CN113066754A - Thimble unit, chip stripping and picking device and chip stripping and picking method - Google Patents

Thimble unit, chip stripping and picking device and chip stripping and picking method Download PDF

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Publication number
CN113066754A
CN113066754A CN202110291111.2A CN202110291111A CN113066754A CN 113066754 A CN113066754 A CN 113066754A CN 202110291111 A CN202110291111 A CN 202110291111A CN 113066754 A CN113066754 A CN 113066754A
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CN
China
Prior art keywords
chip
elastic sheet
driving device
unit
bases
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Pending
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CN202110291111.2A
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Chinese (zh)
Inventor
刘东亮
滕乙超
魏瑀
刘洋洋
王波
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Zhejiang Heqing Flexible Electronic Technology Co ltd
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Zhejiang Heqing Flexible Electronic Technology Co ltd
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Priority to CN202110291111.2A priority Critical patent/CN113066754A/en
Publication of CN113066754A publication Critical patent/CN113066754A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Abstract

The invention provides a thimble unit, which comprises an elastic sheet and a first driving device connected with the elastic sheet; the first driving device is used for controlling the two ends of the elastic sheet to move oppositely so that the elastic sheet protrudes upwards; the elastic pieces have been configured to bend upwards when moved towards each other; the thimble unit is used for bearing the stripping of chip and supplementary chip and notacoria. In addition, the invention also provides a chip stripping and picking device comprising the thimble unit and a chip stripping and picking method. The elastic sheet is innovatively used as a core component of the thimble unit, the elastic sheet protrudes upwards to jack up the chip to realize stripping due to extrusion, and the stripping process depends on the protrusion of the elastic sheet, and the protrusion of the elastic sheet is a gradually changing process, so that the mode is very soft for stripping the chip and cannot cause the situation of breakage. Different from a film inflation mode, the film inflation control method is not needed to consider the material of the film and the inflation control method, and is easier to operate and higher in reliability.

Description

Thimble unit, chip stripping and picking device and chip stripping and picking method
Technical Field
The invention relates to the technical field of chip peeling and picking, in particular to a thimble unit, a chip peeling and picking device and a chip peeling and picking method.
Background
In recent years, flexible electronics have become a hot point of development due to their outstanding extensibility, adaptability and portability. However, after the flexible electronic chip, such as a flexible chip, is cut on the ultra-thin silicon wafer, the flexible electronic chip needs to be peeled off from the back film for subsequent packaging, and various peeling schemes for chips are available at present.
For example, a single-thimble scheme is replaced by a multi-thimble scheme, so that the problem that the flexible chip is easily broken due to the single-thimble scheme is solved, but the multi-thimble scheme is easily incomplete in stripping.
The multi-thimble grading scheme and the common multi-thimble scheme are not suitable for small-sized flexible chips because a plurality of thimbles are required.
And a film thimble scheme is adopted, a deformable film material is adopted, and inflation is carried out below the film, so that the film is subjected to expansion deformation, and the film can be well adapted to the flexible chip due to gradual progress of the film in the expansion deformation process. However, the film thimble is inflated, so the requirement on the material of the film is high, the control precision of inflation is also high, the cost is high, and the reliability is poor.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a thimble unit, a chip stripping and picking device and a chip stripping and picking method.
In a first aspect, in one embodiment, the present invention provides a thimble unit, including an elastic sheet and a first driving device connected to the elastic sheet; the power supply is used for supplying power to the first driving device;
the first driving device is used for controlling the two ends of the elastic sheet to move oppositely so that the elastic sheet protrudes upwards; the elastic pieces are configured to bend upwards when moving towards each other under the action of the first driving device; the thimble unit is used for bearing the stripping of chip and supplementary chip and notacoria.
In one embodiment, the elastic sheet has a bent portion bent upward;
or the elastic piece ejection device further comprises a second driving device arranged below the elastic piece, and the second driving device is used for ejecting the elastic piece upwards by a first preset height before the elastic piece moves oppositely under the action of the first driving device.
In one embodiment, the first driving device comprises two bases, and two ends of the elastic piece are respectively fixed on the two bases.
In one embodiment, the first driving device further comprises a horizontal guide rail, a vertical sliding block, a connecting rod and a driving device, the two bases are sleeved on the horizontal guide rail, and the vertical sliding block is sleeved on the vertical guide rail and is movably connected with the two bases through the connecting rod; the vertical sliding block is further connected with the driving device and used for moving up and down under the driving of the driving device so as to drive the two bases to move in the opposite directions or in the back direction.
