CN214312801U - Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot - Google Patents
Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot Download PDFInfo
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- CN214312801U CN214312801U CN202120356197.8U CN202120356197U CN214312801U CN 214312801 U CN214312801 U CN 214312801U CN 202120356197 U CN202120356197 U CN 202120356197U CN 214312801 U CN214312801 U CN 214312801U
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 44
- 239000000956 alloy Substances 0.000 title claims abstract description 44
- 238000003466 welding Methods 0.000 title claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 37
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 229910052573 porcelain Inorganic materials 0.000 claims abstract description 20
- 239000011241 protective layer Substances 0.000 claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 68
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 239000003973 paint Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 230000000903 blocking effect Effects 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims 4
- 238000009434 installation Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 239000000498 cooling water Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
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- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
The utility model relates to the technical field of electrical elements, in particular to a double-cap SMD wire-wound chip resistor capable of avoiding the breakage of an alloy wire at a welding spot, which comprises a resistor body and a packaging shell, wherein the resistor body comprises a porcelain rod, an alloy resistance wire and a protective layer; a temperature fuse and a resistor body are installed in the packaging shell in a spot welding mode, the temperature fuse is electrically connected to the right metal lead, a pair of lead holes are formed in a bottom plate of the packaging shell, and a packaging cover plate is glued on the front surface of the packaging shell; the utility model discloses a design of single-ended double cap lid is located inlayer cap outer wall with outer cap cover when the installation, can let the alloy resistance wire of inlayer cap outer wall and solder joint all be in the protection of outer cap cover, in later stage is used, when experiencing the mechanical external force that does not destroy the protective layer, all can not cause any influence to alloy resistance wire and solder joint, has also stopped the fracture problem that causes the open circuit of resistance alloy wire.
Description
Technical Field
The utility model relates to an electrical component technical field, concretely relates to can avoid cracked two cap SMD wire-wound chip resistor of solder joint department alloy silk.
Background
The use of Surface Mount Technology (SMT) has become very common, and the proportion of electronic products assembled by SMT has exceeded 90%. The SMT technology should be applied to China from the eighties. With the development of small-sized SMT production equipment, the application range of SMT is further expanded, and various electronic products or parts with small batch sizes are produced by adopting SMT in the fields of aviation, aerospace, instruments, machine tools and the like.
The SMD means a surface mounting device, which is one of SMT components, and the SMD wire-wound chip resistor belongs to a metal glass glaze resistor, and is a product integrating metal powder and glass glaze powder, and the resistor is manufactured by printing the mixture on a substrate by a screen printing method, is moisture-resistant, high-temperature-resistant, small in temperature coefficient, capable of greatly saving circuit space cost, more refined in design, stable in electrical property, high in reliability, low in assembly cost, high in mechanical strength and superior in high-frequency characteristic.
At present, an SMD wire-wound chip resistor used in China structurally comprises a resistance wire wound on a framework made of ceramics or other materials, wherein the end of the resistance wire is connected with a lead-out wire through a cap, and cooling water or other materials are arranged outside the resistance wire to achieve a heat dissipation effect so as to improve the service power of the resistor; however, the conventional MD wire-wound chip resistor still has some disadvantages, as shown in fig. 7, the prior art is a single-end single-cap structure, the alloy resistance wire is wound around the outer wall of the ceramic rod, two ends of the alloy resistance wire are respectively welded to the outer walls of the two caps, and the outer wall of the alloy resistance wire is coated with a protective layer; in addition, the cap covers are directly installed at the two ends of the porcelain rod through the cap pressing equipment, the falling phenomenon can often occur, the resistors can also often fail, and the service life is short.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the problem that the background art provided, designed one kind and can avoided cracked two cap SMD wire-wound chip resistor of solder joint department alloy silk.
