CN113008917A - Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal - Google Patents

Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal Download PDF

Info

Publication number
CN113008917A
CN113008917A CN202110296178.5A CN202110296178A CN113008917A CN 113008917 A CN113008917 A CN 113008917A CN 202110296178 A CN202110296178 A CN 202110296178A CN 113008917 A CN113008917 A CN 113008917A
Authority
CN
China
Prior art keywords
sample
hard
damage
optical crystal
spot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110296178.5A
Other languages
Chinese (zh)
Other versions
CN113008917B (en
Inventor
陈宇
孔金星
曹发祥
杜东兴
李昀桦
尚逢祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Mechanical Manufacturing Technology of CAEP
Original Assignee
Institute of Mechanical Manufacturing Technology of CAEP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Mechanical Manufacturing Technology of CAEP filed Critical Institute of Mechanical Manufacturing Technology of CAEP
Priority to CN202110296178.5A priority Critical patent/CN113008917B/en
Publication of CN113008917A publication Critical patent/CN113008917A/en
Application granted granted Critical
Publication of CN113008917B publication Critical patent/CN113008917B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/04Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/22Measuring arrangements characterised by the use of optical techniques for measuring depth
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/32Polishing; Etching
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/34Purifying; Cleaning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20008Constructional details of analysers, e.g. characterised by X-ray source, detector or optical system; Accessories therefor; Preparing specimens therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/20Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by using diffraction of the radiation by the materials, e.g. for investigating crystal structure; by using scattering of the radiation by the materials, e.g. for investigating non-crystalline materials; by using reflection of the radiation by the materials
    • G01N23/20058Measuring diffraction of electrons, e.g. low energy electron diffraction [LEED] method or reflection high energy electron diffraction [RHEED] method
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00Sampling; Preparing specimens for investigation
    • G01N1/28Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2866Grinding or homogeneising

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Molecular Biology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Investigating And Analyzing Materials By Characteristic Methods (AREA)

Abstract

The invention discloses a macro-micro comprehensive detection method for surface damage of a hard and brittle optical crystal, which comprises the following steps: carrying out precision grinding on the hard and brittle optical crystal sample; cleaning the ground sample and then carrying out gold spraying treatment; detecting the surface micro-morphology of the sample subjected to the gold spraying treatment by using a scanning electron microscope; preparing a sample in a typical characteristic position area on the surface of the sample by adopting a focused ion beam; detecting the prepared sample by using a transmission electron microscope to obtain the subsurface damage microscopic information of the hard and brittle optical crystal; carrying out deterministic spot polishing on the ground sample, then carrying out corrosion treatment, and cleaning the corroded sample; and detecting a crack region in the polishing spot to obtain the depth information of the macroscopic subsurface damage layer of the hard and brittle optical crystal. The method can comprehensively detect and research the macroscopic and microscopic damage of the ground subsurface, and provides a more reliable and comprehensive data basis for the low-damage processing technology of the hard and brittle optical crystal.

