CN113037227B - P-waveband ultra-wideband transmitting module - Google Patents
P-waveband ultra-wideband transmitting module Download PDFInfo
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- CN113037227B CN113037227B CN202110270182.4A CN202110270182A CN113037227B CN 113037227 B CN113037227 B CN 113037227B CN 202110270182 A CN202110270182 A CN 202110270182A CN 113037227 B CN113037227 B CN 113037227B
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- radio frequency
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/42—Modifications of amplifiers to extend the bandwidth
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
Abstract
The invention discloses a P-band ultra-wideband transmitting module, which comprises: a modulator and a preamplifier arranged at the lower layer of the heat sink substrate; the modulator and the preamplifier form a signal input module which is used for receiving an external excitation signal, converting the external excitation signal into a working signal and outputting the working signal to the signal processing module; the input matching circuit, the power tube and the output matching circuit are arranged on the upper layer of the heat sink substrate; the signal processing module consists of an input matching circuit, a power tube and an output matching circuit and is used for receiving the working signal, matching and amplifying the working signal and outputting the working signal to the standing wave monitoring circuit to be converted into a digital signal for outputting; the power tube and the modulator are respectively arranged on the upper layer and the lower layer of the heat sink substrate, and the modulator is prevented from electromagnetic interference by the metal heat sink substrate, so that the electromagnetic interference isolation is realized.
Description
Technical Field
The present invention relates to the field of communications. In particular to a P-band ultra-wideband transmitting module.
Background
The transmitting module is an important component of a solid-state transmitter or phased array TR assembly, and a conventional transmitting module includes: the traditional P-band transmitting module uses a coaxial Transmission Line Transformer (TLT) as an output matching circuit, so that the cost is high and the manufacturing manufacturability is poor; the microstrip balun transformer replacing the TLT is composed of a coupling line with a quarter wavelength, and because the microstrip balun transformer has a long working wavelength and a large volume under the working frequency of tens of mega to hundreds of megahertz, a technical scheme capable of solving the problems is urgently needed at present.
Disclosure of Invention
In order to solve at least one of the above problems, an object of the present invention is to provide a P-band ultra-wideband transmitting module, comprising:
a modulator and a preamplifier arranged at the lower layer of the heat sink substrate; the modulator and the preamplifier form a signal input module which is used for receiving an external excitation signal, converting the external excitation signal into a working signal and outputting the working signal to the signal processing module;
the input matching circuit, the power tube and the output matching circuit are arranged on the upper layer of the heat sink substrate; the signal processing module consists of an input matching circuit, a power tube and an output matching circuit and is used for receiving the working signal, matching and amplifying the working signal, and outputting the working signal to the standing wave monitoring circuit to be converted into a digital signal for outputting.
The external excitation signal comprises a TTL signal, a direct current voltage signal and a radio frequency excitation signal;
a first input end of the modulator receives a TTL signal, a second input end of the modulator receives a direct current voltage signal, and the modulator carries out filtering and radio frequency isolation on the direct current voltage signal according to the TTL signal to generate a drain electrode working voltage of the power tube;
and the second output end of the modulator is used for outputting the grid bias voltage of the power tube.
The drain electrode working voltage is used for controlling the switching between the working state and the off state of the power tube;
the grid bias voltage is used for controlling the C-type working state of the power tube.
The pre-amplifier is used for receiving the radio frequency excitation signal, amplifying the radio frequency excitation signal and outputting the radio frequency excitation signal to a third input end of the input matching circuit;
the input matching circuit converts the amplified radio frequency excitation signal into two paths of signals with the same amplitude and phase difference of 180 degrees, the two paths of signals are matched by a part of LC and then output to a grid electrode of the power tube, and a source electrode of the power tube is grounded;
the partial LC refers to the combination of a planar balun and an LC resonance circuit, and the planar balun and the LC resonance circuit jointly realize impedance matching.
The power tube amplifies the two paths of signals and outputs the signals to the output matching circuit, and the output matching circuit matches the two paths of input signals and synthesizes and converts the signals into a path of radio frequency signals.
