CN110797617A - Extensible flexible radio frequency microstrip line and preparation method thereof - Google Patents
Extensible flexible radio frequency microstrip line and preparation method thereof Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/10—Wire waveguides, i.e. with a single solid longitudinal conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
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Abstract
The invention provides a ductile flexible radio frequency microstrip line and a preparation method thereof, belonging to the technical field of flexible electronics. The flexible radio frequency microstrip line prepared by the invention adopts a sandwich structure of 3 layers including a ductile metal wiring layer, a ductile flexible dielectric layer and a ductile periodic array layer. On one hand, the invention realizes better signal transmission performance, and the signal quality within 0-3 GHz can be ensured; on the other hand, the invention realizes better ductility, and the signal can not be obviously attenuated in the stretching range of 20 percent, and in conclusion, the invention will be greatly colorful in the fields of wireless communication and bioelectronic medical treatment in the future.
Description
Technical Field
The invention belongs to the technical field of flexible electronics, and particularly relates to a malleable flexible radio frequency microstrip line and a preparation method thereof.
Background
Microstrip lines are widely used in mobile phone circuits, and generally have two functions: firstly, high-frequency signals are transmitted more effectively; secondly, a matching network is formed by the signal output end and other solid devices such as an inductor, a capacitor and the like, so that the signal output end is well matched with the load, the power can be consumed by the circuit as little as possible, and the power can be transmitted to the load as much as possible. The traditional microstrip line structure is a microwave transmission line formed by a single conductor strip supported on a rigid medium substrate, and a grounding metal flat plate is manufactured on the other surface of the substrate, which is the basis of a microwave integrated circuit and is widely applied to the microwave integrated circuit and a high-speed pulse circuit. The microstrip line has the advantages of small size, light weight, wide frequency band, high reliability, low cost, easy connection with a solid device and convenient integration of a microwave assembly and a system, but the existing microstrip line is limited to a rigid medium substrate, and the basic structure of the microstrip line sequentially comprises a copper layer, a dielectric layer and a copper layer from top to bottom, so the structure has no ductility.
Flexible electronics is a generic term for technology, referring to the emerging electronic technology for fabricating organic/inorganic material electronic devices on flexible/ductile substrates. Currently, flexible electronics encompasses organic electronics, plastic electronics, bioelectronics, nanoelectronics, printed electronics, and the like, including RFID, flexible displays, organic electroluminescent (OLED) displays and lighting, chemical and biological sensors, flexible photovoltaics, flexible logic and storage, flexible batteries, wearable devices, and a variety of applications. Compared with traditional electronics, the flexible electronics have higher flexibility, can adapt to different working environments to a certain extent, and meet the deformation requirement of equipment. However, the corresponding technical requirements also restrict the development of flexible electronics: firstly, the ductility of the flexible electron body on the basis of not damaging the electronic performance of the flexible electron body, so that new challenges and requirements are provided for the manufacturing materials of the circuit; second, the performance of flexible electronic devices is still insufficient relative to conventional electronic devices.
In recent years, the research of abnormal fire and heat in the field of flexible electronics has led to the development of the field being advanced day by day and long. For the extensible flexible radio frequency microstrip line, on one hand, the traditional microstrip line structure can be extended, so that the use flexibility of the microstrip line is greatly improved, and the application range is widened; on the other hand, the flexible electronic device not only realizes good biocompatibility, but also has the signal transmission performance of the microstrip line with wide frequency band. Therefore, the flexible radio frequency microstrip line has a wide application prospect in the field of wearable electronic equipment and wireless communication technologies (such as Bluetooth, Zigbee and NFC), and the flexible electronic microstrip line can be combined to further make the two mutually draw the best and complement each other. But no preparation process of the flexible microstrip line exists at present.
