CN113013070A - Wafer cleaning and spin-drying method - Google Patents
Wafer cleaning and spin-drying method Download PDFInfo
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- CN113013070A CN113013070A CN202110281585.9A CN202110281585A CN113013070A CN 113013070 A CN113013070 A CN 113013070A CN 202110281585 A CN202110281585 A CN 202110281585A CN 113013070 A CN113013070 A CN 113013070A
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- material frame
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- cleaning
- axis module
- drying method
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- 238000004140 cleaning Methods 0.000 title claims abstract description 48
- 238000001035 drying Methods 0.000 title claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 63
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 22
- 230000007306 turnover Effects 0.000 claims abstract description 10
- 238000005406 washing Methods 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 4
- 230000007723 transport mechanism Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 230000010354 integration Effects 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
Abstract
The invention provides a wafer cleaning and spin-drying method, which comprises the following steps: a manual feeding frame; the vertical turnover mechanism vertically turns over the material frame; the first conveying mechanism conveys the material frame to the ultrasonic cleaning mechanism, and the material frame is subjected to ultrasonic cleaning; the first carrying mechanism carries the finely-washed material frame to an air knife cleaning mechanism to clean the material frame air knife; the material frame enters a cache and overturning reset mechanism to be overturned and reset; the first carrying mechanism carries the material frame to the horizontal rotating and lifting mechanism, and the material frame is horizontally rotated and lifted; the piece removing and stacking mechanism is used for removing pieces of the products in the material frame; and the second conveying mechanism conveys the single-chip products to the cleaning and spin-drying mechanism to clean and spin-dry the single-chip products. The method has simple process, integrates the feeding, vertical turning, carrying, ultrasonic cleaning, turning reset, horizontal rotation lifting, stripping and cleaning and spin-drying of the aggregate frame, has high integration degree and high production efficiency, saves labor and realizes continuous automatic production.
Description
Technical Field
The invention relates to the technical field of wafer production, in particular to a wafer cleaning and spin-drying method.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because it has a circular shape. In the process of producing and processing the wafer, the wafer needs to be cleaned by ultrasonic waves, and after the cleaning is finished, the wafer is dried. The mode of processing through solitary ultrasonic cleaning equipment and solitary equipment of spin-drying, the process is loaded down with trivial details, and is inefficient, and the workman that needs is more, is unfavorable for realizing continuous automated production.
Disclosure of Invention
The invention provides a wafer cleaning and spin-drying method to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a wafer cleaning and spin-drying method comprises the following steps:
a manual feeding frame;
the vertical turnover mechanism vertically turns over the material frame;
the first conveying mechanism conveys the material frame to the ultrasonic cleaning mechanism, and the material frame is subjected to ultrasonic cleaning;
the first carrying mechanism carries the finely-washed material frame to an air knife cleaning mechanism to clean the material frame air knife;
the material frame enters a cache and overturning reset mechanism to be overturned and reset;
the first carrying mechanism carries the material frame to the horizontal rotating and lifting mechanism, and the material frame is horizontally rotated and lifted;
the piece removing and stacking mechanism is used for removing pieces of the products in the material frame;
and the second conveying mechanism conveys the single-chip products to the cleaning and spin-drying mechanism to clean and spin-dry the single-chip products.
Further, the vertical turnover mechanism is used for vertically turning over the material frame and turning over and resetting the material frame; perpendicular tilting mechanism include bottom plate, symmetry set up in two slide rails on the bottom plate, respectively with two slide rail sliding fit's two supports, set up in two drive between the slide rail two the support is along two the gliding slip table cylinder of slide rail, connect in two main shaft between the support, with first backup plate and second backup plate that the main shaft links to each other, set up in first backup plate with two curb plates of second backup plate both sides, set up respectively in two the pivot in the curb plate outside, set up in two body hinge forks of bottom plate one end, set up respectively in two round pin axles in the body hinge fork and connect the homonymy respectively the round pin axle with two connecting rods of pivot.
Further, a connecting plate is arranged between the two supports and connected with the output end of the sliding table air cylinder; and the two supports are respectively provided with a positioning column, the two ends of the connecting plate are respectively provided with a clamping groove matched with the positioning columns, and the positioning columns are respectively positioned in the corresponding clamping grooves.
