CN217993763U - Battery package signal acquisition board - Google Patents
Battery package signal acquisition board Download PDFInfo
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- CN217993763U CN217993763U CN202220574763.7U CN202220574763U CN217993763U CN 217993763 U CN217993763 U CN 217993763U CN 202220574763 U CN202220574763 U CN 202220574763U CN 217993763 U CN217993763 U CN 217993763U
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- adhesive layer
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- signal acquisition
- acquisition board
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Abstract
The utility model provides a battery package signal acquisition board relates to battery package signal acquisition board technical field. The utility model discloses a battery package signal acquisition board includes first insulating layer, first adhesive layer, conductor layer, second adhesive layer and second insulating layer, and the two sides of conductor layer bond with first adhesive layer and second adhesive layer respectively, and the one side that the conductor layer was kept away from on first adhesive layer bonds with first insulating layer, and the one side that the conductor layer was kept away from on second adhesive layer bonds with the second insulating layer; the first adhesive layer and the second insulating layer are both made of normal-temperature curing adhesive layers. The utility model discloses a battery package signal acquisition board adopts normal atmospheric temperature solidification adhesive layer to replace thermosetting adhesive layer, need not the high temperature heating, can the assembly shaping at normal atmospheric temperature, has reduced the requirement to function, material and the structure of mould, has reduced the manufacturing cost of product, has improved production efficiency and security.
Description
Technical Field
The utility model relates to a battery package signal acquisition board technical field especially relates to a battery package signal acquisition board.
Background
In the prior art, a battery pack signal acquisition board is generally prepared by superposing a plastic insulating film coated with a thermosetting adhesive (also called a thermosetting resin adhesive) on the surface thereof with a conductor or a signal acquisition part and heating and molding at high temperature. The thermosetting adhesive is heated at high temperature to fix the plastic insulating film on the conductor or the signal acquisition part, and plays a role in protection and insulation. However, the battery pack signal acquisition board of this type has the following defects: the product manufacturing process needs to use a heavy mold for auxiliary molding, so that the equipment investment cost is high; the energy consumption is high in the high-temperature heating process, and energy conservation and emission reduction are not facilitated; the product needs to be cooled after being heated at high temperature, the production period of the product is long, and the production efficiency is low.
SUMMERY OF THE UTILITY MODEL
Based on this, it is necessary to provide a battery package signal acquisition board to above-mentioned problem, adopts normal atmospheric temperature solidification adhesive layer to replace thermosetting adhesive layer, need not high temperature heating, can assembly moulding at normal atmospheric temperature, and the requirement to the function of mould, material and structure reduces, has reduced the manufacturing cost of product simultaneously, has improved production efficiency and security.
A battery pack signal acquisition board comprises a first insulating layer, a first adhesive layer, a conductor layer, a second adhesive layer and a second insulating layer, wherein two surfaces of the conductor layer are respectively bonded with the first adhesive layer and the second adhesive layer; the first adhesive layer and the second insulating layer are both made of normal-temperature curing adhesive layers.
In one embodiment, the normal temperature curing adhesive layer is an acrylic adhesive layer or an epoxy adhesive layer.
In one embodiment, the thickness of the first adhesive and the second adhesive is 0.05-0.5 μm.
In one embodiment, the first insulating layer is a PI (polyimide) plastic insulating film or a PET (polyethylene terephthalate) plastic insulating film; the second insulating layer is made of a PI plastic insulating film or a PET plastic insulating film.
In one embodiment, the first insulating layer and the second insulating layer each have a thickness of 0.05 to 0.5 μm.
In one embodiment, the conductor layer is a composite board of an FPC and a metal substrate.
In one embodiment, the metal substrate is a copper substrate or an aluminum substrate.
In one embodiment, the thickness of the conductor layer is 0.05-0.5 μm.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses a battery package signal acquisition board adopts normal atmospheric temperature solidification adhesive layer to replace thermosetting adhesive layer, need not the high temperature heating, can the assembly shaping under normal atmospheric temperature, reduces the manufacturing cost of product simultaneously to the requirement of function, material and the structure of mould, has improved production efficiency and security.
Drawings
Fig. 1 is a schematic structural diagram of a battery pack signal acquisition board in the embodiment.