In one embodiment, the vertical guide rail is provided with a first limiting structure and a second limiting structure, and the vertical sliding block is positioned between the first limiting structure and the second limiting structure.
In one embodiment, the thimble unit further includes a spring, and two ends of the spring are respectively connected to the two bases.
In one embodiment, the first driving device further comprises a screw rod and a driving device connected with the screw rod, and the two bases are respectively in threaded connection with the screw rod;
the screw rod is used for rotating under the driving of the driving device so as to drive the two bases to move in the opposite direction or in the back direction.
In one embodiment, the thimble unit further includes a sleeve, the elastic sheet and the first driving device are disposed inside the sleeve, and an opening corresponding to the position of the elastic sheet is formed at the top of the sleeve.
In a second aspect, in an embodiment, the present invention provides a chip peeling and picking apparatus, including the above thimble unit; also includes a pickup unit; the pick-up unit is used for adsorbing the chip carried by the thimble unit and peeling the chip from the back film.
In one embodiment, the picking unit comprises an adsorption device, a plurality of vacuum air pipes and a plurality of air pumping devices which are connected in sequence, wherein a plurality of vacuum air holes which penetrate through the adsorption device are formed in the adsorption device, each vacuum air pipe is communicated with at least one vacuum air hole, and each air pumping device is communicated with at least one vacuum air pipe.
In one embodiment, the suction device comprises a sleeve and a suction nozzle, wherein a plurality of through air pipe channels are formed in the sleeve, a plurality of through vacuum air holes are formed in the suction nozzle, and the vacuum air pipes penetrate through the air pipe channels and are communicated with the vacuum air holes.
In a third aspect, in an embodiment, the present invention provides a chip peeling and picking method using the above chip peeling and picking apparatus, including:
step S1, controlling the elastic sheet to bulge upwards so as to jack up the chip, and enabling the back film and the chip to start to be peeled off from the edge;
and step S2, controlling the pick-up unit to adsorb the chip, completely separating the chip from the back film, and finishing the stripping.
In one embodiment, step S2 includes:
step S21, after the edge of the chip is peeled off to a certain degree, controlling the pick-up unit to contact and adsorb the central area of the upper surface of the chip in a bending state;
and step S22, controlling the elastic sheet and the pick-up unit to perform a back-to-back movement, so that the back film and the central area of the chip start to peel off, and simultaneously the pick-up unit gradually adsorbs the edge area of the chip.
In one embodiment, before step S1, the method further includes:
and S0, controlling the elastic sheet to move upwards by a second preset height so that at least one part of area of the elastic sheet is contacted with the back film.
According to the thimble unit, the chip stripping and picking device and the chip stripping and picking method, the elastic sheet is innovatively used as a core component of the thimble unit, the two ends of the elastic sheet are controlled to move relatively through the first driving device, so that the elastic sheet can be upwards protruded due to extrusion to jack up the chip to realize stripping, and the stripping process depends on the protrusion of the elastic sheet, and the protrusion of the elastic sheet is a gradually changing process, so that the method is very soft for stripping the chip, is very suitable for a thin flexible chip and cannot cause cracking. The bulge of the elastic sheet is clamped by the two ends of the elastic sheet, so that the elastic sheet is different from a film inflation mode, the material of the film is not required to be considered, an inflation control method is not required to be considered, the operation is easier, and the reliability is higher.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
FIG. 1 is a schematic structural view of a thimble unit according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a pickup unit according to an embodiment of the present invention;
FIG. 3 is a schematic view of the bottom of the suction nozzle in an embodiment of the present invention;
FIG. 4 is a schematic view of a wafer being placed on the ejector pin unit according to an embodiment of the present invention;
FIG. 5 is a schematic view of a wafer raised by protrusions formed on an elastic sheet according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a pick-up unit just adsorbing a flexible chip according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a pickup unit completely adsorbing a flexible chip according to an embodiment of the present invention.
