CN113056085A - Heat dissipation assembly and UV-LED module - Google Patents

Heat dissipation assembly and UV-LED module Download PDF

Info

Publication number
CN113056085A
CN113056085A CN201911385538.8A CN201911385538A CN113056085A CN 113056085 A CN113056085 A CN 113056085A CN 201911385538 A CN201911385538 A CN 201911385538A CN 113056085 A CN113056085 A CN 113056085A
Authority
CN
China
Prior art keywords
heat
insulating substrate
built
metal
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911385538.8A
Other languages
Chinese (zh)
Inventor
李保忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lps Technology Zhuhai Co ltd
Original Assignee
Lps Technology Zhuhai Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lps Technology Zhuhai Co ltd filed Critical Lps Technology Zhuhai Co ltd
Priority to CN201911385538.8A priority Critical patent/CN113056085A/en
Publication of CN113056085A publication Critical patent/CN113056085A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
    • B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
    • B41F23/0403—Drying webs
    • B41F23/0406—Drying webs by radiation
    • B41F23/0409—Ultra-violet dryers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
    • B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
    • B41F23/044—Drying sheets, e.g. between two printing stations
    • B41F23/045—Drying sheets, e.g. between two printing stations by radiation
    • B41F23/0453—Drying sheets, e.g. between two printing stations by radiation by ultraviolet dryers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Abstract

The invention provides a heat dissipation assembly and a UV-LED module. The invention provides a heat dissipation assembly which comprises a circuit board and an external heat radiator, wherein the circuit board and the external heat radiator are connected in a bonding mode through a heat conduction bonding layer, the circuit board comprises an insulating substrate and an internal heat radiator embedded in the insulating substrate, the external heat radiator is provided with a protruding portion, the protruding portion is located below the internal heat radiator, and the protruding portion penetrates through the heat conduction bonding layer and is in thermal connection with the internal heat radiator. The invention has the advantage of quickly dissipating heat generated by high-power devices such as UV-LED light sources.