Disclosure of Invention
In view of the problems in the background art, the present invention is directed to a malleable flexible rf microstrip and a method for manufacturing the same. The extensible flexible radio frequency microstrip line comprises a three-layer structure, wherein a rigid medium substrate is replaced by an extensible flexible dielectric layer, electromagnetic waves are limited by an extensible periodic array layer and an extensible metal broken line layer to be transmitted in the dielectric layer, the extensible performance of the microstrip line circuit is realized, and signals cannot be obviously attenuated in the frequency range of 0-3 GHz.
In order to achieve the purpose, the technical scheme of the invention is as follows:
the extensible flexible radio frequency microstrip line is characterized in that the flexible radio frequency microstrip line sequentially comprises an extensible periodic array layer, an extensible flexible dielectric layer and an extensible metal wiring layer from bottom to top; the extensible periodic array layer and the extensible metal broken line layer are both composed of metal and organic polymer, the two layers are both connected with an extensible flexible dielectric layer through the organic polymer, and the two ends of the extensible periodic array layer and the two ends of the extensible metal broken line layer are electrically connected through radio-frequency connecting terminals.
Furthermore, the extensible periodic array layer is formed by periodic arrangement of basic array units, the extensible periodic array layer comprises a pattern area and blank areas on two sides of the pattern area, the pattern area is formed by sequentially rotating basic array units by 90 degrees, 180 degrees and 270 degrees from basic patterns, the basic patterns are formed by connecting a first strip and a second strip through chamfers, an included angle α between the first strip and a horizontal line is 15-60 degrees, an included angle β between the first strip and the second strip is 180-2 α, the widths of the first strip and the second strip are the same and are 0.2-3 mm, one end of the first strip, which is not in contact with the second strip, serves as a rotation center, and the length L0 of the basic array units is 1-10 mm.
Further, an included angle between the first strip and the horizontal line is preferably 15 degrees, 30 degrees, 45 degrees or 60 degrees; when the included angle is 15 degrees, the length of the basic array unit is 6 mm; when the included angle is 30 degrees, the length of the basic array unit is 6.5 mm; when the included angle is 45 degrees, the length of the basic array unit is 7 mm; when the included angle is 60 degrees, the length of the basic array unit is 7.5 mm.
Further, the inner chamfer radius R1 and the outer chamfer radius R2 of the connecting chamfer between the first strip and the second strip are both 0.1 mm-0.8 mm.
Further, the metal may be copper, aluminum, or the like, and the organic polymer may be polyimide, a Liquid Crystal Polymer (LCP), or the like.
Furthermore, the organic polymers of the extensible periodic array layer and the extensible metal wiring layer can be connected with the extensible flexible dielectric layer through a silica gel layer, so that the adhesion is enhanced.
Furthermore, the thicknesses of the metal layers in the extensible periodic array layer and the metal wiring layer are both 0.010 mm-0.100 m m, and the thickness of the organic polymer layer is 0.010 mm-0.100 mm; the material of the extensible flexible dielectric layer is EcoflexTM00-30 mm in thickness of 0.5-3 mm.
Further, the EcoflexTMThe 00-30 is prepared by mixing part A and part B according to the volume ratio or the mass ratio of 1: 1.
