CN113050313B

CN113050313B - Lobe separating equipment

Info

Publication number: CN113050313B
Application number: CN202110345617.7A
Authority: CN
Inventors: 伍心遥; 郑浩旋
Original assignee: HKC Co Ltd; Changsha HKC Optoelectronics Co Ltd
Current assignee: HKC Co Ltd; Changsha HKC Optoelectronics Co Ltd
Priority date: 2021-03-30
Filing date: 2021-03-30
Publication date: 2022-07-22
Anticipated expiration: 2041-03-30
Also published as: CN113050313A

Abstract

The invention discloses a lobe separation device, comprising: a base on which the first substrate is mounted; separating the cards; and the driving mechanism is close to the base, is in driving connection with the separation card and is used for driving the separation card to move and switch between a first position and a second position, when the separation card is positioned at the first position, the separation card is separated from the first substrate, and when the driving mechanism drives the separation card to switch to the second position, the driving mechanism drives the separation card to apply pressure to the residual material unit and drives the separation card to reciprocate along the direction parallel to the crack so as to expand the crack. According to the invention, the driving mechanism is adopted to drive the separation card to apply acting force on the residual material unit at the second position, so that the separation card reciprocates along the length direction parallel to the cutting crack, the acting force applied to the residual material unit is stable, and the problem of substrate fragment is avoided.

Description

Lobe separating equipment

Technical Field

The invention relates to the field of separation processes, in particular to a splinter separation device.

Background

The main body of the display panel generally includes transparent substrates and liquid crystal sealed between the substrates. In the manufacturing process of the display panel, a whole panel is usually processed, then the cutting cracks are formed on the substrate, and the substrate is divided into small-sized panels by adopting a splitting process.

In the conventional splitting process, the residual material unit of the substrate is rotated around the cutting crack as a center and deflected along the circumferential direction until the residual material unit falls off from the substrate. In the deflection process of the residual material unit, the deflection precision of the residual material unit is inconvenient to control, and the residual material unit is easy to break in the deflection process, so that the product quality is influenced.

Disclosure of Invention

The invention mainly aims to provide a lobe separation device, and aims to solve the problem that the conventional lobe separation device is easy to cause lobe breakage.

In order to achieve the above object, the present invention provides a splitting and separating apparatus for separating a residual material unit from a substrate, the substrate including a first substrate, the first substrate having an effective panel and a residual material unit, the residual material unit being connected to the effective panel, and a cleavage crack being formed between the effective panel and the residual material unit, the apparatus including:

a base on which the first substrate is mounted;

separating the cards; and

the driving mechanism is close to the base and is connected with the separation card in a driving mode and used for driving the separation card to move and switch between a first position and a second position, the separation card is located at the first position and separated from the first substrate, the driving mechanism drives the separation card to switch to the second position, the driving mechanism drives the separation card to apply pressure to the residual material unit and drives the separation card to reciprocate in the direction parallel to the cutting crack, and therefore the cutting crack is expanded in extension.

Optionally, the separation card has a first surface facing the first substrate, and the first surface is a slope;

the residual material unit is provided with a first end close to the cutting crack and a second end far away from the cutting crack, and when the separation card is located at the second position, the first surface abuts against the second end of the residual material unit.

Optionally, at least two flag bits are disposed on the first substrate, and the splitting and separating apparatus further includes:

the first positioning mechanism is arranged on the base and used for identifying the mark position and acquiring the offset of the first substrate according to the mark position, and the driving mechanism controls the target adjustment amount of the separation card according to the offset so that the separation card is abutted against the second end of the residual material unit when the separation card is located at the second position.

Optionally, the scrap unit has a second surface facing the first surface, and the lobe separating apparatus further comprises:

and the second positioning mechanism is arranged on the first surface and used for acquiring the distance between the first surface and the second surface so that the first surface is abutted against the second end of the residual material unit when the separation card is positioned at the second position.

