CN113008032A - Heat treatment apparatus - Google Patents

Heat treatment apparatus Download PDF

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Publication number
CN113008032A
CN113008032A CN202011493831.9A CN202011493831A CN113008032A CN 113008032 A CN113008032 A CN 113008032A CN 202011493831 A CN202011493831 A CN 202011493831A CN 113008032 A CN113008032 A CN 113008032A
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CN
China
Prior art keywords
heat treatment
transport
opening
treatment furnace
rod
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Granted
Application number
CN202011493831.9A
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Chinese (zh)
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CN113008032B (en
Inventor
中谷淳司
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JTEKT Thermo Systems Corp
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Koyo Thermo Systems Co Ltd
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Publication of CN113008032A publication Critical patent/CN113008032A/en
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Publication of CN113008032B publication Critical patent/CN113008032B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
    • F27B17/00—Furnaces of a kind not covered by any preceding group
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
    • F27D7/06—Forming or maintaining special atmospheres or vacuum within heating chambers
    • F27D2007/063—Special atmospheres, e.g. high pressure atmospheres

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Tunnel Furnaces (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Heat Treatments In General, Especially Conveying And Cooling (AREA)

Abstract

The invention provides a heat treatment device. The heat treatment furnace (20) has an opening (201) through which the object to be treated (WK) is conveyed. The transfer chamber (30) is connected to the heat treatment furnace (20) through an opening (201). The transfer chamber (30) has an opening (301). The conveying rods (41, 42) are inserted through the opening (201) and the opening (301). The conveying device (50) moves the first end portions (4111, 4211) of the conveying rods (41, 42) in the extending direction in the conveying chamber (30) or the heat treatment furnace (20). The support members (412, 422) are disposed at the first end portions (4111, 4211) of the transport rods (41, 42). The support members (412, 422) are switched between a first mode in which the support members protrude upward from the upper ends of the conveying rods (41, 42) and the object to be processed (WK) can be placed thereon and a second mode in which the support members are disposed downward from the upper ends.

Description

Heat treatment apparatus
Technical Field
The present invention relates to a heat treatment apparatus including a mechanism for carrying an object to be treated in and out of a heat treatment furnace by a transport rod.
Background
Japanese patent application laid-open No. 07-161652 discloses a high-temperature heat treatment furnace and a conveying device in the furnace. In this prior art document, the work is moved in the heat treatment furnace by moving an コ -shaped elevator tube.
The elevator tube is integral with the table. The stage is moved in the horizontal direction and the vertical direction by a motor mechanism.
With such a structure, the work is conveyed in the horizontal direction and the vertical direction in the heat treatment furnace.
However, in the structure described in the above-mentioned prior art document, the shape of the work conveying mechanism is large. Therefore, if the workpiece placed on the conveying mechanism is to be carried into the heat treatment furnace, the opening (carrying-in conveying port) of the heat treatment furnace must be enlarged.
Further, the opening portion becomes large, and the area of the opening inside the heat treatment furnace to the outside becomes large. Therefore, when the atmosphere of the heat treatment furnace is maintained, a large loss occurs. For example, in the case of filling nitrogen gas into a heat treatment furnace, a large amount of nitrogen gas is required.
Accordingly, an object of the present invention is to provide a heat treatment apparatus including a transport mechanism capable of reducing an area of a heat treatment furnace connected to the outside.
Disclosure of Invention
The heat treatment apparatus of the present invention includes a heat treatment furnace, a conveying chamber, a conveying rod, a conveying device, a support member, and a switching device. The heat treatment furnace has a first opening through which the object to be treated is conveyed, and performs heat treatment on the object to be treated. The conveying rod is capable of moving inside and outside the heat treatment furnace, has a first end on the heat treatment furnace side and a second end on the opposite side of the heat treatment furnace, and is in the shape of a rod inserted through the first opening. The conveying device is connected with the second end part and enables the first end part to move in the heat treatment furnace. The support member is disposed at the first end portion, and is capable of switching between a first state in which the support member protrudes upward from the upper end of the transport rod and is capable of placing the object to be processed and a second state in which the support member is disposed downward from the upper end. The switching device switches the first and second modes of the support member via the transport lever.