Furthermore, a through groove is formed in one of the side plates, an installation support is arranged on one side of the through groove, a clamping cylinder is arranged on the installation support, a pressing plate is arranged at the output end of the clamping cylinder, and the pressing plate corresponds to the through groove.
Further, the ultrasonic cleaning mechanism comprises a rough cleaning unit and a fine cleaning unit; transport mechanism carries material frame to ultrasonic cleaning mechanism, includes to material frame ultrasonic cleaning: the rough washing unit is used for rough washing of the material frames, and the fine washing unit is used for fine washing of the material frames.
Furthermore, the first carrying mechanism comprises a first Y-axis module, a first X-axis module arranged at the output end of the first Y-axis module, a first Z-axis module arranged at the output end of the first X-axis module and a carrying clamping jaw unit arranged at the output end of the first Z-axis module.
Furthermore, the second carrying mechanism comprises a second Y-axis module, a second Z-axis module arranged at the output end of the second Y-axis module, and a suction head arranged at the output end of the second Z-axis module.
Further, the horizontal rotation lifting mechanism comprises a rotary table, a rotary motor for driving the rotary table, a clamping arm arranged on the rotary table, a lifting tray arranged at the bottom of the rotary table and a lifting cylinder for driving the lifting tray to lift.
The piece removing and stacking mechanism is used for removing stacked products one by one, and comprises a bearing disc, a piece removing Y-axis module driving the bearing disc to move back and forth, a piece removing X-axis module driving the piece removing Y-axis module to move left and right, a push plate arranged on one side of the bearing disc and a piece removing cylinder driving the push plate.
The invention has the beneficial effects that: the wafer cleaning and spin-drying method disclosed by the invention is simple in process, integrates the functions of feeding, vertical overturning, carrying, ultrasonic cleaning, overturning and resetting, horizontal rotating and lifting, detaching and cleaning and spin-drying of the material frame, is high in integration degree and production efficiency, saves manpower, and realizes continuous automatic production.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a wafer cleaning and spin-drying method according to the present invention;
FIG. 2 is a schematic view of an apparatus corresponding to the wafer cleaning and spin-drying method of the present invention;
FIG. 3 is a schematic view of a vertical turning mechanism of the wafer cleaning and spin-drying method of the present invention;
FIG. 4 is a schematic view of another direction of the vertical turnover mechanism of the wafer cleaning and spin-drying method of the present invention;
labeled as:
the vertical turnover mechanism 1, the bottom plate 10, the slide rail 11, the support 12, the connecting plate 121, the positioning column 122, the clamping groove 123, the sliding table cylinder 13, the main shaft 14, the first backup plate 15, the second backup plate 16, the side plate 17, the rotating shaft 171, the through groove 172, the mounting bracket 173, the clamping cylinder 174, the pressing plate 175, the body hinge fork 18, the pin shaft 181, the connecting rod 19,
a first carrying mechanism 2, a first Y-axis module 21, a first X-axis module 22, a first Z-axis module 23, a carrying jaw unit 24,
an ultrasonic cleaning mechanism 3, a rough cleaning unit 31, a fine cleaning unit 32,
the air knife cleaning mechanism 4 is arranged on the air knife,
the turning-over reset mechanism (5) is arranged,
a horizontal rotary lifting mechanism 6, a turntable 61, a clamping arm 62, a lifting tray 63, a lifting cylinder 64,
a piece-removing and stacking mechanism 7, a bearing disc 71, a piece-removing Y-axis module 72, a piece-removing X-axis module 73, a push plate 74, a piece-removing cylinder 75,
a second carrying mechanism 8, a second Y-axis module 81, a second Z-axis module 82,
the washing and spin-drying mechanism 9.
Detailed Description
The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present invention. The conditions used in the examples may be further adjusted according to the conditions of the particular manufacturer, and the conditions not specified are generally the conditions in routine experiments.