Optionally, the first surface has a third end proximate to the drive mechanism and a fourth end distal from the drive mechanism, and the second positioning mechanism is disposed proximate to the fourth end of the first surface.

Optionally, the second positioning mechanism comprises:

the sensor assembly is arranged on the first surface; and

the electronic reflection plate is used for reflecting the light beam reflected by the second surface to the direction of the sensor assembly.

Optionally, the lobe separation device further comprises:

and the detection module is arranged close to the base and used for detecting the size of the residual material unit after the residual material unit falls off from the first substrate.

Optionally, the substrate further comprises:

the second substrate is arranged opposite to the first substrate, a gap is formed between the first substrate and the second substrate, and when the separation card is located at the second position, at least part of the separation card is located in the gap.

Optionally, the separation card has a third surface facing away from the first substrate, and the third surface is an inclined surface, so that the thickness of one end of the separation card, which is far away from the driving mechanism, is gradually reduced.

Optionally, the lobe separation device further comprises:

and the adsorption mechanism is close to the base and used for adsorbing the residual material unit after the residual material unit falls off from the first substrate.

According to the technical scheme, the driving mechanism is adopted to drive the separation card to apply acting force to the residual material unit at the second position, so that the acting force applied to the residual material unit is relatively stable in the process that the separation card reciprocates along the length direction parallel to the cutting crack, the effective panel is not easily scratched, and the problem of substrate fragment is avoided.

Drawings

In order to more clearly illustrate the embodiments or technical solutions of the present invention, the drawings used in the embodiments or technical solutions of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a lobe separating apparatus according to an embodiment of the present invention;

fig. 2 is a block diagram of a control system of a splinter separation equipment according to an embodiment of the present invention.

The reference numbers indicate:

reference numerals	Name (R)	Reference numerals	Name (R)
				10	First substrate	11	Efficient panel
12	Residual material unit	13	Cutting cracks
				14	Adsorption mechanism	15	First positioning mechanism
16	Detection module	17	Second positioning mechanism
				171	Sensor assembly	172	Electronic reflecting plate
20	Frame glue	30	Second substrate
				40	Driving mechanism	50	Separating card
51	Controller for controlling a motor

The implementation, functional features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The invention provides a splitting and separating device which is used for separating residual material units 12 from a substrate, wherein the substrate comprises a first substrate 10, the first substrate 10 is provided with an effective panel 11 and the residual material units 12 connected with the effective panel 11, and a cutting crack 13 is formed between the effective panel 11 and the residual material units 12. The first substrate 10 may be a CF substrate (color filter), the cutting cracks 13 may be formed by using an existing process, and the cutting cracks 13 are linearly distributed on the first substrate 10. The residual material unit 12 is disposed near the edge of the first substrate 10, and when the splitting separation apparatus completes the splitting process, the residual material unit 12 falls off from the first substrate 10 along the linear track formed by the cutting crack 13. The splinter separation equipment can be used for splinter processes of liquid crystal panels and also can be used for splinter processes of other panel preparation. Fig. 1 and 2 are corresponding drawings of an embodiment of the present invention.

Referring to fig. 1 and 2, in an embodiment, the lobe separating apparatus includes:

a base (not shown) on which the first substrate 10 is mounted; the base is used for forming a platform for supporting the first substrate 10 and is used for supporting the first substrate 10, and the base can be further provided with a limiting structure for limiting the first substrate 10, so that the first substrate 10 is kept at a preset position and a preset angle on the base. The base may be provided with a fixing position corresponding to the shape of the first substrate 10, so that the first substrate 10 can be limited on the base.

Separating the card 50; and is used for generating a force on the residual material unit 12 on the first substrate 10 to make the cutting crack 13 on the first substrate 10 expand and expand, and the residual material unit is separated from the effective panel when the cutting crack is completely broken along with the expansion and expansion of the cutting crack. Because the residual material unit 12 generates relative displacement when receiving the acting force of the separation card 50, when the first substrate 10 is mounted on the base, the residual material unit 12 is suspended relative to the base, or the residual material unit 12 extends out of the base. In this embodiment, the separation card 50 may be made of a high polymer material to avoid abrasion of the substrate caused by the existing metal material.

