigeration terminal 1102 is connected to the conductive element 1320 through a thermally conductive silicone.

Meanwhile, for the semiconductor refrigeration chip 1100, the amount of heat at the heating end 1101 is approximately equal to the sum of the amount of cold at the cooling end 1102 and the input electric power, so in this embodiment, in order to improve the heat dissipation effect, the heat exchange efficiency of the first heat exchanger 1210 is set to be greater than that of the second heat exchanger 1410.

In an application scenario, the first heat exchanger 1210 is a heat pipe heat exchanger, and the second heat exchanger 1410 is a fin-and-tube heat exchanger or a microchannel heat exchanger. Specifically, in the application scenario, with reference to fig. 1 and 3, the first heat exchanger 1210 includes a substrate 1211, a heat dissipation fin 1212, and a heat pipe 1213.

The substrate 1211 is in contact with the heating end 1101 of the semiconductor refrigeration chip 1100; the number of the heat dissipation fins 1212 is plural, the heat dissipation fins 1212 are arranged at intervals on a surface of the substrate 1211 on a side away from the semiconductor refrigeration chip 1100, and an extending direction of the heat dissipation fins 1212 is parallel to a flow direction of the heat dissipation airflow; the heat pipe 1213 connects the substrate 1211 with the plurality of heat dissipation fins 1212.

Specifically, the extending direction of the heat dissipation fins 1212 is set to be parallel to the flow direction of the heat dissipation airflow, so that the heat dissipation effect can be improved, and meanwhile, the heat pipe 1213 can transmit the heat generated by the heating end 1101 of the semiconductor refrigeration chip 1100 to the heat dissipation fins 1212 through the phase change process of the liquid in the heat pipe, and then the heat is taken away by the heat dissipation airflow, so that the heat dissipation performance is improved.

Meanwhile, in order to further improve the heat dissipation performance, one end of the heat pipe 1213, which is connected to the heat dissipation fins 1212, is inserted into the plurality of heat dissipation fins 1212, and in an application scenario, one end of the heat pipe 1213, which is inserted into the plurality of heat dissipation fins 1212, is connected to the plurality of heat dissipation fins 1212 in an interference fit manner.

Meanwhile, in order to ensure good thermal contact between the semiconductor refrigeration chip 1100 and the substrate 1211, the heating terminal 1101 is connected to the substrate 1211 through a thermal conductive silicone.

In this embodiment, the controller is further connected to the circulation pump 1340, and sets the rotation speed of the circulation pump 1340 to a medium speed between the maximum rotation speed and the minimum rotation speed of the circulation pump 1340 when the first fan 1220 and the semiconductor refrigeration chip 1100 are activated, and performs variable speed adjustment of the circulation pump 1340 after the second fan 1420 is activated.

Specifically, in the cold storage stage, the circulating pump 1340 rotates at a fixed rotation speed to enable the cold storage agent to flow at a fixed flow speed to store cold, and in the cold storage stage, the temperature of the refrigerating airflow needs to be changed according to actual conditions by considering factors such as the temperature of ambient wind, the demand of a user on refrigeration, and the temperature change of the cold storage agent, so that the flow speed of the cold storage agent is adjusted by adjusting the rotation speed of the circulating pump 1340, and the temperature of the refrigerating airflow is further adjusted.

In an application scenario, the refrigeration apparatus 1000 further includes a first temperature sensor (not shown) for detecting a temperature of the refrigeration airflow, and the controller performs a variable speed adjustment on the circulation pump 1340 according to a comparison result between the temperature of the refrigeration airflow and a preset temperature threshold.

The temperature of the refrigerating airflow is detected and the circulating pump 1340 is subjected to variable speed adjustment, so that the temperature of the refrigerating airflow meets the requirement of a user on the refrigerating temperature, and the customer experience is improved. The preset temperature threshold may be set by the user for its desired refrigeration temperature.

In another application scenario, the controller first reduces the rotation speed of the circulation pump 1340 after the second fan 1420 is started, and then gradually increases the rotation speed of the circulation pump 1340 over time.

At the initial stage of the refrigeration phase, the cooling capacity of the coolant is sufficient, if the rotation speed of the circulating pump 1340 is kept unchanged, the temperature of the cooling airflow is lower, specifically lower than the refrigeration temperature (preset temperature threshold) desired by the user, so that the rotation speed of the circulating pump 1340 is reduced first, the temperature of the cooling airflow is prevented from being too low, then the cooling capacity in the coolant is gradually taken away along with the cooling airflow, the temperature of the cooling airflow gradually rises, meanwhile, in the process of rising the temperature of the cooling airflow, if the temperature of the cooling airflow is found to be equal to the refrigeration temperature desired by the user, the circulating pump is controlled to maintain the current rotation speed, then along with the loss of the cooling capacity of the coolant, the temperature of the cooling airflow gradually rises, and at this time, the temperature of the cooling airflow exceeds the temperature desired by the user, therefore, in order to reduce 1340 between the temperature of the, the controller steps up the speed of the circulation pump 1340 over time until the maximum speed of the circulation pump 1340 is reached, at which the circulation pump 1340 will eventually rotate until the user is turned off.

