CN113044357B - Bearing structure for substrate of printed circuit board - Google Patents

Bearing structure for substrate of printed circuit board Download PDF

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Publication number
CN113044357B
CN113044357B CN202110372655.1A CN202110372655A CN113044357B CN 113044357 B CN113044357 B CN 113044357B CN 202110372655 A CN202110372655 A CN 202110372655A CN 113044357 B CN113044357 B CN 113044357B
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China
Prior art keywords
main frame
printed circuit
circuit board
grid
fixing
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CN202110372655.1A
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Chinese (zh)
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CN113044357A (en
Inventor
陈安顺
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Group Up Industrial Co ltd
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Group Up Industrial Co ltd
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Priority to CN202110372655.1A priority Critical patent/CN113044357B/en
Publication of CN113044357A publication Critical patent/CN113044357A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D19/00Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D19/38Details or accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D19/00Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D19/38Details or accessories
    • B65D19/44Elements or devices for locating articles on platforms
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2519/00Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D2519/00004Details relating to pallets
    • B65D2519/00258Overall construction
    • B65D2519/00263Overall construction of the pallet
    • B65D2519/00273Overall construction of the pallet made of more than one piece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2519/00Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
    • B65D2519/00004Details relating to pallets
    • B65D2519/00736Details
    • B65D2519/0081Elements or devices for locating articles
    • B65D2519/00815Elements or devices for locating articles on the pallet
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

The invention provides a printed circuit board substrate bearing structure which is used for bearing a plurality of printed circuit boards with different sizes and comprises a main frame, a grid mesh, at least one positioning seat and at least one fixing part. The main frame is rectangular and hollow, and comprises at least one limiting piece, at least one positioning hole and at least one fixing hole, wherein the at least one fixing hole is positioned at four corners of the main frame, and the at least one positioning hole is positioned at two opposite sides of the main frame. The grid mesh is in a criss-cross matrix shape and is used for bearing the printed circuit board. At least one positioning seat is arranged on the main frame by being pivoted with the at least one positioning hole. At least one fixing piece is pivoted with the at least one fixing hole to fix the grid on the main frame.

