CN113038730A - Multilayer board and manufacturing method thereof - Google Patents
Multilayer board and manufacturing method thereof Download PDFInfo
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- CN113038730A CN113038730A CN202110168559.5A CN202110168559A CN113038730A CN 113038730 A CN113038730 A CN 113038730A CN 202110168559 A CN202110168559 A CN 202110168559A CN 113038730 A CN113038730 A CN 113038730A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of circuit boards, in particular to a multilayer board and a manufacturing method thereof, wherein the manufacturing method of the multilayer board comprises the following steps of S1, pretreatment; s2, performing solder mask by adopting low-pressure spraying; s3, characters; s4, laser hole burning; s5, back drilling; s6, washing with high-pressure water; the manufacturing method of the multilayer board can effectively solve the problem that the micro conductive hole is drilled on the back of the hole blocked by the solder resist oil, so that the multilayer board with the good light transmission property of the micro conductive hole is manufactured.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a multilayer board and a manufacturing method thereof.
Background
Currently, the production of multilayer boards involves the following process: pressing → drilling → copper deposition → board electric → outer layer image transfer → pattern plating → back drilling → outer alkali etching → outer layer AOI → solder resist screen printing → character → molding, wherein the back drilling process in the manufacturing flow is set after the pattern plating process and before the solder resist screen printing process/character process. However, since the diameter of the back drilling hole is about 2 times of the diameter (0.25mm) of the micro-conductive hole, once the solder mask printing is carried out, a large amount of ink enters the hole, so that the micro-conductive hole inevitably enters the ink in the solder mask printing process and the ink is thick; residual ink in the hole cannot be effectively removed after development of the solder mask, so that the micro conductive hole cannot transmit light, and the quality standard of the circuit board is influenced.
Disclosure of Invention
The first purpose of the invention is to provide a method for manufacturing a multilayer board, which can avoid the defects in the prior art, and can effectively eliminate the problem that a micro conductive hole is drilled on the back of a hole blocked by solder resist oil, so that the multilayer board with good micro conductive hole light transmission can be manufactured.
The first purpose of the invention is realized by the following technical scheme:
there is provided a method for manufacturing a multilayer board, comprising the steps of,
s1, preprocessing: pretreating the inner layer substrate to obtain an outer layer circuit board with an external circuit;
s2, solder resist: performing solder mask hole plugging treatment on the outer-layer circuit board pretreated by S1, spraying solder mask oil on the outer-layer circuit board in a low-pressure spraying mode after leveling, and then pre-baking, developing, inspecting and baking the outer-layer circuit board;
s3, character: performing character silk-screen printing on the outer-layer circuit board processed in the step S2;
s4, laser hole burning: carrying out hole burning treatment on the outer layer circuit board treated by the S3 by adopting laser to burn and vaporize residual ink in the hole;
s5, back drilling: back drilling the outer layer circuit board processed in the step S4;
s6, high-pressure water washing: washing the outer-layer circuit board treated by the S5 with high-pressure water, wherein the water pressure of the high-pressure water is 60-100 kg/cm2。
Further, in the step S2, the spraying speed of the low-pressure spraying is 1.8-3 m/min, the flow rate of the used ink is 38-45S, the ink amount of the nozzle is 110-130 ml/min, and the wet film thickness is 80-90 μm.
Further, in the step S2, the temperature of pre-baking is 65-80 ℃, and the time is 40-60 min.
Further, in the step S2, the developing time is 60 to 80S, and the upper pressure of the developing is 1 to 3kg/m3The pressing force is 1 to 3kg/m3。
Further, in the step S4, the laser is carbon dioxide laser, and the laser device generates the laser by using an AP21 aperture, a 4-7 mil laser aperture and 20-40 mj energy.
Further, in S4, the outer layer circuit board is subjected to laser hole burning for 2 times.
Further, in S4, the laser-drilled hole is drilled from the via hole to the back-drilled hole.