In the above drawings: 100. a thimble unit; 1. an elastic sheet; 11. a bending section; 2. a base; 21. a fixed part; 22. a sliding part; 31. a horizontal guide rail; 32. a vertical guide rail; 321. a first limit structure; 322. a second limit structure; 4. a vertical slide block; 5. a connecting rod; 6. a spring; 7. a sleeve; 71. an opening; 200. a pickup unit; 8. an adsorption device; 81. a sleeve; 811. a large diameter portion; 812. a small diameter part; 813. a seal ring; 82. a suction nozzle; 821. vacuum air holes; 9. a vacuum gas pipe; 10. a wafer; 101. a chip; 102. a back film.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In a first aspect, as shown in FIG. 1, in one embodiment, the present invention provides a thimble unit 100; comprises an elastic sheet 1 and a first driving device connected with the elastic sheet 1; the power supply is used for supplying power to the first driving device;
the first driving device is used for controlling two ends of the elastic sheet 1 to move oppositely, so that the elastic sheet 1 protrudes upwards; the elastic pieces 1 have been configured to bend upwards when moved towards each other by the first drive means; the thimble unit 100 is used for carrying the chip and assisting the chip to peel off from the back film.
The elastic sheet 1 can be made of a stainless steel cold-rolled steel strip, has good elasticity and strength, and is suitable for being used as an ejector pin in the embodiment. The size of the elastic sheet 1 can be customized by combining the size of a chip to be peeled, for example, the length of the elastic sheet 1 can be set to be 3.5 to 4 times of the length of the chip, and the length of a corresponding protrusion which can be generated is 2.5 to 3 times of the length of the chip, wherein the length is determined according to the variation trend of the length of the elastic sheet 1 and the height of the protrusion in the protrusion process, so that the chip can be well jacked up to realize peeling; the width of the elastic sheet 1 may be set to 0.8 to 0.9 times the chip width, and the width of the elastic sheet 1 is slightly smaller than the chip width so as not to affect other chips in the vicinity of a certain chip when the chip is subjected to lift-off. In other embodiments, the elastic sheet 1 may also be made of plastic, rubber, etc.
The specific form of the first driving device may be many as long as the two ends of the elastic sheet 1 can move in opposite directions, for example, the scissor driving device controls the stretching and compressing of the scissor structure to realize the two ends of the elastic sheet 1 move in opposite directions or move back to back; for example, through the cylinder driving device, the two ends of the elastic sheet 1 move in opposite directions or move back to back through the expansion of the cylinder output shaft; in addition, the screw rod and the thread can be matched, and the embodiment is not limited. And the first driving means may act on both ends of the elastic sheet 1 at the same time, or of course, may act on one end and fix the other end.
The reason why the elastic sheet 1 is configured to bend upward when moving toward each other means that the elastic sheet 1 has a pre-bending upward when moving toward each other, is to ensure that the elastic sheet 1 can only bulge upward when moving toward each other, and if the elastic sheet 1 is flat before moving toward each other, the elastic sheet may bulge upward or downward, so that the bulging process is not controllable.
Wherein, the power supply can be a single independent power supply and is directly connected with the first driving device; of course, the first driving device may also be connected to the external controller, and the external controller is powered by the independent power supply and is powered by the external controller as the power supply of the first driving device.
Through the thimble unit 100, the elastic sheet 1 is innovatively used as a core component of the thimble unit 100, and the relative movement of the two ends of the elastic sheet 1 is controlled by the first driving device, so that the elastic sheet 1 protrudes upwards due to extrusion to jack up the chip to realize stripping, and the stripping process depends on the protrusion of the elastic sheet 1, and the protrusion of the elastic sheet 1 is a gradually changing process, so that the stripping of the chip is very soft in the mode, and the thimble unit is very suitable for a thin flexible chip and cannot cause the situation of breakage. The bulge of the elastic sheet 1 is clamped by the two ends of the elastic sheet, is different from a film inflation mode, does not need to consider the material of the film and the inflation control method, and is easier to operate and higher in reliability.
As shown in fig. 1, in one embodiment, the elastic sheet 1 has a bent portion 11, and the bent portion 11 is used for being protruded upward so as to be fixed when the elastic sheet 1 moves toward each other.
The bending part 11 is arranged to realize upward pre-bending, so that the reliability is high, the cost is low, and other structures or devices are not needed.
In one embodiment, the ejector pin unit may further include a second driving device disposed below the elastic sheet, and the second driving device is configured to eject the elastic sheet upward by a first preset height before the elastic sheets are moved toward each other by the first driving device.