A preparation method of a malleable flexible radio frequency microstrip line comprises the following steps:
step 1: covering the organic polymer layer on the metal layer, and forming patterns of the extensible periodic array layer and the extensible metal wiring layer through etching to prepare the extensible periodic array layer and the extensible metal wiring layer;
step 2: transferring the hydrosol to the metal layers of the extensible periodic array layer and the extensible metal wiring layer obtained in the step 1, and then sealing and standing at room temperature;
and step 3: preparing an extensible flexible dielectric layer, which specifically comprises the following steps: using EcoflexTM00-30, mixing the PartsA solution and the Parts B solution according to the volume ratio or the mass ratio of 1:1, vacuumizing, and pouring into a container to obtain the product;
and 4, step 4: spin-coating silica gel on the aqueous sol of the extensible periodic array layer and the extensible metal wiring layer obtained in the step 2 to enable the silica gel to completely cover the organic polymer layers of the extensible periodic array layer and the extensible metal wiring layer, then respectively adhering the silica gel surfaces of the extensible periodic array layer and the extensible metal wiring layer to two sides of the extensible flexible dielectric layer, standing to enable the silica gel to be solidified into SiO2A layer;
and 5: coating tetraethoxysilane on the structure obtained in the step 4, and then placing the structure under ultraviolet light for UV irradiation to enhance the SiO2Adhesion of the layer to the malleable flexible dielectric layer;
step 6: soaking the device treated in the step 5 in water, removing the hydrosol, and then drying;
and 7: and (4) welding the two sides of the extensible metal wiring layer and the extensible periodic array layer of the device obtained in the step (6) through an SMA radio frequency wiring terminal to form electrical interconnection, and thus the extensible flexible radio frequency microstrip line can be prepared.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. according to the extensible flexible radio frequency microstrip line, the flexible medium is adopted for signal transmission, and the extensible periodic array layer and the extensible metal broken line layer are subjected to pattern design, so that when the device is extensible, signals below 3GHz can be well transmitted, and the signals cannot be obviously attenuated within a 20% stretching range.
2. The microstrip line successfully realizes the impedance matching of a circuit of 50 omega under the conditions that the line width W of the microstrip line is 2mm and the thickness d of the intermediate dielectric layer is 1mm, so that more energy is transferred from the signal input end to the load output end through the microstrip line structure.
3. According to the extensible flexible radio frequency microstrip line, electromagnetic wave signal transmission is transmitted in the middle medium layer according to the impedance matching principle of the microstrip line, SMA terminals are used between the extensible metal fold line layer and the periodic array layer for electrical interconnection, and impedance matching at the connection position of the terminals is also realized, so that the transmission efficiency of signal energy can be improved, and the transmission of signals under specific frequency and electric length can be effectively realized.
Drawings
Fig. 1 is a schematic structural diagram of the extensible flexible radio frequency microstrip line of the present invention.
Fig. 2 is a schematic structural diagram of a ductile periodic array layer and a metal wiring layer used in embodiments 1 and 2 of the present invention;
wherein, (a) to (d) are respectively the structure schematic diagrams when the included angle between the first strip of the basic array unit in the periodic array layer and the horizontal line is 15 °, 30 °, 45 ° or 60 °, and (e) is the structure schematic diagram of the metal fold line layer.
Fig. 3 is a schematic diagram of a process for preparing the extensible flexible radio frequency microstrip line of the present invention.
FIG. 4 shows an Ecoflex intermediate dielectric layer in the ductile flexible RF microstrip line of the present inventionTM00-30 materials.
Fig. 5 shows the self-reflection coefficient (S) of the signal collected by the ductile flexible rf microstrip line prepared according to the embodiments 1 and 2 of the present invention11) And transmission coefficient (S)21) A parameter map.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the following embodiments and accompanying drawings.
As shown in fig. 1, the invention is an extensible flexible radio frequency microstrip line, which sequentially comprises an extensible periodic array layer, an extensible flexible dielectric layer and an extensible metal wiring layer from bottom to top; the extensible periodic array layer and the extensible metal folding line layer are both composed of metal copper and polyimide, the polyimide layers are in contact with the extensible flexible dielectric layer through a silica gel layer, and the polyimide layers and the extensible flexible dielectric layer are electrically interconnected through a radio frequency SMA (shape memory alloy) connecting terminal; the extensible flexible dielectric layer is used for supporting the extensible metal wiring layer on the surface and the extensible periodic array layer on the bottom surface, the dielectric layer has excellent extensible performance, the adhesiveness between the dielectric layer and the upper layer and the adhesiveness between the dielectric layer and the lower layer are good, and the loss of the dielectric used for conducting electromagnetic waves is very small.
