CN113066755B - 一种芯片背面金属化夹具及芯片背面金属化方法 - Google Patents
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Abstract
本发明公开了一种芯片背面金属化夹具及芯片背面金属化方法,包括衬底,所述衬底的上端面平行设置有两个第一挡条,所述衬底的上端面还设置有至少两个第二挡条,每个所述第二挡条的一端与一个所述第一挡条的一侧垂直接触,每个所述第二挡条的另一端与另一个所述第一挡条的一侧垂直接触,相邻的两个所述第二挡条之间设置有与待制作金属化膜层的芯片尺寸相匹配的间距;每个所述第一挡条和每个所述第二挡条均采用与所述芯片晶向结构相同的硅片。本发明能够稳定固定芯片,杜绝芯片“侧面爬金”问题,使背金工艺过程操作便捷,背金成品率高且可实现批量生产。
Description
技术领域
本发明属于微电子制造工艺及混合集成电路制造领域,具体涉及一种芯片背面金属化夹具及芯片背面金属化方法。
背景技术
目前在微电子制造工艺及混合集成电路制造工艺中,某些型号混合电路由于其寿命要求,需将部分芯片导电胶粘接工艺更改为焊接工艺,则芯片必须具备背面金属化膜层。而现有市场只能获得单个裸芯片,不具备背面金属化膜层。因此必须在单个裸芯片背面制作金属化膜层。
由于芯片尺寸各异,缺乏合适工装固定,背面金属化过程中芯片侧面也会覆盖金属化膜层(“侧面爬金”),在后续焊接工艺中,焊料会沿着侧面金属化膜层爬附,形成锡珠等多余物,造成电路性能不合格,产品报废。
发明内容
针对现有技术中存在的问题,本发明提供了一种芯片背面金属化夹具及芯片背面金属化方法,能够稳定固定芯片,杜绝芯片“侧面爬金”问题,使背金工艺过程操作便捷,背金成品率高且可实现批量生产。
为了解决上述技术问题,本发明通过以下技术方案予以实现:
一种芯片背面金属化夹具,包括衬底,所述衬底的上端面平行设置有两个第一挡条,所述衬底的上端面还设置有至少两个第二挡条,每个所述第二挡条的一端与一个所述第一挡条的一侧垂直接触,每个所述第二挡条的另一端与另一个所述第一挡条的一侧垂直接触,相邻的两个所述第二挡条之间设置有与待制作金属化膜层的芯片尺寸相匹配的间距;每个所述第一挡条和每个所述第二挡条均采用与所述芯片晶向结构相同的硅片。
进一步地,所述衬底采用粗糙度小于10nm的微晶玻璃片。
进一步地,所述衬底的厚度为0.25~0.5mm。
进一步地,每个所述第一挡条和每个所述第二挡条的厚度为与所述芯片的厚度一致。
进一步地,所述衬底、第一挡条以及与第一挡条接触的第二挡条之间均为可拆卸连接。
进一步地,所述衬底、第一挡条以及与第一挡条接触的第二挡条之间通过回形针固定。
一种芯片背面金属化方法,应用所述的夹具,首先,将若干待制作金属化膜层的芯片正面朝下依次放置在相邻两个所述第二挡条之间形成的间距中的衬底上,使每个所述芯片均与对应的第二挡条的一侧接触,且使间距两端的所述芯片均与对应的第一挡条的一侧接触;最后,对芯片按照工艺要求进行背面金属化膜层制备。
进一步地,在对芯片进行背面金属化膜层制备之前,在显微镜下观察芯片是否与对应的第一挡条以及第二挡条无缝接触,若芯片与对应的第一挡条以及第二挡条之间存在缝隙,则微调对应的第一挡条和/或第二挡条,直至芯片与对应的第一挡条以及第二挡条无缝接触。
与现有技术相比,本发明至少具有以下有益效果:本发明将若干待制作金属化膜层的芯片正面朝下依次放置在相邻两个第二挡条之间形成的间距中的衬底上,使每个芯片均与对应的第二挡条的一侧接触,且使间距两端的芯片均与对应的第一挡条的一侧接触,芯片与挡条接触后,对芯片按照工艺要求进行背面金属化膜层制备,本发明在芯片背面金属化过程中能够有效杜绝芯片“侧面爬金”问题,背金成品率高且操作流程简单,重复性好,可实现批量生产。
进一步地,衬底采用粗糙度小于10nm的微晶玻璃片,当芯片正面朝下放置在衬底上时,可有效避免操作过程中对芯片表面的划伤。
进一步地,衬底的厚度为0.25~0.5mm,衬底厚度若小于0.25mm,则强度降低,回形针夹持过程中衬底容易碎裂;衬底厚度若大于0.5mm,则回形针夹持过程中形变较大,受力不均很容易导致芯片散落。因此必须选择适当厚度的衬底,能够保证在回形针夹持过程中不发生碎裂且回形针形变越小固定越牢固。
进一步地,挡条的厚度应当保证与待做芯片的厚度一致,若厚度小于芯片厚度则无法完全遮挡住芯片侧壁,若厚度大于芯片厚度则后期溅射金属化膜层的过程中由于芯片与挡条接触部位存在高低差,会形成衍射导致膜层不均匀。因此要保证挡条与芯片在同一水平高度下溅射膜层。