Further, after S6, the method further includes washing the outer layer circuit board with low-pressure water, and then drying the layer circuit board.
Further, the linear speed of the high-pressure water washing is 1.2-1.6 m/min.
Further, in S1, the preprocessing includes the following steps:
s11, pressing: combining the inner layer substrate, the viscose and the copper foil to obtain an outer layer circuit board;
s12, drilling: drilling plug holes on the outer layer circuit board manufactured in the step S11;
s13, copper deposition: carrying out copper deposition treatment on the plug holes prepared in the step S12;
s14, board power: electroplating the plug holes processed in the step S13;
s15, outer layer drawing: transferring the film image to the outer layer circuit board processed in S14;
s16, pattern electroplating: tin plating is carried out on the board surface of the circuit board treated in the step S15 and the non-plug holes;
s17, etching: etching a required circuit on the outer layer circuit board processed in the step S16;
s18, outer layer AOI: and detecting the external circuit of the outer layer circuit board processed by the S17.
The manufacturing method of the multilayer board has the beneficial effects that:
(1) low-pressure spray solder resist is adopted to replace solder resist screen printing, so that the amount of ink entering the micro conductive holes is effectively reduced; a laser hole burning process is added after the character is baked, and ink in the back-drilled micro conductive hole is thoroughly burnt and vaporized, so that the micro conductive hole is transparent; the back drilling process is adjusted after the solder resist screen printing process/character process, so that the problem that a large amount of solder resist oil enters holes when the hole diameter is drilled back in the prior art is solved; and high-pressure water washing is added after back drilling, so that the printing ink and the drilling scraps in the hole are punched through, and the light transmittance of the hole is further ensured.
(2) The invention effectively solves the problem of large ink inlet amount of the micro-conductive holes during solder mask screen printing, effectively removes the ink in the holes during development, solves the problem of light impermeability, ensures the product quality and improves the production efficiency.
The second purpose of the present invention is to avoid the disadvantages of the prior art and to provide a multilayer board having the advantages of good light transmission and stable structure.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
FIG. 1 is a flow chart of one embodiment of a method of manufacturing a multilayer sheet of the present invention;
FIG. 2 is a flow diagram of one embodiment of the pretreatment of a multiwall sheet of the present invention;
FIG. 3 is a graph showing the results of light transmittance of the multilayer sheet of the present invention;
FIG. 4 is a cross-sectional result of the hole of the multi-layer plate of the present invention;
fig. 5 is a graph of the hole depth results for the multi-layer board of the present invention.
Detailed Description
The invention is further described with reference to the following examples.
A method for manufacturing a multilayer board includes the steps of,
s1, preprocessing: pretreating the inner layer substrate to obtain an outer layer circuit board with an external circuit;
s2, solder resist: performing solder mask hole plugging treatment on the outer layer circuit board prepared by S1, after leveling, spraying solder mask oil on the outer layer circuit board in a low-pressure spraying mode, then pre-baking, developing, inspecting and baking the outer layer circuit board, then performing quality inspection, and baking the board according to requirements; the process for spraying the solder resist oil at low pressure reduces the phenomenon that ink is extruded into a back drilling hole due to the extrusion effect of external force.
S3, character: performing character silk-screen printing on the outer-layer circuit board processed in the step S2;
s4, laser hole burning: and (3) carrying out hole burning treatment on the outer layer circuit board treated by the S3 by using laser to burn and vaporize residual ink in the hole, wherein the laser has accurate positioning capability and capability of easily burning the ink, so that a little residual ink in the hole can be burned and vaporized by the laser to ensure that the micro conductive hole is transparent.
S5, back drilling: back drilling the outer layer circuit board processed in the step S4;
s6, high-pressure water washing: washing the outer-layer circuit board treated by the S5 with high-pressure water, wherein the water pressure of the high-pressure water is 60-100 kg/cm2And (3) washing residues vaporized by the laser cutting ink in the hole and residual scraps in the back-drilled hole together by high-pressure water washing to ensure that the hole is transparent and meets the required quality standard.