In the figure, 100, a first insulating layer, 200, a first adhesive layer, 300, a conductor layer, 400, a second adhesive layer, 500, and a second insulating layer.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Example 1
A signal acquisition board for a battery pack is shown in FIG. 1, and comprises a first insulating layer 100, a first adhesive layer 200, a conductor layer 300, a second adhesive layer 400 and a second insulating layer 500 which are sequentially stacked. The upper side surface of the conductor layer 300 is bonded to the first adhesive layer 200, one surface of the first adhesive layer 200 away from the conductor layer 300 is bonded to the first insulating layer 100, and the first insulating layer 100 is adhered to the conductor layer 300 through the first adhesive layer 200; the lower surface of the conductor layer 300 is bonded to the second adhesive layer 400, the surface of the second adhesive layer 400 away from the conductor layer 300 is bonded to the second insulating layer 500, and the second insulating layer 500 is adhered to the conductor layer 300 by the second adhesive layer 400.
The conductive layer 300 may be a conductive layer commonly used in the prior art, such as a composite conductive layer formed by combining an FPC with a metal substrate (e.g., a copper foil, an aluminum plate, etc.), wherein the FPC has a signal acquisition function, and the metal substrate has a conductive function.
In order to avoid high-temperature heating curing, the first adhesive layer 200 and the second adhesive layer 400 in this embodiment are both normal-temperature curing adhesive layers, that is, structures formed by coating normal-temperature curing adhesives, such as acrylic resin or normal-temperature curing epoxy resin, and the normal-temperature curing adhesives can be bonded at room temperature. The first insulating layer 100 and the second insulating layer 500 may use a PI plastic insulating film or a PET plastic insulating film. The conductor layer 300 may employ a copper foil layer.
The thicknesses of the first insulating layer, the first adhesive layer, the second adhesive layer, and the second insulating layer may be determined according to actual needs and performance requirements. For example, in the present embodiment, the first insulating layer 100 and the second insulating layer 500 each have a thickness of 0.5 μm, the conductor layer 300 has a thickness of 0.5 μm, and the first adhesive layer 200 and the second adhesive layer 400 each have a thickness of 0.5 μm.
The battery pack signal acquisition board can be prepared by the following method: coating a layer of normal temperature curing adhesive on the upper surface of the second insulating layer 500 to form a second adhesive layer 400, coating the conductor layer 300 on the second insulating layer 500, coating a layer of normal temperature curing adhesive on the surface of the first insulating layer 100 to form a first adhesive layer 200, facing the surface of the first insulating layer 100 coated with the first adhesive layer 200 downwards and covering the upper surface of the conductor layer 300, and pressing by a mold to obtain the battery pack signal acquisition board.
Because the normal temperature curing adhesive layer is adopted, high temperature heating is not needed in the product forming process, the energy consumption is reduced, the manufacturing period of the product is shortened, the production efficiency and the production safety are improved, and the pressed die is light and thin, so that the equipment investment cost is reduced.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. The battery pack signal acquisition board is characterized by comprising a first insulating layer, a first adhesive layer, a conductor layer, a second adhesive layer and a second insulating layer, wherein two surfaces of the conductor layer are respectively bonded with the first adhesive layer and the second adhesive layer; the first adhesive layer and the second adhesive layer are both made of normal-temperature curing adhesive layers.
2. The battery pack signal acquisition board according to claim 1, wherein the normal temperature curing adhesive layer is an acrylic adhesive layer or an epoxy adhesive layer.
3. The signal acquisition board for battery packs according to claim 1, wherein the first adhesive layer and the second adhesive layer each have a thickness of 0.05 to 0.5 μm.
4. The battery pack signal acquisition board according to claim 1, wherein the first insulating layer is a PI plastic insulating film or a PET plastic insulating film; the second insulating layer is made of a PI plastic insulating film or a PET plastic insulating film.
5. The battery pack signal collecting board according to claim 1, wherein the first insulating layer and the second insulating layer each have a thickness of 0.05 to 0.5 μm.
6. The battery pack signal acquisition board according to claim 1, wherein the conductor layer is a composite board of FPC and metal substrate.
7. The board of claim 6, wherein the metal substrate is a copper substrate or an aluminum substrate.
8. The battery pack signal acquisition board according to any one of claims 1 to 7, wherein the conductor layer has a thickness of 0.5 to 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220574763.7U CN217993763U (en) | 2022-03-16 | 2022-03-16 | Battery package signal acquisition board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220574763.7U CN217993763U (en) | 2022-03-16 | 2022-03-16 | Battery package signal acquisition board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217993763U true CN217993763U (en) | 2022-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220574763.7U Active CN217993763U (en) | 2022-03-16 | 2022-03-16 | Battery package signal acquisition board |
Country Status (1)
| Country | Link |
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| CN (1) | CN217993763U (en) |
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2022
- 2022-03-16 CN CN202220574763.7U patent/CN217993763U/en active Active
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