CN113078088A - Novel LED chip bonding conveying device of chip mounter - Google Patents
Novel LED chip bonding conveying device of chip mounter Download PDFInfo
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- CN113078088A CN113078088A CN202110405793.5A CN202110405793A CN113078088A CN 113078088 A CN113078088 A CN 113078088A CN 202110405793 A CN202110405793 A CN 202110405793A CN 113078088 A CN113078088 A CN 113078088A
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- 230000005540 biological transmission Effects 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 22
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 description 12
- 230000033001 locomotion Effects 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 4
- 238000007599 discharging Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Reciprocating Conveyors (AREA)
Abstract
A novel chip bonding and conveying device of an LED chip mounter comprises a sliding rod 1, a rotating shaft 2, a guide block 3, an annular guide rail 7, a sliding block 8, a bearing frame 9, a material carrying plate 10 and a transmission belt 11, wherein the guide block 3 is provided with a cavity, the sliding rod 1 can slide back and forth in the cavity of the guide block 3, one side of a connecting plate 12 is fixedly connected with the sliding rod 1 into a whole, the other side of the connecting plate 12 is fixedly connected with the transmission belt 11 in a gluing manner, the upper end surface of the rotating shaft 2 is rotationally connected with the lower bottom surface of the guide block 3, the lower end surface of the rotating shaft 2 is fixedly connected with the upper end surface of the sliding block 8, a left belt wheel 6 is connected with a right belt wheel 14 through the transmission belt 11, the transmission belt 11 is sleeved on the two belt wheels, the bearing frame 9 is fixedly connected on the sliding block 8, the lower end, the slide block 8 is embedded on the guide rail 7 to form sliding connection, so that the transmission and bonding of the LED chip are more convenient.
Description
Technical Field
The invention discloses a novel chip bonding and conveying device of an LED chip mounter, belongs to the field of chip manufacturing equipment, and particularly relates to a novel chip bonding and conveying device of an LED chip mounter, which is designed based on a common curve-shaped sliding guide rail, adopts the existing double-belt-wheel combined transmission mechanism as a power driving part, and is provided with a sliding rod guide device, an annular guide rail sliding device, a belt transmission mechanism, a material carrying device, a connecting plate and a base.
Background
In the field of LED chip manufacturing, chips with etched circuits need to be bonded to a substrate by a bonding conveyor. With the change of the times and the continuous development of science and technology, chip conveying devices develop towards high speed, high precision and high reliability, and people design various curve conveying tracks with special functions to meet the requirements of different stations. In LED chip transport devices, sliding guides are generally preferred as supports for supporting loads and transferring motion, and particularly in microelectronics manufacturing and precision instrumentation, there are many work stations and transport mechanisms that require slides and guides to support and transfer motion.
In the existing LED chip conveying device, a belt conveying mode, a chain plate conveying mode, a manipulator transmission conveying mode and the like are mainly adopted, but the modes have the defects of complex structure, unstable motion and difficulty in ensuring precision; the method also adopts a sliding guide rail as a support and a belt or a chain as a power part to pull the sliding block to move in parallel, but the mode that the traction part is fixedly connected with the sliding block exists, the application on a curved guide rail is not flexible, particularly when the elongated circular sliding guide rail is required to be adopted to support feeding, and the feeding and discharging functions are required to be completed at the two far ends of the circular guide rail feeding device, the track curve of the guide rail is required to be similar to the arrangement curve of the transmission belt, and the distance from the guide rail curve to the arrangement curve of the transmission belt in the normal direction is required to be equal everywhere, otherwise, the phenomenon of LED chip clamping can occur in the transmission process, and the flexible application of LED chip bonding transmission is not convenient.
Disclosure of Invention
In order to overcome the technical defects, the invention aims to provide a novel chip bonding and conveying device of an LED chip mounter, so that the LED chips are more flexible and convenient to convey.