Description

Heat dissipation assembly and UV-LED module
Technical Field
The invention relates to a heat dissipation assembly and a UV-LED module with the same.
Background
The ultraviolet curing equipment irradiates an ultraviolet curing material (such as ultraviolet curing glue or ink) by ultraviolet rays, so that the material is cured by polymerization reaction, and the ultraviolet curing equipment is widely applied to printing, coating and other industries.
The UV-LED point light sources are arranged on the circuit board according to a certain rule, part of electric energy is inevitably converted into heat energy in the process of converting electric energy into light energy by the UV-LED, and when the UV-LED light sources work for a long time, the UV-LED and other devices on the circuit board can generate a large amount of heat energy, so that the circuit board is required to have strong heat dissipation capacity, otherwise, the service life of the UV-LED can be influenced. In order to improve the heat dissipation performance, some circuit boards are adhered with metal plates on the back surface through heat conduction adhesive layers, so that the heat dissipation capacity of the whole circuit board is improved. However, for a circuit board mounted with a high power device such as a UV-LED light source, it is difficult to satisfy the requirement that a metal plate is adhered on the whole surface, and it is difficult to effectively dissipate heat generated from the high power device through an insulating substrate and then transferred to the metal plate.
There is a need for a heat dissipation assembly that can quickly dissipate heat generated by a high power device mounted thereon.
Disclosure of Invention
Aiming at the defects of the prior art, the invention mainly aims to provide a heat dissipation assembly which has good heat dissipation performance and can quickly dissipate heat;
it is another object of the present invention to provide a UV-LED module that can rapidly dissipate heat generated by a UV-LED light source.
In order to achieve the above main objective, the present invention provides a heat dissipation assembly, which includes an insulating substrate and an external heat sink, wherein a first metal layer is disposed on an upper surface of the insulating substrate, a conductive trace pattern is formed on the first metal layer, and the external heat sink supports the insulating substrate and is thermally connected to the insulating substrate through a thermal conductive adhesive layer. The circuit board also comprises a built-in radiator, wherein the built-in radiator is embedded in the insulating substrate, the upper surface and the lower surface of the built-in radiator are respectively flush with the upper surface and the lower surface of the insulating substrate, and the insulating substrate and the built-in radiator are bonded together through a first adhesive material; the external radiator is provided with a protruding part, and the protruding part is positioned below the internal radiator; the heat conduction bonding layer is provided with a hole, and the protruding portion penetrates through the heat conduction bonding layer and is in thermal connection with the built-in heat dissipation body.
According to the scheme, when the high-power device is used, the high-power device can be installed on the built-in radiator, the first metal layer on the insulating substrate is electrically connected with the high-power device, so that heat generated by the high-power device can be directly transmitted to the built-in radiator and then transmitted to the external radiator without passing through the insulating substrate, and therefore the heat generated by the high-power device can be quickly dissipated, and the heat dissipation performance of the circuit board is good. In addition, the external radiator is provided with a protruding part protruding towards the internal radiator, and the external radiator is thermally connected with the internal radiator, so that heat transfer is quicker.
The more specific scheme is that the built-in radiator comprises a metal body, a first insulating oxide layer arranged above the metal body and a second metal layer arranged above the first insulating oxide layer, and the second metal layer is flush with the first metal layer. Therefore, the built-in radiator is provided with the second metal layer, so that the built-in radiator can be electrically connected with the high-power device or the first metal layer arranged on the built-in radiator, the first insulating oxide layer is arranged between the second metal layer and the metal body, the electrical connection cannot pass through the metal body of the built-in radiator, and the metal body of the built-in radiator only conducts heat but does not conduct electricity.
More specifically, the lower surface of the insulating substrate is provided with a third metal layer, the built-in radiator further comprises a second insulating oxide layer located below the metal body and a fourth metal layer arranged below the second oxide layer, and the fourth metal layer is flush with the third metal layer. Therefore, the built-in heat radiator is provided with the fourth metal layer so as to establish electric connection with the third metal layer, and the second insulating oxide layer is arranged between the fourth metal layer and the metal body so that the electric connection cannot pass through the metal body of the built-in heat radiator.
In another specific scheme, the heat-conducting bonding layer is a self-adhesive heat-conducting silica gel sheet. The processing technology is simplified by utilizing the self-adhesiveness of the heat-conducting silica gel sheet.
In another more specific scheme, the external heat radiator is a metal heat radiator. For example, a material having a high thermal conductivity such as copper or aluminum.
More specifically, the protruding portion is connected to the built-in heat sink through a welding material. The heat transferred by the built-in radiator is transferred to the external radiator through the welding material, so that the heat dissipation performance of the circuit board is further improved.
Preferably, the cross section of the boss is the same as the cross section of the built-in heat sink. The two sections are the same, so that the heat can be effectively transferred.
Preferably, the insulating substrate comprises a plurality of insulating medium layers, and the two insulating medium layers are bonded together through an adhesive material, so that the process can be simplified.
More specifically, the insulating substrate and the built-in heat sink are hot-pressed to fill the first adhesive material in gaps between the insulating medium layers and the built-in heat sink. The process is simple by using a hot pressing mode, and the insulating medium layers and the insulating substrate and the built-in heat dissipation body can be firmly bonded.
In order to achieve another object, the invention provides a UV-LED module, which comprises a UV-LED light source and the heat dissipation assembly, wherein the UV-LED light source is mounted on a built-in heat dissipation body of a circuit board in the heat dissipation assembly.