In this configuration, even if the position of the transport rod in the height direction is not changed, the position of the object to be processed in the height direction in the heat treatment furnace can be changed by switching the support member from the first mode to the second mode. Therefore, the size of the first opening may be the size when the transport rod and the object to be treated move in the horizontal direction. This reduces the first opening, and reduces the area of the heat treatment furnace connected to the outside.
In the heat treatment apparatus of the present invention, the support member is preferably a rod-like body disposed on a side surface of the transport rod. In this structure, the support member can be realized by a simple structure. Further, the object to be processed can be supported in point contact, and the thermal influence on the object to be processed can be suppressed.
In the heat treatment apparatus according to the present invention, it is preferable that the switching device is connected to the second end of the transport rod, and includes a rotation assisting mechanism for rotating the transport rod in a direction along the side surface. In this configuration, the first and second modes of the support member are switched with a simple configuration.
The heat treatment apparatus of the present invention further includes a conveyance chamber connected to the heat treatment furnace through the first opening and having a second opening in a wall opposite to the first opening. The transport rod is inserted through the first opening and the second opening and moved. In this structure, the heat treatment furnace is connected to the conveyance chamber via the first opening, and the conveyance chamber is connected to the outside via the second opening. Therefore, the temperature and atmosphere of the heat treatment furnace can be easily maintained. Further, by adopting the above-described configuration for the conveying rod, the conveying chamber can be reduced, and the size of the second opening can be the size of the conveying rod, so the second opening can be reduced.
In the heat treatment apparatus of the present invention, the transport chamber includes an inlet port into which the object to be treated is introduced and which is openable and closable. The atmosphere in the transfer chamber is replaced with an inert gas in a state where the inlet is closed.
In this configuration, the amount of gas used for replacing the atmosphere is reduced to the extent that the transfer chamber is filled with the gas.
In the heat treatment apparatus of the present invention, it is preferable that the second opening has a shape that follows the outer shape of the transport rod. In this configuration, the area of the transfer chamber connected to the heat treatment furnace and the outside can be further reduced, and the amount of gas used for replacing the atmosphere can be further reduced.
In addition, according to the present invention, the area of the heat treatment furnace connected to the outside can be reduced.
Drawings
Fig. 1A and 1B are side views showing a schematic configuration of a heat processing apparatus according to an embodiment of the present invention.
Fig. 2 is a plan view of the tip end portion (first end portion) of the transport rod.
Fig. 3A is a side view, fig. 3B is a plan view of the tip end portion (first end portion) of the transport rod, fig. 3C is an end view, and fig. 3D is an external perspective view.
Fig. 4A and 4B are diagrams showing behaviors of the transport rod and the support member.
Fig. 5 is a view showing an opening formed in a front wall of the transport chamber and the transport rod.
Fig. 6A and 6B are diagrams showing an example of the configuration of the switching device.
Fig. 7A, 7B, 7C, 7D, and 7E are diagrams illustrating steps from the outside of the heat treatment apparatus to the time when the object to be treated is charged and heat treatment is performed.
Fig. 8A, 8B, 8C, and 8D are diagrams illustrating steps from after the heat treatment of the object to be treated to the time when the object to be treated is taken out of the heat treatment apparatus.
Fig. 9A and 9B conceptually show another example of the support member.
Fig. 10 is a partial plan view showing a configuration of a derivative example of the transport rod.
Detailed Description
A heat treatment apparatus according to an embodiment of the present invention will be described with reference to the drawings.
Fig. 1A and 1B are side views showing a schematic configuration of a heat processing apparatus according to an embodiment of the present invention. Fig. 1A and 1B show cross-sectional views of the transfer chamber and the heat treatment furnace. Fig. 1A shows a case where the object to be processed is located in the conveyance chamber, and fig. 1B shows a case where the object to be processed is located in the heat treatment furnace. Fig. 2 is a plan view of the tip end portion (first end portion) of the transport rod. Fig. 3A is a side view, fig. 3B is a plan view of the tip end portion (first end portion) of the transport rod, fig. 3C is an end view, and fig. 3D is an external perspective view.
