CN113035473A - Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot - Google Patents
Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot Download PDFInfo
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- CN113035473A CN113035473A CN202110165234.1A CN202110165234A CN113035473A CN 113035473 A CN113035473 A CN 113035473A CN 202110165234 A CN202110165234 A CN 202110165234A CN 113035473 A CN113035473 A CN 113035473A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
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Abstract
The invention relates to the technical field of electrical elements, in particular to a double-cap SMD wire-wound chip resistor capable of avoiding breakage of an alloy wire at a welding spot, which comprises a resistor body and a packaging shell, wherein the resistor body comprises a porcelain rod, an alloy resistance wire and a protective layer, the alloy resistance wire is wound on the outer wall of the porcelain rod, fixing holes are formed in the left end surface and the right end surface of the porcelain rod, a rubber sleeve is bonded on the inner wall of each fixing hole, a left inner-layer cap is sleeved at the left end of the porcelain rod, and a right inner-layer cap is sleeved at the right end of the porcelain rod; the left end of the left inner layer cap is sleeved with a left outer layer cap, the right end of the right inner layer cap is sleeved with a right outer layer cap, and the outer parts of the ceramic rod and the alloy resistance wire are jointly wrapped with a protective layer; the invention can integrally and fixedly install the porcelain rod, the inner layer cap and the outer layer cap, and adopts the design of single-end double caps, so that the alloy resistance wire and the welding spot thereof cannot be influenced when the porcelain rod is subjected to mechanical external force which does not damage the protective layer, and the problem of open circuit caused by the breakage of the resistance alloy wire is also avoided.
Description
Technical Field
The invention relates to the technical field of electrical elements, in particular to a double-cap SMD wire-wound chip resistor capable of avoiding breakage of alloy wires at welding spots.
Background
The use of Surface Mount Technology (SMT) has become very common, and the proportion of electronic products assembled by SMT has exceeded 90%. The SMT technology should be applied to China from the eighties. With the development of small-sized SMT production equipment, the application range of SMT is further expanded, and various electronic products or parts with small batch sizes are produced by adopting SMT in the fields of aviation, aerospace, instruments, machine tools and the like.
The SMD means a surface mounting device, which is one of SMT components, and the SMD wire-wound chip resistor belongs to a metal glass glaze resistor, and is a product integrating metal powder and glass glaze powder, and the resistor is manufactured by printing the mixture on a substrate by a screen printing method, is moisture-resistant, high-temperature-resistant, small in temperature coefficient, capable of greatly saving circuit space cost, more refined in design, stable in electrical property, high in reliability, low in assembly cost, high in mechanical strength and superior in high-frequency characteristic.
At present, an SMD wire-wound chip resistor used in China structurally comprises a resistance wire wound on a framework made of ceramics or other materials, wherein the end of the resistance wire is connected with a lead-out wire through a cap, and cooling water or other materials are arranged outside the resistance wire to achieve a heat dissipation effect so as to improve the service power of the resistor; however, the conventional MD wire-wound chip resistor still has some disadvantages, as shown in fig. 8, the prior art is a single-end single-cap structure, the alloy resistance wire is wound around the outer wall of the ceramic rod, two ends of the alloy resistance wire are respectively welded to the outer walls of the two caps, and the outer wall of the alloy resistance wire is coated with a protective layer; in addition, the cap covers are directly installed at the two ends of the porcelain rod through the cap pressing equipment, the falling phenomenon can often occur, the resistors can also often fail, and the service life is short.
Disclosure of Invention
The invention provides a double-cap SMD wire-wound chip resistor capable of avoiding the breakage of an alloy wire at a welding spot, aiming at the problems in the prior art.