The purpose of pushing the elastic piece upward by the second driving device by a predetermined height is the same as the purpose of using the bent portion in the above embodiment, and both are to make the elastic piece have a pre-bending before moving in opposite directions. In addition, when the pre-bending is realized in this way, the elastic piece itself can slightly move towards each other due to the horizontal component of the upward force when the second driving device pushes the elastic piece upwards, so for the sake of clearer explanation and understanding, the time point when the second driving device starts to operate in the embodiment is only limited before the elastic piece moves towards each other through the action of the first driving device, and the opposite movement caused by the action of the second driving device is not considered.
As shown in fig. 1, in one embodiment, the first driving device includes two bases 2, and two ends of the elastic sheet 1 are respectively fixed on the two bases 2.
Wherein, the two ends of the elastic sheet 1 can be fixed on the base 2 through screws or bolts, and the two ends of the corresponding elastic sheet 1 are provided with drill holes.
The base 2 and the screw or bolt may be made of stainless steel.
The elastic sheet 1 is connected through the base 2, so that the disassembly and the maintenance are convenient.
As shown in fig. 1, in an embodiment, the first driving device further includes a horizontal guide rail 31, a vertical guide rail 32, a vertical slider 4, a connecting rod 5 and a driving device, the base 2 includes a fixed portion 21 and a sliding portion 22 that are fixedly connected, two ends of the elastic sheet 1 are respectively fixed on the two fixed portions 21, the two sliding portions 22 are sleeved on the horizontal guide rail 31, and the vertical slider 4 is sleeved on the vertical guide rail 32 and is respectively movably connected with the two sliding portions 22 through the connecting rod 5; the vertical sliding block 4 is also connected with a driving device and is used for moving up and down under the driving of the driving device so as to drive the two bases 2 to move towards or away from each other.
Here, the fixing portion 21 and the sliding portion 22 may be an integrated structure.
In the embodiment, a scissor drive device is adopted, and the vertical slide block 4 is lifted and lowered to drive the sliding parts 22 of the two bases 2 to move away from and close to each other, so that the elastic pieces 1 finally move back and forth and face to each other. The vertical sliding block 4 is connected with a driving device through a transmission rod, the driving device is arranged at the bottom, and the driving device comprises a motor assembly or an air cylinder assembly. The connecting rod 5 is hinged with the sliding part 22 of the base 2 and the vertical slider 4, respectively. Only one of the scissor drives is shown in fig. 1, but any other scissor drive may be used in other embodiments.
By adopting the scissor drive device in the embodiment, the drive equipment is arranged at the bottom, and the ejector pin unit 100 is generally arranged at the corresponding position of the chip mounter, so that the bottom drive mode is more suitable for the application scene of the chip mounter.
As shown in fig. 1, in one embodiment, the vertical guide rail 32 is further provided with a first limiting structure 321 and a second limiting structure 322, and the vertical sliding block 4 is located between the first limiting structure 321 and the second limiting structure 322.
Wherein, first limit structure 321 and second limit structure 322 are used for limiting the scope that vertical slider 4 can move on vertical guide rail 32 respectively, and according to the size pertinence of flexure strip 1 set up first limit structure 321 and second limit structure 322 and can control flexure strip 1 in a reasonable moving range at vertical guide rail 32 corresponding position to play the effect of protection flexure strip 1, avoid flexure strip 1 excessively or tensile, thereby lead to damaging. The first limiting structure 321 and the second limiting structure 322 can be provided with a buffer pad on one side facing the vertical sliding block 4, so as to protect the vertical sliding block 4 and the first limiting structure 321 and the second limiting structure 322.
The first limiting structure 321 and the second limiting structure 322 are integrated with the vertical guide rail 32, or may be separate structures.
In one embodiment, the thimble unit 100 further includes a spring 6, and both ends of the spring 6 are respectively connected to the two bases 2.
Of these, both ends of the specific spring 6 are connected to the fixing portions 21 of the two bases 2, respectively. The spring 6 has the same effect as the first limiting structure 321 and the second limiting structure 322 in the above embodiment, and can control the elastic sheet 1 within a reasonable moving range, so as to protect the elastic sheet 1 and prevent the elastic sheet 1 from being excessively bent or stretched, thereby causing damage. In addition, the spring 6 also has the function of enhancing the elastic performance of the elastic sheet 1, and can help the elastic sheet 1 to perform deformation recovery. The spring constant of the spring 6 needs to be designed in conjunction with the parameters of the elastic sheet 1. The material of the spring 6 may be 304 stainless steel.