The driving mechanism 40 is disposed near the base, is in driving connection with the separation card 50, and is used for driving the separation card 50 to move and switch between a first position and a second position, when the separation card 50 is located at the first position, the separation card 50 is separated from the first substrate 10, when the driving mechanism 40 drives the separation card 50 to switch to the second position, the driving mechanism 40 drives the separation card 50 to apply pressure to the scrap unit 12, and drives the separation card 50 to reciprocate along a direction parallel to the crack cut 13, so that the crack cut 13 extends and expands. The driving mechanism 40 may be a high-precision servo motor for driving the separating card 50 to move between the first position and the second position, and can drive the separating card 50 to reciprocate along a predetermined direction.

Taking fig. 1 as an example, the driving mechanism 40 is a servomotor, and the driving mechanism 40 can be driven left and right along the direction X in the figure to move the separation card 50 toward or away from the first substrate 10, or can be driven up and down along the direction Z in the figure to press the separation card 50 against the surface of the scrap unit 12 of the first substrate 10, and can be driven back and forth along the direction Y in the figure to move the separation card 50 along the direction parallel to the length direction of the cut crack 13. The first position may be any position outside the base. When the separating card 50 is located at the first position, the separating card 50 is not in contact with the first substrate 10, and the first substrate 10 is not subjected to the acting force of the separating card 50. When the driving mechanism 40 drives the separation card 50 to switch to the second position along the X direction, the driving mechanism 40 drives the separation card 50 to move along the Z direction and abut against the remnant unit 12, so that the separation card 50 generates a force on the remnant unit 12. When the driving mechanism 40 drives the separating card 50 to reciprocate along the Y direction, the separating card 50 generates continuous pressure on the remnant unit 12 until the cutting crack 13 extends and expands until the remnant unit 12 falls off from the first substrate 10.

In the process of reciprocating the separating card 50, because the separating card 50 reciprocates along the direction parallel to the length direction of the cut crack 13, the acting force of the separating card 50 on the residual material unit 12 is relatively stable, the acting force applied to the part of the residual material unit 12 close to the cut crack 13 is relatively stable, the cut crack 13 can gradually extend and expand, and the part of the effective panel 11 close to the cut crack 13 is not easily abraded. In the reciprocating process of the separating card 50, the acting force generated on the residual material unit 12 is relatively uniform, so that the acting force applied to the position, close to the cutting crack 13, of the residual material unit 12 is relatively stable, and the abrasion caused by unstable local force is not easy to occur. During the movement of the separating card 50, the force applied by the separating card 50 to the scrap unit 12 can be controlled by the driving mechanism 40, so that the precise control of the force can be realized.

To facilitate the detection, in an embodiment, the lobe separating apparatus further includes: and the detection module 16 is arranged close to the base and used for detecting the size of the residual material unit 12 after the residual material unit 12 falls off from the first substrate 10. The detection module 16 may be a size measuring sensor, a CCD camera, or other detection device, and is configured to obtain the size of the lumber recovery unit 12 after falling, and compare the size of the lumber recovery unit 12 after falling with preset parameters, so as to determine whether the size of the lumber recovery unit 12 after falling meets preset requirements. When the error between the size of the remnant unit 12 and the preset parameter is larger than the preset range, whether the effective panel 11 is damaged in the splitting process can be obtained by calculating the deviation range between the size of the remnant unit 12 after falling off and the preset parameter.

The detection module 16 may be disposed beside the base, and when the residual wood unit 12 is separated from the effective panel 11 along the extension direction of the cutting crack 13, the detection module 16 directly detects and acquires the size data of the residual wood unit 12. The detection module 16 may be disposed outside the base, and after the remnant unit 12 falls off, the remnant unit 12 may be moved toward the detection module 16 until the detection unit acquires the size data of the remnant unit 12. The driving mechanism 40 and the control module of the detection module 16 may be integrated on the splinter separation device, or may be controlled separately or remotely.

