CN113078426A - Low-pass filter and manufacturing method thereof - Google Patents
Low-pass filter and manufacturing method thereof Download PDFInfo
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- CN113078426A CN113078426A CN202110268319.2A CN202110268319A CN113078426A CN 113078426 A CN113078426 A CN 113078426A CN 202110268319 A CN202110268319 A CN 202110268319A CN 113078426 A CN113078426 A CN 113078426A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
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Abstract
The application relates to a low-pass filter, including flexible substrate, low-pass filter circuit and graphical ground plate set up respectively at the relative both sides surface of flexible substrate, low-pass filter circuit includes input, output, many high impedance microstrip lines and many low impedance microstrip lines, high impedance microstrip line and low impedance microstrip line set up in turn between input and output, high impedance microstrip line has an at least segmental arc, the figure of graphical ground plate and low-pass filter circuit's figure phase-match. Also relates to a manufacturing method of the low-pass filter. The low-pass filter adopts the flexible substrate, the high-impedance microstrip line has at least one arc-shaped section and the ground plate is patterned, the stretchable function of the low-pass filter circuit is realized, and the low-pass filtering function is kept stable.
Description
Technical Field
The application relates to the technical field of filter circuits, in particular to a low-pass filter and a manufacturing method thereof.
Background
The low-pass filter is used as a key front-end device in wireless signal transmission, plays a role in screening specific signals and shielding irrelevant signals, and the design of the low-pass filter directly influences the performance of the whole communication system and a microwave circuit. Along with the gradual wide application of flexible wearable device in real life, the flexible low pass filter that has advantages such as softness, bendable and be convenient for with human commonality also has fine application prospect. However, the conventional flexible low-pass filter can be bent only and not stretched, and there is a limitation in practical application. Therefore, it is of great significance to research and manufacture a flexible and stretchable low-pass filter.
Disclosure of Invention
In view of the above technical problems, the present application provides a low-pass filter and a method for manufacturing the same, in which the low-pass filter employs a flexible substrate, and a high-impedance microstrip line has at least one arc-shaped segment and patterns a ground plate, thereby achieving a stretchable function of a low-pass filter circuit and maintaining a stable low-pass filtering function.
In order to solve the technical problem, the application provides a low pass filter, including flexible substrate, low pass filter circuit and graphical ground plate, low pass filter circuit with graphical ground plate sets up respectively flexible substrate's the relative both sides surface, low pass filter circuit includes input, output, many high impedance microstrip lines and many low impedance microstrip lines, high impedance microstrip line with low impedance microstrip line is in the input with set up in turn between the output, high impedance microstrip line has an at least segmental arc, the figure of graphical ground plate with low pass filter circuit's figure phase-match.
Optionally, the plurality of high-impedance microstrip lines include a first high-impedance microstrip line and a second high-impedance microstrip line, the plurality of low-impedance microstrip lines include a first low-impedance microstrip line, a second low-impedance microstrip line and a third low-impedance microstrip line, and the first low-impedance microstrip line, the first high-impedance microstrip line, the second low-impedance microstrip line, the second high-impedance microstrip line and the third low-impedance microstrip line are sequentially connected between the input end and the output end.
Optionally, the first low-impedance microstrip line and the third low-impedance microstrip line are arranged in parallel, the second low-impedance microstrip line is arranged between the same side ends of the first low-impedance microstrip line and the third low-impedance microstrip line, the first high-impedance microstrip line and the second high-impedance microstrip line both have an arc section, and one side of the circle center of the arc section of the first high-impedance microstrip line and one side of the circle center of the arc section of the second high-impedance microstrip line are arranged in opposite directions.
Optionally, the input end is connected to the other end of the first low-impedance microstrip line, the output end is connected to the other end of the third low-impedance microstrip line, and the input end and the output end are both arc-shaped and extend in opposite directions.
Optionally, the lengths of the low-impedance microstrip line and the high-impedance microstrip line are both less than a quarter of the operating wavelength, and the width of the low-impedance microstrip line is greater than the width of the high-impedance microstrip line.
Optionally, the width of a portion of the patterned ground plate corresponding to each microstrip line of the low-pass filter circuit is 2-4 mm greater than the width of the corresponding microstrip line, and a patterned central line of the patterned ground plate overlaps with a patterned central line of the patterned low-pass filter circuit.