The extensible periodic array layer comprises a pattern area and blank areas on two sides of the pattern area, the blank areas are used for being connected with a radio frequency SMA (shape memory alloy) connecting terminal, the pattern area is formed by periodic arrangement of basic array units, the basic array units are obtained by sequentially rotating basic patterns by 90 degrees, 180 degrees and 270 degrees, the basic patterns are formed by connecting a first strip and a second strip through chamfers, an included angle α between the first strip and a horizontal line is 15-60 degrees, an included angle β between the first strip and the second strip is 180-2 α degrees, the widths of the first strip and the second strip are the same and are 0.2-3 mm, one end of the first strip, which is not in contact with the second strip, serves as a rotation center, and the length of the basic array unit is 1-10 mm, wherein the larger the included angle α between the first strip and the horizontal line is, the better in mechanical property, the larger the degree is, and the worse in electrical property is.
Further, the radius R1 of the inner chamfer and the radius R2 of the outer chamfer between the first strip and the second strip are both 0.1 mm-0.8 mm, and the purpose of chamfering is to passivate edges, increase ductility and reduce parasitic effect.
Further, the material adopted by the extensible flexible dielectric layer is EcoflexTM00-30, is prepared by mixing part A and part B according to the volume ratio or the mass ratio of 1:1, and has thicknessThe degree is 1 mm; the thicknesses of the metal layers in the extensible periodic array layer and the metal wire layer are both 0.010 mm-0.100 mm, and the thickness of the organic polymer layer is 0.010 mm-0.100 mm
Example 1
A method for preparing an extensible flexible radio frequency microstrip line, the specific flow of which is shown in fig. 2, specifically comprising the following steps:
selecting heat release glue at 120 ℃, adhering the heat release glue on a copper-coated surface of a polyimide copper-coated film, and carrying out pattern carving on the heat release glue by using a carving machine to respectively form patterns of an extensible periodic array layer and an extensible metal fold line layer, wherein an included angle between a first strip and a horizontal line in a basic array unit of the extensible periodic array layer is 15 degrees, an included angle β between the first strip and a second strip is 130 degrees, the radius R1 of an inner chamfer and the radius R2 of an outer chamfer between the first strip and the second strip are both 0.2mm, the distance between the central points of two adjacent basic array units is 6.0mm, the width of the strip in the basic array unit is 0.5mm, the horizontal length of the extensible metal fold line layer is 120mm, the vertical length is 26mm, and the width of a fold line is a microstrip line width and is 2 mm;
step 2: placing the structure obtained in the step 1 in an oven at 120 ℃ for baking, and carrying out thermal peeling to form a ductile periodic array layer and a metal wiring layer;
and step 3: transferring the hydrosol on the copper films of the extensible periodic array layer and the extensible metal wiring layer obtained in the step 2, and then sealing and standing at room temperature;
and 4, step 4: preparing the extensible flexible dielectric layer, wherein the specific flow is shown in fig. 4: using EcoflexTM00-30 medicines, mixing 20mL of Parts A solution and 20mL of Parts B solution according to the volume or mass ratio of 1:1, fully stirring for 5min, placing the stirred mixture in a vacuum cover, vacuumizing for 25min to remove bubbles, pouring the vacuumized mixture into a square plastic culture dish with the side length of 11.5 multiplied by 11.5mm, placing the square plastic culture dish on a horizontal plane, standing for 24h, and solidifying and molding;
and 5: spin-coating silica gel on the aqueous sol of the extensible periodic array layer and the extensible metal wiring layer obtained in the step 3 to enable the silica gel to completely cover the polyimide of the extensible periodic array layer and the extensible metal wiring layer, then adhering the silica gel surfaces of the extensible periodic array layer and the polyimide of the extensible metal wiring layer to two sides of the extensible flexible dielectric layer, and standing to enable the silica gel to be cured;
step 6: coating tetraethoxysilane on the structure obtained in the step (5), and then placing the structure under ultraviolet light for UV irradiation to enhance the adhesion of the silica gel layer and the extensible flexible dielectric layer;
and 7: soaking the device treated in the step 6 in water, removing the hydrosol, and then drying;
and 8: and 7, welding the two sides of the extensible metal wiring layer and the extensible periodic array layer of the device obtained in the step 7 through the SMA radio frequency wiring terminal to form electrical interconnection, and thus obtaining the extensible flexible radio frequency microstrip line.
