CN113066736A - High-precision, large-breadth and high-throughput six-dimensional wafer detection system - Google Patents
High-precision, large-breadth and high-throughput six-dimensional wafer detection system Download PDFInfo
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- CN113066736A CN113066736A CN202110319386.2A CN202110319386A CN113066736A CN 113066736 A CN113066736 A CN 113066736A CN 202110319386 A CN202110319386 A CN 202110319386A CN 113066736 A CN113066736 A CN 113066736A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G06T7/90—Determination of colour characteristics
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- H04N5/00—Details of television systems
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- H—ELECTRICITY
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- H04N5/222—Studio circuitry; Studio devices; Studio equipment
- H04N5/262—Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
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- G06T2207/10024—Color image
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- G—PHYSICS
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- G06T2207/10028—Range image; Depth image; 3D point clouds
Abstract
The invention discloses a high-precision, large-breadth and high-flux six-dimensional wafer detection system which comprises a 2D color camera, a 3D depth sensor, an industrial light source, an X-axis grating ruler, a Y-axis grating ruler, an X-axis linear motor, a Y-axis linear motor, a PC (personal computer), a motion controller, a silicon wafer, an X-axis magnetic suspension guide rail, a Y-axis magnetic suspension guide rail, a scanning platform and a fixing device. In the aspect of 2D color image acquisition, a linear array camera is used for focusing, single-point small-hole imaging and pixel-by-pixel scanning imaging are carried out, so that the 2D color images are connected in a seamless mode in a full range; in the aspect of 3D depth image acquisition, the depth information is acquired by utilizing the spectrum confocal principle, and even if the surface is inclined or warped, the depth of the object can be measured, so that the surface texture depth information of the complex object can be acquired. The 2D scanning fineness is greatly improved, the adjacent pixel crosstalk is reduced to the maximum extent, the problem of splicing of large-format image splicing is solved, and finally, a high-precision, high-flux and large-format color image is obtained.
Description
Technical Field
The invention relates to the field of scanning detection, in particular to a high-precision, large-breadth and high-throughput six-dimensional wafer detection system.
Background
The 2D topography measuring technology on the surface of the silicon wafer mainly comprises the following steps: (1) visual detection, wherein human eyes detect the characteristics of color, flatness, size and the like of the surface of the silicon wafer, and the method is simple and easy to implement, but has low accuracy and low efficiency; (2) and optical imaging, namely obtaining a 2D color image on the surface of the silicon wafer through the motion of a precision instrument platform, a CCD/CMOS image acquisition device and a digital image processing technology. The advantages are high efficiency and high stability, but the field of view and accuracy are in contradiction, which negates the trade-off.
The 3D topography measuring technology on the surface of the silicon wafer mainly comprises the following steps: (1) the mechanical/optical probe type measuring method utilizes a mechanical probe/focused light beam to contact the surface to be measured, when the probe moves along the surface of a wafer, the movement amount of the probe and the vertical displacement of the probe are combined into a 3D profile, the measurement has higher accuracy, but a measuring head is contacted with the measured object, so the measured object can be scratched; (2) optical scanning microscopy, scanning probe microscopy, is the measurement by probing the various interactions that exist between a sample and a probe, such as Scanning Tunneling Microscopy (STM) and Atomic Force Microscopy (AFM). The method has the characteristics that the damage to the measured object in the measuring process can be avoided, the acquisition speed is greatly improved, and the defects that the measuring range is small and the full breadth of the wafer cannot be covered are overcome.
Therefore, how to efficiently and stably obtain a large-area high-quality color image and a large-area high-quality depth image of the surface of a silicon wafer is a problem to be solved by those skilled in the art.
Disclosure of Invention
The invention provides a high-precision, large-format and high-throughput six-dimensional wafer detection system aiming at the surface defect detection of silicon wafers, so as to stably and accurately acquire high-resolution 2D color data and 3D appearance depth data of the surfaces of the large-format silicon wafers.