The invention is realized by the following technical scheme:
a double-cap SMD wire-wound chip resistor capable of avoiding breakage of an alloy wire at a welding spot comprises a resistor body and a packaging shell, wherein the resistor body comprises a porcelain rod, an alloy resistance wire and a protective layer, the alloy resistance wire is wound on the outer wall of the porcelain rod, fixing holes are formed in the left end surface and the right end surface of the porcelain rod, a rubber sleeve is bonded on the inner wall of each fixing hole, a left inner layer cap is sleeved on the left end of the porcelain rod, a right inner layer cap is sleeved on the right end of the porcelain rod, the cylindrical outer wall of the left inner layer cap is electrically connected with the left starting end of the alloy resistance wire, the cylindrical outer wall of the right inner layer cap is electrically connected with the right tail end of the alloy resistance wire, jacks are formed in cover plates of the left inner layer cap and the right inner layer cap, expansion sleeves are fixed on the inner sides of the two jacks, and a left metal lead is welded on the cover plate outer wall of the left inner layer cap through fusible, the outer wall of the cover plate of the right inner-layer cap is welded with a right metal lead through fusible metal; the left end of the left inner layer cap is sleeved with a left outer layer cap, the right end of the right inner layer cap is sleeved with a right outer layer cap, the inner side walls of cover plates of the left outer layer cap and the right outer layer cap are both fixed with fixing rods, and the fixing rods and the expansion sleeve are installed in an interference fit manner; the protective layer is wrapped outside the ceramic rod and the alloy resistance wire together, and sequentially comprises a fusing layer, a barrier layer and an insulating paint layer from inside to outside;
the utility model discloses a resistor, including encapsulation casing, resistor body, temperature fuse, right metal lead, a pair of pin hole has been seted up on the bottom plate of encapsulation casing, and is a pair of the inside of pin hole is worn to be equipped with respectively left metal lead with right metal lead, the front surface veneer of encapsulation casing has the encapsulation apron.
As a further improvement of the above scheme, the expansion sleeve comprises an integrally formed sleeve, a front expansion block and a rear expansion block, a plurality of strip-shaped grooves are formed in the outer side walls of the front expansion block and the rear expansion block, and arc-shaped grooves matched with the fixing rods are formed in the inner side walls of the front expansion block and the rear expansion block.
As a further improvement of the scheme, the outer wall of the sleeve is further provided with a pair of grooves, and elastic pieces which are outwards opened are fixed inside the grooves.
As a further improvement of the scheme, the fixed rod is in a circular truncated cone shape, and the exposed end of the fixed rod has the smallest section radius.
As a further improvement of the above scheme, the outer surface of the insulating paint layer is flush with the outer surfaces of the left outer layer cap and the right outer layer cap.
As a further improvement of the scheme, the center positions of the cover plates of the left outer layer cap and the right outer layer cap are both provided with round holes.
As a further improvement of the above solution, the left inner cap and the right inner cap are made of iron, and the left outer cap and the right outer cap are made of insulating plastic.
As a further improvement of the above solution, the production process of the double cap SMD wire wound chip resistor comprises the steps of:
a. welding: firstly, welding a temperature fuse on the right metal lead wire, and cutting off the redundant lead wire after welding
b. Installation: installing the assembled resistor body and the temperature fuse in a packaging shell;
c. packaging: pouring glue into the packaging shell, packaging the resistor body and the temperature fuse in the shell, bending the left metal lead and the right metal lead, and enabling the left metal lead and the right metal lead to penetrate out of the pair of lead holes;
d. forming and cutting feet: the metal lead after the sealing glue is finished can be made into a horizontal type or a vertical type;
e. and (3) testing: and testing the resistance value precision of the resistor, and removing defective products.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention adopts the design of single end and double caps, the outer cap is sleeved on the outer wall of the inner cap when the device is installed, so that the alloy resistance wire and the welding spot on the outer wall of the inner cap can be protected by the outer cap sleeve, the alloy resistance wire and the welding spot thereof cannot be influenced when the device is subjected to mechanical external force which does not damage a protective layer in later application, and the problem of open circuit caused by breakage of the resistance alloy wire is also avoided.