进一步地,衬底、第一挡条以及与第一挡条接触的第二挡条之间均为可拆卸连接,便于通过调整挡条之间的间距实现匹配不同尺寸的芯片。
进一步地,衬底、第一挡条以及与第一挡条接触的第二挡条之间通过回形针固定,回形针夹固稳定,轻巧便捷,易于操作。
为使本发明的上述目的、特征和优点能更明显易懂,下文特举较佳实施例,并配合所附附图,作详细说明如下。
附图说明
为了更清楚地说明本发明具体实施方式中的技术方案,下面将对具体实施方式描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明一种芯片背面金属化夹具使用时的示意图。
图中:1-衬底;2-第一挡条;3-第二挡条;4-芯片;5-回形针。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合附图对本发明的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
作为本发明的某一具体实施方式,如图1所示,一种芯片背面金属化夹具,包括衬底1、第一挡条2、第二挡条3和回形针5,衬底1的上端面平行设置有两个第一挡条2,衬底1的上端面还设置有至少两个第二挡条3,每个第二挡条3的一端与一个第一挡条2的一侧垂直接触,每个第二挡条3的另一端与另一个第一挡条2的一侧垂直接触,相邻的两个第二挡条3之间设置有与待制作金属化膜层的芯片4尺寸相匹配的间距。第一挡条2和第二挡条3是用来固定芯片4的,挡条形成的间距中用于放置待制作金属化膜层的芯片4。
每个第一挡条2和每个第二挡条3均采用与芯片4晶向结构相同的硅片,由于硅片与芯片材料一致,且划道边缘无毛刺,能够实现芯片4与第一挡条2和第二挡条3侧面的紧密衔接,有效避免侧面覆盖金属化膜层。
作为本发明的某一优选实施例,衬底1采用粗糙度小于10nm的微晶玻璃片,可有效避免操作过程中对芯片4表面的划伤。
衬底1的厚度为0.25~0.5mm,衬底厚度若小于0.25mm,则强度降低,回形针夹持过程中衬底容易碎裂;衬底厚度若大于0.5mm,则回形针夹持过程中形变较大,受力不均很容易导致芯片散落。因此必须选择适当厚度的衬底,能够保证在回形针夹持过程中不发生碎裂且回形针形变越小固定越牢固。每个第一挡条2和每个第二挡条3的厚度为与芯片4的厚度一致,若厚度小于芯片厚度则无法完全遮挡住芯片侧壁,若厚度大于芯片厚度则后期溅射金属化膜层的过程中由于芯片与挡条接触部位存在高低差,会形成衍射导致膜层不均匀。因此要保证挡条与芯片在同一水平高度下溅射膜层。
本发明中,衬底1、第一挡条2以及与第一挡条2接触的第二挡条3之间均为可拆卸连接,如图1所示,优选的,衬底1、第一挡条2以及与第一挡条2接触的第二挡条3之间通过回形针5固定,方便拆卸以及固定,方便调整挡条之间的距离,回形针5夹固稳定,轻巧便捷,易于操作。
采用砂轮划片方式将硅片划成矩形条形成第一挡条2和第二挡条3,本实施例中,第一挡条2尺寸为6mm×50mm,第二挡条3根据实际摆放芯片4的尺寸设计。
本发明一种芯片背面金属化方法,首先,将若干待制作金属化膜层的芯片4正面朝下依次放置在相邻两个第二挡条3之间形成的间距中的衬底1上,使每个芯片4均与对应的第二挡条3的一侧接触,且使间距两端的芯片4均与对应的第一挡条2的一侧接触;最后,对芯片4按照工艺要求进行背面金属化膜层制备。
优选的,在对芯片4进行背面金属化膜层制备之前,在显微镜下观察芯片4是否与对应的第一挡条2以及第二挡条3无缝接触,若芯片4与对应的第一挡条2以及第二挡条3之间存在缝隙,则微调对应的第一挡条2和/或第二挡条3,直至芯片4与对应的第一挡条2以及第二挡条3无缝接触。
作为本发明某一具体实施方式,一种芯片背面金属化方法,详细的说,包括以下步骤:
1)材料预处理:选取粗糙度小于10nm,尺寸为50mm×50mm的微晶玻璃片作为衬底1,将衬底表面清洗干净备用;按照芯片摆放长度设计并裁出一定尺寸的若干硅挡条作为第一挡条2和第二挡条3,并用酒精清洗干净备用;
2)摆放芯片:将芯片正面朝下平铺于洁净的方形微晶玻璃衬底上,首先贴合衬底左边缘竖直摆放一根第一挡条2,再贴合上边缘水平摆放一根第二挡条3,两根挡条呈垂直状紧密贴合,用一个回形针5在直角处夹固,然后贴着挡条的内侧直角边将芯片逐个紧密排成一排,在芯片下侧再加一根第二挡条3,使所有芯片紧密贴合,再加一个回形针在挡条直角处夹固,即完成第一排芯片摆放;接着可在下侧继续按照此方法摆放第二排芯片,具体摆放芯片数量根据芯片尺寸及生产任务而调整;最后在衬底右边缘再竖直加一根第一挡条2,且保证第一挡条2与第二挡条3及芯片侧壁均可紧密贴合,最后再用回形针夹固挡条,摆放完成后示意图如图1所示;