And finally, detecting the outer-layer circuit board treated in the step S6 to obtain the multilayer board.
Compared with the prior art, in the manufacturing process of the multilayer board, the solder mask screen printing is optimized to be low-pressure spraying for solder mask, the low-pressure spraying effectively reduces the amount of ink entering the micro conductive holes, and the number of the blocked holes is reduced to be within 0.2% from 10%; (2) a laser hole burning process is added after the character is baked, and the printing ink in the back-drilled micro conductive hole is thoroughly burnt and punched to ensure that the back-drilled micro conductive hole is light-transmitting; (3) the back drilling process is adjusted from the front of the solder mask/character process to the solder mask/character process, so that a large amount of ink inlet holes caused by the back drilling diameter in the solder mask process are avoided; and fourthly, high-pressure water washing is added after back drilling, and the printing ink and the drilling residual scraps in the holes are punched through.
In the step S2, the spraying speed of low-pressure spraying is 1.8-3 m/min, the flow rate of the used ink is 38-45S, the ink volume of the spray head is 110-130 ml/min, the wet film thickness is 80-90 μm, and the hole plugging proportion of the back-drilled hole is reduced by adjusting the flow rate of the low-pressure spraying ink and the spraying oil volume.
Wherein in the step S2, the pre-baking temperature is 65-80 ℃ and the time is 40-60 min.
Wherein in S2, the developing time is 60-80S, and the developing pressure is 1-3 kg/m3The pressing force is 1 to 3kg/m3。
In the S4, the laser is carbon dioxide laser, and the laser device generates the laser by using an AP21 aperture, a 4-7 mil laser aperture and 20-40 mj energy.
In S4, the outer-layer circuit board is subjected to laser hole burning for 2 times.
In S4, the laser-fired hole is fired from the via hole to the back-drilled hole, i.e., the laser is fired from the via hole to the back-drilled hole, so that the ink is quickly removed from the back-drilled hole with a larger size.
And after S6, washing the outer layer circuit board by low-pressure water, and drying the layer circuit board, thereby further washing the outer layer circuit board.
Wherein the linear speed of the high-pressure water washing is 1.2-1.6 m/min.
Wherein, in S1, the preprocessing includes the following steps:
s11, pressing: combining the inner layer substrate, the viscose and the copper foil to obtain an outer layer circuit board;
s12, drilling: drilling plug holes on the outer layer circuit board manufactured in the step S11;
s13, copper deposition: carrying out copper deposition treatment on the plug holes prepared in the step S12;
s14, board power: electroplating the plug holes processed in the step S13;
s15, outer layer drawing: transferring the film image to the outer layer circuit board processed in S14;
s16, pattern electroplating: tin plating is carried out on the board surface of the circuit board treated in the step S15 and the non-plug holes;
s17, etching: etching a required circuit on the outer layer circuit board processed in the step S16;
s18, outer layer AOI: and detecting the external circuit of the outer layer circuit board processed by the S17.
Example 1
As shown in figure 1 of the drawings, in which,
the present example discloses a method for manufacturing a multilayer board, comprising the steps of,
s1, preprocessing: pretreating the inner layer substrate to obtain an outer layer circuit board with an external circuit; specifically, as shown in fig. 2, the pretreatment includes the steps of: s11, pressing: combining the inner layer substrate, the viscose and the copper foil to obtain an outer layer circuit board; s12, drilling: drilling plug holes on the outer layer circuit board manufactured in the step S11; s13, copper deposition: carrying out copper deposition treatment on the plug holes prepared in the step S12; s14, board power: electroplating the plug holes processed in the step S13; s15, outer layer drawing: transferring the film image to the outer layer circuit board processed in S14; s16, pattern electroplating: tin plating is carried out on the board surface of the circuit board treated in the step S15 and the non-plug holes; s17, etching: etching a required circuit on the outer layer circuit board processed in the step S16; s18, outer layer AOI: and detecting the external circuit of the outer layer circuit board processed by the S17.