2. In the invention, when the left inner cap and the right inner cap are installed, because the cover plates of the left inner cap and the right inner cap are respectively provided with the jacks, the inner sides of the two jacks are fixedly provided with the expansion sleeves which are respectively correspondingly inserted into the fixed holes arranged on the left end surface and the right end surface of the porcelain rod, the inner walls of the fixed holes are bonded with the rubber sleeves, then the left outer cap and the right outer cap are respectively sleeved on the outer walls of the left inner cap and the right inner cap, the inner side walls of the cover plates of the left outer cap and the right outer cap are respectively and fixedly provided with the fixed rods which are respectively and correspondingly inserted into the two expansion sleeves, because the fixed rods and the expansion sleeves are installed in an interference fit manner, after the fixed rods are inserted into the expansion sleeves, the front expansion block and the rear expansion block inside the expansion sleeves are respectively bent outwards and deformed, and because the outer side walls of the front expansion block and the rear expansion block are respectively provided with a plurality of strip grooves, therefore, the final front expansion block and the final rear expansion block can be abutted against the inner wall of the rubber sleeve, so that the integrated fixed installation of the porcelain rod, the inner-layer cap and the outer-layer cap is realized, the cap is not easy to fall off after being subjected to external force, the resistance failure is avoided, and the service life of the resistance is ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic perspective view of a package cover plate according to the present invention before installation;
FIG. 2 is an exploded view of the present invention;
FIG. 3 is a schematic perspective view of a resistor body according to the present invention;
FIG. 4 is a schematic structural view of the resistor body according to the present invention before assembly;
FIG. 5 is a schematic view of the installation of the left inner cap, the porcelain rod and the right inner cap in the present invention;
FIG. 6 is a schematic view of the fitting of the expansion sleeve and the fixing rod according to the present invention;
FIG. 7 is a schematic structural view of an expansion shell in example 2 of the present invention;
fig. 8 is a schematic diagram of a resistor with a single-ended single-cap structure in the prior art.
The resistor comprises a resistor body 1, a ceramic rod 101, an alloy resistance wire 102, a protective layer 103, a fixing hole 104, a rubber sleeve 105, a rubber sleeve 106, a left inner layer cap 107, a right inner layer cap 108, an insertion hole 109, an expansion sleeve 1091, a sleeve 1092, a front expansion block 1093, a rear expansion block 1094, a strip groove 1094, a groove 1095, an elastic sheet 1096, a left outer layer cap 110, a right outer layer cap 111, a fixing rod 112, a round hole 113, a packaging shell 2, a metal lead 3-left, a metal lead 4-right, a temperature fuse 5, a lead hole 6 and a packaging cover plate 7.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
The invention is further described below with reference to the accompanying drawings.
Example 1
As shown in fig. 1-6, a double-cap SMD wire-wound chip resistor capable of avoiding breakage of an alloy wire at a welding spot comprises a resistor body 1 and a packaging shell 2, the resistor body 1 comprises a porcelain rod 101, an alloy resistance wire 102 and a protective layer 103, the outer wall of the porcelain rod 101 is wound with the alloy resistance wire 102, the left and right end faces of the porcelain rod 101 are both provided with a fixing hole 104, the inner wall of the fixing hole 104 is bonded with a rubber sleeve 105, the left end of the porcelain rod 101 is sleeved with a left inner cap 106, the right end of the porcelain rod 101 is sleeved with a right inner cap 107, the outer cylindrical wall of the left inner cap 106 is electrically connected with the left starting end of the alloy resistance wire 102, the outer cylindrical wall of the right inner cap 107 is electrically connected with the right end of the alloy resistance wire 102, the cover plates of the left inner cap 106 and the right inner cap 107 are both provided with insertion holes 108, expansion sleeves 109 are fixed on the inner sides of the two insertion holes 108, the outer wall of the cover plate of the, the outer wall of the cover plate of the right inner-layer cap 107 is welded with a right metal lead 4 through fusible metal; a left outer layer cap 110 is sleeved at the left end of the left inner layer cap 106, a right outer layer cap 111 is sleeved at the right end of the right inner layer cap 107, fixing rods 112 are fixed on the inner side walls of the cover plates of the left outer layer cap 110 and the right outer layer cap 111, and the fixing rods 112 and the expansion sleeve 109 are installed in an interference fit mode; the protective layer 103 is wrapped outside the ceramic rod 101 and the alloy resistance wire 102 together, and the protective layer 103 sequentially comprises a fusing layer, a barrier layer and an insulating paint layer from inside to outside;