The utility model discloses a realize through following technical scheme:
a double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at welding spots comprises a resistor body and a packaging shell, the resistor body comprises a porcelain rod, an alloy resistance wire and a protective layer, the alloy resistance wire is wound on the outer wall of the porcelain rod, the left end face and the right end face of the porcelain rod are both provided with annular grooves, the inner wall of each annular groove is bonded with a first annular magnet, the left end of the porcelain rod is sleeved with a left inner layer cap, the right end of the porcelain rod is sleeved with a right inner layer cap, the cylindrical outer wall of the left inner layer cap is electrically connected with the left starting end of the alloy resistance wire, the cylindrical outer wall of the right inner-layer cap is electrically connected with the tail end of the right side of the alloy resistance wire, the outer wall of the cover plate of the left inner-layer cap is welded with a left metal lead through fusible metal, and the outer wall of the cover plate of the right inner-layer cap is welded with a right metal lead through fusible metal; the left end of the left inner layer cap is sleeved with a left outer layer cap, the right end of the right inner layer cap is sleeved with a right outer layer cap, and second annular magnets are bonded on the inner walls of the cover plates of the left outer layer cap and the right inner layer cap;
the temperature fuse is installed in the spot welding of the inside of the packaging shell and the resistor body, the temperature fuse is electrically connected to the right metal lead, a pair of lead holes are formed in the bottom plate of the packaging shell, and the packaging cover plate is glued on the front surface of the packaging shell.
As a further improvement of the above solution, the left inner cap and the right inner cap are made of iron, and the left outer cap and the right outer cap are made of insulating plastic.
As a further improvement of the scheme, the protective layers are wrapped on the outer portions of the ceramic rod and the alloy resistance wire together, the protective layers sequentially comprise a fusing layer, a blocking layer and an insulating paint layer from inside to outside, and the outer surfaces of the insulating paint layer are flush with the outer surfaces of the left outer layer cap and the right outer layer cap.
As a further improvement of the above scheme, the cover plate center positions of the left outer layer cap and the right outer layer cap are both provided with round holes, and the diameters of the round holes are larger than the wire diameters of the left metal lead and the right metal lead.
As a further improvement of the above solution, the left metal lead is inserted into the lead hole on the left side, and the right metal lead is inserted into the lead hole on the right side.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model adopts the design of single end and double caps, when being installed, the outer cap is sleeved on the outer wall of the inner cap, so that the alloy resistance wire and the welding spot of the outer wall of the inner cap can be protected by the outer cap, and in the later application, when the alloy resistance wire and the welding spot are subjected to the mechanical external force which does not damage the protective layer, the alloy resistance wire and the welding spot can not be influenced, and the problem of open circuit caused by the breakage of the resistance alloy wire is also avoided; wherein on the left side of porcelain rod, the ring channel has all been seted up to the right-hand member face, the inner wall of ring channel bonds and has first annular magnet, left side inlayer cap and right inlayer cap are made by iron, thereby first annular magnet can tightly attract left inlayer cap and right inlayer cap to live, the apron inner wall of left outer cap and right inlayer cap all bonds and has second annular magnet, thereby when installation outside cap, left side outer cap also can be tightly with right inlayer cap absorption and the cover locate the outer wall of left inlayer cap and right inlayer cap, thereby it is difficult for droing after receiving external force to receive the cap, the alloy resistance wire is also difficult for appearing the fracture, the resistor inefficacy has been avoided, the life of resistor has been ensured.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic view of a three-dimensional structure of the package cover plate of the present invention before installation;
fig. 2 is an assembly view of the present invention;
fig. 3 is a schematic perspective view of the resistor body according to the present invention;
fig. 4 is an assembly diagram of the resistor body according to the present invention;
FIG. 5 is an assembly view of the left inner cap, the porcelain rod and the right inner cap of the present invention;
fig. 6 is a schematic structural view of a second annular magnet mounted on the right outer cap and the inner wall thereof;
fig. 7 is a schematic diagram of a resistor with a single-ended single-cap structure in the prior art.
The resistor comprises a resistor body 1, a ceramic rod 101, an alloy resistance wire 102, a protective layer 103, an annular groove 104, a first annular magnet 105, a left inner layer cap 106, a right inner layer cap 107, a left outer layer cap 108, a right outer layer cap 109, a second annular magnet 110, a circular hole 111, a packaging shell 2, a left metal lead 3, a right metal lead 4, a temperature fuse 5, a lead hole 6 and a packaging cover plate 7.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the application described herein may be used. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments, and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in the present invention can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The present invention will be further explained with reference to the accompanying drawings.