In an embodiment, the lobe separation apparatus further comprises: and the adsorption mechanism 14 is arranged close to the base and is used for adsorbing the residual material unit 12 after the residual material unit 12 falls off from the first substrate 10. The adsorption mechanism 14 has an adsorption portion for adsorbing on the surface of the scrap unit 12, for example, by suction cup or negative pressure trachea adsorption, when the separation card 50 reciprocates along the direction parallel to the length direction of the cut crack 13, the separation card 50 continuously generates an acting force on the scrap unit 12, the adsorption mechanism 14 adsorbs one side of the scrap unit 12 away from the separation card 50, so that when the scrap unit 12 is separated from the effective panel 11, the adsorption mechanism 14 can also play a role of short-time limiting on the scrap unit 12, and the scrap unit 12 is adsorbed and moved to a preset position by the adsorption mechanism 14. When the splinter separation equipment is provided with the detection module 16, the adsorption mechanism 14 can adsorb the residual material unit 12 to the position of the detection module 16 so as to facilitate rapid detection.

In one embodiment, the substrate further comprises: the second substrate 30 is disposed opposite to the first substrate 10, a gap is formed between the first substrate 10 and the second substrate 30, and when the separation card 50 is located at the second position, at least a portion of the separation card 50 is located in the gap. The second substrate 30 may be a Thin Film Transistor (TFT) substrate, and the sealant 20 is disposed between the first substrate 10 and the second substrate 30. When the separation card 50 is switched to the second position, the separation card 50 extends into a gap between the first substrate 10 and the second substrate 30, and applies an acting force to the first substrate 10, so that the residual material unit 12 on the first substrate 10 has a tendency to move in a direction away from the second substrate 30. In the relative movement process of the separation card 50, no direct acting force is generated on the second substrate 30 of the separation card 50, and no abrasion is generated on the second substrate 30, thereby facilitating the separation of the residual units 12 on the first substrate 10. Since other functional modules, such as a liquid crystal layer, are usually disposed between the first substrate 10 and the second substrate 30, the remnant unit 12 has only a unidirectional force tendency under the action of the separation card 50, and does not rotate up and down around the cutting crack 13, so that the first substrate 10 does not extrude or wear the functional portion between the first substrate 10 and the second substrate 30, thereby helping to ensure the effective state of the functional portion between the first substrate 10 and the second substrate 30.

Since the scrap units 12 are generally located at the edge of the first substrate 10, the scrap units 12 have a first end close to the cutting crack 13 and a second end far away from the cutting crack 13, when the separation card 50 is moved to the gap between the first substrate 10 and the second substrate 30, the separation card 50 can only act on the second end of the scrap units 12, so that the contact area between the separation card 50 and the first substrate 10 is smaller, and the abrasion on the surfaces of the effective panel 11 and the second substrate 30 of the first substrate 10 is further avoided.

In one embodiment, the separating card 50 has a third surface facing away from the first substrate 10, and the third surface is a slope, so that the thickness of the end of the separating card 50 away from the driving mechanism 40 is gradually reduced. When the separating card 50 acts on the remnant unit 12, the separating card 50 is not easy to wear the second substrate 30, thereby helping to reduce the damage to the second substrate 30. By reducing the thickness of the separation card 50, it is possible to more conveniently extend the separation card 50 between the first substrate 10 and the second substrate 30. When the separated card 50 is locally deformed, a certain deformation space can be provided for the separated card 50 by reducing the thickness of the end portion of the separated card 50, and the separated card 50 is prevented from being removed from the gap between the first substrate 10 and the second substrate 30.