wherein, the fixed rod 112 is in a shape of a circular truncated cone, and the exposed end of the fixed rod 112 has the smallest radius of the section; the outer surface of the insulating paint layer is flush with the outer surfaces of the left outer layer cap 110 and the right outer layer cap 111; the center positions of the cover plates of the left outer layer cap 110 and the right outer layer cap 111 are both provided with round holes 113; the left inner cap 106 and the right inner cap 107 are made of iron, and the left outer cap 110 and the right outer cap 111 are made of insulating plastic; expansion sleeve 109 includes integrated into one piece's sleeve 1091, preceding inflation piece 1092 and back inflation piece 1093, and a plurality of bar groove 1094 has all been seted up to preceding inflation piece 1092 and the lateral wall of back inflation piece 1093, and the arc wall of installing with fixed rod 112 cooperation is all seted up to preceding inflation piece 1092 and the inside wall of back inflation piece 1093.
The production process of the double-cap SMD wire-wound chip resistor comprises the following steps:
a. welding: firstly, welding a temperature fuse on the right metal lead wire, and cutting off the redundant lead wire after welding
b. Installation: installing the assembled resistor body and the temperature fuse in a packaging shell;
c. packaging: pouring glue into the packaging shell, packaging the resistor body and the temperature fuse in the shell, bending the left metal lead and the right metal lead, and enabling the left metal lead and the right metal lead to penetrate out of the pair of lead holes;
d. forming and cutting feet: the metal lead after the sealing glue is finished can be made into a horizontal type or a vertical type;
e. and (3) testing: and testing the resistance value precision of the resistor, and removing defective products.
In this embodiment, the assembly process of the resistor body 1 in the production process of the double-cap SMD wire-wound chip resistor is as follows: firstly, both the left end face and the right end face of a porcelain rod 101 are provided with a fixing hole 104, a rubber sleeve 105 is bonded inside each fixing hole 104, then a left inner layer cap 106 and a right inner layer cap 107 are installed, as the cover plates of the left inner layer cap 106 and the right inner layer cap 107 are both provided with jacks 108, expansion sleeves 109 are fixed on the inner sides of the two jacks 108, and the two expansion sleeves 109 are respectively inserted into the fixing holes 104 formed on the left end face and the right end face of the porcelain rod 101 correspondingly; then welding the left metal lead 3 on the outer wall of the left inner layer cap 106 through fusible metal, and welding the right metal lead 4 on the outer wall of the right inner layer cap 107 through fusible metal; then, a left outer-layer cap 110 and a right outer-layer cap 111 are respectively sleeved on the outer walls of the left inner-layer cap 106 and the right inner-layer cap 107, fixing rods 112 are fixed on the inner side walls of the cover plates of the left outer-layer cap 110 and the right outer-layer cap 111, the two fixing rods 112 are respectively and correspondingly inserted into the two expansion sleeves 109, and the fixing rods 112 and the expansion sleeves 109 are installed in an interference fit mode, so that after the fixing rods 112 are inserted into the expansion sleeves 109, front expansion blocks 1092 and rear expansion blocks 1093 inside the expansion sleeves 109 are respectively bent outwards, and a plurality of strip grooves 1094 are formed in the outer side walls of the front expansion blocks 1092 and the rear expansion blocks 1093, so that the front expansion blocks 1092 and the rear expansion blocks 1093 can be abutted against the inner wall of the rubber sleeve 105 finally, and integrated fixed installation of the porcelain rod 101, the inner-layer cap and the outer-layer cap is achieved.