In order to realize the task, the invention adopts the following technical scheme:
the utility model provides a six dimension wafer detecting system of high accuracy, big breadth and high flux, includes 2D color camera, 3D depth sensor, industrial light source, X axle grating chi, Y axle grating chi, X axle linear electric motor, Y axle linear electric motor, PC, motion control ware, silicon wafer, X axle magnetic suspension guide rail, Y axle magnetic suspension guide rail, scanning platform and fixing device, wherein:
the upper surface of the scanning platform is a plane, a scanned silicon wafer is placed on the scanning platform, the 2D color camera and the 3D depth sensor are arranged in parallel and fixed on the Y-axis magnetic suspension guide rail through the mounting frame, and an industrial light source is connected to a lens of the 2D color camera; the middle point of the linear array of the 2D color camera and the acquisition point of the 3D depth sensor are configured on the same horizontal line, and data acquired by the 2D color camera and the 3D depth sensor are transmitted to the PC for subsequent processing;
the X-axis magnetic suspension guide rails are arranged on two sides of the scanning platform in parallel, the Y-axis magnetic suspension guide rails are arranged above the scanning platform in parallel, and two ends of the Y-axis magnetic suspension guide rails are assembled on the X-axis magnetic suspension guide rails through a pair of sliding frames;
the Y-axis linear motor drives the Y-axis magnetic suspension guide rail to drive the 2D color camera and the 3D depth sensor to move on the X-axis magnetic suspension guide rail, the X-axis linear motor drives the mounting frame which bears the 2D color camera and the 3D depth sensor to move on the X-axis magnetic suspension guide rail, and the X-axis grating ruler and the Y-axis grating ruler are respectively arranged on the X-axis magnetic suspension guide rail and one side of the Y-axis magnetic suspension guide rail and used for detecting the positions of the 2D color camera and the 3D depth sensor; the X-axis linear motor and the Y-axis linear motor are connected with a motion controller, and the motion controller is controlled by the PC.
Further, the 2D color camera uses an adjustable diaphragm lens for pinhole imaging and light beam intensity adjustment; in the acquisition process, the 2D color camera is used for full-pixel focusing, pixel-by-pixel point single-point small-hole imaging scanning, and the 2D color camera and the 3D depth sensor are synchronously controlled.
Further, when the detection system works, the motion controller monitors the position of a composite probe composed of the 2D color camera and the 3D depth sensor in real time through the X-axis grating ruler and the Y-axis grating ruler; the method comprises the steps that a composite probe acquires data from left to right in unidirectional scanning, when an X-axis linear motor drives the composite probe to move to reach a preset scanning left boundary, a motion controller simultaneously sends an external trigger high level to an acquisition card and a 3D depth sensor of a 2D color camera, and after the acquisition card and the 3D depth sensor of the 2D color camera receive the external trigger high level, the acquisition card and the 3D depth sensor of the 2D color camera acquire 2D and 3D data pixel by pixel on the surface of a measured object at an acquisition frequency corresponding to preset scanning precision; after scanning for a certain time, the composite probe moves to the right scanning boundary, the external trigger high level is reversely arranged at the moment, the 2D color camera and the 3D depth sensor stop collecting work at the same time, the Y-axis linear motor drives the Y-axis magnetic suspension guide rail to drive the composite probe to move to the left side of the next line, and therefore the scanning collecting work of each line is circularly carried out.
Further, for a high-resolution color image acquired by a 2D color camera and a depth image acquired by a 3D depth sensor, the high-resolution color image is converted into an HSV space, then the depth image is normalized and then is converted back into an RGB space after being fused with the lightness V in the HSV space, and a fused color image of 2D color and 3D depth information is obtained.
Further, in the aspect of 2D color image acquisition, a linear array camera is used for focusing, single-point small-hole imaging and pixel-by-pixel scanning imaging are carried out, so that full-width seamless connection of the 2D color images is realized;
in the aspect of 3D depth image acquisition, the depth information is acquired by using the spectrum confocal principle, and even if the surface is inclined or warped, the depth of the object can be measured under the condition that the normal angle is less than +/-24 degrees, so that the surface texture depth information of the complex object can be acquired.