In one embodiment, the first driving device further comprises a screw rod and a driving device connected with the screw rod, and the two bases are respectively in threaded connection with the screw rod;
the screw rod is used for rotating under the driving of the driving device so as to drive the two bases to move in the opposite direction or in the back direction.
The screw rod is provided with two sections of opposite threads which respectively correspond to the two bases, so that the two bases can move towards or away from each other when the screw rod rotates. One end of the screw rod can be fixedly connected with a motor transmission shaft to realize rotation, and other modes can be adopted.
Through the mode of lead screw, control accuracy is higher, simple structure.
As shown in fig. 1, in an embodiment, the thimble unit 100 further includes a sleeve 7, the elastic sheet 1 and the first driving device are disposed inside the sleeve 7, the top of the sleeve 7 has an opening 71, and the elastic sheet 1 protrudes upwards out of the sleeve 7 through the opening 71.
If the driving device is arranged outside the sleeve 7, a through hole for accommodating the transmission rod connected with the vertical sliding block 4 needs to be formed in the bottom of the sleeve 7, and a sealing structure is arranged at the through hole, so that the sleeve has a dustproof and antifouling protection effect.
In one embodiment, the inner wall of the sleeve 7 may further be provided with a sliding slot, and both ends of the horizontal rail 31 are located in the sliding slot, so that the thimble unit 100 can integrally move up and down.
The elastic sheet 1 and the first driving device can be shielded by the sleeve 7, so that excessive dust and sundries are prevented from entering, and the performance is influenced.
In a second aspect, as shown in fig. 2 and 3, in one embodiment, the present invention provides a chip peeling and picking apparatus, including any one of the thimble units 100 described above; further comprises a pick-up unit 200; the pick-up unit 200 is used for adsorbing the chip carried by the thimble unit 100 and peeling the chip from the back film.
Through the chip stripping and picking device, the elastic sheet 1 is innovatively used as a core component of the thimble unit 100, and the first driving device controls the two ends of the elastic sheet 1 to move relatively, so that the elastic sheet 1 protrudes upwards to jack up the chip to be stripped due to extrusion, and the stripping process depends on the protrusion of the elastic sheet 1, and the protrusion of the elastic sheet 1 is a gradually changing process, so that the mode is very soft for stripping the chip, is very suitable for a thin flexible chip, and cannot cause the situation of breakage. The bulge of the elastic sheet 1 is clamped by the two ends of the elastic sheet, is different from a film inflation mode, does not need to consider the material of the film and the inflation control method, and is easier to operate and higher in reliability.
As shown in fig. 2 and 3, in one embodiment, the pick-up unit 200 includes an adsorption device 8, a plurality of vacuum air pipes 9, and a plurality of air pumping devices, wherein a plurality of vacuum air holes 821 are formed in the adsorption device 8, each vacuum air pipe 9 is communicated with at least one vacuum air hole 821, and each air pumping device is communicated with at least one vacuum air pipe 9.
The picking unit 200 is mainly used for adsorbing a chip so as to transfer the chip, when the vacuum hole 821 is in contact with the surface of the chip to form a closed space, the air pumping device pumps out air in the corresponding vacuum air pipe 9 and the vacuum air hole 821 to form negative pressure, and the chip is pressed on the adsorption device 8 by atmospheric pressure to realize adsorption, so that the chip is picked up and transferred.
Wherein, owing to be equipped with a plurality of air exhaust devices to every air exhaust device and corresponding vacuum trachea 9 intercommunication, and every vacuum trachea 9 communicates with corresponding vacuum gas pocket 821 again for vacuum gas pocket 821 is divided into the multiunit, and every group all has independent adsorption efficiency, also can have adsorption efficiency when the chip that is in the bending state is very little with adsorption equipment 8 area of contact, and the reliability is high.
In one embodiment, the vacuum air holes, the vacuum air pipes and the air exhaust devices are in one-to-one correspondence, so that each vacuum air hole has independent adsorption capacity.
As shown in fig. 2 and 3, in one embodiment, the suction device 8 includes a sleeve 81 and a suction nozzle 82, the sleeve 81 has a plurality of through air passages, the suction nozzle 82 has a plurality of through vacuum holes 821, and the vacuum air pipe 9 passes through the air passages and communicates with the vacuum holes 821.