In order to achieve the purpose, the invention adopts the technical scheme that: comprises a sliding rod guiding device, an annular guide rail sliding device, a belt transmission mechanism, a material carrying device and a base, wherein the sliding rod guiding device comprises a sliding rod 1, a rotating shaft 2, a guide block 3 and a connecting plate 12, the annular guide rail sliding device comprises an annular guide rail 7 and a slide block 8, the belt transmission mechanism comprises a left belt wheel 6, a right belt wheel 14 and a transmission belt 11, the material carrying device comprises a bearing frame 9 and a material carrying plate 10, the guide block 3 is provided with a cavity, the sliding rod 1 can slide back and forth in the cavity of the guide block 3, one side of the connecting plate 12 is fixedly connected with the sliding rod 1, the other side of the connecting plate 12 is fixedly connected with the transmission belt 11 in a whole by gluing, the upper end surface of the rotating shaft 2 is rotatably connected with the lower bottom surface of the guide block 3, the lower end surface of the rotating shaft 2 is fixedly connected with the upper end surface of the slide block 8, a bearing, the inner ring of the bearing 5 is fixedly connected with the upper end part of the driven shaft 4, the lower end part of the driven shaft 4 is fixedly connected with a base 15, a right belt wheel 14 is fixedly connected with the middle part of a driving shaft 13, the lower end part of the driving shaft 13 is matched with a shaft hole on a bottom plate 15 to form rotary connection, the upper end part of the driving shaft 13 is connected with an external power source, a left belt wheel 6 is connected with the right belt wheel 14 through a transmission belt 11, the transmission belt 11 is sleeved on the two belt wheels, during work, motion and torque are transmitted through friction force generated by the contact of the inner side surface of the transmission belt 11 and the outer cylindrical surfaces of the left belt wheel and the right belt wheel, a bearing frame 9 is fixedly connected on a sliding block 8, the lower end part of the bearing frame 9 is provided with an arch-shaped groove, a material carrying plate 10 is fixedly arranged in the, the slider 8 can slide back and forth on the endless guide 7.
The invention designs that the material carrying plate 10 is arranged as a rubber sheet to increase the friction force between the LED chip and the material carrying plate 10 and prevent the LED chip from being thrown out of the material carrying plate 10 in the running process or in the quasi-stop process.
The invention designs that the material carrying plate 10 is fixedly bonded and placed in an arch-shaped groove arranged at the lower part of the bearing frame 9.
The invention envisages the drive belt 11 to be a conventional belt or steel belt.
The invention designs that the guide block 3 is provided with a cavity, the sliding rod 1 can slide back and forth in the cavity of the guide block 3, and the outer side surface of the sliding rod 1 and the inner side surface of the cavity of the guide block 3 form sliding friction connection.
The invention designs that the base 15 is provided with shaft holes corresponding to the positions of the left and right belt wheels and a lug boss for supporting the annular guide rail 7.
The invention designs that the structures of the left belt wheel 6 and the right belt wheel 14 are set to be universal hole plate type structures.
The invention designs that the bearing 5 can adopt a universal ball bearing or a roller bearing.
The invention designs that the sliding block 8 adopts a rolling body sliding block which can slide on an arc guide rail.
The invention designs that the left station 101 is a loading position of the invention, and the right station 102 is a discharging position of the invention.
The invention designs that a driving belt 11 pulls a connecting plate 12 to move along the movement direction of the driving belt 11, the connecting plate 12 drives a sliding rod 1 to move, the sliding rod 1 pushes a guide block 3 to move, the guide block 3 drives a rotating shaft 2 to move, the rotating shaft 2 pushes a sliding block 8 to slide on a guide rail 7 along the direction of a guide rail, the sliding block 8 drives a bearing frame 9 to move, and the bearing frame 9 bears LED chips on a material bearing plate 10 to move along the shape of the guide rail.
The invention designs that the rotating connection between the sliding block 8 and the guide block 3 can eliminate the angle deviation that the normal line of the annular guide rail 7 is not coincident with the normal line of the transmission belt 11 when the sliding block 8 moves to any position on the annular guide rail 7, and the sliding connection between the sliding rod 1 and the guide block 3 can eliminate the displacement deviation of the annular guide rail 7 from the transmission belt 11 when the sliding block 8 moves to any position on the annular guide rail 7.
The invention also designs that a combined segmented guide rail is adopted for the annular guide rail 7 and comprises a left arc section guide rail 16, a short linear guide rail 17, a right arc section guide rail 18 and a long linear guide rail 19, wherein the short linear guide rail 17 is arranged between the left arc section guide rail 16 and the right arc section guide rail 18, the length of the short linear guide rail 17 is 1.5-2 times that of the slide block 8, and the left arc section guide rail 16, the short linear guide rail 17, the right arc section guide rail 18 and the long linear guide rail 19 are part of the annular guide rail 7 in consideration of the fact that a larger gap exists between matching surfaces of the slide block 8 and the arc section guide rail due to the shape of the arc section guide rail when the slide block 8 runs on the arc section guide rail.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a structural view of the endless guide.