(Overall Structure of Heat treatment apparatus 10)
As shown in fig. 1A, 1B, and 2, the heat treatment apparatus 10 includes a heat treatment furnace 20, a conveyance chamber 30, a conveyance rod 41, a conveyance rod 42, a conveyance device 50, and a switching device 60.
The heat treatment furnace 20 and the transfer chamber 30 are arranged in one direction (x direction in fig. 1A and 1B). The heat treatment furnace 20 is connected to the transfer chamber 30. Hereinafter, the direction in which the heat treatment furnace 20 and the transfer chamber 30 are arranged is described as the x direction.
The heat treatment furnace 20 has an internal space 200. The processing stage 230 and the heat source 240 are disposed in the internal space 200. More specifically, for example, as shown in fig. 1A and 1B, the processing table 230 is disposed at substantially the same position as the transport lever 41 and the transport lever 42 in the height direction (z direction in fig. 1A and 1B). The top surface of the processing table 230 is located higher than the upper ends of the transport rods 41 and 42. Hereinafter, the height direction will be described as the z direction.
The heat source 240 is disposed above and below the processing table 230 at a predetermined interval. The heat source 240 may be disposed laterally with respect to the processing table 230. The heat source 240 is realized by a lamp heater such as a linear light emitter, for example. The heat source 240 is not limited to this, and may be any heat source as long as it can uniformly heat the object WK placed on the processing table 230.
An opening 201 is formed in one side wall (front wall 21) of the walls constituting the heat treatment furnace 20. An opening 201 extends through the front wall 21. The internal space 200 of the heat treatment furnace 20 is connected to the internal space 300 of the transfer chamber 30 through the opening 201. The opening 201 corresponds to the "first opening" of the present invention.
The transfer chamber 30 includes an internal space 300. An opening 301 and an opening 302 are formed in one side wall (front wall 31) of the walls constituting the conveyance chamber 30 (see fig. 5). Openings 301, 302 extend through the front wall 31. The inner space 300 of the transfer chamber 30 is connected to the outside through these openings 301, 302.
The transfer chamber 30 is provided with an insulating wall 32. The heat insulating wall 32 is disposed near the end of the transfer chamber 30 on the heat treatment furnace 20 side. The heat insulating wall 32 is movable, and can switch between the connection and disconnection between the space on the side connected to the opening 201 and the space on the side connected to the opening 301 in the internal space 300.
The transport rod 41 and the transport rod 42 are rod-shaped (in the present invention, columnar) extending in one direction. The extending direction of the conveying rods 41 and 42 is parallel to the arrangement direction of the heat treatment furnace 20 and the conveying chamber 30. The transport rod 41 and the transport rod 42 are disposed in parallel with a predetermined distance therebetween. The arrangement direction of the transport rods 41 and 42 is a direction perpendicular to the x-direction and the z-direction (y-direction in fig. 1A and 1B). The distance Ws (see fig. 2) between the transport rod 41 and the transport rod 42 is larger than the y-direction dimension of the processing table 230 in consideration of the lengths of the support member 412 and the support member 422, which will be described later.
The transport rod 41 and the transport rod 42 are inserted through a second opening formed in the front wall 31 of the transport chamber 30. The first end 4111 in the extending direction of the conveyance lever 41 and the first end 4211 (see fig. 2) in the extending direction of the conveyance lever 42 are disposed inside the conveyance chamber 30, and the second end 4112 in the extending direction of the conveyance lever 41 and the second end 4212 (see fig. 6) in the extending direction of the conveyance lever 42 are disposed outside the conveyance chamber 30.
The first end 4111 of the transport lever 41 in the extending direction in the x direction and the first end 4211 of the transport lever 42 in the extending direction are located at the same position, and the second end 4112 of the transport lever 41 in the extending direction and the second end 4212 of the transport lever 42 in the extending direction are located at the same position.
The transfer device 50 is disposed on the side opposite to the side connected to the heat treatment furnace 20 with respect to the transfer chamber 30. That is, the transfer device 50 is disposed outside the transfer chamber 30 and the heat treatment furnace 20. The transport device 50 is connected to the transport rod 41 and the transport rod 42 via a rod holding member 51. The transport lever 41 and the transport lever 42 are held by the lever holding member 51 in a rotatable state in directions along the respective side surfaces.