Optionally, the low-pass filter circuit and the patterned ground plate both include a patterned metal layer and a patterned flexible base layer, the patterned metal layer is located on a surface of the patterned flexible base layer, the surface of the patterned flexible base layer being opposite to the flexible substrate, and the patterned flexible base layer is bonded to the flexible substrate.
The application also provides a manufacturing method of the low-pass filter, which comprises the following steps:
a. providing a flexible substrate, a low-pass filter circuit and a graphical ground plate, wherein the low-pass filter circuit comprises an input end, an output end, a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end and the output end, the high-impedance microstrip lines are provided with at least one arc-shaped section, and the graph of the graphical ground plate is matched with the graph of the low-pass filter circuit;
b. respectively attaching the low-pass filter circuit and the graphical grounding plate to the surfaces of two opposite sides of the flexible substrate;
c. a low pass filter is obtained.
Optionally, step a, comprises:
providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises a metal layer and a flexible substrate layer;
fixing one side of the flexible substrate layer of the single-sided copper-clad plate on a rigid substrate;
and carrying out graphical cutting on the single-sided copper-clad plate to obtain the low-pass filter circuit or the graphical grounding plate.
Optionally, step b, comprises:
stripping the low-pass filter circuit and the graphical grounding plate from the corresponding rigid substrate respectively;
and respectively attaching the low-pass filter circuit and one side of the flexible basal layer of the graphical grounding plate to the surfaces of two opposite sides of the flexible substrate.
The low-pass filter comprises a flexible substrate, a low-pass filter circuit and a graphical ground plate, wherein the low-pass filter circuit and the graphical ground plate are respectively arranged on the surfaces of two opposite sides of the flexible substrate, the low-pass filter circuit comprises an input end, an output end, a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end and the output end, each high-impedance microstrip line is provided with at least one arc-shaped section, and the graph of the graphical ground plate is matched with the graph of the low. The low-pass filter adopts the flexible substrate, the high-impedance microstrip line has at least one arc-shaped section and the ground plate is patterned, the stretchable function of the low-pass filter circuit is realized, and the low-pass filtering function is kept stable.
The manufacturing method of the low-pass filter comprises the following steps: providing a flexible substrate, a low-pass filter circuit and a graphical ground plate, wherein the low-pass filter circuit comprises an input end, an output end, a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end and the output end, each high-impedance microstrip line is provided with at least one arc-shaped section, and the graph of the graphical ground plate is matched with the graph of the low-pass filter circuit; respectively attaching the low-pass filter circuit and the graphical grounding plate to the surfaces of two opposite sides of the flexible substrate; a low pass filter is obtained. By the mode, the prepared low-pass filter has a three-layer structure, and the preparation process is simple.
Drawings
Fig. 1 is a schematic structural diagram of a low-pass filter shown according to a first embodiment;
FIG. 2 is a schematic diagram of the low pass filter circuit of FIG. 1;
fig. 3 is a schematic structural diagram of the patterned ground plate of fig. 1;
FIG. 4 is a graph of scattering parameter versus frequency for different degrees of stretch for the low pass filter shown in accordance with the first embodiment;
FIG. 5 is a graph of the projection parameters as a function of frequency for different degrees of stretch for the low pass filter shown in accordance with the first embodiment;
fig. 6 is a flowchart illustrating a method of manufacturing a low-pass filter according to a second embodiment.
Detailed Description
The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.
In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present application. The following detailed description is not to be taken in a limiting sense, and the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Although the terms first, second, etc. may be used herein to describe various elements in some instances, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.
Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.
First embodiment
Fig. 1 is a schematic structural diagram of a low-pass filter shown according to a first embodiment. As shown in fig. 1, the low-pass filter of the present embodiment includes a flexible substrate 1, a low-pass filter circuit 2 and a patterned ground plate 3, wherein the low-pass filter circuit 2 and the patterned ground plate 3 are respectively disposed on two opposite side surfaces of the flexible substrate 1, and a pattern of the patterned ground plate 3 matches a pattern of the low-pass filter circuit 2.
The low-pass filter circuit 2 includes a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end 21 and the output end 27, and the high-impedance microstrip lines have at least one arc-shaped segment. In this embodiment, please refer to fig. 1 and fig. 2, the low-pass filter circuit 2 includes an input end 21, a first low-impedance microstrip line 22, a first high-impedance microstrip line 23, a second low-impedance microstrip line 24, a second high-impedance microstrip line 25, a third low-impedance microstrip line 26 and an output end 27, wherein the first low-impedance microstrip line 22, the first high-impedance microstrip line 23, the second low-impedance microstrip line 24, the second high-impedance microstrip line 25 and the third low-impedance microstrip line 26 are sequentially and alternately connected between the input end 21 and the output end 27. In practical implementation, low-pass filters of different orders can be selected according to application scenarios, and then more low-impedance microstrip lines or high-impedance microstrip lines can be designed, so that the number of the low-impedance microstrip lines or the high-impedance microstrip lines is not limited.