Referring to fig. 1 to 4, the present invention provides a wafer cleaning and spin-drying method, including the following steps:
a manual feeding frame;
the vertical turnover mechanism 1 vertically turns over the material frame;
the first conveying mechanism 2 conveys the material frame to the ultrasonic cleaning mechanism 3, and the material frame is cleaned by ultrasonic;
the first carrying mechanism 2 carries the material frame after the fine cleaning to an air knife cleaning mechanism 4, and the material frame is cleaned by an air knife;
the material frame enters a caching and overturning reset mechanism 5 to be overturned and reset;
the first conveying mechanism 2 conveys the material frame to the horizontal rotating and lifting mechanism 6, and horizontally rotates and lifts the material frame;
the piece disassembling and stacking mechanism 7 lowers the products in the material frame to be disassembled;
the second conveying mechanism 8 conveys the single products to the cleaning and spin-drying mechanism 9, and the single products are cleaned and spin-dried.
The wafer cleaning and spin-drying method is simple in process, the material collecting frame is integrated with the functions of feeding, vertical overturning, carrying, ultrasonic cleaning, overturning and resetting, horizontal rotating lifting, piece detaching and cleaning and spin-drying, the integration degree is high, the production efficiency is high, manpower is saved, and continuous automatic production is realized.
The vertical turnover mechanism 1 is used for vertically turning over the material frame and turning over and resetting the material frame; perpendicular tilting mechanism 1 include bottom plate 10, symmetry set up in two slide rails 11 on the bottom plate 10, respectively with two slide rails 11 sliding fit's two supports 12, set up in two drive between the slide rail 11 two support 12 is along two slide rail 11 gliding slip table cylinder 13, connect in two main shaft 14 between the support 12, with first backup plate 15 and second backup plate 16 that main shaft 14 links to each other, set up in first backup plate 15 with two curb plates 17 of second backup plate 16 both sides, set up respectively in two pivot 171 in the curb plate 17 outside, set up in two body hinge forks 18 of bottom plate 10 one end, set up respectively in two in the body hinge fork 18 two round pin axles 181 and connect the homonymy respectively round pin axle 181 with two connecting rods 19 of pivot 171. The product, material frame promptly and stack the wafer in the material frame place first backup plate 15 perhaps on the second backup plate 16, slip table cylinder 13 drive is two support 12 is along two slide rail 11 slides, drives main shaft 14 first backup plate 15 with second backup plate 16 rotates, two connecting rod 19 is to two curb plate 17 first backup plate 15 perhaps second backup plate 16 plays spacing effect, two support 12 is along two slide rail 11 slip in-process, first backup plate 15 with second backup plate 16 upset has realized 90 degrees vertical upset promptly, and this vertical turnover mechanism is used for in succession with the feeding of wafer upset, simple structure is compact, and spare part is less, ensures structure safe and reliable.
A connecting plate 121 is arranged between the two supports 12, and the connecting plate 121 is connected with the output end of the sliding table cylinder 13; two of the support bases 12 are respectively provided with a positioning post 122, two ends of the connecting plate 121 are respectively provided with a clamping groove 123 matched with the positioning post 122, and the positioning posts 122 are respectively located in the corresponding clamping grooves 123.
A through groove 172 is formed in one of the side plates 17, a mounting bracket 173 is arranged on one side of the through groove 172, a clamping cylinder 174 is arranged on the mounting bracket 173, a pressing plate 175 is arranged at the output end of the clamping cylinder 174, and the pressing plate 175 corresponds to the through groove 172.
The ultrasonic cleaning mechanism 3 comprises a rough cleaning unit 31 and a fine cleaning unit 32; transport mechanism carries material frame to ultrasonic cleaning mechanism 3, includes to material frame ultrasonic cleaning: the rough washing unit 31 roughly washes the material frames, and the fine washing unit 32 finely washes the material frames. Therefore, the material frame can be roughly washed, and then the material frame is finely washed after rough washing, so that the cleaning efficiency is high, and the cleaning effect is good.
The first carrying mechanism 2 comprises a first Y-axis module 21, a first X-axis module 22 arranged at the output end of the first Y-axis module 21, a first Z-axis module 23 arranged at the output end of the first X-axis module 22, and a carrying clamping jaw unit 24 arranged at the output end of the first Z-axis module 23.
The second carrying mechanism 8 comprises a second Y-axis module 81, a second Z-axis module 82 arranged at the output end of the second Y-axis module 81 and a suction head arranged at the output end of the second Z-axis module 82.