The conveyor 50 moves along the x-direction. By the movement of the transport device 50, the transport rod 41 and the transport rod 42 also move in the x direction. Thus, as shown in fig. 1A, when the transport device 50 is located at the first end of the movement range, a portion of the first end 4111 of the transport lever 41 and a portion of the first end 4211 of the transport lever 42 are disposed in the internal space 300 of the transport chamber 30. On the other hand, as shown in fig. 1B, when the transport device 50 is located at the second end of the movement range, a portion of the first end 4211 of the transport rod 42 and a portion of the first end 4211 of the transport rod 42 are disposed in the internal space 200 of the heat treatment furnace 20.
As a result, as shown in fig. 1A, the heat treatment apparatus 10 can carry the object WK to be treated placed on the first end 4111 of the conveyance lever 41 and the first end 4211 of the conveyance lever 42 into the heat treatment furnace 20 through the opening 201 in the conveyance chamber 30 as shown in fig. 1B. On the other hand, the heat treatment apparatus 10 can carry the object WK heat-treated in the heat treatment furnace 20 out into the transfer chamber 30 through the opening 201.
The switching device 60 is connected to the second end 4112 of the conveyance lever 41 and the second end 4212 of the conveyance lever 42, which will be described in detail later. The switching device 60 includes a rotation assisting mechanism that rotates the transport lever 41 and the transport lever 42 in directions along the respective side surfaces.
In such a configuration, the support member 412 is disposed on the transport rod 41, and the support member 422 is disposed on the transport rod 42.
As shown in fig. 2, the number of the support members 412 is 2, and 2 support members 412 are connected to the vicinity of the first end portion 4111 of the transport lever 41 (the portion of the first end portion 4111 of the transport lever 41). The 2 support members 412 are arranged at intervals LS412 in the extending direction of the transport rod 41. The interval LS412 is determined by the size of the object WK to be processed supported during conveyance in the x direction, and 2 support members 412 are determined to be in contact with the back surface of the object WK.
The 2 support members 412 are connected to the side surface 411 of the transport rod 41. The 2 support members 412 protrude from the side surface 411 toward the conveying rod 42. The projecting amount L412 of the 2 support members 412 is determined by the displacement amount in the height direction of the object WK to be processed.
As shown in fig. 3A to 3D, the 2 support members 412 are round rods and have outer peripheral ends 413 at the distal ends. Thus, when the object WK is supported, the outer peripheral end 413 abuts against the rear surface of the object WK. That is, the support member 412 can support the object WK in a point manner. Therefore, the contact between the support member 412 and the object WK can be minimized. This can suppress, for example, occurrence of a local temperature difference in the object WK due to heat dissipation via the support member 412 in contact with the object WK, and occurrence of thermal influence such as deformation of the object WK. Further, by arranging 2 support members 412 along the x direction, the object WK can be stably supported.
As shown in fig. 2, the number of the support members 422 is 2, and 2 support members 422 are connected to the vicinity of the first end portion 4211 of the transport lever 42 (the portion of the first end portion 4211 of the transport lever 42). The 2 support members 422 are arranged at intervals LS422 in the extending direction of the transport rod 42. The interval LS422 is determined by the size of the object WK to be supported during conveyance in the x direction, and 2 support members 422 are determined to be in contact with the back surface of the object WK.
The 2 support members 422 are connected to the side 421 of the transport rod 42. The 2 support members 422 protrude from the side surface 421 toward the conveying rod 41. The projecting amount L422 of the 2 support members 422 is determined by the amount of movement of the object WK in the height direction.
The 2 support members 422 are round rods, like the 2 support members 412, and have outer peripheral ends 423 at the distal ends (see fig. 4). Thus, when the object WK is supported, the outer peripheral end 423 abuts against the rear surface of the object WK. That is, the support member 422 can support the object WK in a dot manner. Therefore, the contact between the support member 422 and the object WK can be minimized. This can suppress, for example, occurrence of a local temperature difference in the object WK due to heat dissipation via the support member 422 in contact with the object WK, and occurrence of thermal influence such as deformation of the object WK. Further, by arranging 2 support members 422 along the x direction, the object WK can be stably supported. Here, the support members 412 and 422 are examples of round rods, but the present invention is not limited to this, and any members may be used as long as they can support the object to be processed in a point contact manner, such as a triangular prism or polygonal prism rod or a rod having a hemispherical tip.
(behavior of the transportation levers 41 and 42 and the support members 412 and 422)
Fig. 4A and 4B are diagrams showing behaviors of the transport rod and the support member. Fig. 4A shows a first mode in which the object to be processed is supported by the support member, and fig. 4B shows a second mode in which the object to be processed is not supported by the support member.
As described above, the switching device 60 rotates the transport lever 41 and the transport lever 42. Thus, the support members 412 and 422 can be in the first mode shown in fig. 4A and the second mode shown in fig. 4B.
The first mode is a mode in which the tip of the support member 412 is located above the upper end of the transport rod 41, and the tip of the support member 422 is located above the upper end of the transport rod 42. Further, as shown in fig. 4A, in the first embodiment, the object WK to be processed supported by the front ends of the support members 412 and 422 is disposed above the top surface of the processing table 230.
The second mode is a mode in which the tip of the support member 412 is located below the upper end of the transport rod 41, and the tip of the support member 422 is located below the upper end of the transport rod 42.
Therefore, by using this switching, the object WK to be processed is placed on the support members 412 and 422 in the first mode in the transfer chamber 30, and is directly transferred into the heat treatment furnace 20, whereby the object WK to be processed is conveyed above the processing table 230.
In this state, when the processing table is switched to the second mode, the object WK is released from being supported by the support members 412 and 422 and is placed on the top surface of the processing table 230.
On the other hand, after the heat treatment, the conveying rods 41 and 42 are inserted into the heat treatment furnace 20 in the second mode, whereby the conveying rods 41 and 42 are disposed below the object WK to be treated. That is, the conveying rods 41 and 42 are disposed in the heat treatment furnace 20 without interfering with the object WK.
In this state, when the processing table is switched to the first mode, the object WK is supported by the support members 412 and 422 and is separated from the top surface of the processing table 230. Then, the object WK is conveyed while maintaining this state, and the object WK is carried out from the heat treatment furnace 20 to the conveyance chamber 30.
Thus, by using the configuration of the present embodiment, the object WK to be processed can be conveyed from the conveying chamber 30 into the heat treatment furnace 20 and placed on the top surface of the processing table 230 without changing the position of the conveying rods 41 and 42 in the height direction, and the object WK to be processed after the heat treatment can be lifted from the processing table 230 and conveyed from the inside of the heat treatment furnace 20 into the conveying chamber 30.
Thus, the height of the opening 201 can be set to a level from the lower ends of the conveying rods 41 and 42 to the upper surface of the object WK. Therefore, the opening area of the opening 201 can be reduced, and the heat of the heat treatment furnace 20 and the filled gas can be suppressed from leaking into the transfer chamber 30 through the opening 201. That is, the temperature and atmosphere of the heat treatment furnace 20 can be prevented from changing due to the presence of the opening 201.
In addition, by using the structure of the present embodiment, the height of the conveyance chamber 30 can be reduced. This can reduce the volume of the transfer chamber 30, reduce the amount of gas used for the transfer chamber 30, and reduce the replacement time of the atmosphere in the transfer chamber 30.
Further, by using the structure of the present embodiment, the opening areas of the openings 301 and 302 can be reduced. Fig. 5 is a view showing an opening formed in a front wall of the transport chamber and the transport rod.
As described above, in the heat processing apparatus 10, the transport rods 41 and 42 move only in the x direction and do not move in the z direction. Therefore, the openings 301 and 302 may have a size through which the transport rods 41 and 42 are inserted, and may have a shape along the outer shape (circumferential surface) of the transport rods 41 and 42, for example, a shape slightly larger than the outer shape of the transport rods 41 and 42. For example, the openings 301 and 302 may be circular openings having the same shape and the same size as the cross-sectional shape of the transport rods 41 and 42.
More specifically, the diameter Φ 301 of the opening 301 may be approximately the same as the diameter Φ 41 of the transport rod 41 and may be large. In this case, the diameter φ 301 of the opening 301 is preferably as close to the diameter φ 41 of the transport rod 41. The diameter Φ 301 of the opening 301 may be smaller than the distance H41 between the lower end of the transport rod 41 and the upper end of the support member 412 in the first form of the support member 412.