The first low-impedance microstrip line 22 and the third low-impedance microstrip line 26 are arranged in parallel, the second low-impedance microstrip line 24 is arranged between the same side ends of the first low-impedance microstrip line 22 and the third low-impedance microstrip line 26, the first high-impedance microstrip line 23 and the second high-impedance microstrip line 25 both have an arc section, the circle center side of the arc section of the first high-impedance microstrip line 23 and the circle center side of the arc section of the second high-impedance microstrip line 25 are arranged oppositely, the input end 21 is connected with the end part of the first low-impedance microstrip line 22 far away from the side of the second low-impedance microstrip line 24, the output end 27 is connected with the end part of the third low-impedance microstrip line 26 far away from the side of the second low-impedance microstrip line 24, and. Preferably, the arcs of the first high-impedance microstrip line 23, the second high-impedance microstrip line 25, the input end 21 and the output end 27 are all 90 °, so that the low-pass filter circuit 2 integrally extends in a U shape through the design of the plurality of arcs, and is good in tensile property and beneficial to the miniaturization design of devices.
The length of the low-impedance microstrip line and the length of the high-impedance microstrip line are both smaller than one fourth of the working wavelength, and the width of the low-impedance microstrip line is larger than that of the high-impedance microstrip line. Preferably, the width W of the input end 21 and the output end 2712.8 mm; the widths W of the first low-impedance microstrip line 22 and the third low-impedance microstrip line 2624 mm; the width W of the first high impedance microstrip line 23 and the second high impedance microstrip line 2531 mm; width W of the second low impedance microstrip line 24411.9 mm; length L of the straight line portion of input end 21 and output end 2717.2 mm; the length L of the first low-impedance microstrip line 22 and the third low-impedance microstrip line 26212.3 mm; the length L of the linear portions of the first high-impedance microstrip line 23 and the second high-impedance microstrip line 2537.3 mm; length L of the second low impedance microstrip line 2448 mm; minor diameter R of the arc segments of input 21 and output 2713.4mm, major diameter R26.2mm, and the arc degree is 90 degrees; the minor diameter R of the arc segments of the first high-impedance microstrip line 23 and the second high-impedance microstrip line 2533.5mm, major diameter R44.5mm, and the arc degree is 90 degrees.
Please refer to fig. 1 and fig. 1And 3, the width of the part of the graphical grounding plate 3 corresponding to each section of microstrip line of the low-pass filter circuit 2 is 2-4 mm larger than that of the corresponding microstrip line, and the graphical central line of the graphical grounding plate 3 is mutually overlapped with the graphical central line of the graphical low-pass filter circuit. The patterned ground plate 3 includes a first segment 31, a second segment 32, a third segment 33, a fourth segment 34 and a fifth segment 35, the first segment 31 corresponds to the input end 21 and the first low-impedance microstrip line 22, the second segment 32 corresponds to the first high-impedance microstrip line 23, the third segment 33 corresponds to the second low-impedance microstrip line 24, the fourth segment 34 corresponds to the second high-impedance microstrip line 25, and the fifth segment 35 corresponds to the third low-impedance microstrip line 26 and the output end 27. Preferably, the width W of the first segment 31 and the fifth segment 3556 mm; width W of second segment 32 and fourth segment 3473 mm; width W of third segment 33814.9 mm; the length L of the straight portions of the free ends of the first and fifth segments 31, 3557.2 mm; the length of the straight portion of the first segment 31 connecting the second segment 32, the length L of the straight portion of the fifth segment 35 connecting the fourth segment 34612.3 mm; the length L of the straight portions of the second and fourth segments 32, 3477.3 mm; length L of third segment 3388 mm; minor diameter R of the arcuate sections of the first 31 and fifth 35 sections51.8mm, major diameter R67.8mm, and the arc degree is 90 degrees; minor diameter R of the arcuate segments of second and fourth segments 32, 3472.5mm, major diameter R85.5mm, and the arc degree is 90 degrees. By patterning the ground plane to have a pattern matching that of the low-pass filter circuit 2, the stretchability of the overall structure can be further ensured, while the low-pass filter function can be kept stable.