S2, solder resist: performing solder mask hole plugging treatment on the outer layer circuit board treated by S1, leveling, and spraying solder mask oil on the outer layer circuit board by adopting a low-pressure spraying mode, wherein the spraying speed of the low-pressure spraying is 2.8m/min, the flow rate of the used ink is 34S (the flow rate is read by a flow cup for second), the ink amount of a nozzle is 120ml/min, the wet film thickness is 85 mu m, then prebaking the outer layer circuit board for 50min at 76 ℃ for developing at 70S, and the upper pressure of the developing is 2.0kg/m3The pressing pressure was 1.5kg/m3Then, checking and baking the board according to requirements;
s3, character: performing character silk-screen printing on the outer-layer circuit board processed in the step S2;
s4, laser hole burning: and (3) carrying out hole burning treatment on the outer layer circuit board processed by the S3 by using laser to burn and vaporize residual ink in the hole, preferably, the laser is carbon dioxide laser, a laser device generates the laser by using an AP21 aperture, a 6mil laser aperture and 30mj energy, preferably, the laser burning hole is burned from the guide hole to the back drilling hole, and 2 times of laser burning is carried out, so that the vaporized ink is thoroughly burned.
S5, back drilling: back drilling the outer layer circuit board processed in the step S4;
s6, high-pressure water washing: washing the outer layer circuit board treated by the S5 with high-pressure water, wherein the water pressure of the high-pressure water is 80kg/cm2The linear speed of high-pressure water washing is 1.5 m/min; preferably, after the high-pressure water washing, the method further comprises the step of washing an outer circuit board (not shown in fig. 1) with low-pressure water, and then drying the outer circuit board.
And finally, detecting the outer-layer circuit board treated in the step S6 to obtain the multilayer board.
Example 2
This example discloses a method for manufacturing a multilayer board, which is different from example 1 in that: s2, solder resist: spraying speed of low pressure spraying is 1.8m/min, flow rate of used ink is 38s, ink amount of spray head is 110ml/min, wet film thickness is 80 μm, and then prebaking at 65 deg.C for 40min for outer layer circuit board, developing at 60s with developing upper pressure of 1kg/m3The pressing force was 1kg/m3(ii) a S4, laser hole burning: the laser apparatus uses an AP21 aperture, a 4mil laser aperture and 20mj energy to generate the laser, preferably laser-fired holes from pilot hole to back-drilled hole, and 2 laser-fired holes to completely burn the vaporized ink. S6, high-pressure water washing: the water pressure of the high-pressure water is 60kg/cm2The linear speed of the high-pressure water washing is 1.2 m/min; preferably, after the high-pressure water washing, the method further comprises the steps of washing the outer circuit board with low-pressure water, and then drying the outer circuit board. Other processes are the same as those of example 1, and are not described herein again.
Example 3
This example discloses a method for manufacturing a multilayer board, which is different from example 1 in that: s2, solder resist: the spraying speed of the low-pressure spraying is 3m/min, the flow rate of the used ink is 45s, and the oil of the spray headThe ink amount is 130ml/min, the wet film thickness is 90 μm, and the outer layer circuit board is pre-baked at 80 deg.C for 60min and developed for 80s with the developing upper pressure of 3kg/m3The pressing force was 3kg/m3(ii) a S4, laser hole burning: the laser apparatus uses an AP21 aperture, a 7mil laser aperture and 40mj energy to generate the laser, preferably laser-fired holes from pilot hole to back-drilled hole, and 2 laser-fired holes to completely burn the vaporized ink. S6, high-pressure water washing: the water pressure of the high-pressure water is 100kg/cm2The linear speed of the high-pressure water washing is 1.6 m/min; preferably, after the high-pressure water washing, the method further comprises the steps of washing the outer circuit board with low-pressure water, and then drying the outer circuit board. Other processes are the same as those of example 1, and are not described herein again.
