CN113037949A

CN113037949A - Light filtering component, camera module and multi-camera module

Info

Publication number: CN113037949A
Application number: CN201911250886.4A
Authority: CN
Inventors: 陈烈烽; 梅哲文; 赵波杰; 诸海江; 蒋恒; 俞丝丝
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-12-09
Filing date: 2019-12-09
Publication date: 2021-06-25
Anticipated expiration: 2039-12-09
Also published as: CN113037949B; CN114762309A; WO2021114908A1

Abstract

The present invention relates to a light filtering assembly comprising: the bracket comprises an annular lens base part and a cantilever beam which is formed by extending inwards from the lens base part, wherein the center of the cantilever beam is provided with a light through hole; and an optical filter attached to a surface of the cantilever beam by an adhesive, the surface of the cantilever beam having an overlapping region overlapping the optical filter; the overlapping area comprises a main adhesive distribution area and a stress buffer area, the main adhesive distribution area is used for arranging the adhesive, the stress buffer area is located at the corner of the overlapping area, and the stress buffer area has an adhesive distribution mode different from that of the main adhesive distribution area so as to reduce the stress transmitted to the optical filter by the cantilever beam. The invention also provides a corresponding camera module and a multi-camera module. The invention can reduce the risk of the fragmentation or the bending of the optical filter in the camera module, and is particularly suitable for the camera module using the optical filter with large area thickness ratio.

Description

Light filtering component, camera module and multi-camera module

Technical Field

The invention relates to the technical field of camera modules, in particular to a light filtering component, a corresponding camera module and a multi-camera module.

Background

With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like. In order to meet the increasingly wide market demands, a high-pixel, large-chip, small-size and large-aperture camera module is an irreversible development trend of the existing camera module. Especially, current along with the promotion of the demand of shooing of cell-phone, the cell-phone module of making a video recording more and more, sensitization chip area are bigger and bigger, and this leads to the microscope base size to need corresponding grow, installs the light filter on the microscope base and also needs corresponding grow, and this leads to the cracked risk increase that the light filter in the current module structure of making a video recording is more.

Specifically, fig. 1 shows a schematic cross-sectional view of a typical camera module of a mobile phone. Referring to fig. 1, the camera module includes a lens assembly 100, a filter assembly 200, and a photosensitive assembly 300. The lens assembly 100 includes an optical lens and its accessory components, the filter assembly 200 includes an optical filter and its accessory components, and the photosensitive assembly 300 includes a circuit board 310, a photosensitive chip 320 attached to a surface of the circuit board 310, and an electronic component 330 (e.g., a resistor, a capacitor, etc.) mounted on the surface of the circuit board 310 and surrounding the photosensitive chip 320. Wherein the filter, sometimes also referred to as a color filter, is typically an IR filter, which may be used to filter out the infrared band in order to improve the imaging quality. The filter is usually mounted at the rear end of the last lens of the lens group of the optical lens (the rear end refers to the end close to the image side), and at the front end of the photosensitive chip (the front end refers to the end close to the object side). At present, the mobile phone camera module has more and more pixels and larger area of a photosensitive chip, so that an optical filter with larger area is needed. On the other hand, however, it is desirable to reduce the size of the camera module of the mobile phone as much as possible, and particularly, it is desirable to reduce the height (i.e., the size in the optical axis direction) of the camera module of the mobile phone as little as possible so as to avoid an excessive thickness of the mobile phone. This results in that the thickness of the filter is difficult to increase as its area increases. In other words, an increase in the area of the filter will result in an increase in the area-to-thickness ratio (i.e., the filter is relatively thin), and thus the filter is more likely to be chipped or bent. If the corresponding improvement is not performed, the production yield of the camera module may be reduced, which is not favorable for large-scale mass production.

Therefore, a solution that can reduce the risk of breaking or bending the filter in the camera module is urgently needed.

Disclosure of Invention

The present invention is directed to overcome the deficiencies of the prior art and provide a solution for reducing the risk of breaking or bending the filter in the camera module.

In order to solve the above technical problem, the present invention provides a filter assembly for a camera module, the filter assembly comprising: the bracket comprises an annular lens base part and a cantilever beam which is formed by extending inwards from the lens base part, wherein the center of the cantilever beam is provided with a light through hole; and an optical filter attached to a surface of the cantilever beam by an adhesive, the surface of the cantilever beam having an overlapping region overlapping the optical filter; the overlapping area comprises a main adhesive distribution area and a stress buffer area, the main adhesive distribution area is used for arranging the adhesive, the stress buffer area is positioned at the corner of the overlapping area, and the stress buffer area is suitable for reducing the stress transmitted to the optical filter by the cantilever beam compared with the main adhesive distribution area. For example, the stress buffering region may reduce the stress transmitted to the optical filter by the cantilever beam by using a different adhesive dispensing manner from the main adhesive dispensing region.

Wherein the stress buffer is not provided with the adhesive glue.

Wherein the stress buffering area is provided with the bonding glue, and the width of the bonding glue of the stress buffering area is smaller than that of the bonding glue of the main glue distribution area.

The adhesive glue comprises a first adhesive glue and a second adhesive glue, and the first adhesive glue is arranged in the main cloth glue area; the stress buffer area is arranged with the second adhesive glue, and the elastic modulus of the second adhesive glue is smaller than that of the first adhesive glue.

The overlapping area is a rectangular ring, the main glue distribution area comprises four strip-shaped areas corresponding to four edges of the rectangular ring, and the stress buffer area comprises at least two corner areas of the rectangular ring.

Wherein the stress buffer zone comprises four corner regions of the rectangular ring.

The lens seat part is provided with a first edge, the first edge is provided with an avoiding structure for avoiding a motor pin, and the stress buffer area comprises two corner areas, located on one side of the first edge, of the rectangular ring.

The lens seat part is provided with a second edge on the opposite side of the first edge, a third edge and a fourth edge, wherein the third edge and the fourth edge intersect with the first edge, and the widths of the second edge, the third edge and the fourth edge in a top view angle are all larger than that of the first edge.

Wherein the base portion further has a second side located on a side opposite to the first side, and third and fourth sides intersecting the first side; in a top view, the width of the second side is greater than the width of the third side and also greater than the width of the fourth side, and the stress buffer area includes four corner areas of the rectangular ring.

The width of the adhesive in the stress buffer area is 0.1-0.25mm, and the width of the adhesive in the main adhesive distribution area is 0.3-0.4 mm.

Wherein the top surface of the base portion is adapted to mount a motor or a lens carrier.