Similarly, the diameter Φ 302 of the opening 302 may be approximately the same as the diameter Φ 42 of the transport rod 42 and may be large. In this case, the diameter φ 302 of the opening 302 is closer to the diameter φ 42 of the transport rod 42, and the better. The diameter Φ 302 of the opening 302 may be smaller than the distance H42 between the lower end of the transport rod 42 and the upper end of the support member 422 in the first form of the support member 422.
With this configuration, the opening areas of the openings 301 and 302 can be reduced. This can reduce the area of the communication between the transfer chamber 30 and the outside via the openings 301 and 302. Therefore, the influence of the external temperature and the atmosphere on the internal temperature and the atmosphere of the transfer chamber 30 can be reduced. Further, the influence of the internal temperature and atmosphere of the heat treatment furnace 20 via the transfer chamber 30 can be reduced.
The switching device 60 for rotating the transport levers 41 and 42 is realized by, for example, the configuration shown in fig. 6A and 6B. Fig. 6A and 6B are diagrams showing an example of the configuration of the switching device, and fig. 6A corresponds to the first embodiment and fig. 6B corresponds to the second embodiment.
As shown in fig. 6A and 6B, the switching device 60 includes a rotation shaft 611, a rotation shaft 621, a slide plate 612, a slide plate 622, a coupling plate 63, a shaft member 601, and an actuator 602.
The rotation shaft 611 has a shape extending from the transport rod 41 toward the transport rod 42. The first end of the rotating shaft 611 is fixed to the second end 4112 of the conveying lever 41. The second end of the rotating shaft 611 is connected to the sliding plate 612. At this time, a groove 613 extending in the y direction is formed in the sliding plate 612, and the second end of the rotating shaft 611 is slidably connected to the sliding plate 612 by fitting a pin 614 disposed at the second end into the groove 613.
The rotation shaft 621 is shaped to extend from the transport lever 42 toward the transport lever 41. The first end of the rotating shaft 621 is fixed to the second end 4212 of the transport lever 42. The second end of the rotation shaft 621 is connected to the sliding plate 622. At this time, a groove 623 extending in the y direction is formed in the sliding plate 622, and the second end of the rotating shaft 621 is slidably connected to the sliding plate 622 by fitting a pin 624 disposed at the second end into the groove 623.
The sliding plate 612 and the sliding plate 622 are fixed to the coupling plate 63. More specifically, the sliding plate 612 is fixed to a first end portion in the y direction in the coupling plate 63, and the sliding plate 622 is fixed to a second end portion in the y direction in the coupling plate 63.
A first end of a shaft member 601 extending in the z direction is connected to the center of the coupling plate 63 in the y direction. The second end of the shaft member 601 is connected to the actuator 602.
In such a configuration, the actuator 602 changes the length of the shaft member 601, thereby changing the positions of the coupling plate 63, the slide plate 612, and the slide plate 622 in the z direction. Along with this change, the pin 614 moves (slides) in the groove 613, and the pin 624 moves (slides) in the groove 623. Then, the rotation shaft 611 rotates with the movement of the pin 614, and the rotation shaft 621 rotates with the movement of the pin 624. The rotation of these rotating shafts 611 and 621 causes the conveying rods 41 and 42 to rotate.
By using such a configuration for the switching device 60, the rotation of the transport lever 41 and the rotation of the transport lever 42 can be synchronized. Therefore, the object WK can be stably lifted.
The heat treatment apparatus 10 having the above-described configuration performs the heat treatment of the object WK by performing the treatment shown in fig. 7 and 8, for example. Fig. 7A, 7B, 7C, 7D, and 7E are diagrams illustrating steps from the outside of the heat treatment apparatus to the time when the object to be treated is charged and heat treatment is performed. Fig. 8A, 8B, 8C, and 8D are diagrams illustrating steps after the heat treatment of the object to be treated and before the object to be treated is taken out of the heat treatment apparatus.