As shown in fig. 1-7, a double-cap SMD wire-wound chip resistor capable of avoiding breakage of an alloy wire at a solder joint, includes a resistor body 1 and a package case 2, the resistor body 1 includes a porcelain rod 101, an alloy resistance wire 102 and a protective layer 103, the alloy resistance wire 102 is wound on the outer wall of the porcelain rod 101, the left side of the porcelain rod 101, an annular groove 104 is formed in each right end face, a first annular magnet 105 is bonded to the inner wall of each annular groove 104, a left inner layer cap 106 is sleeved at the left end of the porcelain rod 101, a right inner layer cap 107 is sleeved at the right end of the porcelain rod 101, the cylindrical outer wall of the left inner layer cap 106 is electrically connected with the left starting end of the alloy resistance wire 102, the cylindrical outer wall of the right inner layer cap 107 is electrically connected with the right tail end of the alloy resistance wire 102, a left metal lead 3 is welded to the outer wall of a cover plate of the left inner layer cap 106 through fusible metal, and a right metal lead 4 is welded to the outer wall of the cover plate of the right inner layer cap 107 through fusible metal; the left end of the left inner layer cap 106 is sleeved with a left outer layer cap 108, the right end of the right inner layer cap 107 is sleeved with a right outer layer cap 109, the inner walls of the cover plates of the left outer layer cap 108 and the right inner layer cap 107 are both bonded with a second annular magnet 110, the left inner layer cap 106 and the right inner layer cap 107 are made of iron, the left outer layer cap 108 and the right outer layer cap 109 are made of insulating plastics, the outer parts of the ceramic rod 101 and the alloy resistance wire 102 are both wrapped with a protective layer 103, the protective layer 103 sequentially comprises a melting layer, a barrier layer and an insulating paint layer from inside to outside, the outer surface of the insulating paint layer is flush with the outer surfaces of the left outer layer cap 108 and the right outer layer cap 109, the center positions of the cover plates of the left outer layer cap 108 and the right outer layer cap 109 are both provided with round holes 111, and the diameter of the round holes 111 is larger than the wire diameters of the left metal lead 3 and the right metal lead 4;
a temperature fuse 5 and a resistor body 1 are installed in the packaging shell 2 in a spot welding mode, the temperature fuse 5 is electrically connected to the right metal lead 4, a pair of lead holes 6 are formed in a bottom plate of the packaging shell 2, and a packaging cover plate 7 is glued to the front surface of the packaging shell 2; the left metal lead 3 is arranged in the lead hole 6 on the left side in a penetrating mode, and the right metal lead 4 is arranged in the lead hole 6 on the right side in a penetrating mode.
The utility model discloses in, the production process of two cap SMD wire winding chip resistor includes following step:
a. welding: firstly, a temperature fuse 5 is welded on a right metal lead 4, and an excessive lead after welding is cut off
b. Installation: mounting the assembled resistor body 1 and temperature fuse 5 in the package housing 2;
c. packaging: pouring glue into the packaging shell 2, packaging the resistor body 1 and the temperature fuse 5 in the shell, bending the left metal lead 3 and the right metal lead 4, and enabling the left metal lead 3 and the right metal lead 4 to penetrate out of the inside of the pair of lead holes 6;
d. forming and cutting feet: the metal lead after the sealing glue is finished can be made into a horizontal type or a vertical type;
e. and (3) testing: and testing the resistance value precision of the resistor, and removing defective products.
The utility model discloses at the in-process of equipment resistor, the inner wall of ring channel 104 bonds and has first annular magnet 105, left side inlayer cap 106 is made by iron with right inlayer cap 107, thereby first annular magnet 10 can tightly attract left inlayer cap 106 and right inlayer cap 107 to live, left side outer cap 108 all bonds with the apron inner wall of right inlayer cap 107 and has second annular magnet 110, thereby when installing outside cap, left side outer cap 108 also can be tightly adsorbed and the cover locates the outer wall of left inlayer cap 106 and right inlayer cap 107 with right inlayer cap 107, thereby the cap receives and does not drop easily behind the external force, alloy resistance wire also is difficult for appearing the fracture, the resistor inefficacy has been avoided, the life of resistor has been ensured.