Wherein, the bottom surface of mirror seat portion is suitable for and installs in photosensitive assembly.

The lens seat part comprises a side wall and a supporting part formed by bending the top of the side wall, the top surface of the supporting part is suitable for mounting a motor or a lens carrier, and the cantilever beam is formed by inwards extending the supporting part.

Wherein the cantilever beam is thinner than the support part.

According to another aspect of the present application, there is also provided a camera module, which includes: any of the foregoing color filter assemblies; a lens assembly; and the color filtering component is positioned between the lens component and the photosensitive component.

The top surface of the lens seat part is supported and arranged on the bottom surface of the lens component, and the bottom surface of the lens seat part is supported and arranged on the top surface of the photosensitive component.

The photosensitive assembly comprises a circuit board and a photosensitive chip mounted on the surface of the circuit board, the bottom surface of the lens seat part is mounted on the surface of the circuit board, and the lens seat part surrounds the photosensitive chip.

The photosensitive assembly comprises a circuit board, a photosensitive chip mounted on the surface of the circuit board, an electronic element mounted on the surface of the circuit board and a packaging part surrounding the photosensitive chip and covering the electronic element, and the bottom surface of the lens seat part is mounted on the top surface of the packaging part.

The lens assembly is provided with a motor, the motor comprises a motor pin used for being electrically connected with a circuit board, the lens portion is provided with a first edge, the first edge is provided with an avoiding structure, the motor pin penetrates through the avoiding structure from the bottom surface of the motor and is connected to the circuit board, and the stress buffer area comprises two corner areas, located on one side of the first edge, of the rectangular ring.

According to still another aspect of the present application, there is also provided a multi-camera module, including: an outer bracket having a plurality of receiving holes; the camera module is provided with a plurality of camera modules, each camera module is arranged in one accommodating hole, and the outer side surface of the lens component of at least one camera module is bonded to the outer support through a rubber material.

According to still another aspect of the present application, there is also provided a multi-camera module, including: an outer bracket having a plurality of receiving holes; the camera module comprises a plurality of camera modules, each camera module is arranged in one accommodating hole, the outer side surface of the lens component of at least one camera module is bonded to the outer support through a rubber material, and the outer side surface of the lens seat of the camera module is also bonded to the outer support through a rubber material.

Compared with the prior art, the application has at least one of the following technical effects:

1. this application can reduce the cracked or crooked risk of filter in the module of making a video recording.

2. The optical filter can better adapt to the situation that the area thickness of the optical filter is larger, and the risk of the optical filter cracking or bending is obviously reduced. For example, the camera module may need to be processed under high temperature and low temperature environments during the assembly process, and such temperature variation may aggravate the risk of cracking or bending of the filter with large area thickness ratio.

3. In some embodiments of the present disclosure, the problem of uneven stress of the color filter support can be solved or suppressed by providing the stress buffer region, so as to reduce the risk of cracking or bending of the color filter. In some cases, the filter holder (sometimes also referred to as a base) for mounting the filter may be asymmetric (e.g., one side of the base may need to be free of the motor pins, resulting in a narrower base width or a complex base shape on that side), which may result in asymmetric filter holder stress and thus increased risk of cracking or bending of the filter, which may be suppressed by providing a stress buffer.

4. The risk of the fragmentation or the bending of the optical filter in the multi-camera module can be reduced by arranging the stress buffer area. The interaction of the outer support with the lens mount inside each module in a multi-camera module can create stresses that also exacerbate the risk of chipping or bending of filters with large area thickness ratios. The risk of the fracture or the bending of the optical filter in the multi-camera module can be reduced by arranging the stress buffer area.

Drawings

FIG. 1 illustrates a schematic cross-sectional view of a typical camera module of a cell phone;

FIG. 2A shows a schematic top view of a filter holder 210 in one embodiment of the present application;

FIG. 2B is a schematic top view of the filter holder 210 indicating the overlap region 213 according to one embodiment of the present disclosure;

FIG. 3 shows a schematic top view of a conventional camera module with a bracket 210 for mounting color filters;

FIG. 4 illustrates a schematic cross-sectional view of a camera module with a motor 120 in one embodiment of the present application;

fig. 5 illustrates a schematic top view of a filter holder 210 having an asymmetric structure in one embodiment of the present application;

fig. 6 shows a schematic top view of a filter holder 210 with an asymmetric structure in an alternative embodiment of the present application;

fig. 7 shows a schematic top view of a filter holder 210 having an asymmetric structure in another variant embodiment;

fig. 8 shows a schematic cross-sectional view of a camera module with a molding part 340 in another embodiment of the present application;

fig. 9 shows a schematic cross-sectional view of a camera module with a molding part 340 according to a further embodiment of the present application;

FIG. 10 illustrates a schematic cross-sectional view of a multi-camera module in one embodiment of the present application;

FIG. 11 is a schematic top view of a color filter holder 210 for stress buffering by reducing the width of the glue material in an embodiment of the present application;

FIG. 12 shows an enlarged schematic view of one of the corner regions of FIG. 11;

fig. 13 is a schematic top view of a color filter holder 210 for stress buffering by reducing the width of the rubber in another embodiment of the present application;

fig. 14 is a schematic top view of a color filter holder 210 for stress buffering by reducing the width of the rubber in accordance with another embodiment of the present application;

fig. 15 is a schematic top view of a color filter holder 210 for stress buffering by reducing the width of the rubber in accordance with still another embodiment of the present application;

fig. 16 is a schematic top view of a color filter holder 210 for stress buffering by using a soft rubber material according to another embodiment of the present application;

fig. 17 is a schematic top view of a color filter holder 210 for stress buffering by using a soft rubber material according to still another embodiment of the present application;

fig. 18 is a schematic top view of a color filter holder 210 for achieving stress buffering by using a soft rubber material according to still another embodiment of the present application.

Detailed Description

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.