The standing wave monitoring circuit is used for converting the radio frequency signal output by the output matching circuit into a digital signal and outputting the digital signal.
The standing wave monitoring circuit consists of a dual directional coupler, a detector and an A/D converter;
and the radio frequency signal output by the output matching circuit is converted into a digital signal through the double directional coupler, the detector and the A/D converter and then output.
The dual directional coupler couples the radio frequency signal into a main power signal and a reflected power signal; and the main power signal forms an analog signal through the detector, enters the A/D converter to generate a digital signal and is output.
Preferably, the dual directional coupler and the detector are arranged on the upper layer of the heat sink substrate; the A/D converter is arranged on the lower layer of the heat sink substrate.
The invention has the following beneficial effects:
the P-band ultra-wideband transmitting module provided by the invention adopts the input matching circuit and the output matching circuit in the form of planar balun coupling resonance, digitally monitors standing waves, and meanwhile embeds part of circuits on the bottom surface of the heat sink substrate in a layered manner, thereby solving the problems of large volume and low manufacturability of the traditional P-band transmitting module.
Drawings
Fig. 1 shows a schematic diagram of a P-band ultra-wideband transmitting module according to an embodiment of the present invention.
Detailed Description
In order to more clearly illustrate the present invention, the present invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar components in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
An embodiment of the present invention provides a P-band ultra-wideband transmitting module, as shown in fig. 1, including: modulator 1, preceding amplifier 2, input matching circuit 3, power tube 4, output matching circuit 5 still include: standing wave monitoring circuit 6, heat sink base plate 10.
The standing wave monitoring circuit 6 is composed of a dual directional coupler 7, a detector 8 and an a/D converter 9.
The modulator 1 and the preceding stage amplifying circuit 2 form a signal input module, and are used for receiving an external excitation signal, converting the external excitation signal into a working signal and outputting the working signal to the signal processing module; the signal processing module is composed of an input matching circuit 3, a power tube 4 and an output matching circuit 5, and is used for receiving the working signal, matching and amplifying the working signal, and outputting the working signal to the standing wave monitoring circuit to be converted into a digital signal for outputting.
The low-voltage output end of the modulator 1 is connected with the power supply end of the preamplifier 2, the negative-voltage output end of the modulator 1 is connected with the grid electrode of the power tube 4 through the input matching circuit 3, and the high-voltage output end of the modulator 1 is connected with the drain electrode of the power tube 4 through the output matching circuit 5;
the output end of the pre-stage amplifier 2 is connected with the input end of the input matching circuit 3, the output end of the input matching circuit 3 is connected with the grid electrode of the power tube 4, the drain electrode of the power tube 4 is connected with the input end of the output matching circuit 5, and the source electrode of the power tube 4 is grounded; the output end of the output matching circuit 5 is connected with the input end of the standing wave monitoring circuit 6; in the standing wave monitoring circuit 6, the output end of the dual directional coupler 7 is connected to the input end of the detector 8, and the output end of the detector 8 is connected to the input end of an a/D converter (analog-to-digital converter) 9.
The modulator 1, the preamplifier 2 and the A/D converter 9 are embedded in the lower layer of a heat sink substrate 10, and the input matching circuit 3, the power tube 4, the output matching circuit 5, the dual directional coupler 7 and the detector 8 are arranged on the upper layer of the heat sink substrate 10; the heat sink substrate 10 is a metal heat sink substrate and is used for realizing rapid uniform temperature heat dissipation and electromagnetic interference isolation.
When the transmitting circuit works, the low-voltage output end of the modulator 1 provides the working voltage of the preamplifier 2; the negative voltage output end of the modulator 1 outputs a grid bias voltage required by the power tube 4, and the grid bias voltage is connected to the grid of the power tube 4 through the input matching circuit so as to control the C-class working state of the power tube 4; meanwhile, the modulator 1 filters and isolates the direct current voltage received by the second input end into a drain working voltage required by the power tube 4 according to the TTL signal received by the first input end, and then converts the direct current voltage into a drain working voltage required by the power tube 4, and the drain working voltage is output by the high-voltage output end and is connected to the drain of the power tube 4 through the output matching circuit 5 so as to control the working state and the off state of the power tube 4; the direct-current voltage is 40-46V; the working efficiency of the C-type working state can reach 70% -80%, and the working efficiency of the circuit is improved.