Description

Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal
Technical Field
The invention belongs to the technical field of hard and brittle optical crystal sub-surface damage detection, and particularly relates to a macro-micro comprehensive detection method for hard and brittle optical crystal surface damage based on magneto-rheological spot polishing and a projection electron microscope (TEM).
Background
The hard and brittle optical crystal is widely applied to the fields of aerospace, solid lasers and the like by virtue of excellent optical, mechanical and thermal stability properties. In order to achieve better performance indexes such as energy density and output efficiency, an optimized structure design method is required, and extremely high optical element manufacturing quality is also required. Generally, an optical element is manufactured by cutting, grinding and polishing a hard and brittle optical crystal, and due to the characteristics of high hardness, high brittleness, low toughness and the like, subsurface damage of different degrees is easy to occur in the processing process. Subsurface damage can reduce material strength and affect laser damage threshold, thereby affecting indexes such as service life, laser beam quality and energy transmission efficiency of optical components. Therefore, the control of the subsurface damage layer of the hard and brittle optical crystal element is an important index for improving the processability of the material, and the deterministic detection of the subsurface damage layer is an important prerequisite for realizing the high-precision processing of the material, especially for controlling the subsurface damage.
At present, researchers often use subsurface crack depth as an index for evaluating the depth of subsurface damage during grinding, and subsurface crack depth is usually present in a brittle removal area. For subsurface crack depth measurement, common destructive detection methods such as a section microscopic method, an angle polishing method, a magnetorheological polishing method (including a magnetorheological slope polishing method and a magnetorheological spot polishing method) and the like can be used for detecting damage depth in a larger range, and the accuracy is highest particularly by the magnetorheological polishing method. However, due to the non-uniformity of the shape and size of the abrasive grains in the grinding process and the characteristics of the grinding process, the brittle removal in the grinding process is usually accompanied by the plastic removal, and the sub-surface micro information under the surface characteristics left by the plastic removal contains numerous types of sub-surface damages except the sub-surface cracks, but is usually ignored, and the information has important significance for comprehensively knowing the sub-surface damages in the grinding process. There is therefore a need for a method that allows both macroscopic detection of subsurface crack depths and microscopic analysis of localized subsurface damage.
Disclosure of Invention
The invention provides a macro-micro comprehensive detection method for surface damage of a hard and brittle optical crystal based on magnetorheological spot polishing and a Transmission Electron Microscope (TEM), aiming at solving the problem that the existing detection method cannot comprehensively consider the sub-surface damage in the grinding process, thereby influencing the damage control precision and reliability. The method comprises the steps of precisely grinding the surface of a hard and brittle optical crystal material by using a Focused Ion Beam (FIB) to prepare a sample, and observing the sub-surface of the sample in a TEM (transverse electric field), so as to obtain detailed local sub-surface microscopic information of the sample; and integrally detecting the macroscopic subsurface damage depth by utilizing the characteristic that the magnetorheological polishing spots have no additional damage.
The invention is realized by the following technical scheme:
a macro-micro comprehensive detection method for surface damage of a hard and brittle optical crystal comprises the following steps:
step S1, precisely grinding the hard and brittle optical crystal sample;
step S2, cleaning the ground sample and then carrying out metal spraying treatment;
step S3, detecting the micro-topography of the sample surface after the gold spraying treatment by using a scanning electron microscope, and distinguishing the typical characteristic position area of the sample surface;
step S4, preparing a sample in a typical characteristic position area on the surface of the sample by adopting a focused ion beam; detecting a sample prepared in a typical characteristic position area of the surface of the sample by using a transmission electron microscope, and analyzing the subsurface damage of the typical characteristic of the surface to obtain the microscopic information of the subsurface damage of the hard and brittle optical crystal;
step S5, performing deterministic spot polishing on the ground sample, performing corrosion treatment on the polished sample, and cleaning and drying the corroded sample;