It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

According to an embodiment of the present application, a camera module capable of reducing the risk of breaking or bending a filter is provided. Referring to fig. 1, in the present embodiment, the camera module includes a lens assembly 100, a filter assembly 200, and a photosensitive assembly 300. The lens assembly 100 includes an optical lens and its accessory components (e.g., the motor 120 or the lens carrier), the filter assembly 200 includes an optical filter and its accessory components, and the photosensitive assembly 300 includes a circuit board 310, a photosensitive chip 320 attached to a surface of the circuit board 310, and electronic components 330 (e.g., resistors, capacitors, etc.) mounted on the surface of the circuit board 310 and surrounding the photosensitive chip 320. Which is sometimes also referred to as color filter 220. In a mobile phone camera module, the color filter 220 is typically an IR filter, which can be used to filter out the infrared band to improve the image quality. In this embodiment, the auxiliary structural component of the filter assembly 200 may be a bracket 210, and the bracket 210 may include a ring-shaped base portion 211 and a cantilever beam 212 formed by extending inward from the base portion 211 (inward may be understood as a direction toward the optical center of the camera module), and the cantilever beam 212 has a light-passing hole in the center thereof so that light can pass through and be incident on the photosensitive chip 320. Further, fig. 2A shows a schematic top view of the filter holder 210 in an embodiment of the present application. Fig. 2B shows a schematic top view of the filter holder 210 indicating the overlap region 213 in one embodiment of the present application. Referring collectively to fig. 1, 2A and 2B, it can be seen that the filter may be attached to the surface of the cantilever beam 212 by adhesive. The adhesive glue is used here for adhering the IR filter and may therefore also be referred to as IR glue. Specifically, the surface of the cantilever beam 212 has an overlap region 213 that overlaps the filter. The overlapping region 213 here refers to a region of the surface of the cantilever 212 that overlaps with the filter in a plan view. The overlap area 213 includes a main glue area for disposing the adhesive glue (i.e., IR glue 230) and stress buffering areas located at corners of the overlap area 213 (referred to herein as corner areas 214), which may be free of the IR glue 230. As shown in fig. 2B, in the present embodiment, the overlapping area 213 is rectangular, has a rectangular through hole in the center thereof, and has a rectangular outer contour. The filter is mounted on the cantilever beam 212 at four sides thereof by the IR glue 230 (i.e. the IR glue 230 is disposed on the main glue area of the overlapping area 213), and no adhesive is disposed on the four corner areas 214 of the overlapping area 213, so that there is a gap between the four corner areas 214 of the filter and the four corner areas 214 of the surface of the cantilever beam 212 corresponding thereto (i.e. the two areas do not abut against each other at the four corner areas 214), thereby reducing the stress transmitted from the cantilever beam 212 to the filter. The design scheme can improve the problem that the color filter is fragile under the trend that the photosensitive chip of the camera module is larger and larger.

In particular, the inventor has found through research and experiments that the corners of the color filter are more likely to be chipped under the trend of increasing the size of the photosensitive chip of the camera module, and the reason can be summarized as follows: firstly, the increase of the area of the photosensitive chip leads to the increase of the required area of the color filter, while the thickness of the color filter is unchanged or reduced, which leads to the increase of the area/thickness ratio (i.e. the area-thickness ratio) of the color filter, which leads to the easier deformation and more brittleness of the color filter; secondly, filter fracture is caused by the stress and microcracks on the filter surface, which is mainly transmitted by its mounting bracket 210 (the bracket 210 can act as a lens holder for supporting the lens assembly 100 and has a cantilever beam 212 for mounting the filter), and when the stress acts on the filter, the microcracks on the filter surface are intensified to expand; furthermore, the CTE (coefficient of thermal expansion) of the color filter mounting bracket 210 is large, so that the color filter mounting bracket 210 is easily deformed to generate stress under high temperature or low temperature, particularly, the stress is more concentrated at the cantilever beam, and the cantilever beam corner is a shape abrupt change of the cantilever beam, so that the stress is more easily concentrated, and the stress is more concentrated at the color filter corner; finally, at low temperatures, IR glue 230 will be resilient and have a low stiffness such that the stresses created by lens holder portion 211 and cantilevered beam 212 are transmitted through the hardened IR glue 230 to the color filter. Based on the above analysis, the inventor designs a main adhesive dispensing region and a stress buffering region on the surface of the cantilever beam, the stress buffering region is located at the corner of the cantilever beam (specifically, the corner of the overlapping region 213), and the IR adhesive may not be arranged in the stress buffering region, so as to resolve a large amount of stress. On the other hand, since the IR glue is still disposed to the four sides of the cantilever beam, it is possible to provide sufficient adhesive strength, ensuring reliability of assembly. Fig. 3 shows a schematic top view of a conventional camera module with a bracket 210 for mounting color filters. Referring to fig. 3, in the conventional camera module, step glue is usually applied around the central light-transmitting hole, and the difference of the glue application method of this embodiment is that IR glue 230 (shown in fig. 2A) at four corners is eliminated. The design of this embodiment can prevent the stress from transmitting from the mirror base 211 and the cantilever beam 212 to the corner of the color filter, and prevent the color filter from being broken.

It should be noted that, in the above-mentioned embodiment, the four corner regions 214 of the overlapping region 213 of the cantilever beam 212 are all provided as stress buffering regions, but this is not the only implementation manner of the present application, and in other embodiments of the present application, two or other numbers of stress buffering regions may be provided, as long as the stress buffering regions are provided at the corners, the stress transmitted from the color filter support 210 to the color filter 220 can be significantly reduced, and at the same time, since at least four sides of the cantilever beam 212 can be disposed with the glue, the problems of poor adhesion or reliability reduction caused by too little glue can be avoided.

Further, in one embodiment, the holder 210 for mounting the color filter 220 may have an asymmetrical structure. Fig. 4 shows a schematic cross-sectional view of a camera module with a motor 120 according to an embodiment of the present application. Fig. 5 shows a schematic top view of a filter holder 210 with an asymmetric structure in one embodiment of the present application. Referring to fig. 4 and 5 in combination, in the present embodiment, the lens assembly 100 may have a motor 120, and the motor 120 is electrically connected to the circuit board 310 of the photosensitive assembly 300 through a motor pin 121. The bottom surface of the motor 120 can bear against and be attached to the mirror base portion 211 of the bracket 210. Since there are more motor pins 121 on one side of the motor 120 to achieve electrical connection with the circuit board 310, the side of the mirror base portion 211 on which the motor pins 121 are disposed has a narrower width (which can be understood as a width in a top view) to leave a clearance space, and the shape of the mirror base portion on the side is relatively complicated. In other words, in the present embodiment, the lens base portion 211 of the bracket 210 may have three wide sides and one narrow side, and the shape of the narrow side is complex, so that the narrow side and the complex shape both cause stress concentration on the narrow side. Therefore, in the present embodiment, two corner regions 214 located at one side of the narrow side can be set as stress buffering regions. The stress buffer avoids the placement of IR glue. This design can better accommodate a camera module having a motor, prevent stress from being transmitted from the lens holder portion 211 to a specific corner of the color filter 220 in a concentrated manner, and further prevent the color filter 220 from being broken. It should be noted that, although only two corner regions 214 of the overlapping region 213 are provided as the stress buffering regions in the present embodiment, the present application is not limited thereto, for example, in another embodiment, all four corner regions 214 of the overlapping region 213 may be provided as the stress buffering regions, and no glue material is disposed in any of the four corner regions 214 provided as the stress buffering regions, as shown in fig. 6 (fig. 6 shows a schematic top view of the color filter holder 210 with an asymmetric structure in a modified embodiment of the present application). For convenience of description, the complex-shaped side having the avoiding structure 219 is sometimes referred to herein as a first side 215, an opposite side thereof is referred to as a second side 216, and two sides perpendicular to (or intersecting) the first side 215 are referred to as a third side 217 and a fourth side 218, respectively.

