CN113085343A - Production process of flexible ultrathin aluminum-based copper-clad plate - Google Patents
Production process of flexible ultrathin aluminum-based copper-clad plate Download PDFInfo
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- CN113085343A CN113085343A CN202110520305.5A CN202110520305A CN113085343A CN 113085343 A CN113085343 A CN 113085343A CN 202110520305 A CN202110520305 A CN 202110520305A CN 113085343 A CN113085343 A CN 113085343A
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- clad plate
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- glued
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention belongs to the technical field of copper-clad plate manufacturing, in particular to a production process of a flexible ultrathin aluminum-based copper-clad plate, aiming at the problems that the existing production process of the flexible ultrathin aluminum-based copper-clad plate has insufficient insulativity and influences the service life of a product, the following scheme is proposed, and the production process comprises the following steps: s1: stirring MUF resin, a coupling agent, a waterproof agent, a curing agent and water for glue mixing; s2: blending the heat conducting powder and epoxy resin; s3: coating the prepared glue on the heat conducting powder and the epoxy resin to form insulating heat conducting glue; s4: placing the copper-clad plate in a mold, and baking the copper-clad plate; s5: extruding the insulating heat-conducting adhesive and the copper-clad plate to adhere the insulating heat-conducting adhesive and the copper-clad plate together to form a glued copper-clad plate; s6: covering a conductive copper foil on the glued copper-clad plate, and cooling the glued copper-clad plate; s7: and trimming the glued copper clad laminate. The invention has simple structure, the insulating heat-conducting glue is adhered with the copper-clad plate, the insulativity is greatly improved, and the use by people is convenient.
Description
Technical Field
The invention relates to the technical field of copper-clad plate manufacturing, in particular to a production process of a flexible ultrathin aluminum-based copper-clad plate.
Background
The aluminum-based copper-clad plate is a metal-based copper-clad plate with a good heat dissipation function, a common single-sided plate is composed of a three-layer structure, namely a circuit layer, an insulating layer and a metal base layer, and is also designed into a double-sided plate for high-end use, and the structure is formed by attaching a common multilayer plate, the insulating layer and an aluminum base.
The existing production process of the flexible ultrathin aluminum-based copper-clad plate has insufficient insulativity, and the service life of the product is influenced.
Disclosure of Invention
The invention aims to solve the defects that the prior production process of a flexible ultrathin aluminum-based copper-clad plate has insufficient insulativity and influences the service life of a product, and provides the production process of the flexible ultrathin aluminum-based copper-clad plate.
In order to achieve the purpose, the invention adopts the following technical scheme:
a production process of a flexible ultrathin aluminum-based copper-clad plate comprises the following steps:
s1: stirring MUF resin, a coupling agent, a waterproof agent, a curing agent and water for glue mixing;
s2: blending the heat conducting powder and epoxy resin;
s3: coating the prepared glue on the heat conducting powder and the epoxy resin to form insulating heat conducting glue;
s4: placing the copper-clad plate in a mold, and baking the copper-clad plate;
s5: extruding the insulating heat-conducting adhesive and the copper-clad plate to adhere the insulating heat-conducting adhesive and the copper-clad plate together to form a glued copper-clad plate;
s6: covering a conductive copper foil on the glued copper-clad plate, and cooling the glued copper-clad plate;
s7: and (4) trimming, laminating, inspecting and finally packaging the coated copper-clad plate.
Preferably, the MUF resin, the coupling agent, the waterproof agent, the curing agent and the water in the S1 are divided according to the proportion of 1:1:1:1:0.5, the materials are fed by a feeding machine, the stirring is carried out for two minutes, the stirring is carried out while vacuumizing is carried out, the vacuumizing time is one minute, and the vacuumizing can eliminate the foaming.
Preferably, in S2, the heat conductive powder and the epoxy resin are divided according to a ratio of 2:1, and are loaded by a loading machine, and are automatically stirred for two minutes.
Preferably, the glue in S3 is obtained in S1, and the glue is coated on the heat conducting powder and the epoxy resin, and then cooled to form the insulating and heat conducting glue.
Preferably, the mold in S4 is divided into an upper mold and a lower mold, and the heating temperatures of the upper mold and the lower mold are uniformly adjusted to 150 ℃.
Preferably, in the step S5, the baked copper-clad plate and the cooled insulating heat-conducting adhesive are extruded, and the heat-conducting adhesive is softened when heated, increases viscosity thereof and adheres to the copper-clad plate to form the glued copper-clad plate.
Preferably, in the step S6, the conductive copper foil is covered on the glued copper-clad plate, the glued copper-clad plate is heated again for 130 ℃ for one minute to be glued with the conductive copper foil, and then the glued copper-clad plate is physically cooled to 50 ℃.