and step S6, detecting crack areas in the polished spots of the cleaned and dried sample to obtain the depth information of the macroscopic subsurface damage layer of the hard and brittle optical crystal.
Preferably, the characteristic feature location areas of the sample surface distinguished in step S3 of the present invention include: a brittle removal zone and a plastic removal zone.
Preferably, step S4 of the present invention specifically includes:
step S41, preparing a sample in the brittleness removal area by using focused ion beams;
step S42, detecting the sample prepared in the step S41 by using a transmission electron microscope, and analyzing the sub-surface damage characteristic information of the sample, wherein the sub-surface damage characteristic information comprises phase change, amorphous, dislocation, slippage and polycrystal characteristic information in the sample;
step S43, preparing a sample in the plastic removal area by using a focused ion beam;
and step S44, detecting the sample prepared in the step S43 by using a transmission electron microscope, and analyzing the sub-surface damage characteristic information of the sample, wherein the sub-surface damage characteristic information comprises phase change, amorphous, dislocation, slippage and polycrystal characteristic information in the sample.
Preferably, the samples prepared in step S41 and step S43 of the present invention are required to be as follows:
(1) the size is 10 multiplied by 6 multiplied by 0.1 um;
(2) the section to be detected has no additional damage;
(3) the section to be detected is perpendicular to the grinding direction.
Preferably, the deterministic spot polishing of step S5 of the present invention uses an alumina polishing solution, and the requirements for polishing spots are as follows:
(1) the depth of the spot is greater than the depth of the subsurface crack;
(2) 1/2 where the area of the spot on the grinding surface is greater than the area of the sample grinding surface;
(3) the spots are all on the grinding surface and must not touch the edge.
Preferably, the etching treatment of step S5 of the present invention is specifically to etch the sample in a 20% HF solution for 3 min.
Preferably, step S6 of the present invention specifically includes:
step S61, measuring by using a super-depth-of-field microscope, moving the platform along the direction of the grinding direction by taking the tip of the left part of the spot as a measuring reference, and recording the distance of each movement until the crack cannot be observed, wherein the total distance of the platform movement is the length L of the subsurface crack region;
step S62, measuring the spot profile by using a linear profiler, wherein the measuring path passes through the centers of the left tip and the right edge of the spot to obtain the profile appearance of the spot and obtain the inclination angle alpha of the spot profile;
in step S63, the subsurface crack depth SSD ═ L tan α is calculated.
Preferably, step S1 of the present invention is grinding with a diamond grinding head, and the grinding surface is a plane of 15 × 9 mm.
Preferably, the hard brittle optical crystal sample of the present invention is a neodymium-doped yttrium aluminum garnet (Nd: YAG) sample with dimensions of 15X 9X 7 mm.
The invention has the following advantages and beneficial effects:
according to the invention, the microscopic region of the sub-surface damage with local typical characteristics after grinding is analyzed through the TEM, and the macroscopic depth information is accurately obtained by utilizing the magnetorheological polishing spot method, so that the sub-surface damage after grinding is comprehensively detected and researched, and a foundation is laid for guiding the low-damage processing technology of the hard and brittle optical crystal.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic flow chart of the method of the present invention.
FIG. 2 is a schematic diagram of the local subsurface damage detection of the present invention.
FIG. 3 is a schematic view of a magnetorheological spot according to the present invention.
FIG. 4 is a schematic view of measuring the sub-surface crack zone width with ultra depth of field according to the present invention.
FIG. 5 is a schematic view of the line profiler measuring spot profile according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
Example 1
The embodiment provides a macro and micro comprehensive detection method for surface damage of a hard and brittle optical crystal based on magnetorheological spot polishing and a Transmission Electron Microscope (TEM), and the method can be used for comprehensively researching macro and micro information of sub-surface damage of the hard and brittle optical crystal, so that a more reliable data base can be provided for a low-damage processing technology of the brittle optical crystal.
This example further illustrates the embodiments of the present invention by taking a sample of neodymium-doped yttrium aluminum garnet (Nd: YAG) with dimensions of 15X 9X 7mm as the object of the test. As shown in fig. 1, the specific implementation steps of this embodiment are as follows:
step S1, precisely grinding the hard and brittle optical crystal sample: in this example, a sample which was polished without damage was clamped on a precision grinding machine, ground with a diamond grinding head having a grinding surface of 15 × 9mm, and then removed and the workpiece was cleaned with an ultrasonic cleaner.