Furthermore, the 2D color camera adopts a color line camera, the resolution ratio of the color line camera is 2048 multiplied by 3, the pixel size is 14.08 Mum multiplied by 14.08 Mum, 10-bit RGB data can be selectively acquired, and the sampling line speed can reach 70kHz at most.
Furthermore, the depth range of the 3D depth sensor is 3mm, the depth measurement precision is 0.75 mu m, the acquisition line rate can reach 10kHz, the depth measurement resolution is 36nm, and the maximum measurement inclination angle is +/-24 degrees.
Compared with the prior art, the invention has the following technical characteristics:
the invention provides an in-situ synchronous 2D color image-3D depth image combined acquisition scheme for the first time in the field, and realizes the synchronous control of a 2D camera and a 3D depth sensor in the data acquisition process; in the 2D color image acquisition process, a single-pixel-point small-hole imaging technology is used, the 2D color camera is used for realizing pixel-by-pixel scanning, on the premise of synchronously coordinating in-situ measurement with 3D confocal measurement, the 2D scanning fineness is greatly improved, adjacent pixel crosstalk is reduced to the maximum extent, the problem of splicing of large-format image splicing is solved, and finally, a high-precision, high-flux and large-format color image is obtained.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the detection system of the present invention;
FIG. 2 is a schematic diagram of a main interface of a scanning program according to an embodiment of the present invention;
FIG. 3 is a schematic view of a scanning process according to an embodiment of the present invention;
FIG. 4 is a color drawing of a 2D wafer acquired in accordance with an embodiment of the present invention;
FIG. 5 is a 3D wafer depth map acquired in one embodiment of the invention.
Detailed Description
Referring to fig. 1, the present invention provides a high-precision, large-format and high-throughput six-dimensional wafer detection system, which includes a 2D color camera 1, a 3D depth sensor 2, an industrial light source 3, an X-axis grating scale 4, a Y-axis grating scale 5, an X-axis linear motor 6, a Y-axis linear motor 7, a PC 8, a motion controller 9, a silicon wafer 10, an X-axis magnetic suspension guide rail 11, a Y-axis magnetic suspension guide rail 12, a scanning platform 13 and a fixing device 14, wherein:
the upper surface of the scanning platform 13 is a plane, a scanned silicon wafer 10 is placed on the scanning platform 13, the 2D color camera 1 and the 3D depth sensor 2 are arranged in parallel and fixed on the Y-axis magnetic suspension guide rail 12 through the mounting frame 14, and the lens of the 2D color camera 1 is connected with the industrial light source 3; the middle point of the linear array of the 2D color camera 1 and the acquisition point of the 3D depth sensor 2 are configured on the same horizontal line, and data acquired by the 2D color camera 1 and the 3D depth sensor 2 are transmitted to the PC 8 for subsequent processing; the 2D color camera 1 uses an adjustable diaphragm lens and is used for pinhole imaging and light beam intensity adjustment; in the acquisition process, a 2D color camera 1 is used for focusing all pixels and scanning pixel-by-pixel point single-point pinhole imaging; the mounting frame 14 may be, for example, a clamp, a bracket, a bolt fastener, or the like.
The X-axis magnetic suspension guide rails 11 are arranged on two sides of the scanning platform 13 in parallel, the Y-axis magnetic suspension guide rails 12 are arranged above the scanning platform 13 in parallel, and two ends of the Y-axis magnetic suspension guide rails 11 are assembled on the X-axis magnetic suspension guide rails through a pair of sliding frames.