Fig. 7 shows a schematic top view of a filter holder 210 having an asymmetric structure in another modified embodiment, in which the filter holder 210 has a wide side, two narrow sides, and a structurally complex side (the structurally complex side is a first side 215 in fig. 7) having an escape area for the motor pin 121 (i.e., having an escape structure 219 for escaping the motor pin 121). The two narrow sides are opposite sides (i.e. they are parallel to each other, in fig. 7, the two narrow sides are respectively the third side 217 and the fourth side 218), the wide side and the two narrow sides are perpendicular (or crossed), and the complex-structure side and the wide side are opposite sides (i.e. they are parallel to each other, in fig. 7, the wide side is the second side 216). In this embodiment, the four corner regions 214 of the cantilever beam 212 of the color filter holder 210 may be provided as stress buffer regions that avoid the arrangement of IR paste to significantly reduce the stress transmitted from the mirror base portion 211 and the cantilever beam 212 to the color filter 220, thereby preventing the color filter 220 from being broken. Compared with the embodiment shown in fig. 6, in the present embodiment, since the two wide sides are changed into the two narrow sides, the stress inside the bracket 210 is larger, and the color filter is more easily broken, so in the present embodiment, at the four corners, gaps are left between the color filter and the cantilever beam, that is, stress buffer regions are disposed at the positions corresponding to the four corners, thereby effectively preventing the color filter from being broken.

It should be noted that in other embodiments of the present application, the camera module may also adopt other filter holders with asymmetric structures, for example, four sides of the filter holder may all adopt different widths and shapes, that is, any two sides have different widths or shapes. At this time, gaps can be reserved between the color filter and the cantilever beam at four corners of the overlapped area of the color filter support, namely stress buffer areas are arranged at positions corresponding to the four corners, so that the color filter is effectively prevented from being cracked.

Further, fig. 8 shows a schematic cross-sectional view of a camera module with a mold part 340 in another embodiment of the present application. Referring to fig. 8, in the present embodiment, the photosensitive assembly 300 includes a circuit board 310, a photosensitive chip 320 mounted (which may be mounted by attaching) on a surface of the circuit board 310, and an electronic component 330 (which may be a resistor component, a capacitor component, or the like) mounted on a surface of the circuit board 310, and the electronic component 330 is disposed around the photosensitive chip 320. Further, in this embodiment, the photosensitive assembly 300 further includes a molding part 340 surrounding the photosensitive chip 320, and an optical window is formed in the center of the molding part 340 so that the photosensitive chip 320 receives the imaging light beam. The molding part 340 may be directly formed on the surface of the circuit board 310 based on a molding process. Specifically, the circuit board 310 may be pressed by using an upper mold and a lower mold, wherein the back surface of the circuit board 310 is supported by the lower mold, the upper mold is pressed on an edge area (the edge area may be referred to as a pressing edge) of the front surface of the circuit board 310, and the inner surface of the upper mold and the front surface (i.e., the upper surface) of the circuit board may together form a molding cavity. The desired molded part 340 is obtained by injecting a liquid molding material into the molding cavity and curing and molding the liquid molding material. The molding part 340 may not contact the photo chip 320, and may contact the side surface of the photo chip 320 (or an edge area of the side surface and the upper surface of the photo chip 320, which is generally a non-photosensitive area). Further, the color filter holder 210 is mounted on the top surface of the molding part 340 in this embodiment. The shape and configuration of the filter holder 210 may correspond to the previous embodiments, i.e., the filter holder 210 may include the mirror base portion 211 and the cantilever beam 212. Wherein the top surface of the lens mount portion 211 is adapted to bear against and mount the lens assembly 100. The lens assembly 100 may or may not have a motor 120 (e.g., the lens assembly may not have a motor when the camera module is a fixed focus module). In this embodiment, a color filter 220 is attached to the surface of the cantilever beam 212. The surface of the cantilever beam 212 has a rectangular shape with the overlapping region 213 of the color filter 220. Specifically, the overlapping area 213 is annular, and both an outer contour (refer to fig. 2B, in which a dotted frame 213a shows the outer contour of the overlapping area 213) and an inner contour (i.e., the contour of the light passing hole) may be rectangular, which will be referred to as rectangular rings hereinafter for convenience of description. Wherein a glue material (e.g., IR glue 230) for attaching a color filter is disposed on four sides of the rectangular ring, and the four corner regions 214 of the rectangular ring are not disposed with the glue material, so that a gap is left between the color filter 220 and the surface of the cantilever beam 212 at the position of the four corners, i.e., the four corner regions 214 can serve as stress buffering regions. Since the corner locations are stress concentrations of the filter holder 210, the design of the present embodiment can significantly reduce the stress experienced by the filter 220. Meanwhile, four sides of the cantilever beam 212 are all provided with enough adhesive materials for adhering the color filter, so that the stability and reliability of adhesion can be effectively ensured. It is noted that in other alternative embodiments, stress buffering regions may be provided in only two corner regions 214 or in other numbers of corner regions. The molding portion may be replaced by other types of packaging portions, for example, the packaging portion may be directly formed on the surface of the wiring board 310 based on other processes such as Transfer molding (Transfer molding) or Injection molding (Injection molding). The encapsulation portion covers the electronic component 330, and the top surface of the encapsulation portion can be mounted (e.g., attached) to the color filter holder 210.

Further, fig. 9 shows a schematic cross-sectional view of a camera module with a mold part 340 in another embodiment of the present application. Unlike the embodiment shown in fig. 8, in this embodiment, lens assembly 100 is directly mounted to the top surface of molding portion 340 (or package portion). The filter holder 210 is also mounted to the top surface of the molding 340 (or package) and the filter holder 210 is located inside the lens assembly seating area. Lens assembly receiving area is defined herein as the area of the top surface of mold 340 (or package) that is configured to receive a lens assembly. In this embodiment, the color filter holder 210 may have a mirror base portion 211 and a cantilever beam 212. Note that in the present embodiment, the mirror base portion 211 is only used for supporting the cantilever beam 212, and is not used as a mirror base of the lens assembly.