The flexible substrate 1 may use Polydimethylsiloxane (PDMS) or silicone rubber (Ecoflex). In this embodiment, the low-pass filter circuit 2 and the patterned ground plate 3 each include a patterned metal layer and a patterned flexible base layer, the patterned metal layer overlaps with the pattern of the patterned flexible base layer, the patterned metal layer is located on a surface of the patterned flexible base layer facing away from the flexible substrate 1, and the patterned flexible base layer is bonded to the flexible substrate 1, preferably by curing silicone rubber. In practical implementation, the low-pass filter circuit 2 and the patterned grounding plate 3 are made of a polyimide single-sided copper-clad plate, and patterning can be performed by performing laser cutting on the polyimide single-sided copper-clad plate, preferably, the thickness of the flexible substrate 1 is 1mm, the thickness of the polyimide layer is 40 μm, and the thickness of the copper layer is 18 μm, so that the low-pass filter is low in cost, light in weight, and easy to integrate in structure.
Fig. 4 is a graph of scattering parameter versus frequency for different degrees of stretching for the low-pass filter shown according to the first embodiment. Fig. 5 is a graph showing the variation of the projection parameters with frequency for different degrees of stretching for the low-pass filter according to the first embodiment. As can be seen from fig. 4 and 5, in the case of stretching 0%, stretching 20%, stretching 40%, and stretching 60%, the cut-off frequency of the scattering parameter (S11) and the projection parameter (S21) of the low-pass filter are stable at 2GHz, and the pass-band and stop-band characteristics remain stable, indicating that the low-pass filter of the present application still has good stability under a large stretching strength, and is suitable for the field of wearable microwave devices.
The low-pass filter comprises a flexible substrate, a low-pass filter circuit and a graphical ground plate, wherein the low-pass filter circuit and the graphical ground plate are respectively arranged on the surfaces of two opposite sides of the flexible substrate, the low-pass filter circuit comprises an input end, an output end, a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end and the output end, each high-impedance microstrip line is provided with at least one arc-shaped section, and the graph of the graphical ground plate is matched with the graph of the low. The low-pass filter adopts the flexible substrate, the high-impedance microstrip line has at least one arc-shaped section and the ground plate is patterned, the stretchable function of the low-pass filter circuit is realized, and the low-pass filtering function is kept stable.
Second embodiment
Fig. 6 is a flowchart illustrating a method of manufacturing a low-pass filter according to a second embodiment. As shown in fig. 6, the method for manufacturing a low-pass filter of this embodiment includes:
When the flexible substrate is manufactured, mixing the glue A and the glue B of the Ecoflex according to the mass ratio of 1:1, uniformly stirring, placing for 3-10 min in a vacuum environment with the pressure of 0.1Torr to remove bubbles generated by stirring, and then pouring into a culture dish to stand for 24h to obtain the flexible substrate with the thickness of 1 mm.
When the low-pass filter circuit is manufactured, a single-sided copper-clad plate is provided and comprises a metal layer and a flexible substrate layer, and the single-sided copper-clad plate is preferably a polyimide copper-clad plate with the thickness of 58 mu m, wherein the thickness of the polyimide layer is 40 mu m, and the thickness of the copper layer is 18 mu m; then, fixing one side of the flexible substrate layer of the single-sided copper-clad plate on a rigid substrate, for example, attaching one side of the flexible substrate layer of the single-sided copper-clad plate on the rigid substrate through a heat release adhesive tape; then, the single-sided copper-clad plate and the rigid substrate are placed into a laser cutting machine together, and the single-sided copper-clad plate is subjected to graphical cutting according to the required graph, namely, the metal layer and the flexible substrate layer of the single-sided copper-clad plate are simultaneously subjected to graphical cutting, so that the low-pass filter circuit can be obtained. The structure of the low-pass filter circuit is as described in the first embodiment, and is not described herein again.
The process of making the patterned ground plate is similar to the process of making the low pass filter circuit. Firstly, providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises a metal layer and a flexible substrate layer, and the single-sided copper-clad plate is preferably a polyimide copper-clad plate with the thickness of 58 mu m, wherein the thickness of the polyimide layer is 40 mu m, and the thickness of the copper layer is 18 mu m; then, fixing one side of the flexible substrate layer of the single-sided copper-clad plate on a rigid substrate, for example, attaching one side of the flexible substrate layer of the single-sided copper-clad plate on the rigid substrate through a heat release adhesive tape; then, the single-sided copper-clad plate and the rigid substrate are placed into a laser cutting machine together, the single-sided copper-clad plate is subjected to graphical cutting according to the required graph, namely, the metal layer and the flexible substrate layer of the single-sided copper-clad plate are simultaneously subjected to graphical cutting, and the graphical earth plate can be obtained. The structure of the patterned ground plate is as described in the first embodiment, and is not described herein again.