Detailed Description
FIG. 1 is a drawing showing an embodiment of the present invention, which is described in detail with reference to FIG. 1, and comprises a slide bar guiding device, an endless guide sliding device, a belt transmission mechanism, a material loading device and a base, wherein the slide bar guiding device comprises a slide bar 1, a rotating shaft 2, a guide block 3 and a connecting plate 12, the endless guide sliding device comprises an endless guide 7 and a slide block 8, the belt transmission mechanism comprises a left belt wheel 6, a right belt wheel 14 and a transmission belt 11, the material loading device comprises a bearing frame 9 and a material loading plate 10, the guide block 3 is provided with a cavity, the slide bar 1 can slide back and forth in the cavity of the guide block 3, one side of the connecting plate 12 is fixedly connected with the slide bar 1, the other side of the connecting plate 12 is fixedly connected with the transmission belt 11, the upper end surface of the rotating shaft 2 is rotatably connected with the lower end surface of the guide block 3, a bearing 5 is arranged between the left belt wheel 6 and the driven shaft 4, the outer ring of the bearing 5 is fixedly connected with the shaft hole of the left belt wheel 6 into a whole, the inner ring of the bearing 5 is fixedly connected with the upper end part of the driven shaft 4, the lower end part of the driven shaft 4 is fixedly connected with a base 15, the right belt wheel 14 is fixedly connected with the middle part of the driving shaft 13, the lower end part of the driving shaft 13 is matched with the shaft hole on the bottom plate 15 to form rotary connection, the upper end part of the driving shaft 13 is connected with an external power source, the left belt wheel 6 is connected with the right belt wheel 14 through a transmission belt 11, the transmission belt 11 is sleeved on the two belt wheels, during working, the motion and the torque are transmitted through the friction force generated by the contact of the inner side surface of the transmission belt 11 with the outer cylindrical surfaces of the left belt wheel and, the bottom of the sliding block 8 is cut with a groove which is slightly wider than the annular guide rail 7, the sliding block 8 is embedded on the annular guide rail 7 to form sliding connection, and the sliding block 8 can slide back and forth on the annular guide rail 7.
In this embodiment, the carrier plate 10 is fixedly bonded to the lower portion of the carrier 9 in an arcuate groove.
In the embodiment, the material loading plate 10 is a rubber sheet to increase the friction between the LED chip and the material loading plate 10, so as to prevent the LED chip from being thrown out of the material loading plate 10 during operation or during a quasi-stop of the present invention.
In the present embodiment, the slider 8 is a rolling element slider that can slide on a circular arc guide rail.
In this embodiment, the left station 101 is a charging port, and the right station 102 is a discharging port.
In the present embodiment, the transmission belt 11 is a general belt or steel belt.
In this embodiment, the guide block 3 is provided with a cavity, the sliding rod 1 can slide back and forth in the cavity of the guide block 3, and the outer side surface of the sliding rod 1 and the inner side surface of the cavity of the guide block 3 form a sliding friction connection.
In the present embodiment, the structure of the left pulley 6 and the right pulley 14 is provided as a common orifice plate type structure.
In the present embodiment, the bearing 5 is a general ball bearing or a roller bearing.
In this embodiment, the left pulley 6 is a driven pulley, and the right pulley 14 is a driving pulley.
In this embodiment, the left pulley 6 and the right pulley 14 are connected by a transmission belt, and during operation, the friction force generated by the contact between the inner side surface of the transmission belt 11 and the outer cylindrical surface of the left and right pulleys is used for transmitting motion and torque.
In this embodiment, the annular guide rail 7 adopts a combined type segmented guide rail, and includes a left circular arc section guide rail 16, a short linear guide rail 17, a right circular arc section guide rail 18 and a long linear guide rail 19, wherein the short linear guide rail 17 is arranged between the left circular arc section guide rail 16 and the right circular arc section guide rail 18, the length of the short linear guide rail 17 is 1.5 to 2 times that of the slider 8, and the left circular arc section guide rail 16, the short linear guide rail 17, the right circular arc section guide rail 18 and the long linear guide rail 19 are part of the annular guide rail 7.