Example 2
Preparing the extensible flexible radio frequency microstrip line according to the steps of embodiment 1, adjusting only the included angles between the first strip and the horizontal line in the basic array units of the extensible periodic array layer in step 1 to be 30 °, 45 ° and 60 °, adjusting the distance between the center points of two adjacent basic array units to be 6.5mm, 7.0mm and 7.5mm, respectively, adjusting the radius R1 of the inner chamfer between the first strip and the second strip to be 0.2mm, adjusting the radius R2 of the outer chamfer to be 0.4mm, 0.6mm and 0.8mm, adjusting the widths of the strips to be 0.8mm, 1.0mm and 1.0mm, respectively, and keeping the other steps unchanged.
The left and right ends of the ductile flexible radio frequency microstrip line prepared in the embodiment 1 and the embodiment 2 are welded with SMA radio frequency wiring terminals, and then the whole device is placed in a vector network analyzer for measurement to obtain the S of the device11And S21The parameters can reflect the quality of the signal transmission capability of the sample. As can be seen from fig. 5, S for the ductile flexible radio frequency microstrip lines prepared under the conditions of 15 °, 30 °, 45 ° and 60 °, S thereof11The parameters are basically distributed below-10 dB, and S21The signal attenuation amplitude of the parameter within 3GHz does not exceed-10 dB, which shows that the malleable flexible microstrip transmission line has excellent signal transmission capability.
In the invention, the characteristic impedance Z of the extensible flexible radio frequency microstrip line0The calculation formula of (2) is as follows:
wherein the content of the first and second substances,
wherein epsilonrThe relative dielectric constant of the microstrip line intermediate dielectric layer is 4.2 epsiloneW is the effective dielectric constant of the microstrip line, W is the line width of the microstrip line, and d is the thickness of the intermediate dielectric layer, so that the specific characteristic impedance Z can be realized by selecting proper conductive medium, line width and dielectric layer thickness0. In general radio frequency circuit, the required characteristic impedance is 50 Ω, so we first choose W/d as a fixed value to ensure Z0On the basis of 50 Ω, a set of parameters is obtained, in this embodiment, W/d is 2, and is controlled by process parameters, so that W and d are required to be ensured to be between 0.2mm and 3mm, so d is 1mm, and W is 2 mm. Thus, in the present invention, impedance matching of the circuit can be successfully achieved to transfer more energy from the signal input terminal to the load output terminal through the microstrip line structure.
While the invention has been described with reference to specific embodiments, any feature disclosed in this specification may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise; all of the disclosed features, or all of the method or process steps, may be combined in any combination, except mutually exclusive features and/or steps.
Claims (9)
1. The extensible flexible radio frequency microstrip line is characterized in that the flexible radio frequency microstrip line sequentially comprises an extensible periodic array layer, an extensible flexible dielectric layer and an extensible metal wiring layer from bottom to top; the extensible periodic array layer and the extensible metal folding line layer are both composed of metal and organic polymer, the organic polymer and the extensible flexible dielectric layer are connected, and the extensible periodic array layer and the extensible metal folding line layer are electrically connected through radio-frequency connection terminals at two ends.