The Y-axis linear motor 7 drives the Y-axis magnetic suspension guide rail 12 to drive the 2D color camera 1 and the 3D depth sensor 2 to move on the X-axis magnetic suspension guide rail 11, the X-axis linear motor 6 drives the mounting frame 14 which bears the 2D color camera 1 and the 3D depth sensor 2 to move on the X-axis magnetic suspension guide rail 11, and the X-axis grating ruler 4 and the Y-axis grating ruler 5 are respectively arranged on the X-axis magnetic suspension guide rail 11 and one side of the Y-axis magnetic suspension guide rail and used for detecting the positions of the 2D color camera 1 and the 3D depth sensor; the X-axis linear motor 6 and the Y-axis linear motor 7 are connected with a motion controller 9, and the motion controller 9 is controlled by the PC 8.
The pixel-by-pixel scanning mode adopted in the scheme can realize the crosstalk of adjacent pixels as far as possible and realize the seamless scanning of images. Traditional scanning mode adopts line scanning, face scanning, because the reason of temperature, the process temperature of scanning changes, and camera temperature is low when beginning scanning, does not take place the distortion when scanning the pixel, but the temperature is overheated at the back for a period of time, can take place the distortion, can appear the piece problem. The scheme innovatively adopts pixel-by-pixel scanning to avoid the problem as far as possible, and is well suitable for the semiconductor wafer which needs high-precision scanning.
2D-3D synchronous scan acquisition control
When the detection system works, the PMAC multi-axis motion controller 9 monitors the position of a composite probe composed of the 2D color camera 1 and the 3D depth sensor 2 in real time through the X-axis grating ruler 4 and the Y-axis grating ruler 5; the composite probe acquires data from left to right (along the X-axis direction) in unidirectional scanning, when the X-axis linear motor 6 drives the composite probe to move to reach a preset scanning left boundary, the motion controller 9 sends an external trigger high level to the acquisition card of the 2D color camera 1 and the 3D depth sensor 2 at the same time, and after the acquisition card of the 2D color camera 1 and the 3D depth sensor 2 receive the external trigger high level, the acquisition controller acquires 2D and 3D data pixel by pixel on the surface of the object to be detected at an acquisition frequency corresponding to preset scanning accuracy; after scanning for a certain time, the composite probe moves to the right scanning boundary, the external trigger high level is reversely arranged at the moment, the 2D color camera 1 and the 3D depth sensor 2 stop collecting work at the same time, the Y-axis linear motor 7 drives the Y-axis magnetic suspension guide rail 12 to drive the composite probe to move to the left side of the next line, and therefore the scanning collecting work of each line is circularly carried out.
In the scheme, the 2D color camera 1 adopts a linear array camera, and the linear array midpoint of the 2D color camera 1 and the acquisition point of the 3D depth sensor 2 are strictly on the same horizontal line during system installation, so that the 2D color camera 1 and the 3D depth sensor 2 scan the same pixel row in the line-by-line scanning process, and the acquired pixel row image data is accurately matched from pixel points to pixel points through a subsequent image fusion algorithm.
Image fusion algorithm
And fusing high-resolution colors R (x, y), G (x, y), B (x, y) and depth z (x, y) with the same pixel and breadth size according to the brightness V of the color HSV space to form a new color fusion image with depth information.
Let the two-dimensional color image be R (x, y), G (x, y), B (x, y), and the three-dimensional depth image be z (x, y). The two-dimensional color image R, G, B is converted into H (x, y), S (x, y), V (x, y) of HSV chromaticity space.
Wherein, the hue H (hue) is measured by an angle and has a value range of 0-360 degrees; saturation s (saturation) represents the degree to which a color approaches a spectral color; lightness V (value) represents the degree of brightness of the color, and takes the value of [0, 1 ]. Calculation formula of RGB conversion HSV:
V＝max(R,G,B)
3D depth information normalization processing:
fusing the result after the 3D depth information normalization with the brightness V of HSV:
the new lightness Vn (x, y) of H (x, y), S (x, y) and fused depth information is then converted back to RGB space according to the following formula:
when H is more than or equal to 0 and less than 360, S is more than or equal to 0 and less than or equal to 1, and V is more than or equal to 0 and less than or equal to 1:
C＝V×S
X＝C×(1-|(H/60°)mod2-1|
m＝V-C
(R，G，B)＝((R′+m)×255，(G′+m)×255，(B′+m)×255)
the resulting color image Rn(x，y)，Gn(x，y)，Bn(x, y) is a fused color image of 2D color and 3D depth information.