Example 2
This embodiment is inserting expansion sleeve 109 respectively to the left and right terminal surface of porcelain rod 101 when rubber sleeve 105 is inside in the fixed orifices 104 that all seted up, because a pair of recess 1095 has still been seted up to the outer wall of sleeve 1091, recess 1095 is inside to be fixed with outside open flexure strip 1096, expansion sleeve 109 inserts to rubber sleeve 105 inside back, flexure strip 1096 is in by compression state, there is bounce, thereby can increase the static friction between expansion sleeve 109 and the rubber sleeve 105, thereby also be difficult for taking off after the installation of expansion sleeve 109.
By integrating the embodiment 1 and the embodiment 2, the ceramic rod 101, the inner layer cap and the outer layer cap are integrally and fixedly mounted, and the caps are not easy to fall off after being subjected to external force, so that the resistor failure is avoided, and the service life of the resistor is guaranteed; meanwhile, the invention also adopts the design of single end and double caps, the outer cap is sleeved on the outer wall of the inner cap when in installation, so that the alloy resistance wire and the welding spot on the outer wall of the inner cap can be protected by the outer cap sleeve, and in later application, when mechanical external force which does not damage the protective layer is applied, the alloy resistance wire and the welding spot thereof cannot be influenced, and the problem of open circuit caused by the breakage of the resistance alloy wire is also avoided.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. The utility model provides a can avoid cracked two cap SMD wire-wound chip resistor of solder joint department alloy silk, includes resistor body (1) and packaging shell (2), its characterized in that: the resistor body (1) comprises a porcelain rod (101), alloy resistance wires (102) and a protective layer (103), the alloy resistance wires (102) are wound on the outer wall of the porcelain rod (101), fixing holes (104) are formed in the left end face and the right end face of the porcelain rod (101), a rubber sleeve (105) is bonded on the inner wall of each fixing hole (104), a left inner layer cap (106) is sleeved at the left end of the porcelain rod (101), a right inner layer cap (107) is sleeved at the right end of the porcelain rod (101), the cylindrical outer wall of the left inner layer cap (106) is electrically connected with the left starting end of the alloy resistance wires (102), the cylindrical outer wall of the right inner layer cap (107) is electrically connected with the right tail end of the alloy resistance wires (102), jacks (108) are formed in the cover plates of the left inner layer cap (106) and the right inner layer cap (107), expansion sleeves (109) are fixed on the inner sides of the two jacks (108), the outer wall of the cover plate of the left inner-layer cap (106) is welded with a left metal lead (3) through fusible metal, and the outer wall of the cover plate of the right inner-layer cap (107) is welded with a right metal lead (4) through fusible metal; a left outer layer cap (110) is sleeved at the left end of the left inner layer cap (106), a right outer layer cap (111) is sleeved at the right end of the right inner layer cap (107), fixing rods (112) are fixed on the inner side walls of cover plates of the left outer layer cap (110) and the right outer layer cap (111), and the fixing rods (112) and the expansion sleeve (109) are installed in an interference fit mode; the protective layer (103) is wrapped outside the ceramic rod (101) and the alloy resistance wire (102) together, and the protective layer (103) sequentially comprises a fusing layer, a barrier layer and an insulating paint layer from inside to outside;
temperature fuse (5) are installed in the inside spot welding of encapsulation casing (2) with resistor body (1), temperature fuse (5) electric connection in on right side metal lead (4), a pair of pin hole (6) have been seted up on the bottom plate of encapsulation casing (2), and it is a pair of the inside of pin hole (6) is worn to be equipped with respectively left side metal lead (3) with right side metal lead (4), the front surface veneer of encapsulation casing (2) has encapsulation apron (7).
2. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the expansion sleeve (109) comprises an integrally formed sleeve (1091), a front expansion block (1092) and a rear expansion block (1093), the front expansion block (1092) and the outer side wall of the rear expansion block (1093) are provided with a plurality of strip-shaped grooves (1094), and the front expansion block (1092) and the inner side wall of the rear expansion block (1093) are provided with arc-shaped grooves matched with the fixing rod (112) for installation.