The horizontal rotation lifting mechanism 6 comprises a rotary table 61, a rotary motor for driving the rotary table 61, a clamping arm 62 arranged on the rotary table 61, a lifting tray 63 arranged at the bottom of the rotary table 61 and a lifting cylinder 64 for driving the lifting tray 63 to lift.
The piece removing and stacking mechanism 7 is used for removing stacked products one by one, and the piece removing and stacking mechanism 7 comprises a bearing disc 71, a piece removing Y-axis module 72 for driving the bearing disc 71 to move back and forth, a piece removing X-axis module 73 for driving the piece removing Y-axis module 72 to move left and right, a push plate 74 arranged on one side of the bearing disc 71 and a piece removing cylinder 75 for driving the push plate 74.
The wafer cleaning and spin-drying method disclosed by the invention is simple in process, integrates the functions of feeding, vertical overturning, carrying, ultrasonic cleaning, overturning and resetting, horizontal rotating and lifting, detaching and cleaning and spin-drying of the material frame, is high in integration degree and production efficiency, saves manpower, and realizes continuous automatic production.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above examples are only for illustrating the technical idea and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the content of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (9)
1. A wafer cleaning and spin-drying method is characterized by comprising the following steps:
a manual feeding frame;
the vertical turnover mechanism vertically turns over the material frame;
the first conveying mechanism conveys the material frame to the ultrasonic cleaning mechanism, and the material frame is subjected to ultrasonic cleaning;
the first carrying mechanism carries the finely-washed material frame to an air knife cleaning mechanism to clean the material frame air knife;
the material frame enters a cache and overturning reset mechanism to be overturned and reset;
the first carrying mechanism carries the material frame to the horizontal rotating and lifting mechanism, and the material frame is horizontally rotated and lifted;
the piece removing and stacking mechanism is used for removing pieces of the products in the material frame;
and the second conveying mechanism conveys the single-chip products to the cleaning and spin-drying mechanism to clean and spin-dry the single-chip products.
2. The wafer cleaning and spin-drying method as claimed in claim 1, wherein: the vertical turnover mechanism is used for vertically turning over the material frame and turning over and resetting the material frame; perpendicular tilting mechanism include bottom plate, symmetry set up in two slide rails on the bottom plate, respectively with two slide rail sliding fit's two supports, set up in two drive between the slide rail two the support is along two the gliding slip table cylinder of slide rail, connect in two main shaft between the support, with first backup plate and second backup plate that the main shaft links to each other, set up in first backup plate with two curb plates of second backup plate both sides, set up respectively in two the pivot in the curb plate outside, set up in two body hinge forks of bottom plate one end, set up respectively in two round pin axles in the body hinge fork and connect the homonymy respectively the round pin axle with two connecting rods of pivot.
3. The wafer cleaning and spin-drying method as claimed in claim 2, wherein: a connecting plate is arranged between the two supports and is connected with the output end of the sliding table cylinder; and the two supports are respectively provided with a positioning column, the two ends of the connecting plate are respectively provided with a clamping groove matched with the positioning columns, and the positioning columns are respectively positioned in the corresponding clamping grooves.
4. The wafer cleaning and spin-drying method as claimed in claim 2, wherein: one of the side plates is provided with a through groove, one side of the through groove is provided with an installation support, the installation support is provided with a clamping cylinder, the output end of the clamping cylinder is provided with a pressing plate, and the pressing plate corresponds to the through groove.
5. The wafer cleaning and spin-drying method as claimed in claim 1, wherein: the ultrasonic cleaning mechanism comprises a rough cleaning unit and a fine cleaning unit; transport mechanism carries material frame to ultrasonic cleaning mechanism, includes to material frame ultrasonic cleaning: the rough washing unit is used for rough washing of the material frames, and the fine washing unit is used for fine washing of the material frames.
6. The wafer cleaning and spin-drying method as claimed in claim 1, wherein: the first carrying mechanism comprises a first Y-axis module, a first X-axis module arranged at the output end of the first Y-axis module, a first Z-axis module arranged at the output end of the first X-axis module and a carrying clamping jaw unit arranged at the output end of the first Z-axis module.