Example 4
This example discloses a method for manufacturing a multilayer board, which is different from example 1 in that: s2, solder resist: spraying speed of low-pressure spraying is 2.1m/min, flow rate of used ink is 41s, ink amount of spray head is 122ml/min, wet film thickness is 90 μm, then outer layer circuit board is prebaked at 72 deg.C for 53min, developed at 73s, and upper pressure of developed is 2.2kg/m3The pressing pressure was 2.2kg/m3(ii) a S4, laser hole burning: the laser apparatus uses an AP21 aperture, a 5.5mil laser aperture and 32mj energy to generate the laser, preferably laser firing holes from pilot hole back drilled and 1 laser firing hole performed to completely burn the vaporized ink. S6, high-pressure water washing: the water pressure of the high-pressure water is 70kg/cm2The linear speed of the high-pressure water washing is 1.4 m/min; preferably, after the high-pressure water washing, the method further comprises the steps of washing the outer circuit board with low-pressure water, and then drying the outer circuit board. Other processes are the same as those of example 1, and are not described herein again.
Example 5
This example discloses a method for manufacturing a multilayer board, which is different from example 1 in that: s2, solder resist: spraying speed of low pressure spraying is 2m/min, flow rate of used ink is 40s, ink amount of spray head is 120ml/min, wet film thickness is 85 μm, and then pre-baking at 70 deg.C for 59min for outer layer circuit board, developing at 70s with upper pressure of 2kg/m3The pressing force was 2kg/m3(ii) a S4, laser hole burning: the laser apparatus uses an AP21 aperture, a 5mil laser aperture and 30mj energy to generate the laser, preferably laser-fired holes from pilot hole to back-drilled hole, and 2 laser-fired holes to completely burn the vaporized ink. S6, high-pressure water washing: the water pressure of the high-pressure water is 60kg/cm2The linear speed of the high-pressure water washing is 1.2 m/min; preferably, after the high-pressure water washing, the method further comprises the steps of washing the outer circuit board with low-pressure water, and then drying the outer circuit board. Other processes are the same as those of example 1, and are not described herein again.
Example 6
This example discloses a method for manufacturing a multilayer board, which is different from example 1 in that: s2, solder resist: spraying speed of low-pressure spraying is 2.5m/min, flow rate of used ink is 42s, ink amount of spray head is 125ml/min, wet film thickness is 92 μm, and then prebaking at 75 deg.C for 55min for outer layer circuit board, developing at 75s with upper pressure of 2.5kg/m3The pressing pressure was 2.5kg/m3(ii) a S4, laser hole burning: the laser apparatus uses an AP21 aperture, a 6mil laser aperture and 35mj energy to generate the laser, preferably laser-fired holes from pilot hole to back-drilled hole, and 2 laser-fired holes to completely burn the vaporized ink. S6, high-pressure water washing: the water pressure of the high-pressure water is 100kg/cm2The linear speed of the high-pressure water washing is 1.6 m/min; preferably, after the high-pressure water washing, the method further comprises the steps of washing the outer circuit board with low-pressure water, and then drying the outer circuit board. Other processes are the same as those of example 1, and are not described herein again.