When the separation card 50 is manufactured, one end of the separation card 50, which is far away from the driving mechanism 40, may be integrally in a tapered structure with gradually decreasing thickness, or one end of the separation card 50, which is far away from the driving mechanism 40, may be in a sheet structure with gradually decreasing thickness, when the separation card 50 abuts on the remnant unit 12, the distance between the third surface of the separation card 50 and the second substrate 30 is increased, and only one end portion of the separation card with smaller thickness extends into the gap between the first substrate and the second substrate, so as to further avoid damage to the second substrate 30.

In one embodiment, the separation card 50 has a first surface facing the first substrate 10, and the first surface is a slope; the residual material unit 12 has a first end close to the cutting crack 13 and a second end far away from the cutting crack 13, and when the separation card 50 is at the second position, the first surface abuts against the second end of the residual material unit 12. Under the action of the first surface, the thickness of the end of the separation card 50 away from the driving mechanism 40 is gradually reduced, so that the first surface of the separation card 50 forms a slope. When the first surface abuts against the second end of the remnant unit 12, the contact surface between the remnant unit 12 and the separating card 50 is small, and the two can be in line contact. When the driving mechanism 40 drives the separation card 50 to move to the second position, the contact area between the first surface which is arranged in an inclined plane and the residual material unit 12 is small, so that when the separation card 50 moves along the length direction which is parallel to the cutting crack 13, the acting force applied to the residual material unit 12 is relatively more uniform, and the precision of the splitting process is conveniently controlled. When the separation card 50 is slightly deformed, when the first inclined plane acts on the residual material unit 12, the acting point can be always concentrated on the second end of the residual material unit 12, and then the acting force of the separation card 50 on the residual material unit 12 can be conveniently controlled to be always concentrated on one side of the second end of the residual material unit 12.

One side of the separation card 50, which faces away from the first substrate 10, is a third surface, when the substrate is further provided with the second substrate 30, a gap is formed between the first substrate 10 and the second substrate 30, and when the separation card 50 is switched to the second position, one end, far away from the driving mechanism 40, of the separation card 50 extends into the gap. When the first surface and the third surface are both inclined surfaces, the thickness of one end of the separation card 50 extending into the gap between the first substrate 10 and the second substrate 30 is relatively small, so that the abrasion of the separation card 50 to the first substrate 10 and the second substrate 30 can be reduced. When there is slight deformation of the separation card 50, the first slope and the second slope can act as a buffer to prevent the separation card 50 from being removed from the gap between the first substrate and the second substrate.

In an embodiment, at least two mark locations are disposed on the first substrate 10, and the mark locations are locations to be identified that are preset in a specific shape and/or location of the first substrate 10, for example, a specific material or a specific shaped patch or the like may be disposed on the first substrate 10 as the mark locations. The shape of the flag is relatively determined and the position of the flag on the first substrate 10 is relatively determined, and by determining the position and angle of the flag, the offset of the first substrate 10 on the susceptor can be determined.

In this embodiment, the lobe of a leaf splitter still includes: the first positioning mechanism 15 is arranged on the base and used for identifying the mark position and acquiring the offset of the first substrate 10 according to the mark position, and the driving mechanism 40 controls the target adjustment amount of the separation card 50 according to the offset so that the separation card 50 abuts against the second end of the residual material unit 12 when the separation card 50 is located at the second position. The first positioning mechanism 15 can be a CCD camera or the like arranged on the base, the flag bit is identified through the first positioning mechanism 15, obtaining the offset of the first substrate 10 on the base by reading the angle and the position of the flag, the offset of the first substrate 10 on the base, corresponding to the target adjustment amount when the driving mechanism 40 drives the separation card 50 to move to the second position, after the offset amount of the first substrate 10 is acquired, the operation of the driving mechanism 40 may be controlled according to the corresponding target adjustment amount, to compensate for control of the drive mechanism 40, such that when the separator card 50 is in the second position, the separating card 50 can generate a force on the scrap unit 12 and can reciprocate in a direction parallel to the longitudinal direction of the cutting crack 13. The first positioning mechanism 15 and the control unit of the driving mechanism 40 may be integrated on the splinter separating device, or may adopt a remote control mode.