220, respectively attaching the low-pass filter circuit and the graphical grounding plate to the surfaces of the two opposite sides of the flexible substrate;
in step 230, a low pass filter is obtained.
The low-pass filter circuit and the graphical grounding plate are respectively stripped from the corresponding rigid substrates. Specifically, water soluble adhesive tapes are respectively attached to the metal layer sides of the low-pass filter circuit and the graphical grounding plate, then the heat release adhesive tapes are heated to be separated, the adhesive force between the low-pass filter circuit and the graphical grounding plate and the rigid substrate is reduced, and then the low-pass filter circuit and the graphical grounding plate are respectively peeled off from the corresponding rigid substrate by the water soluble adhesive tapes.
And then, the low-pass filter circuit and one side of the flexible substrate layer of the graphical grounding plate are respectively attached to the two opposite side surfaces of the flexible substrate. Specifically, the precursor mixture of the silicon rubber can be coated on one side of the flexible substrate layer of the low-pass filter circuit and the patterned grounding plate, then the low-pass filter circuit and one side of the flexible substrate layer of the patterned grounding plate are respectively attached to the surfaces of the two opposite sides of the flexible substrate, standing is carried out for 10min, and the precursor mixture of the silicon rubber is solidified, so that the adhesion can be realized. Finally, the water-soluble tape was washed off with water to give a flexible and stretchable low-pass filter.
The manufacturing method of the low-pass filter comprises the following steps: providing a flexible substrate, a low-pass filter circuit and a graphical ground plate, wherein the low-pass filter circuit comprises an input end, an output end, a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end and the output end, each high-impedance microstrip line is provided with at least one arc-shaped section, and the graph of the graphical ground plate is matched with the graph of the low-pass filter circuit; respectively attaching the low-pass filter circuit and the graphical grounding plate to the surfaces of two opposite sides of the flexible substrate; a low pass filter is obtained. By the mode, the prepared low-pass filter has a three-layer structure, and the preparation process is simple.
The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.
Claims (10)
1. A low-pass filter is characterized by comprising a flexible substrate, a low-pass filter circuit and a graphical ground plate, wherein the low-pass filter circuit and the graphical ground plate are respectively arranged on the surfaces of two opposite sides of the flexible substrate, the low-pass filter circuit comprises an input end, an output end, a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end and the output end, each high-impedance microstrip line is provided with at least one arc-shaped section, and the graph of the graphical ground plate is matched with the graph of the low-pass filter circuit.
2. The low-pass filter according to claim 1, wherein the plurality of high-impedance microstrip lines include a first high-impedance microstrip line and a second high-impedance microstrip line, the plurality of low-impedance microstrip lines include a first low-impedance microstrip line, a second low-impedance microstrip line and a third low-impedance microstrip line, and the first low-impedance microstrip line, the first high-impedance microstrip line, the second low-impedance microstrip line, the second high-impedance microstrip line and the third low-impedance microstrip line are sequentially connected between the input end and the output end.
3. The low-pass filter according to claim 2, wherein the first low-impedance microstrip line and the third low-impedance microstrip line are arranged in parallel, the second low-impedance microstrip line is arranged between the ends of the first low-impedance microstrip line and the third low-impedance microstrip line which are at the same side, the first high-impedance microstrip line and the second high-impedance microstrip line both have an arc-shaped section, and one side of a circle center of the arc-shaped section of the first high-impedance microstrip line and one side of a circle center of the arc-shaped section of the second high-impedance microstrip line are arranged in opposite directions.
4. The low-pass filter according to claim 3, wherein the input end is connected to the other end of the first low-impedance microstrip line, the output end is connected to the other end of the third low-impedance microstrip line, and the input end and the output end are both arc-shaped and extend in opposite directions.
5. The low-pass filter according to claim 1, wherein the length of the low-impedance microstrip line and the length of the high-impedance microstrip line are both less than a quarter of the operating wavelength, and the width of the low-impedance microstrip line is greater than the width of the high-impedance microstrip line.
