CN113061846A

CN113061846A - Vacuum coating device

Info

Publication number: CN113061846A
Application number: CN202110280645.5A
Authority: CN
Inventors: 刘玉东; 童明伟; 郭智宏; 胡鹏; 王惠敏
Original assignee: Chongqing University
Current assignee: Chongqing University
Priority date: 2021-03-16
Filing date: 2021-03-16
Publication date: 2021-07-02

Abstract

The invention relates to a vacuum coating device, which belongs to the field of semiconductor devices and comprises a vacuum cover 1, a coating supporting sheet 2, an insulating rod 3, a chassis bracket 4, a direct current positive electrode 5, a direct current negative electrode 6, an electric furnace 7, a pincer pot 8, an electric furnace lead-out line 9, a vacuum-pumping valve 10, a vacuum pump 11, a vacuum meter valve 12, a vacuum meter 13, a chassis 14, a sealing washer 15 and an object to be coated 16. If the object 16 to be plated is to be plated on the surface of the object on the film-plating supporting sheet 2, the electric furnace 7 and the pincer-pot 8 are placed on the chassis 14, then the object 16 to be plated is chipped and placed in the pincer-pot 8, then the vacuum cover 1 is covered on the chassis 14, then the vacuum pump 11 is started for vacuumizing, when the vacuum degree in the vacuum cover 1 reaches below 100Pa, the electric furnace 7 is powered on to heat the object 16 to be plated in the pincer-pot 8, and simultaneously the positive current positive electrode 5 and the negative current negative electrode 6 are started to enable the object 16 to be plated to be in a negative pole and the surface of the object on the film-plating supporting sheet 2 to be in a positive pole, so that the vapor molecules of the object 16 to be plated in the vacuum cover 1 with negative electricity can be attached to the surface of the object on the film.

Description

Vacuum coating device

The technical field is as follows:

the invention relates to a vacuum coating device, belonging to the field of semiconductor devices,

background art:

the thermocouple is made by spot welding two different metals, the diameter of the metal system determines the size of the temperature sensing head, and the temperature point of the miniature thermocouple made by the existing process is also larger than 0.5 mm. And the semiconductor device formed by combining the P-type and T-type materials for manufacturing the semiconductor is more than 1 mm. Thus, temperature control and measurement in a line located in a stratified layer are very difficult.

The invention content is as follows:

in order to make up for the defects in the prior art, the invention provides the vacuum coating device, which can layer a plurality of materials in a vacuum chamber to the thickness of a molecular set. The invention adopts a vacuum cover 1, a coating supporting sheet 2, an insulating rod 3, a chassis bracket 4, a direct current positive electrode 5, a direct current negative electrode 6, an electric furnace 7, a pincer pot 8, an electric furnace lead-out wire 9, a vacuum pumping valve 10, a vacuum pump 11, a vacuum meter valve 12, a vacuum meter 13, a chassis 14, a sealing washer 15, a vacuum tube 16 and an object to be coated 17. When the object 17 to be plated is to be plated on the surface of the object on the film-plating supporting sheet 2, the electric furnace 7 and the crucible 8 are sequentially placed on the base plate 14, the object 17 to be plated is placed in the crucible 8, and then the vacuum cover 1 is covered on the base plate 14. After a power source is led out and a line 9 is energized, the vacuum pump 11 is turned on to evacuate the vacuum housing 1. When the pressure in the vacuum cover 1 reaches below 100Pa, power is supplied to the electric furnace 7 to heat the crucible 8, then the direct current positive electrode 5 and the direct current negative electrode 6 are opened, the object to be plated 17 is heated and gasified, and the molecules of the object to be plated 17 suspended in the vacuum cover 1 are electronegative. This gradually sinks towards the positively charged support sheet 2. When the deposition layer reaches a certain thickness, the power supply is stopped, the vacuum cover 1 is opened, another object to be plated 17 is filled in the pincer pot 8, and the above procedures are repeated, so that another layer of vapor molecules of the object to be plated 17 can be plated on the surface of the plated film. Thus, the ultra-micro thermocouple or ultra-thin semiconductor refrigerating sheet can be obtained.