Further, the design idea of this application can also be applied to the many camera module group to solve the easy cracked or crooked problem of color filter among the many camera module group. Fig. 10 is a schematic cross-sectional view of a multi-camera module in an embodiment of the present application. In this embodiment, a plurality of (at least two) camera modules are combined together through a metal outer frame 400. Referring to fig. 10, in the present embodiment, the multi-camera module includes two camera modules and a metal external cradle 400. The metal outer bracket 400 is provided with two accommodating holes, the two camera modules are respectively arranged in the two accommodating holes, and the outer side surface of each camera module is bonded with the metal outer bracket 400 through a rubber material, so that a multi-camera module is assembled. Specifically, in the present embodiment, each camera module may include a lens assembly 100, a filter assembly 200, and a photosensitive assembly 300 (refer to fig. 1 and 4 in combination). Wherein the outer side of the lens assembly 100 may be the outer side of the lens carrier or motor 120, and the optical lens (which includes a lens barrel and a lens group mounted in the lens) may be mounted in the lens carrier or motor 120. A rubber material 410 can be disposed between the lens carrier/motor 120 and the metal outer frame 400, so as to assemble the camera module and the metal outer frame 400 together. Further, in the present embodiment, the filter assembly includes a filter holder 210 and a filter 220, wherein the filter holder 210 includes a base portion 211 and a cantilever beam 212. When the camera module adopts the camera module structure shown in fig. 1, the gap between the color filter holder 210 and the metal outer holder 400 can be arranged with a glue material (for example, in the case of the left camera module in fig. 10, the gap between the color filter holder 210 and the metal outer holder 400 can be arranged with a glue material 420), so as to improve the reliability of the adhesion between the camera module and the metal outer holder 400. In this embodiment, there is a gap between at least two corners of the color filter 220 and the cantilever 212 (i.e. there is a stress buffer region at least two corners, which avoids the arrangement of IR glue), so as to reduce the influence of the stress generated by the cooperation of the metal outer frame 400 and the color filter frame 210 at high or low temperature on the color filter and prevent the color filter from being cracked. In the multi-camera module, since the filter holder 210 deforms relatively more at high or low temperatures and the metal base 400 (whose CTE is relatively small) deforms less due to the difference in CTE, it is likely that a greater stress is generated inside the filter holder 210, corresponding to the metal base 400 restricting the deformation of the filter holder 210. In this embodiment, the stress buffering regions are disposed at least two corners of the cantilever 212 to absorb more stress from the color filter holder 210, so as to prevent the color filter 220 from being cracked or bent due to the stress transmitted to the color filter 220. Even in the case where the camera module is bonded to the metal exterior holder 400 only by the lens carrier/motor 120 (for example, in the case of the right-side camera module in fig. 10), since the lens assembly is bonded to the color filter holder 210 by the adhesive 430, when the lens assembly adhesive 430 (hereinafter, referred to as lens assembly adhesive 430 for convenience of description) is hardened at a low temperature, stress applied to the lens assembly by the metal exterior holder 400 is transmitted to the color filter holder 210 by the hardened lens assembly adhesive 430, thereby causing an increase in internal stress of the color filter holder 210. Therefore, according to the solution of the present embodiment, for the camera module bonded to the metal external frame 400 only through the lens carrier/motor 120, similarly, the stress buffer regions are disposed at least two corners of the cantilever beam 212, which can also absorb more stress from the color filter holder 210, thereby preventing the stress from being transmitted to the color filter to cause the color filter to be cracked or bent. On the other hand, sometimes the lens assembly adhesive 430 may overflow to contact the metal outer holder 400, and when the temperature changes, since the metal outer holder 400 deforms less to form an inward contraction effect, the contraction of the metal outer holder 400 (note that the contraction of the metal outer holder 400 is relative contraction with respect to the camera module) causes the stress of the metal outer holder 400 to be transmitted to the color filter holder 210 through the overflowing lens assembly adhesive 430 (the adhesive 430 may harden at a low temperature), so that a greater stress is generated inside the color filter holder 210. Therefore, the stress buffer regions disposed at least two corners of the cantilever 212 can absorb more stress from the color filter holder 210, and prevent the stress from being transmitted to the color filter 220 to break or bend the color filter 220. Further, in an embodiment of the present application, the lens assembly adhesive 430 may be prevented from overflowing by retracting the position of applying the lens assembly adhesive 430 inward, so that the lens assembly adhesive 430 is prevented from contacting the metal outer frame 400, thereby relieving the stress of the color filter holder 210, and preventing the color filter 220 from being cracked or bent due to the stress transmitted to the color filter 220. Here, retracting the application position of the lens assembly adhesive 430 inward means: the lens assembly adhesive 430 is disposed at a region closer to an optical axis, or an outer side surface of the lens assembly adhesive 430 is closer to the optical axis than outer side surfaces of the lens assembly and the color filter assembly, wherein the optical axis refers to an optical axis of the camera module.

In the above embodiments, the stress buffer area is disposed on the cantilever beam 212 and the IR glue is not used in the stress buffer area, so as to reduce and relieve the stress transmitted to the color filter, thereby preventing the color filter from being cracked or bent. However, the implementation of the stress buffering action therein is not limited thereto. Fig. 11 is a schematic top view of a color filter holder 210 for stress buffering by reducing the width of the rubber in one embodiment of the present application. Fig. 12 shows an enlarged schematic view of one of the corner regions of fig. 11. Referring to fig. 11 and 12, in the present embodiment, the cantilever beam 212 of the color filter holder 210 has the overlapping region 213 (the overlapping region 213 refers to a region where the cantilever beam 212 overlaps the color filter 220, and is shaped as a rectangular ring). The four corner regions 214 of the overlap region 213 are stress buffer regions. The IR glue 230 is arranged in the stress buffer area, and the width a of the IR glue in the stress buffer area is smaller than the width of the IR glue in the main glue dispensing area. Here, the width refers to the width of the rubber material in a plan view. The four sides of the overlap region 213 constitute the main rubberizing region. In this embodiment, since the width of the IR glue in the stress buffer is small, the stress transmitted from the corner of the cantilever 212 (as described above, the inventor found that the corner of the cantilever 212 is the stress concentration point) to the color filter 220 can be reduced, thereby significantly improving the problem of the color filter cracking or bending during the assembly process (or during the use process) of the camera module. In this embodiment, reference may be made to fig. 1 for a cross-sectional view of the camera module, which is not described herein again. Further, in one embodiment, the width a of the IR glue of the stress buffering area may be 0.1-0.25mm, and the width of the IR glue of the main glue spreading area may be 0.3-0.4 mm. When the width of the IR paste is 0.1 to 0.25mm, the IR paste is easily deteriorated (i.e., its adhesiveness is significantly decreased) at high or low temperatures. Therefore, for the camera module provided by this embodiment, the IR glue at the corner of the cantilever (i.e. the stress buffering region) can be separated from the color filter at high temperature or low temperature, so that the stress generated by the color filter holder is not transmitted to the corner of the color filter through the IR glue, or the stress transmitted from the corner of the cantilever of the color filter holder to the corner of the color filter can be effectively buffered due to the significantly reduced adhesion of the IR angle with a width of 0.1-0.25mm at high temperature or low temperature. Therefore, the camera module provided by the embodiment can effectively avoid the phenomena of fragmentation or bending of the color filter.