FIG. 2 illustrates a main interface of a scanning program according to an embodiment of the present invention. Referring to the scanning flowchart of fig. 3, for one scanning process, the following operations are performed:
turning on a power main switch, placing a silicon wafer on a scanning platform, initializing a motor, then turning on a scanning program in a PC (personal computer), setting parameters such as file names, inputting parameters such as scanning length, scanning width, exposure rate, resolution ratio and the like, clicking a button to start scanning, waiting for the end of the scanning program, and processing data.
2D color image acquisition
According to the requirements of the overall system scheme, the selected 2D color camera 1 should have the following features: (1) high resolution, which is a necessary condition for achieving high-precision imaging; (2) large data throughput, which is required for real-time processing of image data; (3) high sampling frequency, adjustable exposure time and quick scanning.
In one embodiment of the invention, the 2D color camera 1 adopts a CMOS color line array camera of DALSA company P4-CC-02K04T-00-R, the resolution is 2048 multiplied by 3, the pixel size is 14.08 microns multiplied by 14.08 microns, 10-bit RGB data can be collected selectively, and the sampling line speed can reach 70kHz at most. The system uses an adjustable diaphragm lens for pinhole imaging and light beam intensity adjustment; the industrial light source 3 in the system adopts a dome LED light source, and light rays emitted by the LED are smoothly and uniformly irradiated on the surface of a measured object after being subjected to spherical diffuse reflection.
When the system works, the 2D color camera 1 scans and collects 2D color pixel data pixel by pixel through transverse movement in a single-point pinhole imaging mode; in the acquisition process, the 2D color linear array camera is used for full-pixel focusing and pixel-by-pixel point single-point small-hole imaging, the problem of pixel point deformation caused by uncertain temperature rise can be avoided, the problems of adjacent pixel crosstalk and image splicing seam splicing are reduced to the maximum extent, and a large-amplitude high-quality 30-bit RGB 2D color image is obtained.
3D depth image acquisition
In one embodiment of the invention, the 3D depth sensor 2 adopts a 3D depth sensor with the model of IFS2405 manufactured by Micro-Epsilon company, the depth range is 3mm, the depth measurement precision is 0.75 mu m, the acquisition linear rate can reach 10kHz, the depth measurement resolution is 36nm, and the maximum measurement inclination angle is +/-24 degrees.
When the system works, the 3D depth sensor emits a beam of polychromatic light with a wide spectrum from a light source, and the spectral dispersion is generated through a dispersion lens to form monochromatic light with different wavelengths; the focal point for each wavelength corresponds to a distance value. The measuring light is emitted to the surface of an object and reflected back, and only monochromatic light meeting the confocal condition can be sensed by the 3D depth sensor through the small hole. The distance value is obtained by calculating the wavelength of the sensed focal point and by conversion. The principle has the advantages that even if the measured object has inclination or warpage, the depth of the object can be measured with high precision, and a large-amplitude high-quality 3D depth image can be obtained.
As shown in fig. 4 and 5: with the wafer as the sample, fig. 4 is a 2D color sample map of 2000DPI scanned with the inventive system. Viewing the 2D image: the circuit structure is clear in the normal triode crystalline grain unit, the double-wiring column structure of the two sides of the central line is complete, and the two-dimensional structure of the triode crystalline grain unit is roughly composed of three parts: the black crystal grain unit frame on the outermost layer, an annular dark brown circuit inside the frame and white double-wiring columns on two sides of the central line. Compared with a normal crystal grain unit, a collapsed cavity can be observed in the central area of the damaged crystal grain unit, and the internal circuit structure of the damaged crystal grain unit is completely damaged; figure 5 is a 3D image of a 3D color sample image of 2000DPI scanned with the present system: the normal triode crystal grain unit has clear circuit structure, the double-wiring columns on two sides of the central line have complete structure and obvious protrusion, and the three-dimensional structure of the triode crystal grain unit also comprises an outer frame, a circuit and the double-wiring columns. Compared with the normal crystal grain unit, the damaged unit can observe a collapse cavity with a large depth in the central area, and the circuit and the wiring terminal structure of the damaged unit are obviously damaged. The pictures scanned by the scanner are clear, the detail effect is good, and the scanner can be widely applied to the wafer scanning in the industrial field.
The invention firstly provides a 2D-3D image acquisition scheme, realizes synchronous acquisition and in-situ image acquisition to obtain a high-flux and high-precision (R, G, B, X, Y and Z) six-dimensional image, and firstly realizes seamless, large-breadth and high-precision 30-bit 2D color images at home and abroad, and the technical indexes are advanced.
The scanning breadth is 500mm multiplied by 500mm, on the basis of the large breadth, the image resolution is 4000dpi at most, 4000 pixel points are collected at most in each inch of length, and finally high precision, large breadth and high flux are achieved. In the aspect of 2D color image acquisition, a linear array camera is used for focusing, single-point small-hole imaging and pixel-by-pixel scanning imaging are carried out, the problem of pixel point deformation caused by uncertain temperature rise is avoided, the problems of adjacent pixel crosstalk and image splicing seam splicing are reduced to the maximum extent, and the 2D color images are truly connected in a seamless mode in a full-width mode.
In the aspect of 3D depth image acquisition, a 3D depth sensor is selected, and depth information is acquired by utilizing the spectrum confocal principle. Even if the surface has inclination and warping, under the condition that the normal angle is less than +/-24 degrees, the depth measurement can be carried out on the object, and the surface texture depth information of the complex object can be obtained. The depth range can reach 3mm, the precision reaches the micron level, pixel point-by-pixel point scanning imaging is realized, and 3D image full breadth seamless connection is realized.
The above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.
Claims (7)
1. The utility model provides a six dimension wafer detecting system of high accuracy, big breadth and high flux, its characterized in that, including 2D color camera 1, 3D depth sensor (2), industrial light source (3), X axle grating chi (4), Y axle grating chi (5), X axle linear electric motor (6), Y axle linear electric motor (7), PC (8), motion control ware (9), silicon wafer (10), X axle magnetic suspension guide rail (11), Y axle magnetic suspension guide rail (12), scanning platform (13) and fixing device (14), wherein:
the upper surface of the scanning platform (13) is a plane, a scanned silicon wafer (10) is placed on the scanning platform (13), the 2D color camera (1) and the 3D depth sensor (2) are arranged in parallel and fixed on the Y-axis magnetic suspension guide rail (12) through the mounting frame (14), and an industrial light source (3) is connected to a lens of the 2D color camera (1); the linear array midpoint of the 2D color camera (1) and the acquisition point of the 3D depth sensor (2) are configured on the same horizontal line, and data acquired by the 2D color camera (1) and the 3D depth sensor (2) are transmitted to the PC (8) for subsequent processing;
the X-axis magnetic suspension guide rails (11) are arranged on two sides of the scanning platform (13) in parallel, the Y-axis magnetic suspension guide rails (12) are arranged above the scanning platform (13) in parallel, and two ends of the Y-axis magnetic suspension guide rails (11) are assembled on the X-axis magnetic suspension guide rails through a pair of sliding frames;
the Y-axis linear motor (7) drives the Y-axis magnetic suspension guide rail (12) to drive the 2D color camera (1) and the 3D depth sensor (2) to move on the X-axis magnetic suspension guide rail (11), the X-axis linear motor (6) drives an installation frame (14) bearing the 2D color camera (1) and the 3D depth sensor (2) to move on the X-axis magnetic suspension guide rail (11), and the X-axis grating ruler (4) and the Y-axis grating ruler (5) are respectively arranged on the X-axis magnetic suspension guide rail (11) and one side of the Y-axis magnetic suspension guide rail and used for detecting the positions of the 2D color camera (1) and the 3D depth sensor; the X-axis linear motor (6) and the Y-axis linear motor (7) are connected with a motion controller (9), and the motion controller (9) is controlled by the PC (8).