The sleeve 81 is mainly used for binding the vacuum air tube 9, so that the vacuum air tube 9 and the vacuum air hole 821 can be connected more stably.
The air pipe channels may correspond to the vacuum air pipes 9 one by one, or one air pipe channel may accommodate a plurality of vacuum air pipes 9.
As shown in fig. 2, in one embodiment, the sleeve 81 of the suction device 8 includes a large diameter portion 811 connected to the vacuum pipe 9, and a small diameter portion 812 connected to the large diameter portion 811, and a seal 813 is provided on the small diameter portion 812 at a position close to the large diameter portion 811. The packing 813 contacts both the small diameter portion 812 and the large diameter portion 811.
The large diameter portion 811 and the small diameter portion 812 are formed with a diameter difference so as to be engaged with a corresponding mounting structure, and the mounting structure is generally an elastic snap. Sealing washer 813 is the rubber material, and sealing washer 813 is then for making the contact in the installation have the buffering, and the buckle process is safer, also makes adsorption equipment 8's installation more stable, and difficult emergence is rocked. In addition, the dust-proof purpose is achieved.
As shown in fig. 2 and 3, in one embodiment, the plurality of vacuum holes 821 are distributed in an array on the adsorption device 8, and the pattern of the plurality of vacuum holes 821 is a square. The array distribution is relatively uniform, and stable adsorption force can be provided for the chip. Of course, in other embodiments, the pattern formed by the plurality of vacuum holes 821 may also be rectangular, circular, etc., and may be designed according to the shape of the chip.
In one embodiment, the diameter of the vacuum vents is 0.5-1 mm.
In a third aspect, as shown in fig. 2, 3, 4, 5, 6 and 7, in one embodiment, the present invention provides a chip peeling and picking method using any one of the above chip peeling apparatuses, including:
as shown in fig. 4, the thimble unit 100 is mounted to a corresponding position; the wafer 10 is placed on the ejector pin unit 100, the wafer 10 includes a back film 102 and a chip 101 adhered to a surface of the back film 102, and the back film 102 faces the ejector pin unit 100.
In which the ejector pin unit 100 is mounted to a mount of a mounter so that the entire wafer 10 is placed on the mounter with the region to be peeled being aligned with the elastic sheet 1. The peeling and picking-up device of the chip is to separate the chip 101 and the back film 102.
As shown in fig. 5, the first driving device is activated to control the two ends of the elastic sheet 1 to move towards each other, so that the elastic sheet 1 protrudes upwards to jack up the wafer 10, and the back film 102 and the chip 101 start to peel off from the edge.
However, while the relative radius of the elastic sheet 1 is smaller and the height of the protrusion is higher and the back film 102 is deformed and bent, and the chip 101 is also bent, the elastic modulus of the back film 102 is greatly different from that of the chip 101, the elastic modulus of the chip 101 is larger than that of the back film 102, and the relative back film 102 is deformed and reduced, so that the chip 101 and the back film 102 are peeled off, and the deformation starts from the edge, and thus the peeling starts from the edge.
As shown in fig. 2, 3 and 6, after the edge of the chip 101 is peeled off to some extent, the pickup unit 200 is activated to control the suction device 8 to contact and suck the central region of the upper surface of the chip 101 in a bent state.
In the process, the thimble unit 100 and the pick-up unit 200 work simultaneously, so that the chip 101 and the adsorption device 8 move oppositely, after the adsorption device 8 is contacted with the chip 101, the adsorption device 8 can be controlled to stop at the current position, the elastic sheet 1 continuously protrudes upwards, the chip 101 is pressed against the adsorption device 8 and pressed to form a certain plane, and the central area of the chip 101 can be adsorbed. Of course, the suction device 8 and the chip 101 may be moved further toward each other, or the chip 101 may be stopped at the current position and the suction device 8 may be moved further downward. Since the vacuum holes 821 have independent suction capability, it is possible to have sufficient suction force to the central area of the chip 101, and since the chip 101 is deformed by the adhesive action of the back film 102 during the upward protrusion of the elastic sheet 1 and the edge is bent downward, only the central area is first contacted with the suction means 8.