Step S2, cleaning the ground sample and then carrying out metal spraying treatment; this example was gold-blasted so that the sample could be imaged clearly in the SEM, but the surface features were not masked by the gold film.
Step S3, detecting the micro-topography of the sample surface after the gold spraying treatment by using a scanning electron microscope, and distinguishing the typical characteristic position area of the sample surface; in this embodiment, a sample after being sprayed with gold is placed in an SEM chamber for observation, and a brittle removal region and a plastic removal region are distinguished, as shown in a schematic diagram of common surface characteristics after YAG grinding (mainly including the brittle removal region and the plastic removal region) in fig. 2.
Step S4, preparing a sample in a typical characteristic position area on the surface of the sample by adopting a focused ion beam; detecting a sample prepared in a typical characteristic position area of the surface of the sample by using a transmission electron microscope, and analyzing the subsurface damage of the typical characteristic of the surface to obtain the microscopic information of the subsurface damage of the hard and brittle optical crystal; step S4 of this embodiment specifically includes:
step S41, positioning the brittle removal area, and preparing a sample in the brittle removal area by adopting a focused ion beam;
step S42, detecting the sample prepared in the step S41 by using a transmission electron microscope, and then analyzing the sub-surface damage characteristic information of the sample by using transmission electron microscope analysis software Digital Micrograth, wherein the sub-surface damage characteristic information comprises sub-surface damage characteristic information of phase change, amorphousness, dislocation, slippage, polycrystal and the like in the sample;
step S43, preparing a sample in the plastic removal area by using a focused ion beam;
and step S44, detecting the sample prepared in the step S43 by using a transmission electron microscope, and analyzing the sub-surface damage characteristic information of the sample, wherein the sub-surface damage characteristic information comprises sub-surface damage characteristic information of phase change, amorphousness, dislocation, slippage, polycrystal and the like in the sample.
The samples prepared in step S41 and step S43 in this example were required to be as follows:
(1) the dimension is 10 multiplied by 6 multiplied by 0.1um, (2) the section to be detected has no additional damage, (3) the section to be detected is perpendicular to the grinding direction shown in fig. 2.
And step S5, performing deterministic spot polishing on the ground sample, performing corrosion treatment on the polished sample, and cleaning and drying the corroded sample.
The spot polishing process of this embodiment is specifically: the method comprises the following steps of (1) enabling the grinding surface of a sample to face upwards, adhering the sample to a workpiece platform of a magnetorheological polishing machine tool, setting polishing parameters to polish magnetorheological spots, wherein an alumina polishing solution is used as the polishing solution, and the requirements for polishing the spots are as follows: (1) the depth of the spot is greater than the subsurface crack depth, (2) the area of the spot in the grinding plane is greater than 1/2 for the area of the sample grinding surface, (3) the spot should be guaranteed to be completely on the grinding surface and not to contact the edge, and the schematic view of the polishing spot is shown in fig. 3.
The etching treatment in this embodiment is specifically: and (3) putting the sample into a 20% HF solution for corrosion for 3min, and carrying out ultrasonic cleaning and drying treatment after corrosion.
And step S6, detecting crack areas in the polished spots of the cleaned and dried sample to obtain the depth information of the macroscopic subsurface damage layer of the hard and brittle optical crystal.
Step S6 of this embodiment specifically includes:
step S61, measuring by using a super-depth-of-field microscope, as shown in FIG. 4, moving the platform along the direction of the grinding direction by using 400X multiplying power and taking the tip of the left part of the spot as a measuring reference, and recording the distance of each movement until the crack cannot be observed, wherein the total distance of the platform movement is the length L of the sub-surface crack region;
step S62, measuring the spot profile by using a linear profiler, wherein the measuring path passes through the centers of the left tip and the right edge of the spot to obtain the profile appearance of the spot, and obtaining the inclination angle alpha of the spot profile, as shown in FIG. 5;
in step S63, the subsurface crack depth SSD ═ L tan α is calculated based on the measured sub-planar crack region length L and the spot profile inclination angle α, that is, the macroscopic subsurface damage layer depth information can be obtained.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (9)