First, as shown in fig. 7A, the object WK to be processed is input from the input port 39 in a state where the first end portions 4111, 4211 of the conveyance rods 41, 42 are positioned in the conveyance chamber 30. At this time, the support members 412 and 422 are in the first mode, and the object WK is placed on the support members 412 and 422. In this state, the heat insulating wall 32 is provided so as to separate the internal space 300 of the conveyance chamber 30 into a side where the conveyance rods 41 and 42 are present and a side connected to the opening 201. This can prevent the inlet 39 from directly connecting to the opening 201. As described above, after the object WK is input, the input port 39 is closed. Then, when the object WK to be processed is introduced into the conveyance chamber 30, the conveyance chamber 30 is replaced to remove the outside air mixed from the introduction port 39. This replacement process is performed by supplying a purge gas such as nitrogen gas into the transfer chamber 30, and the air in the transfer chamber 30 is purged by the purge gas. Thereby, the atmosphere in the transfer chamber 30 is replaced with an inert gas atmosphere such as nitrogen gas.
Next, as shown in fig. 7B, the heat insulating wall 32 is moved upward with the inlet 39 closed. This allows the conveyance rods 41 and 42 and the object WK to be carried into the heat treatment furnace 20 through the opening 201.
Next, as shown in fig. 7C, the first end portions 4111, 4211 of the conveyance rods 41, 42 are inserted into the heat treatment furnace 20 by moving the conveyance rods 41, 42 by the conveyance device 50. Thereby, the object WK to be processed is conveyed to the upper side of the processing table 230.
Next, as shown in fig. 7D, the support members 412 and 422 are switched from the first mode to the second mode, and the object WK to be processed is placed on the top surface of the processing table 230.
Next, as shown in fig. 7E, the transport device 50 moves the transport rods 41 and 42, and retracts the first end portions 4111 and 4211 of the transport rods 41 and 42 into the transport chamber 30. In this state, the heat insulating wall 32 moves downward, and separates the internal space 300 of the transport chamber 30 into a side where the transport rods 41 and 42 are present and a side connected to the opening 201. In other words, the heat insulating wall 32 is configured to close the opening 201, and forms a closed space.
Then, in this state, the heat treatment furnace 20 is controlled to a predetermined temperature and atmosphere to heat-treat the object WK.
After the object WK is heat-treated, the heat insulating wall 32 moves upward as shown in fig. 8A. Then, the conveyance rods 41 and 42 move, and the first end portions 4111 and 4211 of the conveyance rods 41 and 42 reach below the object WK to be processed in the heat treatment furnace 20. At this time, since the support members 412 and 422 are in the second mode, even if the first end portions 4111 and 4211 of the conveyance rods 41 and 42 approach the object WK, the first end portions do not collide with the object WK.
Next, as shown in fig. 8B, the support members 412 and 422 are switched from the second form to the first form, and the object WK to be processed is lifted from the top surface of the processing table 230. Then, the object WK is supported by the support members 412 and 422.
Next, as shown in fig. 8C, the transport device 50 moves the transport rods 41 and 42, and moves the first end portions 4111 and 4211 of the transport rods 41 and 42 into the transport chamber 30. Thereby, the object WK to be processed is carried out from the heat treatment furnace 20 to the conveyance chamber 30.
Next, as shown in fig. 8D, the heat insulating wall 32 is moved downward to separate the internal space 300 of the transport chamber 30 into a side where the transport rods 41 and 42 are present and a side connected to the opening 201. In this state, the object WK to be treated is taken out of the heat treatment apparatus 10 by opening the inlet 39.
In such a heat treatment process, the opening 201 between the heat treatment furnace 20 and the transfer chamber 30 and the opening 301 between the transfer chamber 30 and the outside affect the maintenance of the temperature and atmosphere of the heat treatment furnace 20 and the transfer chamber 30. However, by adopting the structure of the present embodiment, the opening areas of the openings 201 and 301 can be reduced, and the influence on the temperature and atmosphere maintenance of the heat treatment furnace 20 and the transfer chamber 30 can be suppressed. That is, loss of the openings 201 and 301 in maintaining the temperature and atmosphere of the heat treatment furnace 20 and the transfer chamber 30 can be suppressed, and the temperature and atmosphere of the heat treatment furnace 20 and the transfer chamber 30 can be effectively maintained.