Further, fig. 13 is a schematic top view of a color filter holder 210 for achieving stress buffering by reducing the width of the adhesive material according to another embodiment of the present disclosure. In this embodiment, the cantilever beam 212 of the color filter holder 210 may have three broad sides and one narrow side, wherein the narrow side is a structurally complex side to avoid the motor pin 121. The stress buffering regions are disposed at two corner regions 214 (as shown in fig. 13) on one side of the narrow side (i.e., the side with a complicated structure), and the width of the IR glue of the stress buffering regions is smaller than that of the IR glue of the main glue dispensing region, so as to reduce the stress transmitted from the corner of the cantilever beam 212 on one side of the narrow side (in this embodiment, the corner of the cantilever beam 212 on one side of the narrow side is a stress concentration point) to the color filter 220, thereby significantly improving the problem of cracking or bending of the color filter during the assembly process (or during the use process) of the camera module. The cross-sectional view of the camera module of this embodiment may be the same as that of fig. 4, and is not repeated here. Further, in one embodiment, the width a of the IR glue of the stress buffering area may be 0.1-0.25mm, and the width of the IR glue of the main glue spreading area may be 0.3-0.4 mm.

Further, fig. 14 is a schematic top view of a color filter holder 210 for achieving stress buffering by reducing the width of the adhesive material in still another embodiment of the present application. The difference between this embodiment and the previous embodiment is that the four corner regions 214 of the cantilever beam 212 (i.e. the four corner regions 214 of the overlapping region 213) are all provided as stress buffering regions, and the width of the IR glue of the stress buffering regions is smaller than that of the IR glue of the main glue dispensing region, so as to reduce the stress transmitted from the corners of the cantilever beam 212 to the color filter 220, thereby significantly improving the problem of the color filter cracking or bending during the assembly process (or during the use process) of the camera module. Other structures of the present embodiment are the same as those of the previous embodiment, and the cross-sectional view of the camera module of the present embodiment can refer to fig. 4, which is not repeated herein. Further, in one embodiment, the width a of the IR glue of the stress buffering area may be 0.1-0.25mm, and the width of the IR glue of the main glue spreading area may be 0.3-0.4 mm.

Further, fig. 15 is a schematic top view of a color filter holder 210 for achieving stress buffering by reducing the width of the adhesive material in still another embodiment of the present application. This embodiment differs from the previous embodiment in that the cantilevered beam 212 of the filter holder 210 has a broad side, two narrow sides that are opposite sides of each other (i.e., substantially parallel), a broad side that is perpendicular to (or intersects) both of the narrow sides, and a structurally complex side that is opposite sides of each of the broad sides (i.e., substantially parallel). The structurally complex edge has an avoidance zone to avoid the motor pin 121. The four corner regions 214 of the cantilever beam 212 (i.e. the four corner regions 214 of the overlapping region 213) are all provided as stress buffering regions, and the width of the IR glue of the stress buffering regions is smaller than that of the IR glue of the main glue dispensing region, so as to reduce the stress transmitted from the corners of the cantilever beam 212 to the color filter 220, thereby significantly improving the problem of the color filter cracking or bending during the assembly process (or during the use process) of the camera module. Other structures of the present embodiment are the same as those of the previous embodiment, and the cross-sectional view of the camera module of the present embodiment can refer to fig. 4, which is not repeated herein. Further, in one embodiment, the width a of the IR glue of the stress buffering area may be 0.1-0.25mm, and the width of the IR glue of the main glue spreading area may be 0.3-0.4 mm.

Further, the above-mentioned scheme of implementing the stress buffering effect by reducing the width of the rubber material may also be applied to the embodiments corresponding to fig. 8, fig. 9, or fig. 10, and the specific principle may refer to the description of the corresponding embodiments, and is not described herein again.

Further, fig. 15 is a schematic top view of the color filter holder 210 for achieving stress buffering by using a soft adhesive material according to an embodiment of the present application. In this embodiment, the cantilever beam 212 of the color filter holder 210 has the overlapping region 213 (the overlapping region 213 refers to the region where the cantilever beam 212 overlaps the color filter 220, and is shaped as a rectangular ring). The four corner regions 214 of the overlap region 213 are stress buffer regions. The four sides of the overlap region 213 constitute the main rubberizing region. The stress buffer area is provided with IR glue, and the material of the IR glue of the stress buffer area can be different from that of the main glue distribution area. Specifically, the modulus of elasticity of the IR glue of the stress buffering zone may be less than the modulus of elasticity of the IR glue of the main glue area, i.e. the IR glue of the stress buffering zone may be softer than the IR glue of the main glue area. Thus, since the IR glue in the stress buffer is relatively flexible, the stress transmitted from the corner of the cantilever (which is found by the inventor as mentioned above) to the color filter can be reduced, and the problem of cracking or bending of the color filter during the assembly process (or during the use process) of the camera module can be significantly improved. In this embodiment, reference may be made to fig. 1 for a cross-sectional view of the camera module, which is not described herein again.