Description

Bearing structure of printed circuit board substrate
Technical Field
The present invention relates to a substrate supporting structure, and more particularly, to a substrate supporting structure of a printed circuit board capable of supporting different sizes of substrates.
Background
In the production process of printed circuit boards, trays for carrying and transporting the printed circuit boards are typically provided with a peripheral main frame and support bars of different forms for supporting and spacing the plurality of printed circuit boards. The Printed Circuit Board (PCB) carrier (tray) is used for storing and transporting the PCB during the module manufacturing process, and also enables the PCB substrates to be accurately arranged during the assembly process of the PCB substrates, thereby improving the assembly yield. Therefore, the PCB substrate supporting structure should have high reliability, i.e. the structure should be stable, firm, not easy to deform, and able to precisely arrange the plurality of PCBs. In addition, the PCB substrate carrying structure also requires a high degree of freedom to enable carrying of PCBs of different sizes, and other considerations such as selection of low cost materials and ease of fabrication are also contemplated.
The conventional tray is used for carrying a PCB substrate and mainly comprises a main frame and a plurality of support rods. The inner space formed by the main frame is divided into two parts by a clapboard parallel to the support rod to form two opposite L-shaped areas. The support rods in each region are arranged at equal intervals and used for bearing and separating a plurality of substrates. The tray is typically made by resin injection molding or injection molding. The material for manufacturing the tray is easy to deform, the parallel precision between the support rods is insufficient, and the assembly qualification rate (assembly yield) is reduced. In addition, the tray can only bear one size of PCB substrate, when the size is changed, another tray needs to be customized again, the manufacturing time is long, the original tray can not be used and discarded, the tray is not suitable for diversified product mass production, and the cost is wasted. As mentioned above, there is a need to provide a PCB substrate supporting structure, which can overcome the above-mentioned disadvantages.
Therefore, how to solve the above problems and deficiencies of the prior art is the subject of the urgent research and development of the related art.
Disclosure of Invention
The present invention is directed to a substrate supporting structure of a printed circuit board, which can support printed circuit boards of different sizes, and has a solid structure and is not easy to deform.
The invention provides a printed circuit board substrate bearing structure, which is used for bearing a plurality of printed circuit boards with different sizes and is characterized by comprising the following components:
the main frame is provided with a rectangular appearance, the interior of the main frame is hollow, the main frame comprises at least one limiting piece, at least one positioning hole and at least one fixing hole, the at least one fixing hole is positioned at four corners of the main frame, and the at least one positioning hole is positioned at two opposite sides of the main frame;
a grid mesh which is in a criss-cross matrix shape and is provided with a plurality of grids, the grid mesh is used for bearing a printed circuit board, and the material of the grid mesh has high heat conduction coefficient;
at least one positioning seat arranged on the main frame by being pivoted with the at least one positioning hole; and at least one fixing piece which is pivoted with the at least one fixing hole to fix the grid on the main frame.
In an embodiment of the present invention, the grid further includes a plurality of teflon pipes, and the plurality of teflon pipes are detachably disposed on the grid.
In an embodiment of the invention, the at least one limiting member is disposed on four peripheral side surfaces of the main frame, and each peripheral side surface has two limiting members.
In an embodiment of the present invention, the grid is made of a heat-resistant structural material.
In an embodiment of the invention, when the grid is fixed to the main frame, the at least one limiting member is located inside the grid and the at least one positioning seat is located outside the grid.
In summary, the PCB substrate carrying structure disclosed in the present invention has high degree of freedom, i.e. can carry PCB substrates of different sizes, thereby saving cost and shortening the preparation time of the manufacturing tool.
The purpose, technical content, features and effects of the present invention will be more readily understood by the detailed description of the embodiments below.
Drawings
Fig. 1 is an exploded schematic view of a pcb substrate carrying structure of the present invention.
Fig. 2 is a combination schematic view of the printed circuit board substrate bearing structure of the invention.
Description of reference numerals: 100-a printed circuit board substrate carrying structure; 110-a main frame; 112-a limit stop; 1121-limiting hole; 114-positioning holes; 116-a fixation hole; 120-a grid; 122-teflon tube; 130-positioning seat; 132-a cover plate; 134-locating columns; 140-fixing member.
Detailed Description
In order to solve the problem of the cost of the conventional printed circuit board substrate, the inventor of the present invention has made many years of research and development to overcome the disadvantages of the conventional products, and will hereinafter describe in detail how to provide a structure for supporting a printed circuit board substrate according to the present invention to achieve the most efficient functional requirements. In order to make the aforementioned and other objects, features, and advantages of the invention more apparent, preferred embodiments of the invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is an exploded schematic view of a supporting structure of a printed circuit board substrate according to the present invention. Fig. 2 is a combination schematic view of the printed circuit board substrate bearing structure of the invention. The pcb substrate supporting structure 100 according to the embodiment of the invention has a low cost and a short manufacturing time, thereby reducing and shortening the cost and preparation time of the product manufacturing tool. In detail, the pcb substrate supporting structure 100 includes a main frame 110, a grid 120, at least one positioning seat 130 and at least one fixing member 140. The main frame 110 has a rectangular shape and a hollow interior, and the main frame 110 has a plurality of frames, each of which is connected to form a hollow opening. The main frame 110 includes at least one limiting member 112, at least one positioning hole 114 and at least one fixing hole 116, the fixing holes 116 are located at four corners of the main frame 110, the positioning holes 114 are located at two opposite sides (each side has two positioning holes 114) of the main frame 110, the limiting members 112 are disposed at four peripheral side surfaces of the main frame 110, each peripheral side surface has two limiting members 112, wherein the limiting members 112 are combined on the main frame 110 through the limiting holes 1121.
The grid 120 is in a criss-cross matrix shape and has a plurality of grids, the grid 120 is used for bearing printed circuit boards with different sizes, the grid 120 is made of heat-resistant structural materials, wherein the grid 120 is made of materials with high heat conductivity coefficient, so that the grid 120 can uniformly conduct heat energy or heat to the whole grid 120 in the baking process, and further the printed circuit boards can be uniformly heated. It should be noted that each grid size of the grid 120 is smaller than the size of the printed circuit board, so as to prevent the printed circuit board from falling from the grid. The positioning base 130 is disposed on the main frame 110 by being pivoted to the positioning hole 114, wherein the positioning base 130 includes a cover plate 132 and a positioning post 134, and is pivoted to the positioning hole 114 by the cover plate 132 and the positioning post 134. The fixing member 140 fixes the grill 120 to the main frame 110 by pivotally connecting the at least one fixing hole 116. In an embodiment, the pcb substrate supporting structure 100 further includes a plurality of teflon tubes 122, the teflon tubes 122 are detachably or replaceably disposed on the grid 120, and the teflon tubes 122 are used to prevent the pcb from being scratched. As shown in fig. one or fig. two, in the present embodiment, the teflon tube 122 is disposed in the transverse or longitudinal direction of the grid 120. When the grid 120 and the main frame 110 are fixed together, the at least one limiting member 112 is located inside the grid 120 and the at least one positioning seat 130 is located outside the grid 120, and the at least one limiting member 112 is located on four sides of the main frame 110, and each side has two limiting members 112 for preventing the printed circuit board from sliding out of the grid 120. Through the embodiment of the invention, when the size of the printed circuit board is changed in the baking process of the printed circuit board, an additional tray (a substrate bearing structure) does not need to be customized, the processing time is shortened, and the original tray can be used and discarded, so that the method is suitable for mass production of diversified products and saves the cost.
In summary, the PCB substrate carrying structure disclosed in the present invention has high degree of freedom, i.e. can carry PCB substrates of different sizes, thereby saving cost and shortening the preparation time of the manufacturing tool.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations, or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (5)