The utility model discloses a design of single-ended double cap lid is located inlayer cap outer wall with outer cap cover when the installation, can let the alloy resistance wire of inlayer cap outer wall and solder joint all be in the protection of outer cap cover, in later stage is used, when experiencing the mechanical external force that does not destroy the protective layer, all can not cause any influence to alloy resistance wire and solder joint, has also stopped the fracture problem that causes the open circuit of resistance alloy wire.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. The utility model provides a can avoid cracked two cap SMD wire-wound chip resistor of solder joint department alloy silk, includes resistor body (1) and packaging shell (2), its characterized in that: the resistor body (1) comprises a porcelain rod (101), an alloy resistance wire (102) and a protective layer (103), the alloy resistance wire (102) is wound on the outer wall of the porcelain rod (101), annular grooves (104) are formed in the left end face and the right end face of the porcelain rod (101), a first annular magnet (105) is bonded on the inner wall of each annular groove (104), a left inner layer cap (106) is sleeved at the left end of the porcelain rod (101), a right inner layer cap (107) is sleeved at the right end of the porcelain rod (101), the cylindrical outer wall of the left inner layer cap (106) is electrically connected with the left starting end of the alloy resistance wire (102), the cylindrical outer wall of the right inner layer cap (107) is electrically connected with the right tail end of the alloy resistance wire (102), a left metal lead (3) is welded on the outer wall of a cover plate of the left inner layer cap (106) through fusible metal, and a right metal lead (4) is welded on the outer wall of the cover plate of the right inner layer cap (107); a left outer layer cap (108) is sleeved at the left end of the left inner layer cap (106), a right outer layer cap (109) is sleeved at the right end of the right inner layer cap (107), and second annular magnets (110) are bonded on the inner walls of the cover plates of the left outer layer cap (108) and the right inner layer cap (107);
temperature fuse (5) and resistor body (1) are installed in the inside spot welding of encapsulation casing (2), temperature fuse (5) electric connection in on right side metal lead (4), a pair of pin hole (6) have been seted up on the bottom plate of encapsulation casing (2), the front surface veneer of encapsulation casing (2) has encapsulation apron (7).
2. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the left inner cap (106) and the right inner cap (107) are made of iron, and the left outer cap (108) and the right outer cap (109) are made of insulating plastic.
3. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the protective layer (103) wraps the outer portions of the porcelain rod (101) and the alloy resistance wire (102) together, the protective layer (103) sequentially comprises a fusing layer, a blocking layer and an insulating paint layer from inside to outside, and the outer surface of the insulating paint layer is flush with the outer surfaces of the left outer layer cap (108) and the right outer layer cap (109).
4. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: round holes (111) are formed in the center positions of cover plates of the left outer layer cap (108) and the right outer layer cap (109), and the diameters of the round holes (111) are larger than the wire diameters of the left metal lead (3) and the right metal lead (4).
5. The double-cap SMD wire-wound chip resistor capable of avoiding the breakage of alloy wires at a solder joint according to claim 1, characterized in that: the left metal lead (3) penetrates through the lead hole (6) on the left side, and the right metal lead (4) penetrates through the lead hole (6) on the right side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120356197.8U CN214312801U (en) | 2021-02-06 | 2021-02-06 | Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120356197.8U CN214312801U (en) | 2021-02-06 | 2021-02-06 | Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214312801U true CN214312801U (en) | 2021-09-28 |
Family
ID=77833712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120356197.8U Expired - Fee Related CN214312801U (en) | 2021-02-06 | 2021-02-06 | Double-cap SMD wire-wound chip resistor capable of avoiding alloy wire fracture at welding spot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214312801U (en) |
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2021
- 2021-02-06 CN CN202120356197.8U patent/CN214312801U/en not_active Expired - Fee Related
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210928 |
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| CF01 | Termination of patent right due to non-payment of annual fee |