Further, fig. 16 is a schematic top view of a color filter holder 210 for achieving stress buffering by using a soft rubber material according to another embodiment of the present application. In this embodiment, the cantilever beam 212 of the color filter holder 210 may have three broad sides and one narrow side, wherein the narrow side is a structurally complex side to avoid the motor pin 121. The stress buffering regions are disposed at two corner regions 214 (as shown in fig. 16) on one side of the narrow side (i.e., the side with a complex structure), and the elastic modulus of the IR glue of the stress buffering regions is smaller than that of the IR glue of the main glue dispensing region (i.e., the IR glue of the stress buffering regions is softer than that of the main glue dispensing region), so as to reduce the stress transmitted from the corner of the cantilever beam on one side of the narrow side (the corner of the cantilever beam on one side of the narrow side in this embodiment is a stress concentration point) to the color filter, thereby significantly improving the problem of the color filter cracking or bending during the assembly process (or during the use process) of the camera module. The cross-sectional view of the camera module of this embodiment may be the same as that of fig. 4, and is not repeated here.

Further, fig. 17 is a schematic top view of a color filter holder 210 for achieving stress buffering by using a soft adhesive material according to still another embodiment of the present application. The difference between this embodiment and the previous embodiment is that the four corner regions 214 of the cantilever beam (i.e. the four corner regions 214 of the overlapping region 213) are all provided as stress buffering regions, and the elastic modulus of the IR glue of the stress buffering regions is smaller than that of the IR glue of the main glue region (i.e. the IR glue of the stress buffering regions is softer than that of the main glue region), so as to reduce the stress transmitted from the corners of the cantilever beam to the color filter, thereby significantly improving the problem of cracking or bending of the color filter during the assembly process (or during the use process) of the camera module. Other structures of the present embodiment are the same as those of the previous embodiment, and the cross-sectional view of the camera module of the present embodiment can refer to fig. 4, which is not repeated herein.

Further, fig. 18 is a schematic top view of a color filter holder 210 for achieving stress buffering by using a soft adhesive material according to still another embodiment of the present application. This embodiment differs from the previous embodiment in that the cantilevered beam 212 of the filter holder 210 has a broad side, two narrow sides that are opposite sides of each other (i.e., substantially parallel), a broad side that is perpendicular to (or intersects) both of the narrow sides, and a structurally complex side that is opposite sides of each of the broad sides (i.e., substantially parallel). The structurally complex edge has an avoidance zone to avoid the motor pin 121. The four corner regions 214 of the cantilever beam 212 (i.e. the four corner regions 214 of the overlapping region 213) are all provided as stress buffering regions, and the elastic modulus of the IR glue of the stress buffering regions is smaller than that of the IR glue of the main glue dispensing region (i.e. the IR glue of the stress buffering regions is softer than that of the main glue dispensing region), so as to reduce the stress transmitted from the corners of the cantilever beam to the color filter, thereby significantly improving the problem of the color filter cracking or bending during the assembly process (or during the use process) of the camera module. Other structures of the present embodiment are the same as those of the previous embodiment, and the cross-sectional view of the camera module of the present embodiment can refer to fig. 4, which is not repeated herein.

Further, the above-mentioned scheme of implementing the stress buffering effect by using the soft rubber material may also be applied to the embodiments corresponding to fig. 8, fig. 9, or fig. 10, and the specific principle may refer to the description of the corresponding embodiments, which is not described herein again.

In the above embodiments, the overlapping regions of the cantilever beams are all in the shape of rectangular rings, but the application is not limited thereto, for example, in some embodiments, rectangular rings may be replaced by other types of polygonal rings (e.g., polygonal rings with more than four sides). For the overlapping region of the polygonal ring, the intersection region of any two sides constitutes the corner region. The angle area may be set as the stress buffering area, and the sides of the overlapping area may be set as a main glue area, where the IR glue is arranged. The IR glue is not arranged in the stress buffer area, or the width of the IR glue of the stress buffer area is smaller than that of the IR glue of the main glue distribution area (the width refers to the width in a top view), or the elastic modulus of the IR glue of the stress buffer area is smaller than that of the IR glue of the main glue distribution area.

Further, referring to fig. 1, in one embodiment of the present application, the color filter holder 210 includes a holder portion 211 and a cantilever beam 212. And the thickness of the cantilever beam 212 is smaller than that of the mirror base portion 211. This kind of design both can guarantee the structural strength of lens seat portion 211 to stably provide the support for the lens subassembly reliably, can reduce the space that the cantilever beam took in the optical axis direction again, help reducing the height of the module of making a video recording (wherein height refers to the size of the module of making a video recording in its optical axis direction).

Further, still referring to fig. 1, in an embodiment of the present application, the base portion 211 includes a sidewall 211a and a support portion 211b formed by bending at the top of the sidewall 211a, the top surface of the support portion 211b is suitable for mounting a motor or a lens carrier, wherein the cantilever beam 212 is formed by extending the support portion 211b inward. The cantilever beam 212 has a thickness smaller than that of the support portion 211 b. This design can ensure the structural strength of the lens holder portion 211, and at the same time, a space can be left between the supporting portion 211b and the circuit board for mounting the electronic component 330. In this embodiment, the lens holder portion 211 includes a sidewall 211a and a support portion 211b, and a gap is formed between the support portion 211b and the circuit board, so that the stress of the lens holder portion 211 (or the color filter holder 210) may be relatively large. For example, the filter holder 210 of this embodiment may have a greater stress than the filter holder 210 of the embodiment shown in fig. 9. Therefore, with the color filter holder 210 structure adopted in this embodiment, the effect of preventing the color filter from being cracked or bent is more obvious by providing the stress buffering region on the cantilever beam 212 (wherein the stress buffering region has a different glue distribution manner from the main glue distribution region so as to reduce the stress transmitted to the color filter by the cantilever beam 212). On the other hand, in the embodiment, the bottom of the color filter holder 210 is directly mounted on the circuit board, and the circuit board is more susceptible to large deformation caused by temperature change than the molded part, so that the color filter holder 210 generates large stress. In this case, the effect of providing a stress buffer on the cantilever beam 212 to prevent the color filter from cracking or bending is more significant. That is, the effect of preventing the color filter from being chipped or bent may be more significant in the embodiment of the present embodiment than in the embodiment of fig. 8 and 9 (the embodiment in which the color filter holder 210 is attached to the top surface of the molding part).

In the above embodiments, the color filter is bonded to the upper surface of the cantilever of the color filter holder through the bottom surface thereof, that is, the adhesive dispensing regions of the cantilever are located on the upper surface thereof, but it should be noted that the present application is not limited thereto. For example, in other embodiments, the color filter may be bonded by its top surface to the lower surface of the cantilever beam of the color filter holder.