2. The high-precision, large-format and high-throughput six-dimensional wafer inspection system according to claim 1, wherein the 2D color camera (1) uses an adjustable diaphragm lens for pinhole imaging and adjusting the intensity of light beam; the acquisition process utilizes the full-pixel focusing of the 2D color camera (1), the single-point pinhole imaging scanning of pixel point by pixel point, and carries out synchronous control on the 2D color camera (1) and the 3D depth sensor (2).
3. The high-precision, large-format and high-throughput six-dimensional wafer inspection system according to claim 1, wherein when the inspection system is in operation, the motion controller (9) monitors the position of the composite probe composed of the 2D color camera (1) and the 3D depth sensor (2) in real time through the X-axis grating scale (4) and the Y-axis grating scale (5); the method comprises the steps that a composite probe acquires data from left to right in unidirectional scanning, when an X-axis linear motor (6) drives the composite probe to move to reach a preset scanning left boundary, a motion controller (9) sends an external trigger high level to an acquisition card and a 3D depth sensor (2) of a 2D color camera (1) at the same time, and after the acquisition card and the 3D depth sensor (2) of the 2D color camera (1) receive the external trigger high level, the acquisition device acquires 2D and 3D data pixel by pixel on the surface of a measured object at an acquisition frequency corresponding to preset scanning accuracy; after scanning for a certain time, the composite probe moves to the right scanning boundary, the external trigger high level is reversely arranged at the moment, the 2D color camera (1) and the 3D depth sensor (2) stop collecting work at the same time, the Y-axis linear motor (7) drives the Y-axis magnetic suspension guide rail (12) to drive the composite probe to move to the left side of the next line, and therefore the scanning collecting work of each line is circularly carried out.
4. The high-precision, large-format and high-throughput six-dimensional wafer inspection system according to claim 1, wherein for the high-resolution color image collected by the 2D color camera (1) and the depth image collected by the 3D depth sensor (2), the high-resolution color image is first converted into HSV space, then the depth image is normalized, and after being fused with the brightness V in HSV space, the depth image is converted back into RGB space, so as to obtain a fused color image of 2D color and 3D depth information.
5. The high-precision, large-format and high-throughput six-dimensional wafer inspection system according to claim 1, wherein in 2D color image acquisition, the 2D color images are seamlessly connected in full-format by focusing with a line camera, single-point pinhole imaging, and pixel-by-pixel scanning imaging;
in the aspect of 3D depth image acquisition, the depth information is acquired by using the spectrum confocal principle, and even if the surface is inclined or warped, the depth of the object can be measured under the condition that the normal angle is less than +/-24 degrees, so that the surface texture depth information of the complex object can be acquired.
6. The high-precision, large-format and high-throughput six-dimensional wafer inspection system according to claim 1, wherein the 2D color camera (1) is a color line camera, the resolution of the color line camera is 2048 × 3, the pixel size is 14.08 μm × 14.08 μm, 10-bit rgb data can be selectively collected, and the sampling line speed can reach 70kHz at most.
7. The high-precision, large-format and high-throughput six-dimensional wafer inspection system according to claim 1, wherein the depth range of the 3D depth sensor (2) is 3mm, the depth measurement precision is 0.75 μm, the acquisition line rate can reach 10kHz, the depth measurement resolution is 36nm, and the maximum measurement tilt angle is ± 24 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110319386.2A CN113066736B (en) | 2021-03-25 | 2021-03-25 | High-precision, large-breadth and high-throughput six-dimensional wafer detection system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110319386.2A CN113066736B (en) | 2021-03-25 | 2021-03-25 | High-precision, large-breadth and high-throughput six-dimensional wafer detection system |
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| CN113066736A true CN113066736A (en) | 2021-07-02 |
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