When the LED chip packaging machine works, an external power driving part drives a driving shaft 13 to rotate, the driving shaft 13 is connected with a right belt wheel 14 into a whole so as to drive the right belt wheel 14 to rotate, a transmission belt 11 is sleeved on the right belt wheel 14, the right belt wheel 14 drives a left belt wheel 6 to rotate through the transmission belt 11, a connecting plate 12 is fixedly connected to the outer side of the transmission belt 11 so as to pull the connecting plate 12 to move along the movement direction of the transmission belt 11, the connecting plate 12 drives a sliding rod 1 to move, the sliding rod 1 pushes a guide block 3 to move, the guide block 3 drives a rotating shaft 2 to move, the rotating shaft 2 pushes a sliding block 8 to slide on an annular guide rail 7 along the direction of the guide rail, the sliding block 8 drives a bearing frame 9.
In the working process of the invention, when the slide block 8 runs on the long linear guide rail 19 at the middle section of the annular guide rail 7, as the arrangement direction of the long linear guide rail 19 is basically parallel to the direction of the transmission belt 11, namely, the normal distance between the long linear guide rail 19 and the transmission belt 11 is basically equal everywhere, when the transmission belt 11 pulls the guide device to drive the slide block 8 to move, the slide rod 1 basically does not slide in the guide block 3, at the moment, the guide device is equivalent to a connecting rod to fixedly connect the transmission belt 11 and the slide block 8, and at the moment, the connecting rod can be adopted to replace a guide connecting device.
When the invention turns, the slider 8 moves to the circle segment guide, for example on the right circle segment guide 18, because the center of the right arc guide rail 18 is not concentric with the rotation center of the transmission belt 11, the normal distance from the right arc guide rail 18 to the transmission belt 11 is not equal everywhere, but a follow-up variable quantity, and if the connecting rod is adopted to fixedly connect the transmission belt 11 and the slide block 8, the phenomenon of 'jamming' occurs, and can not continue to run, at this moment the slide bar 1 will stretch out and draw back and slide in the guide block 3 in the guiding arrangement designed in this invention, has eliminated the surplus offset, the slide block 8 still slides according to the shape curve of the right arc section guide rail 18, the tie plate 12 moves according to the motion curve of the drive belt 11, the offset of the drive belt 11 from the right arc section guide rail 18 is all eliminated by the sliding connection between slide bar 1 and guide block 3; when the normal direction of the right arc guide rail 18 has an offset angle with the normal direction of the transmission belt 11, the offset angle is eliminated by the rotation of the rotating shaft 2 between the guide block 3 and the slide block 8. Under the drive of the external power driving part, the LED chip can be carried by the carrying plate to continuously move or stop along the shape curve of the guide rail through the combination of the belt transmission mechanism, the guide device and the sliding device. When loading and unloading the LED chips at the left station 101 and the right station 102, the loading plate 10 can be stopped at the stations 101 and 102 accurately and stably to load and unload the LED chips.
The guide device designed by the invention can effectively solve the problem that the center distance of two belt wheels in the existing annular guide rail feeding device is not adjustable, and simultaneously, the problem of unstable positioning caused by the shape of the arc guide rail after the slide block is accurately stopped at the left end and the right end of the annular guide rail is solved by additionally arranging the short linear guide rail 17 between the left arc section guide rail and the right arc section guide rail of the annular guide rail, so that the requirements on assembly precision are reduced for the installation and the arrangement of the annular guide rail and the belt transmission mechanism, and the flexible application of an LED chip in the bonding and conveying process is more convenient.
In the technical field of a novel chip bonding and conveying device of an LED chip mounter; the guide device comprises a sliding rod 1, a rotating shaft 2, a guide block 3, an annular guide rail 7, a sliding block 8, a bearing frame 9, a material carrying plate 10 and a connecting plate 12, wherein the guide block 3 is provided with a cavity, the sliding rod 1 can slide back and forth in the cavity of the guide block 3, one side of the connecting plate 12 is fixedly connected with the sliding rod 1, the other side of the connecting plate 12 is fixedly connected with a transmission belt 11 in a gluing manner, the upper end surface of the rotating shaft 2 is rotatably connected with the lower bottom surface of the guide block 3, the lower end surface of the rotating shaft 2 is fixedly connected with the upper end surface of the sliding block 8, the lower end part of the bearing frame 9 is provided with an arch-shaped groove, the material carrying plate 10 is fixedly arranged in the arch-shaped groove, the sliding block 8 is embedded on the guide rail 7 to form sliding connection, the annular guide rail 7 adopts a combined type segmented guide rail, a short linear guide rail 17 is arranged between a left, and that various modifications and alterations may occur to those skilled in the art without departing from the spirit of the invention.