When the substrates include the first substrate 10 and the second substrate 30, the flag may be set on the second substrate 30, and whether the substrate is offset on the susceptor may be determined by recognizing the flag on the second substrate 30.

When the first substrate 10 and the second substrate 30 are assembled, there may be an installation error between the first substrate 10 and the second substrate 30, and when the separating card 50 generates an acting force on the scrap unit 12 at the second position, the separating card simultaneously reciprocates along a direction parallel to the length direction of the cutting crack 13, and by determining the position of the mark on the first substrate 10, and accordingly compensating the relative position of the separating card 50, the position of the separating card 50 may be determined by referring to only a single variable in the positioning process of the separating card 50, so that rapid positioning may be conveniently performed, and control accuracy in the splitting process may be improved.

In another embodiment, the scrap unit 12 has a second surface facing the first surface, and the splitting apparatus further comprises: the second positioning mechanism 17 is disposed on the first surface, and is configured to obtain a distance between the first surface and the second surface, so that when the separation card 50 is located at the second position, the first surface abuts against the second end of the remnant unit 12. The first surface is an inclined surface, the length of the separation card 50 extending into the scrap unit 12 can be controlled by controlling the formation of the driving mechanism 40, the distance between the first surface and the second surface can be determined by measuring the distance between the specific position of the first surface and the specific position of the second surface of the scrap unit 12, and then whether the separation card 50 reaches the second position is determined, so that accurate positioning can be realized in the relative movement process of the separation card 50.

Optionally, the first surface has a third end near the driving mechanism 40 and a fourth end far from the driving mechanism 40, and the second positioning mechanism 17 is disposed near the fourth end of the first surface. Taking fig. 1 as an example, when the separation card 50 reaches the second position, the fourth end of the separation card 50 extends into the scrap unit 12 on a side close to the cut crack 13, and the fourth end of the separation card 50 is suspended above the scrap unit 12, and it can be determined that the distance between the separation card 50 and the scrap unit 12 is kept within a preset distance by determining the distance between the fourth end of the separation card 50 and the second surface of the scrap unit 12, so that when the separation card 50 is at the second position, the separation card 50 can always exert a certain pressure on the scrap unit 12.

When lobe of a leaf splitter separation facility is provided with during first positioning mechanism 15, can pass through first positioning mechanism 15 confirms the angle of first base plate 10 and the offset of mounted position, according to the offset is confirmed the compensation volume of actuating mechanism 40 drive stroke, works as separation card 50 is close to during the incomplete material unit 12, second positioning mechanism 17 confirms separation card 50 with distance between the second surface of incomplete material unit 12, and then make separation card 50 is in during the second position, can be right the second end of incomplete material unit 12 produces certain pressure.

When the separation card 50 has a certain deformation, the distance between the separation card 50 and the residual material unit 12 is determined, so that the separation card 50 always has a part which is in contact with the residual material unit 12 when being located at the second position, and the problem of splitting failure caused by the deformation of the separation card 50 is avoided.

The second positioning mechanism 17 may be a laser distance measuring device, or may select other distance measuring methods. The control module of the second positioning mechanism 17 may be integrated with the splinter separation device or may be remotely controlled. In one embodiment, the second positioning mechanism 17 includes: a sensor assembly 171 disposed on the first surface; and an electronic reflection plate 172, wherein the sensor component 171 is used for emitting the detection light beam to the second surface, and the electronic reflection plate 172 is used for reflecting the light beam reflected by the second surface to the direction of the sensor component 171. The light beam emitted from the sensor unit 171 generates diffuse reflection on the second surface of the scrap unit 12, and the electron reflection plate 172 reflects the light beam reflected diffusely toward the sensor unit 171, so as to improve the light signal reception of the sensor unit 171.