7. The wafer cleaning and spin-drying method as claimed in claim 1, wherein: the second carrying mechanism comprises a second Y-axis module, a second Z-axis module arranged at the output end of the second Y-axis module and a suction head arranged at the output end of the second Z-axis module.
8. The wafer cleaning and spin-drying method as claimed in claim 1, wherein: the horizontal rotation lifting mechanism comprises a rotary table, a rotary motor for driving the rotary table, a clamping arm arranged on the rotary table, a lifting tray arranged at the bottom of the rotary table and a lifting cylinder for driving the lifting tray to lift.
9. The wafer cleaning and spin-drying method as claimed in claim 1, wherein: the piece removing and stacking mechanism is used for removing stacked products one by one, and comprises a bearing disc, a piece removing Y-axis module driving the bearing disc to move back and forth, a piece removing X-axis module driving the piece removing Y-axis module to move left and right, a push plate arranged on one side of the bearing disc and a piece removing cylinder driving the push plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110281585.9A CN113013070A (en) | 2021-03-16 | 2021-03-16 | Wafer cleaning and spin-drying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110281585.9A CN113013070A (en) | 2021-03-16 | 2021-03-16 | Wafer cleaning and spin-drying method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113013070A true CN113013070A (en) | 2021-06-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110281585.9A Pending CN113013070A (en) | 2021-03-16 | 2021-03-16 | Wafer cleaning and spin-drying method |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030027295A (en) * | 2001-09-28 | 2003-04-07 | 한국디엔에스 주식회사 | Apparatus for cleaning wafer of semiconductor fabrication equipment |
| CN104813438A (en) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Method and apparatus for cleaning semiconductor wafer |
| CN106876527A (en) * | 2017-03-30 | 2017-06-20 | 江西比太科技有限公司 | Aggregation type dry method fluff making device and production line |
| CN208819846U (en) * | 2018-10-18 | 2019-05-03 | 江苏科沛达半导体科技有限公司 | A kind of wafer precision scrubbing unit |
| CN110379747A (en) * | 2019-08-14 | 2019-10-25 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer piece cleans patch all-in-one machine |
| CN110921261A (en) * | 2019-12-04 | 2020-03-27 | 浙江沁园水处理科技有限公司 | Compact carton tilting mechanism |
| CN211275709U (en) * | 2019-09-10 | 2020-08-18 | 苏州鸣动智能设备有限公司 | Mould cleaning machine |
| CN211839290U (en) * | 2020-01-07 | 2020-11-03 | 厦门英惟达智能科技有限公司 | Chip cleaning machine and feeding and discharging mechanism thereof |
| CN112038273A (en) * | 2020-08-26 | 2020-12-04 | 厦门英惟达智能科技有限公司 | Wafer taking mechanism and wafer cleaning machine using same |
-
2021
- 2021-03-16 CN CN202110281585.9A patent/CN113013070A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030027295A (en) * | 2001-09-28 | 2003-04-07 | 한국디엔에스 주식회사 | Apparatus for cleaning wafer of semiconductor fabrication equipment |
| CN104813438A (en) * | 2012-11-28 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Method and apparatus for cleaning semiconductor wafer |
| CN106876527A (en) * | 2017-03-30 | 2017-06-20 | 江西比太科技有限公司 | Aggregation type dry method fluff making device and production line |
| CN208819846U (en) * | 2018-10-18 | 2019-05-03 | 江苏科沛达半导体科技有限公司 | A kind of wafer precision scrubbing unit |
| CN110379747A (en) * | 2019-08-14 | 2019-10-25 | 常州科沛达清洗技术股份有限公司 | Full-automatic wafer piece cleans patch all-in-one machine |
| CN211275709U (en) * | 2019-09-10 | 2020-08-18 | 苏州鸣动智能设备有限公司 | Mould cleaning machine |
| CN110921261A (en) * | 2019-12-04 | 2020-03-27 | 浙江沁园水处理科技有限公司 | Compact carton tilting mechanism |
| CN211839290U (en) * | 2020-01-07 | 2020-11-03 | 厦门英惟达智能科技有限公司 | Chip cleaning machine and feeding and discharging mechanism thereof |
| CN112038273A (en) * | 2020-08-26 | 2020-12-04 | 厦门英惟达智能科技有限公司 | Wafer taking mechanism and wafer cleaning machine using same |
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