An external radio frequency excitation signal RF in is input to a preamplifier 2 to be amplified, the preamplifier 2 outputs the amplified radio frequency excitation signal to an input matching circuit 3, the amplified radio frequency excitation signal is matched and converted into two paths of signals with the same amplitude and 180-degree phase difference through partial LC (resonance) in the input matching circuit 3, the two paths of signals are input to a power tube 4, the two paths of signals are amplified by the power tube, the two paths of signals are output to an output matching circuit 5, the two paths of signals are matched through partial LC in the output matching circuit 5 and then synthesized into a path of high-power radio frequency signal, and the high-power radio frequency signal is radiated outwards after being transmitted to a standing wave monitoring circuit 6. A double directional coupler 7 in the standing wave monitoring circuit 6 couples an input high-power radio frequency signal out of milliwatt-level main power and reflected power, and sends the coupled high-power radio frequency signal to a detector 8 to form an analog level signal, and the analog signal is converted into a digital signal by an A/D converter 9 and is output.
The partial LC refers to the combination of a planar balun and an LC resonant circuit, and the planar balun and the LC resonant circuit together realize impedance matching
In a specific embodiment, the external dimension (including a heat sink substrate) of the P-band ultra-wideband transmitting module is 100 × 50 × 13 (length × width × height, unit: mm), wherein the size of the power tube is 40 × 10 (length × width, unit: mm), and the heat emitted by the power tube can be rapidly dissipated by conducting through the lower metal surface of the heat sink substrate and contacting with an external cold plate. The P-band ultra-wideband transmitting module works at hundreds of megahertz frequency, the output power is 1000W, and the efficiency can reach 70%. In addition, the LC matching in the matching circuit of the transmitting module is slightly adjusted, and the working frequency can be as low as tens of MHz, namely, the transmitting module works in a meter wave band.
The invention adopts surface-mounted devices except the power tube 4, thereby improving the manufacturability and the integration level; the impedance matching is realized by combining the LC resonance circuit and the planar balun, so that the volume of the transmitting module is reduced; the power tube and the modulator are respectively arranged on the upper layer and the lower layer of the heat sink substrate, and the metal heat sink substrate enables the modulator to be free from electromagnetic interference of the power tube, so that electromagnetic interference isolation is realized.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.
Claims (6)
1. A P-band ultra-wideband transmit module, comprising:
a modulator and a preamplifier disposed at the lower layer of the heat sink substrate; the modulator and the preamplifier form a signal input module which is used for receiving an external excitation signal, converting the external excitation signal into a working signal and outputting the working signal to the signal processing module;
the input matching circuit, the power tube and the output matching circuit are arranged on the upper layer of the heat sink substrate; the signal processing module consists of an input matching circuit, a power tube and an output matching circuit and is used for receiving the working signal, matching and amplifying the working signal, and outputting the working signal to the standing wave monitoring circuit to be converted into a digital signal for outputting;
the external excitation signal comprises a TTL signal, a direct current voltage signal and a radio frequency excitation signal;
the first input end of the modulator receives the TTL signal, the second input end of the modulator receives the direct-current voltage signal, and the modulator carries out filtering and radio frequency isolation on the direct-current voltage signal according to the TTL signal to generate the drain electrode working voltage of the power tube;
the second output end of the modulator is used for outputting the grid bias voltage of the power tube; the standing wave monitoring circuit consists of a dual directional coupler, a detector and an A/D converter;
the radio frequency signal output by the output matching circuit is converted into a digital signal by the double directional coupler, the detector and the A/D converter in sequence and then output;
the dual directional coupler and the detector are arranged on the upper layer of the heat sink substrate; the A/D converter is arranged on the lower layer of the heat sink substrate.
2. The P-band ultra-wideband transmit module of claim 1,
the drain electrode working voltage is used for controlling the switching between the working state and the off state of the power tube;
the grid bias voltage is used for controlling the C-type working state of the power tube.