1. A PCB substrate carrying structure for carrying a plurality of PCBs of different sizes, the PCB substrate carrying structure comprising:
the main frame is provided with a rectangular appearance, the interior of the main frame is hollow, the main frame comprises at least one limiting piece, at least one positioning hole and at least one fixing hole, the at least one fixing hole is positioned at four corners of the main frame, and the at least one positioning hole is positioned at two opposite sides of the main frame;
a grid mesh which is in a criss-cross matrix shape and is provided with a plurality of grids, the grid mesh is used for bearing a printed circuit board, and the material of the grid mesh has high heat conduction coefficient;
at least one positioning seat arranged on the main frame by being pivoted with the at least one positioning hole; and
at least one fixing piece for fixing the grid on the main frame by pivoting the fixing holes.
2. The printed circuit board substrate support structure of claim 1, wherein: still include a plurality of teflon pipes, these a plurality of teflon pipes set up on this bars net and for removable.
3. The printed circuit board substrate support structure of claim 1, wherein: the at least one limiting piece is arranged on four peripheral side surfaces of the main frame, and each peripheral side surface is provided with two limiting pieces.
4. The printed circuit board substrate support structure of claim 1, wherein: the grid is made of heat-resistant structural material.
5. The printed circuit board substrate support structure of claim 1, wherein: when the grid mesh and the main frame are fixed together, the at least one limiting piece is positioned inside the grid mesh and the at least one positioning seat is positioned outside the grid mesh.
CN202110372655.1A 2021-04-07 2021-04-07 Bearing structure for substrate of printed circuit board Active CN113044357B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110372655.1A CN113044357B (en) 2021-04-07 2021-04-07 Bearing structure for substrate of printed circuit board

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Application Number Priority Date Filing Date Title
CN202110372655.1A CN113044357B (en) 2021-04-07 2021-04-07 Bearing structure for substrate of printed circuit board

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CN113044357B true CN113044357B (en) 2023-02-03

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114497974A (en) * 2022-03-16 2022-05-13 安捷利(番禺)电子实业有限公司 Antenna array

Citations (5)

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Publication number Priority date Publication date Assignee Title
US5927504A (en) * 1998-06-23 1999-07-27 Samsung Electronics Co., Ltd. Apparatus for carrying plural printed circuit boards for semiconductor module
CN204259287U (en) * 2014-11-19 2015-04-08 深圳市海能达通信有限公司 Many spelling PCB paster fixtures
TWM598297U (en) * 2020-03-30 2020-07-11 群翊工業股份有限公司 Holding device for placing substrate
TWM608165U (en) * 2020-11-10 2021-02-21 群翊工業股份有限公司 Structure reinforcing plate rack for circuit board
CN215098930U (en) * 2021-04-07 2021-12-10 群翊工业股份有限公司 Bearing structure of printed circuit board substrate

Family Cites Families (3)

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Publication number Priority date Publication date Assignee Title
US6549418B1 (en) * 2001-09-26 2003-04-15 Hewlett Packard Development Company, L.P. Land grid array integrated circuit device module
US20040090747A1 (en) * 2002-10-25 2004-05-13 Po-Hung Wang Adjustable frame structure for carrying a circuit board
WO2018075915A1 (en) * 2016-10-21 2018-04-26 Corning Incorporated Methods and apparatus for securing an article

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5927504A (en) * 1998-06-23 1999-07-27 Samsung Electronics Co., Ltd. Apparatus for carrying plural printed circuit boards for semiconductor module
CN204259287U (en) * 2014-11-19 2015-04-08 深圳市海能达通信有限公司 Many spelling PCB paster fixtures
TWM598297U (en) * 2020-03-30 2020-07-11 群翊工業股份有限公司 Holding device for placing substrate
TWM608165U (en) * 2020-11-10 2021-02-21 群翊工業股份有限公司 Structure reinforcing plate rack for circuit board
CN215098930U (en) * 2021-04-07 2021-12-10 群翊工业股份有限公司 Bearing structure of printed circuit board substrate

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