According to the scheme, the UV-LED light source is arranged on the built-in radiator of the circuit board, and heat generated by the UV-LED light source in the using process can be transferred to the external radiator through the built-in radiator, so that the radiating effect is good.
To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation assembly in accordance with embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a built-in heat sink in embodiment 1 of the heat dissipation assembly of the present invention;
fig. 3 is a schematic structural diagram of an insulating substrate and a built-in heat sink combined together in a manufacturing process of a heat dissipation assembly in embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of an insulating substrate and a built-in heat sink in the preparation process of the heat dissipation assembly in embodiment 1 of the present invention;
fig. 5 is a schematic structural view of a heat dissipation assembly in accordance with embodiment 2 of the present invention;
FIG. 6 is a schematic diagram of a UV-LED module according to an embodiment of the present invention.
Detailed Description
Embodiment 1 of heat dissipating module
As shown in fig. 1, a heat dissipation assembly in embodiment 1 of the present invention includes an insulating substrate 10 and a metal heat sink 20 as a built-in heat sink, where the metal heat sink 20 is completely embedded in the insulating substrate 10, and upper and lower surfaces of the metal heat sink 20 are flush with upper and lower surfaces of the insulating substrate 10, respectively. The adhesive material 31 is provided between the insulating substrate 10 and the metal heat spreader 20, thereby bonding the insulating substrate 10 and the metal heat spreader 20 together. The metal plate 51 as an external heat sink is disposed below the insulating substrate 10 and the metal heat sink 20, and is bonded to the insulating substrate 10 by the heat conductive adhesive layer 41. The heat conductive adhesive layer 41 is provided with a hole at a position below the metal heat radiator 20, and the boss 511 of the metal plate 51 is inserted into the hole and connected to the metal heat radiator 20 by the welding material 61.
As shown in fig. 2, the metal heat sink 20 includes a metal body 21, an insulating oxide layer 211 as a first insulating oxide layer and a metal layer 221 as a second metal layer are provided above the metal body 21, and an insulating oxide layer 212 as a second insulating oxide layer and a metal layer 222 as a fourth metal layer are provided below the metal body 21. In the preparation of the heat dissipating module of the present embodiment, the metal heat sink 20 may be made of an aluminum plate which is anodized and then plated. After the aluminum plate is anodized, an insulating oxide layer is formed on the surface of the aluminum plate, and then a metal layer such as copper can be electroplated on the oxide layer to form a conductive circuit.
In the preparation of the present embodiment, the insulating substrate 10 and the metal heat sink 20 are bonded together, as shown in fig. 3. The insulating substrate 10 includes an insulating dielectric layer 11, a metal layer 101 as a first metal layer on an upper surface, and a metal layer 102 as a third metal layer on a lower surface. Wherein the upper surface of metal layer 101 is flush with the upper surface of metal layer 221 and the lower surface of metal layer 102 is flush with the lower surface of metal layer 222. A step of etching the conductive line may then be performed to form a desired conductive line pattern on one or more of the metal layers 101, 221, 102, 222, as shown in fig. 4. The insulating substrate with the metal heat spreader is then bonded to the metal plate 51 via the thermally conductive adhesive layer 41 and the solder material 61.
Preferably, the cross section of the convex portion 511 of the metal plate 51 is the same as that of the metal heat radiator 20, and the same cross section can achieve effective heat transfer. Preferably, the heat-conducting bonding layer is a self-adhesive heat-conducting silica gel sheet, the processing technology is simplified by utilizing the self-adhesion of the heat-conducting silica gel sheet, and in other embodiments, the heat-conducting bonding layer with double-sided back adhesive can be used.
When the heat dissipation assembly is used, a high-power device can be mounted on the upper surface of the metal heat dissipation body 20, and heat generated by the high-power device in the using process is fully transferred to the upper surface of the metal heat dissipation body through the lower surface of the high-power device, transferred to the welding material through the metal heat dissipation body 20, transferred to the protruding portion of the metal plate, and then dissipated through the outer surface of the metal plate. Therefore, heat generated by the high-power device can be quickly dissipated, and the heat dissipation performance of the heat dissipation assembly is good.
Embodiment 2 of heat dissipating module
This embodiment has a structure similar to that of embodiment 1, but is different in the insulating substrate structure. As shown in fig. 5, the insulating substrate 10 includes two insulating medium layers 11, 12 with an adhesive material 31 therebetween, which may be the same as the adhesive material 31 between the insulating substrate and the metal heat sink 20, so that the process of creating the insulating substrate from the two insulating medium layers may be combined with the process of bonding the metal heat sink 20 and the insulating substrate. The adhesive material can be bonded together by filling gaps between the insulating medium layers and the metal heat spreader by, for example, hot pressing. The hot pressing method is simple in process, and the insulating medium layers and the insulating substrate and the metal heat sink can be firmly bonded.
In other embodiments, the insulating substrate may include more insulating dielectric layers, and the circuit board may further include inner conductive traces disposed inside the insulating substrate.
UV-LED Module embodiments
In this embodiment, the heat dissipating module of embodiment 1 is used. As shown in fig. 6, the UV-LED light source 100 is mounted on the upper surface of the metal heat sink 20, wherein when the metal layer 221 has a conductive trace pattern, the UV-LED light source 100 can be electrically connected to the metal layer 221, and the metal layer 221 is electrically connected to the metal layer 101 through a metal wire or the like. The UV-LED light source 100 may also be electrically connected directly to the metal layer 101 through metal wires or the like without through the metal layer 221.
When the UV-LED module of the present embodiment is used, heat generated by the UV-LED light source during use can be transferred to the metal plate 51 through the metal heat sink 20, so that the heat dissipation effect is good. It is understood that the UV-LED module may employ the heat sink assembly in other heat sink assembly embodiments.
Although the present invention has been described with reference to specific embodiments, it is not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that changes may be made without departing from the scope of the invention, and it is intended that all matter contained in the above description or shown in the accompanying drawings shall be interpreted as illustrative and not in a limiting sense.