Description of the drawings:

FIG. 1 is a structural view of a vacuum coater.

Wherein: 1-vacuum cover, 2-coating supporting piece, 3-insulating rod, 4-chassis support, 5-DC positive electrode, 6-DC negative electrode, 7-electric furnace, 8-pincer pot, 9-electric furnace leading-out wire, 10-vacuum-pumping valve, 11-vacuum pump, 12-vacuum meter valve, 13-vacuum meter 13, 14-chassis, 15-sealing washer, 16-vacuum tube,

17- -object to be plated.

The specific implementation mode is as follows:

fig. 1 also shows a coater for manufacturing the semiconductor chilling plate. The vacuum cover 1 is a capping container which is made of graphite glass and has the diameter of 300mm, the wall thickness of 5mm and the height of 300mm, and the circumference of the bottom is smooth and flat. The silicon rubber gasket is reversely buckled in a phi 300/phi 288 and a 5mm deep annular groove on a stainless steel chassis 14 with phi 400 and a 15mm wall thickness, and a phi 300/phi 288 silicon rubber-sealing gasket 15 with a thickness of 2mm is arranged between the two. An electric furnace 7 of 350W is arranged in the middle of the base plate, and a clamp pot 8 is arranged on the electric furnace. The tail end of a vacuum tube 16 with the diameter phi 10 is fixedly connected with the vacuum pumping valve 10 and then is communicated with a vacuum pump 11. A thin layer of conductive varnish was applied to the outer surface of a 40X40mm rubber sheet of 0.2 thickness and then adhered to the coated support sheet 3. After the direct current positive electrode 5 is combined with one side of the rubber sheet brushed with the conductive varnish, a pressing strip with a wide guide line is left on the other side of the outer surface of the rubber sheet, and then wax is coated. A small amount of copper scraps are put into the pincer pot 8, then the vacuum cover 1 is covered, and the vacuum pump is started to pump vacuum. Let electric stove 7 ohmic heating, after the copper in the pincers pot 8 is cut the gasification, hold up the copper molecule of negative electricity and just tend to and deposit on the conduction of rubber piece is located a tape. When the thickness of the deposit is about 0.2mm, the rubber sheet is taken out, the wax on the rubber sheet is removed, and the processes are repeated after the polar materials of the semiconductor P and the semiconductor T are respectively filled in the clamp anchor pot twice. The rubber sheet can be plated with a P pole of 0.1-0.2 mm and a T pole of 0.1-0.2 mm as required, so that the required light and thin semiconductor refrigerating sheet can be obtained.

Claims

1. The utility model provides a vacuum coating device, it is by vacuum cover (1), coating film supporting piece (2), insulator spindle (3), chassis support (4), direct current positive electrode (5), direct current negative electrode (6), electric stove (7), pincers pot (8), electric stove are drawn forth line (9), evacuation valve (10), vacuum pump (11), vacuum meter valve (12), vacuum meter (13), chassis (14), seal ring (15), vacuum tube (16), wait to plate thing (17) and constitute, true characterized in that: the four chassis supports (4) are arranged at the lower part of the chassis (14), the vacuum cover (1) covers the upper part of the chassis (14), and a sealing gasket (15) is arranged at the joint of the vacuum cover (1) and the chassis (14); the vacuum pipe (16) penetrates through the base plate (14), the tail end of the vacuum pipe is communicated and fixedly connected with the air exhaust port of the vacuumizing valve (10), the outlet of the vacuumizing valve (10) is communicated and fixedly connected with the vacuum pump (11), the electric furnace (7) is arranged on the base plate (14) in the vacuum cover (1), the electric furnace (8) is stacked on the electric furnace (7), and the object to be plated (17) is arranged in the electric furnace (8); an electric furnace lead-out line (9) is led out from the power end of the electric furnace, penetrates through the chassis (14) and is connected with a heat supply power supply, a direct current negative electrode (6) is connected with the pincer pot (8), and a direct current positive electrode (5) is communicated with the film coating supporting sheet (2); the lower end of the insulating rod (3) is arranged on the chassis (14), and the upper end of the insulating rod (3) is communicated with the film coating supporting piece (2).