6. The low-pass filter of claim 1, wherein the width of the portion of the patterned ground plate corresponding to each microstrip line of the low-pass filter circuit is 2-4 mm larger than the width of the corresponding microstrip line, and the pattern central line of the patterned ground plate and the pattern central line of the patterned low-pass filter circuit are overlapped with each other.
7. The low-pass filter of claim 1, wherein the low-pass filter circuit and the patterned grounding plate each comprise a patterned metal layer and a patterned flexible base layer, the patterned metal layer is located on a surface of the patterned flexible base layer facing away from the flexible substrate, and the patterned flexible base layer is bonded to the flexible substrate.
8. A method of making a low pass filter, comprising:
a. providing a flexible substrate, a low-pass filter circuit and a graphical ground plate, wherein the low-pass filter circuit comprises an input end, an output end, a plurality of high-impedance microstrip lines and a plurality of low-impedance microstrip lines, the high-impedance microstrip lines and the low-impedance microstrip lines are alternately arranged between the input end and the output end, the high-impedance microstrip lines are provided with at least one arc-shaped section, and the graph of the graphical ground plate is matched with the graph of the low-pass filter circuit;
b. respectively attaching the low-pass filter circuit and the graphical grounding plate to the surfaces of two opposite sides of the flexible substrate;
c. a low pass filter is obtained.
9. The method for manufacturing a low pass filter according to claim 8, wherein the step a comprises:
providing a single-sided copper-clad plate, wherein the single-sided copper-clad plate comprises a metal layer and a flexible substrate layer;
fixing one side of the flexible substrate layer of the single-sided copper-clad plate on a rigid substrate;
and carrying out graphical cutting on the single-sided copper-clad plate to obtain the low-pass filter circuit or the graphical grounding plate.
10. The method for manufacturing a low pass filter according to claim 9, wherein the step b comprises:
stripping the low-pass filter circuit and the graphical grounding plate from the corresponding rigid substrate respectively;
and respectively attaching the low-pass filter circuit and one side of the flexible basal layer of the graphical grounding plate to the surfaces of two opposite sides of the flexible substrate.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114335941A (en) * | 2021-12-27 | 2022-04-12 | 电子科技大学 | Flexible band-pass filter of stretching |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004320522A (en) * | 2003-04-17 | 2004-11-11 | New Japan Radio Co Ltd | Band path filter |
| CN202217757U (en) * | 2010-09-02 | 2012-05-09 | 深圳市国人射频通信有限公司 | Coaxial low pass filter |
| CN108183293A (en) * | 2017-12-11 | 2018-06-19 | 南京理工大学 | Plane micro-strip duplexer |
| CN108563050A (en) * | 2018-05-31 | 2018-09-21 | 成都天马微电子有限公司 | Liquid crystal phase shifter and antenna |
| CN209104333U (en) * | 2018-11-30 | 2019-07-12 | 陕西理工大学 | A kind of rich font structure microstrip line low-pass filter |
| CN110797617A (en) * | 2019-10-30 | 2020-02-14 | 电子科技大学 | Extensible flexible radio frequency microstrip line and preparation method thereof |
| WO2021034177A1 (en) * | 2019-08-19 | 2021-02-25 | 주식회사 에이스테크놀로지 | Low pass filter having transmission zero |
-
2021
- 2021-03-12 CN CN202110268319.2A patent/CN113078426A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004320522A (en) * | 2003-04-17 | 2004-11-11 | New Japan Radio Co Ltd | Band path filter |
| CN202217757U (en) * | 2010-09-02 | 2012-05-09 | 深圳市国人射频通信有限公司 | Coaxial low pass filter |
| CN108183293A (en) * | 2017-12-11 | 2018-06-19 | 南京理工大学 | Plane micro-strip duplexer |
| CN108563050A (en) * | 2018-05-31 | 2018-09-21 | 成都天马微电子有限公司 | Liquid crystal phase shifter and antenna |
| CN209104333U (en) * | 2018-11-30 | 2019-07-12 | 陕西理工大学 | A kind of rich font structure microstrip line low-pass filter |
| WO2021034177A1 (en) * | 2019-08-19 | 2021-02-25 | 주식회사 에이스테크놀로지 | Low pass filter having transmission zero |
| CN110797617A (en) * | 2019-10-30 | 2020-02-14 | 电子科技大学 | Extensible flexible radio frequency microstrip line and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114335941A (en) * | 2021-12-27 | 2022-04-12 | 电子科技大学 | Flexible band-pass filter of stretching |
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