1. A macro-micro comprehensive detection method for surface damage of a hard and brittle optical crystal is characterized by comprising the following steps:
step S1, precisely grinding the hard and brittle optical crystal sample;
step S2, cleaning the ground sample and then carrying out metal spraying treatment;
step S3, detecting the micro-topography of the sample surface after the gold spraying treatment by using a scanning electron microscope, and distinguishing the typical characteristic position area of the sample surface;
step S4, preparing a sample in a typical characteristic position area on the surface of the sample by adopting a focused ion beam; detecting a sample prepared in a typical characteristic position area of the surface of the sample by using a transmission electron microscope, and analyzing the subsurface damage of the typical characteristic of the surface to obtain the microscopic information of the subsurface damage of the hard and brittle optical crystal;
step S5, performing deterministic spot polishing on the ground sample, performing corrosion treatment on the polished sample, and cleaning and drying the corroded sample;
and step S6, detecting crack areas in the polished spots of the cleaned and dried sample to obtain the depth information of the macroscopic subsurface damage layer of the hard and brittle optical crystal.
2. The method for comprehensively detecting the macro and micro damage on the surface of the hard and brittle optical crystal according to claim 1, wherein the sample surface typical characteristic position areas distinguished in the step S3 comprise: a brittle removal zone and a plastic removal zone.
3. The method for comprehensively detecting the surface damage of the hard and brittle optical crystal according to claim 2, wherein the step S4 specifically comprises:
step S41, preparing a sample in the brittleness removal area by using focused ion beams;
step S42, detecting the sample prepared in the step S41 by using a transmission electron microscope, and analyzing the sub-surface damage characteristic information of the sample, wherein the sub-surface damage characteristic information comprises phase change, amorphous, dislocation, slippage and polycrystal characteristic information in the sample;
step S43, preparing a sample in the plastic removal area by using a focused ion beam;
and step S44, detecting the sample prepared in the step S43 by using a transmission electron microscope, and analyzing the sub-surface damage characteristic information of the sample, wherein the sub-surface damage characteristic information comprises phase change, amorphous, dislocation, slippage and polycrystal characteristic information in the sample. .
4. The method for comprehensively detecting the surface damage of the hard and brittle optical crystal according to claim 3, wherein the samples prepared in the steps S41 and S43 are required to be as follows:
(1) the size is 10 multiplied by 6 multiplied by 0.1 um;
(2) the section to be detected has no additional damage;
(3) the section to be detected is perpendicular to the grinding direction.
5. The method for comprehensively detecting the macro and micro damage on the surface of the hard and brittle optical crystal according to claim 1, wherein the deterministic spot polishing of step S5 is performed with an alumina polishing solution, and the requirements for polishing spots are as follows:
(1) the depth of the spot is greater than the depth of the subsurface crack;
(2) 1/2 where the area of the spot on the grinding surface is greater than the area of the sample grinding surface;
(3) the spots are all on the grinding surface and must not touch the edge.
6. The method for comprehensively detecting the surface damage of the hard and brittle optical crystal according to claim 1, wherein the corrosion treatment of step S5 is specifically to put the sample into a 20% HF solution for corrosion for 3 min.
7. The method for comprehensively detecting the surface damage of the hard and brittle optical crystal according to claim 1, wherein the step S6 specifically comprises:
step S61, measuring by using a super-depth-of-field microscope, moving the platform along the direction of the grinding direction by taking the tip of the left part of the spot as a measuring reference, and recording the distance of each movement until the crack cannot be observed, wherein the total distance of the platform movement is the length L of the subsurface crack region;
step S62, measuring the spot profile by using a linear profiler, wherein the measuring path passes through the centers of the left tip and the right edge of the spot to obtain the profile appearance of the spot and obtain the inclination angle alpha of the spot profile;
in step S63, the subsurface crack depth SSD ═ Ltan α is calculated.
8. The method for comprehensively detecting the macro and micro damage on the surface of the hard and brittle optical crystal according to claim 1, wherein the step S1 is implemented by grinding with a diamond grinding head, and the grinding surface is a plane of 15 x 9 mm.
9. The method for comprehensively detecting the surface damage of the hard and brittle optical crystal according to claim 1, wherein the hard and brittle optical crystal sample is a neodymium-doped yttrium aluminum garnet (Nd: YAG) sample, and the size of the sample is 15 x 9 x 7 mm.
CN202110296178.5A 2021-03-19 2021-03-19 Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal Active CN113008917B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110296178.5A CN113008917B (en) 2021-03-19 2021-03-19 Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110296178.5A CN113008917B (en) 2021-03-19 2021-03-19 Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal

Publications (2)

Publication Number Publication Date
CN113008917A true CN113008917A (en) 2021-06-22
CN113008917B CN113008917B (en) 2022-12-06

Family

ID=76403278

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110296178.5A Active CN113008917B (en) 2021-03-19 2021-03-19 Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal

Country Status (1)

Country Link
CN (1) CN113008917B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115343301A (en) * 2022-10-20 2022-11-15 盛吉盛(宁波)半导体科技有限公司 Characterization method for subsurface damage depth of non-metallic material
CN115372090A (en) * 2022-07-29 2022-11-22 中国船舶重工集团公司第七0七研究所 Method for manufacturing and detecting quartz glass subsurface damage depth sample

Citations (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0202937A2 (en) * 1985-05-21 1986-11-26 Tekscan Limited Surface analysis spectroscopy apparatus
US5440238A (en) * 1991-11-07 1995-08-08 Sandia Corporation Surface property detection apparatus and method
US6046802A (en) * 1998-11-16 2000-04-04 General Electric Company Optical element surface monitoring system and method
WO2001020303A1 (en) * 1999-09-16 2001-03-22 Wayne State University Miniaturized contactless sonic ir device for remote non-destructive inspection
US20050036135A1 (en) * 2003-04-11 2005-02-17 Earthman James C. Methods and apparatus for detecting and quantifying surface characteristics and material conditions using light scattering
CN1814821A (en) * 2005-01-31 2006-08-09 宝山钢铁股份有限公司 Rotary component whose surface layer is composite nano crystal grain
CN101135654A (en) * 2007-09-29 2008-03-05 中国科学院上海光学精密机械研究所 Method for detecting subsurface defects
CN101672625A (en) * 2009-10-13 2010-03-17 西安交通大学 Measurement method of thickness of subsurface damaged layer of bucky optical material
CN101864247A (en) * 2010-07-20 2010-10-20 南京航空航天大学 Abrasive material-free polishing fluid for chemical mechanical polishing of rigid fragile material
WO2011141755A1 (en) * 2010-05-14 2011-11-17 Paramata Ltd Rf reflection for inspecting composite materials
CN102426170A (en) * 2011-09-14 2012-04-25 西安交通大学 Holographic inversion detection method for micro-cracks on damaged layer of subsurface of brittle material
CN103017713A (en) * 2012-12-03 2013-04-03 南京航空航天大学 Measuring method for damage layer thickness of optical material subsurface
CN103163154A (en) * 2013-02-04 2013-06-19 西安交通大学 Characterization method of hard brittle high-precision component sub-surface damage degree
CN103885099A (en) * 2014-02-13 2014-06-25 同济大学 Transmission optical component damage threshold improvement method based on multi-iteration etching
CN104061853A (en) * 2014-07-04 2014-09-24 西安工业大学 Method for measuring sub-surface affected layer depth and morphology of optical material
EP2799842A1 (en) * 2013-04-30 2014-11-05 Research Center Pharmaceutical Engineering GmbH A device and a method for monitoring a property of a coating of a solid dosage form during a coating process forming the coating of the solid dosage form
CN105891548A (en) * 2016-04-12 2016-08-24 中国人民解放军国防科学技术大学 Nanoscale optical subsurface damage detection method based on ion sputtering technology
CN106093037A (en) * 2016-06-06 2016-11-09 南京航空航天大学 Use the method that side successively polishing etch obtains fragile material cracks can spread three-dimensional appearance
CN106140671A (en) * 2015-04-13 2016-11-23 中国工程物理研究院机械制造工艺研究所 Cleaning method after KDP crystal MRF
US20170165756A1 (en) * 2015-12-11 2017-06-15 Purdue Research Foundation Method of making nanocrystalline metal flakes and nanocrystalline flakes made therefrom
CN107037059A (en) * 2017-06-09 2017-08-11 浙江师范大学 A kind of detection method of optical material sub-surface crack depth
CN107042467A (en) * 2017-04-07 2017-08-15 大连理工大学 Nm deep damages layer mechanochemistry method for grinding
CN107843608A (en) * 2017-10-25 2018-03-27 哈尔滨工业大学 A kind of evaluation method for optical crystal Ultra-precision Turning sub-surface damage
CN108098536A (en) * 2018-01-31 2018-06-01 湖南科技大学 A kind of efficient ultraprecise shear thickening-chemical cooperated burnishing device
CN108515460A (en) * 2018-04-10 2018-09-11 湖南工学院 Planar optical elements sub-surface damage detection method
CN108535174A (en) * 2018-04-08 2018-09-14 浙江师范大学 Optical glass sub-surface damage depth measurement method based on chemical attack
CN109396967A (en) * 2018-12-12 2019-03-01 中国电子科技集团公司第四十六研究所 A kind of cmp method for cadmium selenide crystal
CN109781666A (en) * 2018-11-27 2019-05-21 大连理工大学 A kind of method of polarization laser scattering detection monocrystalline silicon piece sub-surface damage
CN110220923A (en) * 2019-06-24 2019-09-10 大连理工大学 A kind of optical glass abrasive machining sub-surface Crack Damage distribution characteristics detection method
CN209970284U (en) * 2019-06-20 2020-01-21 中国工程物理研究院机械制造工艺研究所 Ultrasonic vibration destressing grinding and polishing equipment for weak rigid member
CN111024534A (en) * 2019-12-30 2020-04-17 浙江师范大学 Mechanical characterization method for optical glass subsurface damage
CN111638305A (en) * 2020-06-08 2020-09-08 郑州磨料磨具磨削研究所有限公司 Method for determining optimal processing direction of single crystal material
US20200321242A1 (en) * 2015-09-18 2020-10-08 Bing Hu Method of separating a film from a brittle material
CN112176306A (en) * 2020-09-14 2021-01-05 江苏集创原子团簇科技研究院有限公司 Method for forming amorphous layer in substrate by gas cluster ion beam
US20220221428A1 (en) * 2019-05-06 2022-07-14 Otr Wheel Safety, Inc. Integrated system for assessing and modeling integrity of wheels and rims of off the road vehicles