In the present embodiment, the controller increases the cooling power of the semiconductor cooling chip 1100 after the second fan 1420 is activated.

Specifically, after the second fan 1420 is started, the requirement for the cooling capacity is greater than that in the cold storage phase due to the fact that the cooling capacity is lost to the outside, and therefore the requirement for the cooling capacity of the user can be guaranteed by increasing the cooling power of the semiconductor refrigeration chip 1100, that is, ensuring that the cooling power of the semiconductor refrigeration chip 1100 is greater than that in the cold storage phase in the cooling phase.

In the present embodiment, the controller gradually increases the cooling power of the semiconductor cooling chip 1100 over time after the second fan 1420 is activated.

Specifically, after the second fan 1420 is started, the cooling capacity of the coolant gradually loses to the outside along with the time, the temperature of the cooling airflow gradually rises and exceeds the temperature expected by the user, and in order to minimize the difference between the temperature of the cooling airflow and the temperature expected by the user, the controller gradually increases the cooling power of the semiconductor cooling chip 1100 along with the time, so that the semiconductor cooling chip 1100 is ensured to generate more and more cooling capacity, and the requirements of the user are met.

In this embodiment, the cooling device 1000 further includes a second temperature sensor (not shown) for detecting an ambient temperature, and the controller controls the cooling power of the semiconductor cooling chip 1100 according to the ambient temperature before the second fan 1420 is activated.

Specifically, in the cold accumulation stage, the refrigeration power of the semiconductor refrigeration chip 1100 is controlled according to the ambient temperature, so that the cold accumulation assembly 1300 can store a proper amount of cold, the phenomenon of too much or too little stored cold is avoided, and the purposes of saving energy and improving user experience are achieved.

In this embodiment, the cooling device 1000 further includes a control panel (not shown), and the controller activates the first fan 1220 and the semiconductor cooling chip 1100 in response to a reservation command received by the control panel, and further activates the second fan 1420 in response to a cooling command received by the control panel.

In an application scenario, when a user needs to cool the refrigeration device 1000, an appointment instruction is input on the control panel, and then the refrigeration device 1000 starts to cool the air.

In another application scenario, a user inputs a reservation instruction on the control panel, then the refrigeration device 1000 starts to store cold, and at the same time, after the preset time for receiving the reservation instruction is reached, the refrigeration device 1000 automatically performs refrigeration, that is, at this time, the refrigeration device 1000 defaults to receiving the refrigeration instruction and does not need the user to input the refrigeration instruction again.

The refrigeration device 1000 in this embodiment may establish a communication connection with the mobile terminal in a wired or wireless manner, so that a user may remotely set the cold storage time and the refrigeration time of the refrigeration device 1000.

In this embodiment, the control panel counts the receiving time of the cooling command to obtain a first scheduled time, and the controller further sets a second scheduled time before the first scheduled time as the starting time of the first fan 1220 and the semiconductor cooling chip 1100.

Specifically, the control panel analyzes the receiving time of the previous refrigeration instruction by using big data to obtain the rule that the user uses the refrigeration device 1000 to perform refrigeration, so as to presume that the user will use the refrigeration device 1000 to perform refrigeration at a first scheduled time, for example, the user will use the refrigeration device 1000 to perform refrigeration at 11 points (the first scheduled time) every day, and further set a second scheduled time before the first scheduled time as a cold storage time, and the subsequent refrigeration device 1000 will automatically start cold storage at the second scheduled time, thereby realizing automation and intellectualization of the refrigeration device 1000.

In an application scene, the control panel counts the receiving time of the reservation instruction besides the receiving time of the refrigeration instruction, so that the time interval between cold accumulation and refrigeration of a user is obtained, and then a second reservation time is set according to the counted first reservation time and the time interval.

In other embodiments, the cooling device 1000 may not include a control panel, but may include a timer (not shown), in which case the controller starts the first fan 1220 and the semiconductor cooling chip 1100 at a first scheduled time according to the timing result of the timer, and further starts the second fan 1420 at a second scheduled time according to the timing result of the timer.

Specifically, the user sets the cold accumulation time and the refrigeration time of the refrigeration device 1000 in a countdown manner in advance, for example, cold accumulation starts after 5 hours, refrigeration starts after 5.5 hours, and then a timer starts to count time, and the controller controls the operation of the refrigeration device 1000 according to the timing result of the timer.

In yet another embodiment, the refrigeration device 1000 may include both a control panel and a timer, without limitation.

Referring to fig. 4, fig. 4 is a schematic structural diagram of another embodiment of the refrigeration device of the present application. Unlike the above-described embodiment, in order to further improve the cooling performance of the cooling device 2000, the number of the semiconductor cooling chips 2100 is at least two, and the at least two semiconductor cooling chips 2100 are sequentially arranged in the flow direction of the coolant, wherein the flow direction of at least a part of the heat radiation airflow is opposite to the flow direction of the coolant.

Generally, for the semiconductor cooling chip 2100, the larger the temperature difference between the cooling end 2102 and the heating end 2101 is, the lower the working efficiency is and the more energy is consumed, so the temperature difference between the heating end 2101 and the cooling end 2102 of the semiconductor cooling chip 2100 is required to be not more than 30 degrees celsius due to the requirements of economy and working efficiency. Therefore, in this embodiment, the flowing direction of the heat dissipation air flow that sequentially exchanges heat with the heating end 2101 of each semiconductor refrigeration chip 2100 is opposite to the flowing direction of the coolant that sequentially exchanges heat with the cooling end 2102 of each semiconductor refrigeration chip 2100, and when the specifications of each semiconductor refrigeration chip 2100 are completely the same, the temperature of the cooling end 2102 of each semiconductor refrigeration chip 2100 is sequentially decreased along the flowing direction of the coolant, and the temperature of the heating end 2101 of each semiconductor refrigeration chip 2100 is sequentially increased along the flowing direction of the heat dissipation air flow, that is, the overall temperature of each semiconductor refrigeration chip 2100 is sequentially decreased along the flowing direction of the coolant, so that the temperature difference between the two ends of each semiconductor refrigeration chip 2100 can be ensured to meet the requirement.

In the present embodiment, during operation, the cooling power of each semiconductor cooling chip 2100 is sequentially reduced in the direction of flow of the coolant.

Specifically, since the temperature of the coolant gradually decreases after passing through the cooling end 2102 of each semiconductor cooling chip 2100 in sequence, the temperature of the coolant to be processed by the semiconductor cooling chip 2100 at the front end is higher than that of the coolant to be processed by the semiconductor cooling chip 2100 at the rear end along the flow direction of the coolant, and thus the cooling power for setting each semiconductor cooling chip 2100 is sequentially decreased along the flow direction of the coolant, that is, the semiconductor cooling chip 2100 at the front end has stronger cooling capacity than that of the semiconductor cooling chip 2100 at the rear end along the flow direction of the coolant, and the purpose of saving energy can be achieved.

In this embodiment, when the semiconductor refrigeration chip 2100 is operated, the temperature of the cooling end 2102 of each semiconductor refrigeration chip 2100 is sequentially decreased in the flow direction of the coolant, and the temperature of the heating end 2101 of each semiconductor refrigeration chip 2100 is sequentially increased in the direction opposite to the flow direction of the coolant, so that the temperature difference between the heating end 2101 and the cooling end 2102 of each semiconductor refrigeration chip 2100 can be satisfied.

Meanwhile, in the present embodiment, the heating terminals 2101 of at least two semiconductor cooling chips 2100 may be thermally connected to the same first heat exchanger 2210 (as shown in fig. 4), or may be thermally connected to different first heat exchangers 2210, which is not limited herein.

Referring to fig. 5, the present application further provides a cigarette making machine 3000 including the refrigeration device 3100 according to any one of the above embodiments, wherein for the specific structure of the refrigeration device 3100, reference may be made to the above embodiments, and details are not repeated herein.

The cooling airflow in the cooling device 3100 is eventually blown towards the user and the cooling airflow is eventually blown away from the user.

In summary, the refrigeration device provided by the present application can improve the refrigeration efficiency of the semiconductor refrigeration chips by implementing early cold accumulation, and reduce the number of the semiconductor refrigeration chips by time multiples, thereby achieving the purpose of saving volume and cost.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A refrigeration device, comprising:

the semiconductor refrigeration chip comprises a heating end and a refrigeration end;

the first heat exchange assembly comprises a first heat exchanger and a first fan, the first heat exchanger is in heat conduction connection with the heating end, and the first fan is used for generating heat dissipation airflow flowing through the first heat exchanger;

the cold accumulation assembly is in heat conduction connection with the refrigerating end and is used for storing cold energy generated by the refrigerating end of the semiconductor refrigerating chip;

the second heat exchange assembly comprises a second heat exchanger and a second fan, the second heat exchanger is in heat conduction connection with the cold accumulation assembly, and the second fan is used for generating refrigerating airflow flowing through the second heat exchanger;

and the controller is used for controlling the delayed start of the second fan relative to the first fan and the semiconductor refrigeration chip.

2. A cold storage assembly according to claim 1, wherein the cold storage assembly comprises:

the cold storage box is used for storing cold storage agent;

a conductor in thermal contact with the cooling end;

the pipeline is connected with the cold storage box and the conduction piece;

and the circulating pump is used for pumping the cold storage agent to circulate between the cold storage tank and the conduction piece along the pipeline.

3. A cold appliance according to claim 2, wherein the second heat exchanger is arranged on the pipeline.

4. A cold appliance according to claim 3, wherein the conduit comprises a first conduit for conveying the cold storage agent from the cold storage tank to the conductive element and a second conduit for conveying the cold storage agent from the conductive element to the cold storage tank, wherein the circulation pump is provided on the first conduit and the second heat exchanger is provided on the second conduit.

5. A cold appliance according to claim 4, wherein the number of the semiconductor cooling chips is at least two, and the at least two semiconductor cooling chips are arranged in sequence along the flow direction of the coolant, wherein the flow direction of at least part of the heat dissipating air flow is opposite to the flow direction of the coolant.

6. A cold appliance according to claim 5, wherein, in use, the cooling power of each semiconductor cooling chip decreases sequentially in the direction of flow of the coolant.

7. A cold appliance according to claim 5, wherein, in use, the temperature at the cold end of each semiconductor cold chip decreases sequentially in the direction of flow of the cold storage agent and the temperature at the hot end of each semiconductor cold chip increases sequentially in the direction opposite to the direction of flow of the cold storage agent.

8. A refrigerating device as recited in claim 4 wherein said conducting member comprises a conducting body, a first joint and a second joint arranged in a block shape, wherein said conducting body is in thermal contact with said refrigerating end, and a liquid flow channel is arranged in said conducting body, and said first joint and said second joint are arranged at both ends of said liquid flow channel and are connected to said cold storage tank through said first pipeline and said second pipeline, respectively.

9. The refrigeration apparatus of claim 2 wherein the controller is further coupled to the circulation pump and configured to set the circulation pump to a medium speed when the first fan and the semiconductor refrigeration chip are activated and to adjust the circulation pump at a variable speed after the second fan is activated, the medium speed being between a maximum speed and a minimum speed of the circulation pump.

10. A refrigeration unit as recited in claim 9 further comprising a first temperature sensor for sensing the temperature of said refrigerant gas stream, said controller effecting variable speed adjustment of said circulation pump based upon a comparison of the temperature of said refrigerant gas stream to a predetermined temperature threshold.

11. The refrigeration apparatus as claimed in claim 9, wherein the controller decreases the rotational speed of the circulation pump after the second fan is started, and then gradually increases the rotational speed of the circulation pump with time.

12. The cooling device as claimed in claim 1, wherein the controller increases the cooling power of the semiconductor cooling chip after the second fan is started.

13. The cooling device as claimed in claim 1, wherein the controller increases the cooling power of the semiconductor cooling chip gradually with time after the second fan is started.

14. The cooling device as claimed in claim 1, further comprising a second temperature sensor for detecting an ambient temperature, wherein the controller controls the cooling power of the semiconductor cooling chip according to the ambient temperature before the second fan is started.

15. The refrigeration device as recited in claim 1 further comprising a control panel, said controller activating said first fan and said semiconductor refrigeration chip in response to a reservation command received by said control panel and further activating said second fan in response to a refrigeration command received by said control panel.

16. A cooling device as claimed in claim 15, wherein the control panel counts a reception time of the cooling command to obtain a first scheduled time, and the controller further sets a second scheduled time before the first scheduled time as a start time of the first fan and the semiconductor cooling chip.

17. The cooling device as claimed in claim 1, further comprising a timer, wherein the controller starts the first fan and the semiconductor cooling chip at a first scheduled time according to a timing result of the timer, and further starts the second fan at a second scheduled time according to a timing result of the timer.

18. A cold appliance according to claim 1, wherein the first heat exchanger has a greater heat exchange efficiency than the second heat exchanger.

19. A refrigeration apparatus as recited in claim 1 wherein said first heat exchanger is a heat pipe heat exchanger and said second heat exchanger is a tube and fin heat exchanger or a microchannel heat exchanger, said heat pipe heat exchanger comprising:

the substrate is in contact with the heating end of the semiconductor refrigeration chip;

the heat dissipation fins are arranged on the surface of one side, far away from the semiconductor refrigeration chip, of the substrate at intervals, and the extension directions of the heat dissipation fins are parallel to the flow direction of the heat dissipation airflow;

and the heat pipe is used for connecting the substrate and the plurality of radiating fins.

20. A machine as claimed in any one of claims 1 to 19 comprising a refrigeration unit as claimed in any one of claims 1 to 19.