3. The double-cap SMD wire-wound chip resistor capable of avoiding breakage of alloy wires at solder joints according to claim 2, characterized in that: the outer wall of the sleeve (1091) is further provided with a pair of grooves (1095), and the grooves (1095) are internally fixed with outwards-opened elastic pieces (1096).
4. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the fixed rod (112) is in a circular truncated cone shape, and the radius of the section of one exposed end of the fixed rod (112) is the smallest.
5. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the outer surface of the insulating paint layer is flush with the outer surfaces of the left outer layer cap (110) and the right outer layer cap (111).
6. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: round holes (113) are formed in the center positions of the cover plates of the left outer layer cap (110) and the right outer layer cap (111).
7. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the left inner cap (106) and the right inner cap (107) are made of iron, and the left outer cap (110) and the right outer cap (111) are made of insulating plastic.
8. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the production process of the double-cap SMD wire-wound chip resistor comprises the following steps:
a. welding: firstly, welding a temperature fuse on the right metal lead wire, and cutting off the redundant lead wire after welding;
b. installation: installing the assembled resistor body and the temperature fuse in a packaging shell;
c. packaging: pouring glue into the packaging shell, packaging the resistor body and the temperature fuse in the shell, bending the left metal lead and the right metal lead, and enabling the left metal lead and the right metal lead to penetrate out of the pair of lead holes;
d. forming and cutting feet: the metal lead after the sealing glue is finished can be made into a horizontal type or a vertical type;
e. and (3) testing: and testing the resistance value precision of the resistor, and removing defective products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110165234.1A CN113035473B (en) | 2021-02-06 | 2021-02-06 | Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110165234.1A CN113035473B (en) | 2021-02-06 | 2021-02-06 | Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot |
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| CN113035473A true CN113035473A (en) | 2021-06-25 |
| CN113035473B CN113035473B (en) | 2022-06-28 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101212371B1 (en) * | 2011-06-10 | 2012-12-13 | 스마트전자 주식회사 | Resistor and method for manufacturing the same |
| KR101853459B1 (en) * | 2017-08-18 | 2018-04-30 | 아벨정밀(주) | Wire Wound Resistor for SMD type and Method for Manufacturing Same |
| CN109509598A (en) * | 2018-12-23 | 2019-03-22 | 张凯 | A kind of nothing cuts double cap wire resistors and its preparation process |
| CN209766156U (en) * | 2019-05-07 | 2019-12-10 | 山东航天正和电子有限公司 | Precise metal film leadless resistor |
| CN210925625U (en) * | 2019-10-11 | 2020-07-03 | 泰兴市明递电子有限公司 | Metal film resistor with good sealing performance |
| CN211294772U (en) * | 2020-03-17 | 2020-08-18 | 深圳市蓝宝安科电子有限公司 | Double-cap type chip resistor |
-
2021
- 2021-02-06 CN CN202110165234.1A patent/CN113035473B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101212371B1 (en) * | 2011-06-10 | 2012-12-13 | 스마트전자 주식회사 | Resistor and method for manufacturing the same |
| KR101853459B1 (en) * | 2017-08-18 | 2018-04-30 | 아벨정밀(주) | Wire Wound Resistor for SMD type and Method for Manufacturing Same |
| CN109509598A (en) * | 2018-12-23 | 2019-03-22 | 张凯 | A kind of nothing cuts double cap wire resistors and its preparation process |
| CN209766156U (en) * | 2019-05-07 | 2019-12-10 | 山东航天正和电子有限公司 | Precise metal film leadless resistor |
| CN210925625U (en) * | 2019-10-11 | 2020-07-03 | 泰兴市明递电子有限公司 | Metal film resistor with good sealing performance |
| CN211294772U (en) * | 2020-03-17 | 2020-08-18 | 深圳市蓝宝安科电子有限公司 | Double-cap type chip resistor |
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| CN113035473B (en) | 2022-06-28 |
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