Effect verification:
the back surface of the multilayer sheet obtained in example 1 was irradiated with light, and as shown in FIG. 3, the light transmittance of each hole was good; as shown in fig. 4, the cross section of the hole is flat and has no burr, which illustrates that the manufacturing method of the present invention does not affect the internal structure of the hole; as shown in FIG. 5, the inside of the hole is smooth and free of foreign matters, wherein the depth of the back drilling hole is qualified, which shows that the manufacturing method of the invention can effectively remove the ink in the hole.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. A method of manufacturing a multilayer board, characterized by: comprises the following steps of (a) carrying out,
s1, preprocessing: pretreating the inner layer substrate to obtain an outer layer circuit board with an external circuit;
s2, solder resist: performing solder mask hole plugging treatment on the outer-layer circuit board pretreated by S1, spraying solder mask oil on the outer-layer circuit board in a low-pressure spraying mode after leveling, and then pre-baking, developing, inspecting and baking the outer-layer circuit board;
s3, character: performing character silk-screen printing on the outer-layer circuit board processed in the step S2;
s4, laser hole burning: carrying out hole burning treatment on the outer layer circuit board treated by the S3 by adopting laser to burn and vaporize residual ink in the hole;
s5, back drilling: back drilling the outer layer circuit board processed in the step S4;
s6, high-pressure water washing: washing the outer-layer circuit board treated by the S5 with high-pressure water, wherein the water pressure of the high-pressure water is 60-100 kg/cm2。
2. The multilayer board manufacturing method according to claim 1, characterized in that: in the step S2, the spraying speed of low-pressure spraying is 1.8-3 m/min, the flow rate of the used ink is 38-45S, the ink amount of the spray head is 110-130 ml/min, and the wet film thickness is 80-90 μm.
3. The multilayer board manufacturing method according to claim 2, characterized in that: in the S2, the pre-baking temperature is 65-80 ℃ and the time is 40-60 min.
4. The multilayer plate manufacturing method according to claim 3, characterized in that: in the step S2, the developing time is set to60 to 80 seconds, the developing pressure is 1 to 3kg/m3The pressing force is 1 to 3kg/m3。
5. The multilayer board manufacturing method according to claim 1, characterized in that: in S4, the laser is carbon dioxide laser, the laser equipment adopts an AP21 diaphragm, a 4-7 mil laser aperture and 20-40 mj energy to generate the laser, and the outer layer circuit board is subjected to laser hole burning for 2 times.
6. The multilayer board manufacturing method according to claim 1, characterized in that: in S4, the laser-fired hole is fired from the via hole to the back-drilled hole.
7. The multilayer board manufacturing method according to claim 1, characterized in that: and after S6, washing the outer layer circuit board by low-pressure water, and drying the layer circuit board.
8. The multilayer board manufacturing method according to claim 7, characterized in that: the linear speed of the high-pressure water washing is 1.2-1.6 m/min.
9. The multilayer board manufacturing method according to claim 1, characterized in that: in S1, the preprocessing includes the following steps:
s11, pressing: combining the inner layer substrate, the viscose and the copper foil to obtain an outer layer circuit board;
s12, drilling: drilling plug holes on the outer layer circuit board manufactured in the step S11;
s13, copper deposition: carrying out copper deposition treatment on the plug holes prepared in the step S12;
s14, board power: electroplating the plug holes processed in the step S13;
s15, outer layer drawing: transferring the film image to the outer layer circuit board processed in S14;
s16, pattern electroplating: tin plating is carried out on the board surface of the circuit board treated in the step S15 and the non-plug holes;
s17, etching: etching a required circuit on the outer layer circuit board processed in the step S16;
s18, outer layer AOI: and detecting the external circuit of the outer layer circuit board processed by the S17.
10. A multi-layer board, comprising: the multilayer sheet according to any one of claims 1 to 9 is produced by a method for producing a multilayer sheet.
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| CN113507783A (en) * | 2021-07-06 | 2021-10-15 | 珠海市深联电路有限公司 | High aspect ratio metallized blind hole or blind groove, manufacturing method, circuit board and client |
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| US20090314538A1 (en) * | 2008-06-20 | 2009-12-24 | Houssam Jomaa | Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same |
| CN105578801A (en) * | 2015-12-15 | 2016-05-11 | 深圳崇达多层线路板有限公司 | Manufacturing method of back-drilling hole of solder resist ink half-plug hole |
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| CN113507783A (en) * | 2021-07-06 | 2021-10-15 | 珠海市深联电路有限公司 | High aspect ratio metallized blind hole or blind groove, manufacturing method, circuit board and client |
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