3)自检:将摆好的芯片及夹具放于显微镜下逐个观察,轻微调整挡条,确保芯片四条边均无可见缝隙,用洗耳球轻轻吹扫表面,确保芯片表面无杂质、颗粒等;
4)溅射:在溅射台中按照工艺要求完成芯片背面金属化膜层制备。
实施例
选用不同尺寸的实验芯片300只,分6次进行试验,按照上述工艺步骤,将芯片固定于本申请所提的夹具内,在溅射台中进行背面金属化膜层制备,最后经外观检验结果如表1所示:
表1试验结果
次数 | 样品数量 | 合格数 |
1 | 42只大芯片 | 41 |
2 | 42只小芯片 | 42 |
3 | 28只大芯片 | 28 |
4 | 42只小芯片 | 41 |
5 | 20只大芯片 | 20 |
6 | 126只小芯片 | 124 |
合计 | 300 | 合格率98.6% |
由表1可以看出,使用本发明提出的工装夹具后,芯片背面金属化后侧面爬金情况非常少,检验合格率达到98.6%。
本发明提出的工装夹具,实现了针对不同尺寸单芯片背面金属化的批量生产,且有效杜绝了芯片“侧面爬金”问题,成品率高,操作便捷,成本较低。
最后应说明的是:以上所述实施例,仅为本发明的具体实施方式,用以说明本发明的技术方案,而非对其限制,本发明的保护范围并不局限于此,尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,其依然可以对前述实施例所记载的技术方案进行修改或可轻易想到变化,或者对其中部分技术特征进行等同替换;而这些修改、变化或者替换,并不使相应技术方案的本质脱离本发明实施例技术方案的精神和范围,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应所述以权利要求的保护范围为准。
Claims (8)
1.一种芯片背面金属化夹具,其特征在于,包括衬底(1),所述衬底(1)的上端面平行设置有两个第一挡条(2),所述衬底(1)的上端面还设置有至少两个第二挡条(3),每个所述第二挡条(3)的一端与一个所述第一挡条(2)的一侧垂直接触,每个所述第二挡条(3)的另一端与另一个所述第一挡条(2)的一侧垂直接触,相邻的两个所述第二挡条(3)之间设置有与待制作金属化膜层的芯片(4)尺寸相匹配的间距;每个所述第一挡条(2)和每个所述第二挡条(3)均采用与所述芯片(4)晶向结构相同的硅片。
2.根据权利要求1所述的一种芯片背面金属化夹具,其特征在于,所述衬底(1)采用粗糙度小于10nm的微晶玻璃片。
3.根据权利要求1所述的一种芯片背面金属化夹具,其特征在于,所述衬底(1)的厚度为0.25~0.5mm。
4.根据权利要求3所述的一种芯片背面金属化夹具,其特征在于,每个所述第一挡条(2)和每个所述第二挡条(3)的厚度与所述芯片(4)的厚度一致。
5.根据权利要求4所述的一种芯片背面金属化夹具,其特征在于,所述衬底(1)、第一挡条(2)以及与第一挡条(2)接触的第二挡条(3)之间均为可拆卸连接。
6.根据权利要求5所述的一种芯片背面金属化夹具,其特征在于,所述衬底(1)、第一挡条(2)以及与第一挡条(2)接触的第二挡条(3)之间通过回形针(5)固定。
7.一种芯片背面金属化方法,其特征在于,应用如权利要求1至6任一项所述的夹具,首先,将若干待制作金属化膜层的芯片(4)正面朝下依次放置在相邻两个所述第二挡条(3)之间形成的间距中的衬底(1)上,使每个所述芯片(4)均与对应的第二挡条(3)的一侧接触,且使间距两端的所述芯片(4)均与对应的第一挡条(2)的一侧接触;最后,对芯片(4)按照工艺要求进行背面金属化膜层制备。
8.根据权利要求7所述的一种芯片背面金属化方法,其特征在于,在对芯片(4)进行背面金属化膜层制备之前,在显微镜下观察芯片(4)是否与对应的第一挡条(2)以及第二挡条(3)无缝接触,若芯片(4)与对应的第一挡条(2)以及第二挡条(3)之间存在缝隙,则微调对应的第一挡条(2)和/或第二挡条(3),直至芯片(4)与对应的第一挡条(2)以及第二挡条(3)无缝接触。
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