TWI755314B - Printed circuit board (pcb) substrate carrying structure - Google Patents

Abstract

A printed circuit board (PCB) substrate carrying structure for carrying a plurality of PCBs of different sizes comprises a main frame, a grid, at least one positioning base and at least one fixing part. The main frame is in a rectangular shape and hollow inside, and the main frame includes at least one limiting part, at least one positioning hole, and at least one fixing hole, and these fixing holes are disposed at four corners of the main frame and the positioning holes are disposed on two opposite sides of the main frame. The grid is in a crisscross matrix shape and provided for carrying the printed circuit board. The positioning base is mounted onto the main frame by pivotally connecting the positioning holes, and the fixing part is pivotally connected to the fixing hole to fix the grid onto the main frame.

Description

Printed circuit board substrate carrier structure

A substrate carrying structure, especially a printed circuit board substrate carrying structure capable of carrying different substrate sizes.

Press, in the production process of the printed circuit board, the tray used for carrying and transporting the printed circuit board typically has a peripheral main frame and different forms of support rods for supporting and spacing the plurality of printed circuit boards. The printed circuit board (PCB; Printed Circuit Board) carrying device (tray) is not only used for storing and transporting the printed circuit board (PCB) in the module manufacturing process, but also in the PCB substrate assembly process. Substrates are precisely aligned to improve combined yield. Therefore, the PCB substrate bearing structure must have high reliability, that is, the structure must be stable, firm, and not easily deformed, and the plurality of PCBs can be accurately placed and arranged. In addition, the PCB substrate carrier structure also requires a high degree of freedom to be able to carry PCBs of different sizes, and other considerations such as selection of low-cost materials and ease of fabrication are also considered.

The conventional tray is used to carry the PCB substrate, which is mainly composed of a main frame and a plurality of support rods. The inner space formed by the main frame is divided into two by a partition parallel to the support rod, forming two opposite L-shaped areas. Support rods in each area are arranged at equal intervals for carrying and separating a plurality of substrates. The tray is generally made by resin injection molding or injection molding. The material used to manufacture the tray is relatively easy to deform, and the parallel accuracy between the support rods is insufficient, which reduces the assembly yield. yield rate). In addition, the tray can only carry one size of PCB substrate. When the size is changed, another tray must be re-made, which not only takes a long time to make, but also the original tray cannot be used and discarded, which is not suitable for mass production of diversified products. , and cost waste. As mentioned above, there is a need to provide a PCB substrate carrying structure that can overcome the above disadvantages.

Therefore, how to solve the above-mentioned problems and deficiencies of the prior art is the subject that the relevant industry is eager to develop.

The main purpose of the present invention is to provide a printed circuit board substrate carrying structure, which can carry printed circuit boards of different sizes, and has a firm structure and is not easily deformed.

The invention provides a printed circuit board substrate carrying structure for carrying a plurality of printed circuit boards of different sizes, including a main frame, a grid, at least one positioning seat and at least one fixing piece. The main frame has a rectangular shape and its interior is hollow. The main frame includes at least one stopper, at least one positioning hole and at least one fixing hole. The fixing holes are located at the four corners of the main frame, and the positioning holes are located at the main frame. the opposite sides. The grid, which is in the form of a criss-cross matrix, is used to carry the printed circuit board. At least one positioning seat is disposed on the main frame by pivotally connecting the positioning holes. At least one fixing member fixes the grid on the main frame by pivoting the fixing holes.

In one embodiment of the present invention, the printed circuit board substrate carrying structure further includes a plurality of Teflon tubes, and the Teflon tubes are disposed on the grid and are detachable.

In one embodiment of the present invention, the limiting members are disposed on four surrounding side surfaces of the main frame, and each surrounding side surface has two limiting members.

In an embodiment of the present invention, the grid is made of a heat-resistant structural material.

In an embodiment of the present invention, when the grid and the main frame are fixed together, the limiting members are located inside the grid and the positioning seats are located outside the grid.

To sum up, the printed circuit board substrate carrying structure disclosed in the present invention can have a high degree of freedom, that is, it can carry PCB substrates of different sizes, which can save costs and shorten the preparation time of manufacturing tools.

The following describes in detail with specific embodiments, when it is easier to understand the purpose, technical content, characteristics and effects of the present invention.

100: Printed circuit board substrate carrying structure

110: Main Frame

112: Limiter

1121: limit hole

114: Positioning hole

116:Fixing hole

120: Grid

122: Teflon tube

130: Positioning seat

132: Cover

134: Positioning post

140: Fixing parts

The first figure is a schematic exploded exploded view of the printed circuit board substrate bearing structure of the present invention.

The second figure is a schematic diagram of the combination of the printed circuit board substrate bearing structure of the present invention.

In order to solve the cost problem of the existing printed circuit board substrate, the inventor has made many years of research and development to improve the criticism of the existing product. The following will introduce in detail how the present invention uses a printed circuit board substrate bearing structure to achieve the most efficient efficiency. functional requirements. In order to make the above and other objects, features, and advantages of the present invention more apparent, preferred embodiments of the present invention are hereinafter described in detail with the accompanying drawings.