As shown in fig. 2, 3 and 7, the elastic sheet 1 and the suction device 8 are controlled to perform a back-to-back movement so that the back film 102 and the center region of the chip 101 start to peel off while the suction device 8 gradually sucks the edge region of the chip 101.
In the above embodiment, the chip 101 and the back film 102 have been peeled off at the edge, and the central region of the chip 101 is sucked, and the central region of the chip has not been peeled off at this time, so in this embodiment, the elastic sheet 1 and the suction device 8 are controlled to perform the backward movement, and the peeling of the central region of the chip 101 is realized by the suction force of the suction device 8. Specifically, the elastic sheet 1 can be moved downward, the adsorption device 8 is moved upward, the chip 101 is subjected to a pulling force of the back film 102 (the generation of the pulling force depends on the downward movement of the back film 102 and the upward movement of the adsorption device 8, the magnitude of the pulling force is determined by the adhesive between the back film 102 and the chip 101), the adsorption force of the adsorption device 8 is greater than the pulling force, and the pulling force is gradually reduced, so that the central area of the chip 101 is peeled off. The elastic sheet 1 can be stopped at the current position, and the adsorption device 8 moves upwards; or the adsorption device 8 stops at the current position, and the elastic piece 1 moves downwards; the specific principle is the same as the above-mentioned downward movement of the elastic sheet 1, and the upward movement of the adsorption device 8 is basically the same, which is not described herein again.
In the peeling process of the central region, the chip 101 is gradually peeled from the back film 102, the chip 101 is gradually flattened, the contact area between the suction device 8 and the chip 101 is gradually increased, and the suction degree is increased until the chip is completely peeled and completely sucked.
According to the chip peeling and picking method, the elastic sheet 1 is innovatively used as a core component of the thimble unit 100, the first driving device controls the two ends of the elastic sheet 1 to move relatively, so that the elastic sheet 1 protrudes upwards to jack up the chip 101 to realize peeling due to extrusion, and the peeling process depends on the protrusion of the elastic sheet 1, and the protrusion of the elastic sheet 1 is a gradually changing process, so that the method is very soft for peeling the chip 101, is very suitable for thin flexible chips, and cannot cause cracking. The bulge of the elastic sheet 1 is clamped by the two ends of the elastic sheet, is different from a film inflation mode, does not need to consider the material of the film and the inflation control method, and is easier to operate and higher in reliability.
In one embodiment, before the step of controlling the two ends of the elastic sheet 1 to move towards each other by activating the first driving device, the method further comprises:
the elastic sheet 1 is controlled to move upwards by a second preset height, so that at least one part of the area of the elastic sheet 1 is in contact with the back film 102.
In the embodiment, in consideration of the problem of parameters of the elastic sheet 1, the protrusion degree may be insufficient, and the elastic sheet 1 has a certain distance from the back film 102, so that complete peeling cannot be achieved, so that the thimble unit 100 may be moved upward by a preset height, so that the elastic sheet 1 contacts with the back film 102 in advance, and at this time, the elastic sheet 1 can be ejected to the back film 102 as long as the elastic sheet 1 starts to protrude upward, and the elastic sheet 1 does not need to protrude to a certain height before being ejected to the back film 102.
In this case, the thimble unit 100 needs to move upward as a whole, for example, in the above-mentioned embodiment with the sleeve 7, in this embodiment, the areas where the horizontal rail 31, the vertical rail 32, etc. need to contact with the sleeve 7 are movable, for example, the two ends of the horizontal rail 31 are located in the sliding grooves on the sleeve 7, and such a design may enable the thimble unit 100 to move upward as a whole.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (14)

1. A thimble unit is characterized by comprising an elastic sheet and a first driving device connected with the elastic sheet; the power supply is used for supplying power to the first driving device;
the first driving device is used for controlling two ends of the elastic sheet to move oppositely, so that the elastic sheet protrudes upwards; the elastic pieces have been configured to bend upwards when moved towards each other by the first drive means; the thimble unit is used for bearing a chip and assisting in peeling the chip and the back film.
2. The ejector pin unit according to claim 1, wherein said elastic piece has a bent portion bent upward;
or the elastic piece ejection device further comprises a second driving device arranged below the elastic piece, and the second driving device is used for ejecting the elastic piece upwards by a first preset height before the elastic piece moves oppositely under the action of the first driving device.