(other examples of the manner of switching the supporting member)
In the above description, the embodiment in which the positions of the distal ends of the support members 412 and 422 in the height direction (z direction) are changed by rotating the transport rods 41 and 42 is shown. However, with other configurations, the positions of the distal ends of the support members 412 and 422 in the height direction can be changed. Fig. 9A and 9B are diagrams conceptually showing another example of the support member. Fig. 9A and 9B are views seen from the first end side of the support member.
The support members 412 and 422 have a first form shown in fig. 9A protruding from the upper ends of the transport rods 41 and 42 and a second form shown in fig. 9B housed in the transport rods 41 and 42. The mechanism for projecting the support members 412 and 422 from the upper ends of the transport rods 41 and 42 or housing the support members 412 and 422 in the transport rods 41 and 42 may be a mechanism for physically pushing out or pulling in the support members 412 and 422, or a mechanism for pushing out or pulling in the support members 412 and 422 using compressed air or the like. Other mechanisms are also possible. Even with such a configuration, the same operational effects as those of the configuration using the mechanism for rotating the transport levers 41 and 42 described above can be obtained.
Further, in the above description, the example in which the pair of conveyance levers 41 and 42 are used as the conveyance levers has been described, but the above configuration is not limited thereto, and one conveyance lever may be used. At this time, one transport rod 41 can be moved to carry the object WK into the heat treatment furnace 20.
Fig. 10 is a partial plan view showing a configuration of a derivative example of the transport rod. For example, as shown in fig. 10, one transport rod 41 may be branched into two branches at its distal end portion, and the support members 412 and 422 may be disposed at one end and the other end of the two branches, respectively. In this case, as for the switching between the first form and the second form of the support members 412 and 422, for example, as in the case of the example shown in fig. 9A and 9B, the support members 412 and 422 can be switched between the first form protruding from one end and the other end of the bifurcated portion and the second form accommodated in one end and the other end of the bifurcated portion.
In the above description, the atmosphere furnace is used as the heat treatment furnace 20, but the above configuration is not limited to the atmosphere furnace, and can be applied to heat treatment furnaces of other specifications.
In the above description, the embodiment including the conveyance chamber 30 is described, but the configuration of the present invention can be applied to the embodiment without the conveyance chamber 30.
The foregoing description of the embodiments is illustrative in all respects and should not be taken as limiting. The scope of the present invention is indicated not by the description of the above embodiments but by the claims. Further, the present invention includes meanings equivalent to the claims and all modifications within the scope of the claims.

Claims (6)

1. A heat treatment apparatus is characterized by comprising:
a heat treatment furnace having a first opening through which an object to be treated is conveyed, and performing heat treatment on the object to be treated;
a rod-shaped conveying rod which is movable into and out of the heat treatment furnace, has a first end on the heat treatment furnace side and a second end on the opposite side of the heat treatment furnace, and is inserted through the first opening;
a conveyor connected to the second end portion to move the first end portion in the heat treatment furnace;
a support member disposed at the first end portion, and configured to be switched between a first state in which the support member protrudes upward from an upper end of the transport rod and on which the object to be processed can be placed and a second state in which the support member is disposed downward from the upper end; and
a switching device for switching the first and second forms of the support member via the transport lever.
2. The thermal processing device of claim 1,
the support member is a rod-shaped body disposed on a side surface of the first end portion.
3. The thermal processing device of claim 2,
the switching device is connected to the second end portion, and includes a rotation assisting mechanism that rotates the transport rod in a direction along the side surface.
4. The heat treatment apparatus according to any one of claims 1 to 3,
the heat treatment apparatus includes a transfer chamber connected to the heat treatment furnace via the first opening, and having a second opening in a wall opposite to the first opening,
the transport rod is inserted through the first opening and the second opening and moved.
5. The thermal processing device of claim 4,
the transport chamber is provided with an input port which is input with the processed object and can be opened and closed,
in a state where the inlet port is closed, an atmosphere of the transfer chamber is replaced with an inert gas.
6. The thermal processing device of claim 4,
the second opening has a shape following the outer shape of the transport rod.
CN202011493831.9A 2019-12-20 2020-12-17 Heat treatment device Active CN113008032B (en)

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JP7379135B2 (en) 2023-11-14

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