2. The extensible flexible radio-frequency microstrip line according to claim 1, wherein the extensible periodic array layer comprises a pattern region and blank regions on two sides of the pattern region, the pattern region is formed by periodic arrangement of basic array units, the basic array units are obtained by sequentially rotating basic patterns by 90 °, 180 ° and 270 °, the basic patterns are formed by connecting a first strip and a second strip through chamfers, an included angle α between the first strip and a horizontal line is 15 ° to 60 °, an included angle β between the first strip and the second strip is 180 ° to 2 α, the widths of the first strip and the second strip are the same and are 0.2mm to 3mm, one end of the first strip, which is not in contact with the second strip, serves as a rotation center, and the length of the basic array unit is 1mm to 10 mm.
3. The malleable flexible radio frequency microstrip of claim 2 wherein the first elongated strip forms an angle with the horizontal of 15 °, 30 °, 45 ° or 60 °; when the included angle is 15 degrees, the length of the basic array unit is 6 mm; when the included angle is 30 degrees, the length of the basic array unit is 6.5 mm; when the included angle is 45 degrees, the length of the basic array unit is 7 mm; when the included angle is 60 degrees, the length of the basic array unit is 7.5 mm.
4. The ductile flexible radio-frequency microstrip of claim 2 wherein the inner chamfer radius R1 and the outer chamfer radius R2 of the connecting chamfer between the first elongated shape and the second elongated shape are both 0.1mm to 0.8 mm.
5. The malleable flexible radio frequency microstrip of claim 1 wherein the metal is copper or aluminum and the organic polymer is polyimide or liquid crystal high molecular weight polymer.
6. The ductile flexible radio-frequency microstrip of claim 1 wherein the organic polymers of the ductile periodic array layer and the ductile metal wiring layer are SiO-coated2The layer is connected to a malleable flexible dielectric layer.
7. The ductile flexible radio-frequency microstrip line according to claim 1, wherein the thickness of the metal layer in the ductile periodic array layer and the metal wiring layer is 0.010mm to 0.100mm, and the thickness of the organic polymer layer is 0.010mm to 0.100 mm; the material of the extensible flexible dielectric layer is EcoflexTM00-30 mm in thickness of 0.5-3 mm.
8. The malleable flexible radio frequency microstrip of claim 7 wherein the EcoflexTMThe 00-30 material is prepared by mixing part A and part B according to the volume ratio or the mass ratio of 1: 1.
9. A method for preparing a malleable flexible radio-frequency microstrip according to claim 6 comprising the steps of:
step 1: covering the organic polymer layer on the metal layer, and forming patterns of the extensible periodic array layer and the extensible metal wiring layer through etching to prepare the extensible periodic array layer and the extensible metal wiring layer;
step 2: transferring the hydrosol to the metal layers of the extensible periodic array layer and the extensible metal wiring layer obtained in the step 1, and then sealing and standing at room temperature;
and step 3: preparing an extensible flexible dielectric layer, which specifically comprises the following steps: using EcoflexTM00-30, mixing part A solution and part B solution according to the volume ratio or mass ratio of 1:1, vacuumizing, and pouring into a container to obtain the product;
and 4, step 4: spin-coating silica gel on the aqueous sol of the extensible periodic array layer and the extensible metal wiring layer obtained in the step 2 to enable the silica gel to completely cover the organic polymer layers of the extensible periodic array layer and the extensible metal wiring layer, and then respectively enabling the extensible metal wiring layer and the extensible periodic array layer to be respectively coated with organic polymer layersThe silica gel surfaces of the extended period array layer and the extensible metal wire layer are adhered to two sides of the extensible flexible dielectric layer, and the silica gel is solidified into SiO by standing2A layer;
and 5: coating tetraethoxysilane on the structure obtained in the step 4, and then placing the structure under ultraviolet light for UV irradiation to enhance the SiO2Adhesion of the layer to the malleable flexible dielectric layer;
step 6: soaking the device treated in the step 5 in water, removing the hydrosol, and then drying;
and 7: and (4) welding the two sides of the extensible metal wiring layer and the extensible periodic array layer of the device obtained in the step (6) through an SMA radio frequency wiring terminal to form electrical interconnection, and thus the extensible flexible radio frequency microstrip line can be prepared.
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