Claims (10)

1. A heat dissipation assembly, comprising:
the circuit board comprises an insulating substrate, wherein a first metal layer is arranged on the upper surface of the insulating substrate, and a conductive circuit pattern is formed on the first metal layer;
the external radiator supports the insulating substrate and is connected with the insulating substrate in a bonding mode through a heat conduction bonding layer;
the method is characterized in that: the built-in heat radiator is embedded in the insulating substrate, and the upper surface and the lower surface of the built-in heat radiator are flush with the upper surface and the lower surface of the insulating substrate respectively; the insulating substrate and the built-in heat radiator are bonded together through an adhesive material;
the external radiator is provided with a protruding part which is positioned below the internal radiator; the heat conduction bonding layer is provided with a hole, and the protruding portion penetrates through the heat conduction bonding layer and is in thermal connection with the built-in heat dissipation body.
2. The heat dissipation assembly of claim 1, wherein the built-in heat spreader comprises a metal body, a first insulating oxide layer disposed over the metal body, and a second metal layer disposed over the first insulating oxide layer, the second metal layer being flush with the first metal layer.
3. The heat dissipation assembly of claim 2, wherein a third metal layer is disposed on a lower surface of the insulating substrate, the built-in heat sink further includes a second insulating oxide layer disposed below the metal body and a fourth metal layer disposed below the second oxide layer, and the fourth metal layer is flush with the third metal layer.
4. The heat sink assembly of claim 1, wherein the thermally conductive adhesive layer is a self-adhesive thermally conductive silicone sheet.
5. The heat dissipation assembly of claim 1, wherein the external heat sink is a metal heat sink.
6. The heat dissipation assembly of claim 5, wherein the boss is connected to the internal heat sink by a solder material.
7. The heat dissipating assembly of any of claims 1 to 6, wherein the cross-section of the boss is the same as the cross-section of the built-in heat sink.
8. The heat dissipating assembly of any of claims 1 to 6, wherein the insulating substrate comprises a plurality of insulating dielectric layers, and the two insulating dielectric layers are bonded together by an adhesive material.
9. The heat dissipation assembly of claim 8, wherein the adhesive material fills gaps between the insulating medium layers and the built-in heat sink by hot pressing the insulating substrate and the built-in heat sink.
A UV-LED module comprising a UV-LED light source and a heat sink assembly according to any one of claims 1 to 9, said UV-LED light source being mounted on a built-in heat sink of a circuit board in said heat sink assembly.
CN201911385538.8A 2019-12-29 2019-12-29 Heat dissipation assembly and UV-LED module Pending CN113056085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911385538.8A CN113056085A (en) 2019-12-29 2019-12-29 Heat dissipation assembly and UV-LED module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911385538.8A CN113056085A (en) 2019-12-29 2019-12-29 Heat dissipation assembly and UV-LED module

Publications (1)

Publication Number Publication Date
CN113056085A true CN113056085A (en) 2021-06-29

Family

ID=76507240

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911385538.8A Pending CN113056085A (en) 2019-12-29 2019-12-29 Heat dissipation assembly and UV-LED module

Country Status (1)

Country Link
CN (1) CN113056085A (en)

Similar Documents

Publication Publication Date Title
KR102120785B1 (en) Heat-Sink Substrate For Semiconductor And Manufacturing Process Thereof
JP3128955U (en) Electric circuit board structure with heat dissipation sheet
JP2010109036A (en) Printed circuit board and circuit device
US11062972B2 (en) Electronic module for power control and method for manufacturing an electronic module power control
WO2014155977A1 (en) Heat dissipating sheet and heat dissipating structural body using same
WO2013104206A1 (en) Power device insulating heat radiation structure, circuit board and power supply equipment
KR101930391B1 (en) Electronic device
CN109588023B (en) Heat dissipation structure and related equipment
JP2006196593A (en) Semiconductor device and heat sink
JP2004104115A (en) Power module and its manufacturing method
JP3128948U (en) Electric circuit board structure with heat dissipation layer
CN110913593A (en) Circuit board preparation method
TWM592106U (en) Power module
CN113056085A (en) Heat dissipation assembly and UV-LED module
CN209882211U (en) HDI high density lamination circuit board
JP2004096034A (en) Method of manufacturing module structure, circuit board and method of fixing the same
CN113727515A (en) Metal copper-clad plate
CN209659706U (en) A kind of wiring board with heat conduction structure
CN202738247U (en) Circuit board provided with improved heat dissipation performance
CN109714885A (en) Composite radiating type circuit board, ultraviolet light curing mold group and preparation method thereof
CN217035622U (en) Heat radiation structure of bridge rectifier chip
CN109728155A (en) Circuit board, ultraviolet LED curing light source and the method for preparing circuit board
JP6918225B2 (en) Power converter
CN210271941U (en) Chip resistor substrate structure
CN220733077U (en) Heat radiation structure of printed circuit board

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20210629