The principles of the invention are explained in detail below with reference to the accompanying drawings: the splinter separation device is provided with a controller 51, the controller 51 stores a control program, the splinter separation device is provided with a base for supporting a first substrate 10 of the substrate, the second substrate 30 is positioned on one side of the first substrate 10, which is far away from the base, a mark position can be arranged on the first substrate 10, the mark position is identified through a first positioning mechanism 15 so as to determine whether the first substrate 10 is installed at a preset position on the base, when the first substrate 10 deviates from the preset position, the deviation of the mark position can be obtained through the first positioning mechanism 15 so as to calculate the position compensation amount of the separation card 50, so that when the separation card 50 moves to the second position, the separation card 50 can abut against one end of the residual material unit 12, which is far away from the crack 13. The second positioning mechanism 17 determines the distance between the separation card 50 and the surface of the scrap unit 12, and when there is local deformation of the separation card 50, the separation card 50 can always have a portion in contact with the scrap unit 12 by determining the distance between the separation card 50 and the scrap unit 12. When the separation card 50 is at the second position, the driving mechanism 40 drives the separation card 50 to reciprocate along a direction parallel to the length direction of the cut crack 13, so that the separation card 50 generates pressure on the residual material unit 12, the cut crack 13 can gradually extend under the action of the pressure, and the residual material unit 12 is only stressed on one side, and thus functional components on the first substrate 10 cannot be extruded. When the cutting crack 13 extends to the residual wood unit 12 and falls off, the adsorption mechanism 14 adsorbs the residual wood unit 12 and adsorbs the residual wood unit 12 to a preset position, and the detection module 16 detects the size of the residual wood unit 12 to determine whether damage is generated to the position of the effective panel 11.

Claims

1. A lobe separating device for separating residual material units from a substrate, the substrate comprising a first substrate, the first substrate having an active panel and residual material units, the residual material units being connected to the active panel, and cutting lobes being formed between the active panel and the residual material units, the lobe separating device comprising:

a base on which the first substrate is mounted;

separating the cards; and

the driving mechanism is arranged close to the base, is in driving connection with the separation card and is used for driving the separation card to move and switch between a first position and a second position, when the separation card is located at the first position, the separation card is separated from the first substrate, and when the driving mechanism drives the separation card to switch to the second position, the driving mechanism drives the separation card to apply pressure on the residual material unit and drives the separation card to reciprocate along the direction parallel to the crack so as to expand the crack;

the substrate further comprises a second substrate, the second substrate is opposite to the first substrate, a gap is formed between the first substrate and the second substrate, and when the separation card is located at the second position, at least part of the separation card is located in the gap.

2. The lobe separation apparatus of claim 1, wherein the separation card has a first surface facing the first substrate, the first surface being a bevel;

3. The lobe separation device of claim 2, wherein the first substrate has at least two flag bits disposed thereon, the lobe separation device further comprising:

the first positioning mechanism is arranged on the base and used for identifying the mark position and acquiring the offset of the first substrate according to the mark position, and the driving mechanism controls the target adjustment amount of the separation card according to the offset so that the separation card is abutted to the second end of the residual material unit when the separation card is located at the second position.

4. The lobe separation device of claim 2, wherein the scrap unit has a second surface facing the first surface, the lobe separation device further comprising:

5. The lobe separation apparatus of claim 4, wherein the first surface has a third end proximate the drive mechanism and a fourth end distal from the drive mechanism, and the second positioning mechanism is disposed proximate the fourth end of the first surface.

6. The lobe separation apparatus of claim 4, wherein the second positioning mechanism comprises:

the sensor assembly is arranged on the first surface; and

7. A splinting separation device according to any one of claims 1 to 6, further comprising:

and the detection module is close to the base and used for detecting the size of the residual material unit after the residual material unit falls off from the first substrate.

8. The lobe separation device of any one of claims 1 to 6, wherein the separation card has a third surface facing away from the first substrate, the third surface being beveled to provide a tapering thickness at an end of the separation card remote from the drive mechanism.

9. The lobe separation device of any one of claims 1 to 6, further comprising:

and the adsorption mechanism is arranged close to the base and used for adsorbing the residual material unit after the residual material unit falls off from the first substrate.