Claims (3)
1. A chip bonding and conveying device of a novel LED chip mounter is disclosed; the method is characterized in that: comprises a sliding rod (1), a rotating shaft (2), a guide block (3), an annular guide rail (7), a sliding block (8), a bearing frame (9), a material carrying plate (10) and a connecting plate (12), wherein the guide block (3) is provided with a cavity, the sliding rod (1) can slide back and forth in the cavity of the guide block (3), one side of the connecting plate (12) is fixedly connected with the sliding rod (1) into a whole, the other side of the connecting plate (12) is fixedly connected with a driving belt (11) in a gluing way, the upper end surface of the rotating shaft (2) is rotationally connected with the lower bottom surface of the guide block (3), the lower end surface of the rotating shaft (2) is fixedly connected with the upper end surface of the sliding block (8), an arch-shaped groove is arranged at the lower end part of the bearing frame (9), the material carrying plate (10) is fixedly arranged in the arch-shaped groove, the annular guide rail (7), The guide rail structure comprises a right circular arc section guide rail (18) and a long straight line guide rail (19), wherein a short straight line guide rail (17) is arranged between a left circular arc section guide rail (16) and the right circular arc section guide rail (18), the length of the short straight line guide rail (17) is 1.5-2 times that of a sliding block (8), and the left circular arc section guide rail (16), the short straight line guide rail (17), the right circular arc section guide rail (18) and the long straight line guide rail (19) are parts of an annular guide rail (7).
2. The novel chip bonding and conveying device of the LED chip mounter according to claim 1; the method is characterized in that: the driving belt (11) pulls the connecting plate (12) to move along the moving direction of the driving belt (11), the connecting plate (12) drives the sliding rod (1) to move, the sliding rod (1) pushes the guide block (3) to move, the guide block (3) drives the rotating shaft (2) to move, the rotating shaft (2) pushes the sliding block (8) to slide on the annular guide rail (7) along the direction of the guide rail, the sliding block (8) drives the bearing frame (9) to move, and the bearing frame (9) bears the LED chip on the material carrying plate (10) to move along the shape of the guide rail.
3. The novel chip bonding and conveying device of the LED chip mounter according to claim 1; the method is characterized in that: the rotary connection between the sliding block (8) and the guide block (3) can eliminate the angular deviation that the normal line of the annular guide rail (7) is not coincident with the normal line of the transmission belt (11) when the sliding block (8) moves to any position on the annular guide rail (7), and the sliding connection between the sliding rod (1) and the guide block (3) can eliminate the displacement deviation of the annular guide rail (7) from the transmission belt (11) when the sliding block (8) moves to any position on the annular guide rail (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110405793.5A CN113078088A (en) | 2021-04-15 | 2021-04-15 | Novel LED chip bonding conveying device of chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110405793.5A CN113078088A (en) | 2021-04-15 | 2021-04-15 | Novel LED chip bonding conveying device of chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113078088A true CN113078088A (en) | 2021-07-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110405793.5A Withdrawn CN113078088A (en) | 2021-04-15 | 2021-04-15 | Novel LED chip bonding conveying device of chip mounter |
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| Country | Link |
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| CN (1) | CN113078088A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114735420A (en) * | 2022-04-06 | 2022-07-12 | 德宸食品配料(武汉)有限公司 | Transportation equipment is used in essence production of safety and stability |
-
2021
- 2021-04-15 CN CN202110405793.5A patent/CN113078088A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114735420A (en) * | 2022-04-06 | 2022-07-12 | 德宸食品配料(武汉)有限公司 | Transportation equipment is used in essence production of safety and stability |
| CN114735420B (en) * | 2022-04-06 | 2023-08-25 | 茂名市德威圣科技有限责任公司 | Transportation equipment is used in production of safe and stable essence |
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Application publication date: 20210706 |
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