Please refer to the first figure and the second figure at the same time, the first figure is an exploded schematic diagram of the printed circuit board substrate carrying structure of the present invention. The second figure is a schematic diagram of the combination of the printed circuit board substrate bearing structure of the present invention. The printed circuit board substrate carrier structure 100 in the embodiment of the present invention has a low cost and a short manufacturing time, thereby reducing and shortening the cost and preparation time of product manufacturing. In detail, the printed circuit board substrate carrier structure 100 includes a main frame 110 , a grid 120 , at least one positioning seat 130 and at least one fixing Fixed piece 140 . The main frame 110 has a rectangular shape and is hollow inside. The main frame 110 has a plurality of frames, and each frame is connected to form a hollow opening. The main frame 110 includes at least one stopper 112 , at least one positioning hole 114 and at least one fixing hole 116 . The fixing holes 116 are located at four corners of the main frame 110 , and the positioning holes 114 are located on opposite sides of the main frame 110 (each There are two positioning holes 114 on the side of the main frame 110 , the limiter 112 is disposed on the four surrounding sides of the main frame 110 , each of the surrounding sides has two limiters 112 , wherein the limiter 112 is combined with the main frame through the limit holes 1121 . on frame 110. The positioning hole 114 can be seen in the first figure, but the positioning hole 114 cannot be seen in the second figure because the positioning seat 130 passes through the positioning hole 114 for positioning the main frame 110 and the grid 120 .

The grid 120 is in the shape of a crisscross matrix and has a plurality of grids, and the grid 120 is used to carry printed circuit boards of different sizes. The grid 120 is composed of a heat-resistant structural material, wherein the material of the grid 120 has high thermal conductivity The coefficient enables the grid 120 to uniformly conduct thermal energy or heat to the entire grid 120 during the baking process, thereby uniformly heating the printed circuit board. It should be noted that the size of each grid of the grid 120 is smaller than that of the printed circuit board to prevent the printed circuit board from falling off the grid. The positioning seat 130 is disposed on the main frame 110 through the pivoting positioning hole 114 , wherein the positioning seat 130 includes a cover plate 132 and a positioning column 134 , and is pivotally connected to the positioning hole 114 through the cover plate 132 and the positioning column 134 . The fixing member 140 fixes the grid 120 on the main frame 110 by pivoting the fixing holes 116 . In one embodiment, the printed circuit board substrate carrier structure 100 further includes a plurality of Teflon tubes 122 . The Teflon tubes 122 are disposed on the grid 120 and are detachable or replaceable. The dragon tube 122 is used to avoid scratches on the printed circuit board. As shown in FIG. 1 or FIG. 2 , in this embodiment, the Teflon tube 122 is disposed in the transverse or longitudinal direction of the grid 120 . When the grid 120 and the main frame 110 are fixed together, the limiting members 112 are located inside the grid 120 and the positioning seats 130 are located outside the grid 120 , and are located at the limiting positions on the four sides of the main frame 110 112, each side has two limiting members 112, which can prevent the printed circuit board from sliding out of the grid 120. Through the embodiment of the present invention, when the printed circuit board is in the baking process, when the size of the printed circuit board is changed, it is not necessary to change the size of the printed circuit board. To re-customize another tray (substrate carrier structure), not only the process time is shortened, but the original tray can be used and discarded, which is suitable for mass production of diversified products and saves costs.

To sum up, the printed circuit board substrate carrying structure disclosed in the present invention can have a high degree of freedom, that is, it can carry PCB substrates of different sizes, which can save costs and shorten the preparation time of manufacturing tools.

Only the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, all equivalent changes or modifications made according to the features and spirits described in the scope of the application of the present invention shall be included in the scope of the application for patent of the present invention.

100: Printed circuit board substrate carrying structure

110: Main Frame

112: Limiter

1121: limit hole

114: Positioning hole

116:Fixing hole

120: Grid

122: Teflon tube

130: Positioning seat

132: Cover

134: Positioning post

140: Fixing parts

Claims (5)

A printed circuit board substrate carrying structure for carrying a plurality of printed circuit boards of different sizes, the printed circuit board substrate carrying structure comprising: A main frame with a rectangular shape and a hollow inside, the main frame includes at least one stopper, at least one positioning hole and at least one fixing hole, the fixing holes are located at four corners of the main frame, the The positioning holes are located on opposite sides of the main frame; A grid, which is in the shape of a crisscross matrix and has a plurality of grids, the grid is used to carry the printed circuit board, wherein the material of the grid has a high thermal conductivity, so that the grid is uniform during the baking process Conducts heat to evenly heat the printed circuit board; at least one positioning seat is disposed on the main frame by pivotally connecting the positioning holes; and At least one fixing piece is used to fix the grid on the main frame by pivoting the fixing holes. The printed circuit board substrate carrying structure according to claim 1, further comprising a plurality of Teflon tubes, the Teflon tubes are arranged on the grid and are detachable. The printed circuit board substrate carrying structure as claimed in claim 1, wherein the limiting members are disposed on four surrounding side surfaces of the main frame, and each surrounding side surface has two limiting members. The printed circuit board substrate carrying structure according to claim 1, wherein the grid is composed of a heat-resistant structural material. The printed circuit board substrate carrying structure of claim 1, wherein when the grid and the main frame are fixed together, the limiting members are located inside the grid and the positioning seats are located outside the grid.

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