Further, in the above embodiment, the color filter holder has a portion for supporting and mounting the lens assembly and/or the photosensitive assembly, which can be regarded as the lens base portion, and the color filter holder further has a cantilever beam formed to extend inward from the lens base portion, and the cantilever beam can be used for mounting the color filter. The surface (which may be the upper surface or the lower surface) of the cantilever beam has an overlapping region overlapping (meaning overlapping in a top view or a bottom view) with the color filter, and the outline of the overlapping region is consistent with the outline of the color filter. The corners of the overlap region may directly correspond to the corners of the color filter. For example, when the color filter is substantially rectangular, the color filter has four corners, and the overlap region also has four corresponding corners. In the foregoing embodiments, the corners of the overlap region are sometimes referred to as corner regions.

In the foregoing embodiment, three specific ways for reducing the stress transmitted from the cantilever to the optical filter in the stress buffer region are provided, which are respectively: no IR glue is arranged; or the width of the IR glue of the stress buffer area is smaller than that of the IR glue of the main glue distribution area (the width refers to the width in a top view angle); or the elastic modulus of the IR glue of the stress buffer area is smaller than that of the IR glue of the main glue distribution area. It should be noted that the three implementation manners described above are not exhaustive, and in other embodiments of the present application, the stress buffering region may be implemented by other deformed glue dispensing manners as long as the deformed glue dispensing manners are different from the glue dispensing manner of the main glue dispensing region, and the stress transmitted to the optical filter by the cantilever beam may be reduced compared to the glue dispensing manner of the main glue dispensing region.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. A filter assembly for a camera module, the filter assembly comprising:

the bracket comprises an annular lens base part and a cantilever beam which is formed by extending inwards from the lens base part, wherein the center of the cantilever beam is provided with a light through hole; and

an optical filter attached to a surface of the cantilever beam by an adhesive, the surface of the cantilever beam having an overlapping region overlapping the optical filter; the overlapping area comprises a main adhesive distribution area and a stress buffer area, the main adhesive distribution area is used for arranging the adhesive, the stress buffer area is positioned at the corner of the overlapping area, and the stress buffer area is suitable for reducing the stress transmitted to the optical filter by the cantilever beam compared with the main adhesive distribution area.

2. A light filter assembly according to claim 1, wherein the stress buffering area is free of the adhesive glue.

3. The filter assembly of claim 1, wherein the stress buffer is disposed with the adhesive glue, and a width of the adhesive glue of the stress buffer is less than a width of the adhesive glue of the primary glue area.

4. The filter assembly of claim 1, wherein the adhesive glue comprises a first adhesive glue and a second adhesive glue, the first adhesive glue being disposed in the main glue area; the stress buffer area is arranged with the second adhesive glue, and the elastic modulus of the second adhesive glue is smaller than that of the first adhesive glue.

5. The filter assembly of claim 1, wherein the overlapping regions are rectangular rings, the primary glue region comprises four strip regions corresponding to four sides of the rectangular rings, and the stress buffer region comprises at least two corner regions of the rectangular rings.

6. A filter assembly according to claim 5, wherein the stress buffering regions comprise four corner regions of the rectangular annulus.

7. The filter assembly of claim 5, wherein the base portion has a first edge having an avoidance structure for avoiding a motor pin, the stress buffer zone comprising two of the corner regions of the rectangular ring on one side of the first edge.

8. The filter assembly of claim 7, wherein the base portion further has a second side opposite the first side, and third and fourth sides intersecting the first side, the second, third, and fourth sides each having a greater width in plan view than the first side.

9. The filter assembly of claim 7, wherein the base portion further has a second edge on a side opposite the first edge, and third and fourth edges intersecting the first edge; in a top view, the width of the second side is greater than the width of the third side and also greater than the width of the fourth side, and the stress buffer area includes four corner areas of the rectangular ring.

10. A light filter assembly according to claim 3, wherein said adhesive of said stress buffering regions has a width of 0.1-0.25mm, and said adhesive of said main adhesive regions has a width of 0.3-0.4 mm.

11. The filter assembly of claim 1, wherein the top surface of the base portion is adapted to mount a motor or a lens carrier.

12. The filter assembly of claim 1, wherein the bottom surface of the base portion is adapted to mount to a photosensitive assembly.

13. The filter assembly of claim 1, wherein the base portion includes a sidewall and a support portion bent at a top of the sidewall, a top surface of the support portion being adapted to mount a motor or a lens carrier, wherein the cantilever is formed by the support portion extending inward.

14. The filter assembly of claim 13, wherein the cantilever beam has a thickness less than a thickness of the support portion.

15. The utility model provides a module of making a video recording which characterized in that includes:

a color filter assembly as recited in any one of claims 1-14;

a lens assembly; and

the color filter assembly is positioned between the lens assembly and the photosensitive assembly.

16. The camera module of claim 15, wherein the top surface of the base portion bears against and mounts to the bottom surface of the lens assembly, and the bottom surface of the base portion bears against and mounts to the top surface of the photosensitive assembly.

17. The camera module according to claim 16, wherein the photosensitive assembly comprises a circuit board and a photosensitive chip mounted on a surface of the circuit board, a bottom surface of the lens holder portion is mounted on the surface of the circuit board, and the lens holder portion surrounds the photosensitive chip.

18. The camera module according to claim 16, wherein the photosensitive assembly comprises a circuit board, a photosensitive chip mounted on a surface of the circuit board, an electronic component mounted on a surface of the circuit board, and a package portion surrounding the photosensitive chip and covering the electronic component, and a bottom surface of the lens portion is mounted on a top surface of the package portion.

19. The camera module of claim 16, wherein the lens assembly has a motor, the motor includes a motor pin for electrically connecting to a circuit board, the lens portion has a first edge, the first edge has an escape structure, the motor pin passes through the escape structure from a bottom surface of the motor and is connected to the circuit board, the overlapping region is a rectangular ring, and the stress buffer region includes two of the corner regions of the rectangular ring on one side of the first edge.

20. A multi-camera module, comprising:

an outer bracket having a plurality of receiving holes;

the camera module of any of claims 15-19, and having a plurality of camera modules, each camera module being disposed within one of the receiving holes, wherein an outer side of the lens assembly of at least one of the camera modules is bonded to the outer frame by a glue.

21. A multi-camera module, comprising:

an outer bracket having a plurality of receiving holes;

the camera module of any of claims 15-19, and having a plurality of camera modules, each camera module being disposed in one of the receiving holes, wherein an outer side of the lens assembly of at least one of the camera modules is bonded to the outer frame by a glue, and an outer side of the lens mount portion of the camera module is also bonded to the outer frame by a glue.