3. The P-band ultra-wideband transmit module of claim 1,
the pre-amplifier is used for receiving the radio frequency excitation signal, amplifying the radio frequency excitation signal and outputting the radio frequency excitation signal to a third input end of the input matching circuit;
the input matching circuit converts the amplified radio frequency excitation signal into two paths of signals with the same amplitude and phase difference of 180 degrees, and the two paths of signals are matched by a part of LC and then output to a grid electrode of the power tube; the source electrode of the power tube is grounded;
the partial LC refers to the combination of a planar balun and an LC resonance circuit, and the planar balun and the LC resonance circuit jointly realize impedance matching.
4. The P-band ultra-wideband transmit module of claim 3,
the power tube amplifies the two paths of signals and outputs the signals to the output matching circuit, and the output matching circuit matches the two paths of input signals and synthesizes the signals into a path of radio frequency signal.
5. The P-band ultra-wideband transmit module of claim 1,
the standing wave monitoring circuit is used for converting the radio frequency signal output by the output matching circuit into a digital signal.
6. The P-band ultra-wideband transmit module of claim 1,
the dual directional coupler couples the radio frequency signal into a main power signal and a reflected power signal; and the main power signal forms an analog signal through the detector, enters the A/D converter to generate a digital signal and is output.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110270182.4A CN113037227B (en) | 2021-03-12 | 2021-03-12 | P-waveband ultra-wideband transmitting module |
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| CN202110270182.4A CN113037227B (en) | 2021-03-12 | 2021-03-12 | P-waveband ultra-wideband transmitting module |
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| CN113037227A CN113037227A (en) | 2021-06-25 |
| CN113037227B true CN113037227B (en) | 2023-03-03 |
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Citations (6)
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| CN105024154A (en) * | 2015-07-08 | 2015-11-04 | 东莞电子科技大学电子信息工程研究院 | Multi-element low-temperature co-fired ceramic (LTCC) microwave radio-frequency circuit and method for using same |
| KR20180078169A (en) * | 2016-12-29 | 2018-07-09 | 스카이워크스 솔루션즈, 인코포레이티드 | Front end systems and related devices, integrated circuits, modules, and methods |
| DE102017107834A1 (en) * | 2017-04-11 | 2018-10-11 | Osram Opto Semiconductors Gmbh | RADIATION-EMITTING COMPONENT |
| CN109698676A (en) * | 2017-10-24 | 2019-04-30 | 包改欣 | Ultra wide band Miniature power amplifier based on PTT technology |
| CN111103569A (en) * | 2019-12-19 | 2020-05-05 | 南京吉凯微波技术有限公司 | Satellite-borne active phased array four-channel microwave TR component capable of self-heating |
| CN111969968A (en) * | 2020-08-27 | 2020-11-20 | 无锡华测电子系统有限公司 | Novel X-waveband all-solid-state transmitter |
-
2021
- 2021-03-12 CN CN202110270182.4A patent/CN113037227B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105024154A (en) * | 2015-07-08 | 2015-11-04 | 东莞电子科技大学电子信息工程研究院 | Multi-element low-temperature co-fired ceramic (LTCC) microwave radio-frequency circuit and method for using same |
| KR20180078169A (en) * | 2016-12-29 | 2018-07-09 | 스카이워크스 솔루션즈, 인코포레이티드 | Front end systems and related devices, integrated circuits, modules, and methods |
| DE102017107834A1 (en) * | 2017-04-11 | 2018-10-11 | Osram Opto Semiconductors Gmbh | RADIATION-EMITTING COMPONENT |
| CN109698676A (en) * | 2017-10-24 | 2019-04-30 | 包改欣 | Ultra wide band Miniature power amplifier based on PTT technology |
| CN111103569A (en) * | 2019-12-19 | 2020-05-05 | 南京吉凯微波技术有限公司 | Satellite-borne active phased array four-channel microwave TR component capable of self-heating |
| CN111969968A (en) * | 2020-08-27 | 2020-11-20 | 无锡华测电子系统有限公司 | Novel X-waveband all-solid-state transmitter |
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