Patent Citations (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0202937A2 (en) * 1985-05-21 1986-11-26 Tekscan Limited Surface analysis spectroscopy apparatus
US5440238A (en) * 1991-11-07 1995-08-08 Sandia Corporation Surface property detection apparatus and method
US6046802A (en) * 1998-11-16 2000-04-04 General Electric Company Optical element surface monitoring system and method
WO2001020303A1 (en) * 1999-09-16 2001-03-22 Wayne State University Miniaturized contactless sonic ir device for remote non-destructive inspection
EP1214575A1 (en) * 1999-09-16 2002-06-19 Wayne State University Miniaturized contactless sonic ir device for remote non-destructive inspection
US20050036135A1 (en) * 2003-04-11 2005-02-17 Earthman James C. Methods and apparatus for detecting and quantifying surface characteristics and material conditions using light scattering
CN1814821A (en) * 2005-01-31 2006-08-09 宝山钢铁股份有限公司 Rotary component whose surface layer is composite nano crystal grain
CN101135654A (en) * 2007-09-29 2008-03-05 中国科学院上海光学精密机械研究所 Method for detecting subsurface defects
CN101672625A (en) * 2009-10-13 2010-03-17 西安交通大学 Measurement method of thickness of subsurface damaged layer of bucky optical material
WO2011141755A1 (en) * 2010-05-14 2011-11-17 Paramata Ltd Rf reflection for inspecting composite materials
US20130139596A1 (en) * 2010-05-14 2013-06-06 Paramata Ltd. Sensing System and Method
CN101864247A (en) * 2010-07-20 2010-10-20 南京航空航天大学 Abrasive material-free polishing fluid for chemical mechanical polishing of rigid fragile material
CN102426170A (en) * 2011-09-14 2012-04-25 西安交通大学 Holographic inversion detection method for micro-cracks on damaged layer of subsurface of brittle material
CN103017713A (en) * 2012-12-03 2013-04-03 南京航空航天大学 Measuring method for damage layer thickness of optical material subsurface
CN103163154A (en) * 2013-02-04 2013-06-19 西安交通大学 Characterization method of hard brittle high-precision component sub-surface damage degree
EP2799842A1 (en) * 2013-04-30 2014-11-05 Research Center Pharmaceutical Engineering GmbH A device and a method for monitoring a property of a coating of a solid dosage form during a coating process forming the coating of the solid dosage form
CN103885099A (en) * 2014-02-13 2014-06-25 同济大学 Transmission optical component damage threshold improvement method based on multi-iteration etching
CN104061853A (en) * 2014-07-04 2014-09-24 西安工业大学 Method for measuring sub-surface affected layer depth and morphology of optical material
CN106140671A (en) * 2015-04-13 2016-11-23 中国工程物理研究院机械制造工艺研究所 Cleaning method after KDP crystal MRF
US20200321242A1 (en) * 2015-09-18 2020-10-08 Bing Hu Method of separating a film from a brittle material
US20170165756A1 (en) * 2015-12-11 2017-06-15 Purdue Research Foundation Method of making nanocrystalline metal flakes and nanocrystalline flakes made therefrom
CN105891548A (en) * 2016-04-12 2016-08-24 中国人民解放军国防科学技术大学 Nanoscale optical subsurface damage detection method based on ion sputtering technology
CN106093037A (en) * 2016-06-06 2016-11-09 南京航空航天大学 Use the method that side successively polishing etch obtains fragile material cracks can spread three-dimensional appearance
CN107042467A (en) * 2017-04-07 2017-08-15 大连理工大学 Nm deep damages layer mechanochemistry method for grinding
CN107037059A (en) * 2017-06-09 2017-08-11 浙江师范大学 A kind of detection method of optical material sub-surface crack depth
CN107843608A (en) * 2017-10-25 2018-03-27 哈尔滨工业大学 A kind of evaluation method for optical crystal Ultra-precision Turning sub-surface damage
CN108098536A (en) * 2018-01-31 2018-06-01 湖南科技大学 A kind of efficient ultraprecise shear thickening-chemical cooperated burnishing device
CN108535174A (en) * 2018-04-08 2018-09-14 浙江师范大学 Optical glass sub-surface damage depth measurement method based on chemical attack
CN108515460A (en) * 2018-04-10 2018-09-11 湖南工学院 Planar optical elements sub-surface damage detection method
CN109781666A (en) * 2018-11-27 2019-05-21 大连理工大学 A kind of method of polarization laser scattering detection monocrystalline silicon piece sub-surface damage
CN109396967A (en) * 2018-12-12 2019-03-01 中国电子科技集团公司第四十六研究所 A kind of cmp method for cadmium selenide crystal
US20220221428A1 (en) * 2019-05-06 2022-07-14 Otr Wheel Safety, Inc. Integrated system for assessing and modeling integrity of wheels and rims of off the road vehicles
CN209970284U (en) * 2019-06-20 2020-01-21 中国工程物理研究院机械制造工艺研究所 Ultrasonic vibration destressing grinding and polishing equipment for weak rigid member
CN110220923A (en) * 2019-06-24 2019-09-10 大连理工大学 A kind of optical glass abrasive machining sub-surface Crack Damage distribution characteristics detection method
CN111024534A (en) * 2019-12-30 2020-04-17 浙江师范大学 Mechanical characterization method for optical glass subsurface damage
CN111638305A (en) * 2020-06-08 2020-09-08 郑州磨料磨具磨削研究所有限公司 Method for determining optimal processing direction of single crystal material
CN112176306A (en) * 2020-09-14 2021-01-05 江苏集创原子团簇科技研究院有限公司 Method for forming amorphous layer in substrate by gas cluster ion beam