Preferably, in the step S7, the glued copper-clad plate is trimmed by using a tool, the product is cooled by using an air cooler again, and then the product is subjected to film pasting and inspection, and finally the qualified product is packaged and then put in storage.
Compared with the prior art, the invention has the advantages that:
(1) the copper-clad plate is adhered with the insulating heat-conducting glue to form the insulating heat-conducting glue, and the insulating property is greatly improved and the working efficiency is improved because the insulating heat-conducting glue removes the heat-resistant material.
The invention has simple structure and convenient use, and the insulating heat-conducting glue is adhered with the copper-clad plate, thereby greatly improving the insulativity and facilitating the use of people.
Drawings
FIG. 1 is a schematic diagram of a forming flow structure of a production process of a flexible ultrathin aluminum-based copper-clad plate provided by the invention.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments, but not all embodiments.
Example one
Referring to fig. 1, a production process of a flexible ultrathin aluminum-based copper-clad plate comprises the following steps:
s1: stirring MUF resin, a coupling agent, a waterproof agent, a curing agent and water for glue mixing;
s2: blending the heat conducting powder and epoxy resin;
s3: coating the prepared glue on the heat conducting powder and the epoxy resin to form insulating heat conducting glue;
s4: placing the copper-clad plate in a mold, and baking the copper-clad plate;
s5: extruding the insulating heat-conducting adhesive and the copper-clad plate to adhere the insulating heat-conducting adhesive and the copper-clad plate together to form a glued copper-clad plate;
s6: covering a conductive copper foil on the glued copper-clad plate, and cooling the glued copper-clad plate;
s7: and (4) trimming, laminating, inspecting and finally packaging the coated copper-clad plate.
In this example, the MUF resin, the coupling agent, the waterproofing agent, the curing agent, and the water in S1 are divided into portions in a ratio of 1:1:1:1:0.5, and the portions are fed by a feeding machine, stirred for two minutes, and vacuumized while stirring for one minute, and the bubbling is eliminated by vacuuming.
In this embodiment, the heat conductive powder and the epoxy resin in S2 are divided according to a ratio of 2:1, and are loaded by a loading machine, and are automatically stirred for two minutes.
In this embodiment, the glue in S3 is obtained in S1, and the heat conductive powder and the epoxy resin placed in the mold are coated with the glue and cooled to form the insulating heat conductive glue.
In the embodiment, the die in the S4 is divided into an upper die and a lower die, the copper-clad plate is placed in the upper die and the lower die, the dies are closed, and the dies are baked at the baking temperature of 150 ℃.
In this embodiment, in S5, the baked copper-clad plate and the cooled insulating heat-conducting adhesive are extruded, and the heat-conducting adhesive softens when exposed to heat, increases its viscosity, and adheres to the copper-clad plate to form the adhesive coated copper-clad plate.
In this embodiment, the conductive copper foil is covered on the glued copper clad laminate in S6, the glued copper clad laminate is heated again for 130 ℃ for one minute to be glued with the conductive copper foil, and then the glued copper clad laminate is physically cooled to 50 ℃.
In the embodiment, the glued copper-clad plate is trimmed by using a tool in S7, the product is cooled by using the air cooler again, and then the glued copper-clad plate is subjected to film pasting and inspection, finally the qualified product is packaged and then is put in storage.
Example two
Referring to fig. 1, a production process of a flexible ultrathin aluminum-based copper-clad plate comprises the following steps:
s1: stirring MUF resin, a coupling agent, a waterproof agent, a curing agent and water for glue mixing;
s2: blending the heat conducting powder and epoxy resin;
s3: coating the prepared glue on the heat conducting powder and the epoxy resin to form insulating heat conducting glue;
s4: placing the copper-clad plate in a mold, and baking the copper-clad plate;
s5: extruding the insulating heat-conducting adhesive and the copper-clad plate to adhere the insulating heat-conducting adhesive and the copper-clad plate together to form a glued copper-clad plate;
s6: covering a conductive copper foil on the glued copper-clad plate, and cooling the glued copper-clad plate;
s7: and (4) trimming, laminating, inspecting and finally packaging the coated copper-clad plate.
In this example, the MUF resin, the coupling agent, the waterproofing agent, the curing agent, and the water in S1 are divided into portions in a ratio of 1:1:1:1:0.5, and the portions are fed by a feeding machine, stirred for two minutes, and vacuumized while stirring for one minute, and the bubbling is eliminated by vacuuming.
In this embodiment, the heat conductive powder and the epoxy resin in S2 are divided according to a ratio of 2:1, and are loaded by a loading machine, and are automatically stirred for two minutes.
In this embodiment, the glue in S3 is obtained in S1, and the heat conductive powder and the epoxy resin placed in the mold are coated with the glue and cooled to form the insulating heat conductive glue.
In the embodiment, the die in the S4 is divided into an upper die and a lower die, the copper-clad plate is placed in the upper die and the lower die, the dies are closed, the dies are baked, the baking temperature is adjusted to 150 ℃, the baking time is 1 hour, and the dies are taken out and cooled to 100 ℃ after being baked.
In this embodiment, in S5, the baked copper-clad plate and the cooled insulating heat-conducting adhesive are extruded, and the heat-conducting adhesive softens when exposed to heat, increases its viscosity, and adheres to the copper-clad plate to form the adhesive coated copper-clad plate.
In this embodiment, in S6, the conductive copper foil is covered on the glued copper-clad plate, the glued copper-clad plate is heated again for 130 ℃ for one minute, the glued copper-clad plate and the conductive copper foil are pressed to be glued together, and an air cooler is used to physically cool the glued copper-clad plate and the conductive copper foil to 50 ℃.
In the embodiment, the glued copper-clad plate is trimmed by using a tool in S7, the product is cooled by using the air cooler again, and then the glued copper-clad plate is subjected to film pasting and inspection, finally the qualified product is packaged and then is put in storage.
The above description is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention in the technical scope of the present invention.
Claims (8)
1. A production process of a flexible ultrathin aluminum-based copper-clad plate is characterized by comprising the following steps:
s1: stirring MUF resin, a coupling agent, a waterproof agent, a curing agent and water for glue mixing;
s2: blending the heat conducting powder and epoxy resin;
s3: coating the prepared glue on the heat conducting powder and the epoxy resin to form insulating heat conducting glue;
s4: placing the copper-clad plate in a mold, and baking the copper-clad plate;
s5: extruding the insulating heat-conducting adhesive and the copper-clad plate to adhere the insulating heat-conducting adhesive and the copper-clad plate together to form a glued copper-clad plate;
s6: covering a conductive copper foil on the glued copper-clad plate, and cooling the glued copper-clad plate;
s7: and (4) trimming, laminating, inspecting and finally packaging the coated copper-clad plate.
2. The production process of the flexible ultrathin aluminum-based copper-clad plate as claimed in claim 1, wherein the MUF resin, the coupling agent, the waterproof agent, the curing agent and the water in the step S1 are divided into components according to the proportion of 1:1:1:1:0.5, the components are fed by a feeding machine, stirred for two minutes, and vacuumized while being stirred for one minute, and the bubbling can be eliminated by vacuumizing.
3. The production process of the flexible ultra-thin aluminum-based copper-clad plate according to claim 1, wherein the heat conducting powder and the epoxy resin in the S2 are divided according to a ratio of 2:1, and are fed by a feeding machine and automatically stirred for two minutes.
4. The process for producing a flexible ultra-thin aluminum-based copper-clad plate according to claim 1, wherein the glue in S3 is obtained from S1, and the glue is coated on the heat conductive powder and the epoxy resin, and then cooled to form the insulating heat conductive glue.
5. The production process of the flexible ultra-thin aluminum-based copper-clad plate according to claim 1, wherein the mold in S4 is divided into an upper mold and a lower mold, and the heating temperatures of the upper mold and the lower mold are uniformly adjusted to 150 ℃.
6. The process for producing a flexible ultra-thin aluminum-based copper-clad plate according to claim 1, wherein in step S5, the baked copper-clad plate and the cooled insulating heat-conducting adhesive are extruded, and the heat-conducting adhesive softens under heat and increases its viscosity to adhere the copper-clad plate together, thereby forming a rubberized copper-clad plate.
7. The process for producing a flexible ultra-thin aluminum-based copper-clad plate according to claim 1, wherein in step S6, the coated copper-clad plate is covered with a conductive copper foil, and then heated again for 130 ℃ for one minute to adhere the coated copper-clad plate to the conductive copper foil, and then physically cooled to 50 ℃.
8. The production process of the flexible ultrathin aluminum-based copper-clad plate according to claim 1, characterized in that in S7, the glued copper-clad plate is trimmed by using a tool, the product is cooled by using an air cooler again, and then the product is subjected to film pasting and inspection, and finally the qualified product is packaged and then put in storage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110520305.5A CN113085343A (en) | 2021-05-13 | 2021-05-13 | Production process of flexible ultrathin aluminum-based copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110520305.5A CN113085343A (en) | 2021-05-13 | 2021-05-13 | Production process of flexible ultrathin aluminum-based copper-clad plate |
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| Publication Number | Publication Date |
|---|---|
| CN113085343A true CN113085343A (en) | 2021-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110520305.5A Pending CN113085343A (en) | 2021-05-13 | 2021-05-13 | Production process of flexible ultrathin aluminum-based copper-clad plate |
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| Country | Link |
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| CN (1) | CN113085343A (en) |
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- 2021-05-13 CN CN202110520305.5A patent/CN113085343A/en active Pending
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