3. The needle unit of claim 1, wherein said first driving means comprises two bases, and both ends of said elastic piece are fixed to said two bases, respectively.
4. The ejector pin unit according to claim 3, wherein the first driving device further comprises a horizontal guide rail, a vertical slider, a connecting rod and a driving device, the two bases are sleeved on the horizontal guide rail, the vertical slider is sleeved on the vertical guide rail and is movably connected with the two bases through the connecting rod respectively; the vertical sliding block is further connected with the driving device and used for moving up and down under the driving of the driving device so as to drive the two bases to move towards or away from each other.
5. The needle unit of claim 4, wherein said vertical rail is provided with a first stop structure and a second stop structure, and said vertical slider is located between said first stop structure and said second stop structure.
6. The needle unit of claim 3, further comprising a spring, wherein two ends of the spring are connected to the two bases, respectively.
7. The needle unit of claim 3, wherein said first driving means further comprises a screw and a driving device connected to said screw, said two bases being respectively screw-connected to said screw;
the screw rod is used for rotating under the driving of the driving device so as to drive the two bases to move oppositely or reversely.
8. The needle unit of claim 1, further comprising a sleeve, wherein said elastic sheet and said first driving means are disposed inside said sleeve, and an opening corresponding to the position of said elastic sheet is formed at the top of said sleeve.
9. A chip peeling and picking apparatus comprising the ejector pin unit according to any one of claims 1 to 8; also includes a pickup unit; the picking unit is used for adsorbing the chip carried by the thimble unit and peeling the chip from the back film.
10. The chip peeling and picking apparatus according to claim 9, wherein the picking unit comprises an adsorption device, a plurality of vacuum air pipes, and a plurality of air suction devices connected in sequence, the adsorption device has a plurality of vacuum air holes formed therein, each vacuum air pipe is communicated with at least one vacuum air hole, and each air suction device is communicated with at least one vacuum air pipe.
11. The chip peeling and picking apparatus as claimed in claim 10, wherein the suction device comprises a sleeve and a suction nozzle, the sleeve has a plurality of air duct passages formed therein, the suction nozzle has a plurality of vacuum air holes formed therein, and the vacuum air duct passes through the air duct passages and communicates with the vacuum air holes.
12. A chip peeling pick-up method using the chip peeling pick-up apparatus according to any one of claims 9 to 11, comprising:
step S1, controlling the elastic sheet to bulge upwards so as to jack up the chip, and enabling the back film and the chip to start to peel from the edge of the chip;
and step S2, controlling the pickup unit to absorb the chip, completely separating the chip from the back film, and finishing the peeling.
13. The chip detachment pickup method according to claim 12, wherein the step S2 includes:
step S21, after the edge of the chip is peeled off to a certain extent, controlling the pickup unit to contact and adsorb with the central area of the upper surface of the chip in a bent state;
and step S22, controlling the elastic sheet and the pick-up unit to move back to back, so that the back film and the central area of the chip start to peel off, and simultaneously the pick-up unit gradually adsorbs the edge area of the chip.
14. The chip detachment pickup method according to claim 12, further comprising, before said step S1:
and S0, controlling the elastic sheet to move upwards by a second preset height so that at least one part of area of the elastic sheet is in contact with the back film.
CN202110291111.2A 2021-03-18 2021-03-18 Thimble unit, chip stripping and picking device and chip stripping and picking method Pending CN113066754A (en)

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Application Number Priority Date Filing Date Title
CN202110291111.2A CN113066754A (en) 2021-03-18 2021-03-18 Thimble unit, chip stripping and picking device and chip stripping and picking method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110291111.2A CN113066754A (en) 2021-03-18 2021-03-18 Thimble unit, chip stripping and picking device and chip stripping and picking method

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115072369A (en) * 2022-06-28 2022-09-20 深圳市华星光电半导体显示技术有限公司 Transport module and film forming apparatus
CN115295476A (en) * 2022-10-08 2022-11-04 四川洪芯微科技有限公司 Chip demoulding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115072369A (en) * 2022-06-28 2022-09-20 深圳市华星光电半导体显示技术有限公司 Transport module and film forming apparatus
CN115295476A (en) * 2022-10-08 2022-11-04 四川洪芯微科技有限公司 Chip demoulding device
CN115295476B (en) * 2022-10-08 2023-01-10 四川洪芯微科技有限公司 Chip demoulding device

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