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
JING-FEI YIN.ET: "Methods for Detection of Subsurface Damage: A Review", 《CHINESE JOURNAL OF MECHANICAL ENGINEERING》 *
刘军: "基于偏振效应的激光晶体亚表面损伤测量方法研究", 《中国优秀硕士学位论文全文数据库 (基础科学辑)》 *
曹发祥等: "Nd:YAG晶体表面性能等离子体改性研究", 《华南理工大学学报(自然科学版)》 *
王华东等: "光学材料亚表面损伤的表征与检测技术的研究进展", 《激光与光电子学进展》 *
高睿等: "光学玻璃亚表面损伤深度预测及实验研究", 《光学仪器》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115372090A (en) * 2022-07-29 2022-11-22 中国船舶重工集团公司第七0七研究所 Method for manufacturing and detecting quartz glass subsurface damage depth sample
CN115343301A (en) * 2022-10-20 2022-11-15 盛吉盛(宁波)半导体科技有限公司 Characterization method for subsurface damage depth of non-metallic material

Also Published As

Publication number Publication date
CN113008917B (en) 2022-12-06

Similar Documents

Publication Publication Date Title
CN113008917B (en) Macro-micro comprehensive detection method for surface damage of hard and brittle optical crystal
Gu et al. Investigation of grinding modes in horizontal surface grinding of optical glass BK7
CN103645078B (en) A kind of cross section quick Fabrication of single crystal semiconductor substrate and sub-crizzle detection method
CN104061853A (en) Method for measuring sub-surface affected layer depth and morphology of optical material
Qu et al. Grinding mechanism and surface quality evaluation strategy of single crystal 4H-SiC
KR100796829B1 (en) Tem sample slicing process
JP2007260904A (en) Apparatus and method for machining of hard metal with reduced detrimental white layer effect
CN106093037A (en) Use the method that side successively polishing etch obtains fragile material cracks can spread three-dimensional appearance
CN107037059A (en) A kind of detection method of optical material sub-surface crack depth
CN111024534A (en) Mechanical characterization method for optical glass subsurface damage
CN114131208B (en) Laser-induced plasma profiling device and method
CN105300762A (en) Structure positioning sample preparation method of sheet
JP5046192B2 (en) Method for preparing sample for cross-sectional observation by scanning electron microscope
CN110757263B (en) Mechanical grinding method-based micro-opening control method for micro-arc-edge diamond cutter
Shi et al. Modelling white layer thickness based on the cutting parameters of hard machining
CN110756987A (en) Laser plane processing equipment
JP5004324B2 (en) Repair method for molds containing magnetic material
CN211219151U (en) Laser plane processing equipment
JP4742360B2 (en) Method for arranging micro holes in an array, AFM standard sample, and AFM stage
JP4335656B2 (en) Sample preparation method for microscope
Guangjun et al. Optimization of Machining Parameters and Electrochemical Corrosion Behavior of hardened Cr12MoV Mold Steel
Guzmán Durán et al. Machining with cutting tool coated with monolayer of HfN
CN113916148B (en) Method for detecting indentation crack depth of silicate glass
CN115343301B (en) Characterization method of subsurface damage depth of nonmetallic material
CN1831510A (en) Method and system for sample preparation for exposing a main pole on a recording head

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant