CN112993606B - Electronic equipment and preparation method of elastic grounding assembly - Google Patents

Abstract

The application discloses an electronic device, including the display screen, equipment housing and elasticity ground connection subassembly, the display screen is located on the equipment housing, elasticity ground connection subassembly includes elastomer and metal conducting strip, the metal conducting strip is including the first section that links up in proper order, second section and third section, the second section is bent and is formed tubular structure portion, tubular structure portion is located to the elastomer, first section and third section superpose each other and all link up in one side of tubular structure portion, tubular structure portion elastic support is between display screen and equipment housing, the equipment housing includes the ground connection region, first section and third section all are connected with the regional electricity of ground connection, just so form two independent conduction paths each other, in order to guarantee the stability of ground connection conductive process, and then guarantee the effective transmission of signal, the application still discloses an elasticity ground connection subassembly's preparation method.

Description

Electronic equipment and preparation method of elastic grounding assembly

Technical Field

The present disclosure relates to the field of communications devices, and in particular, to a method for manufacturing an electronic device and an elastic grounding assembly.

Background

The grounding assembly in the mobile phone is used for ensuring signal transmission, the grounding assembly generally comprises a conducting strip, viscose, foam with a nickel plating cover and the like, and the screen and the middle frame can form grounding backflow through the support of the foam and the adhesion of the viscose, so that grounding is completed.

However, the existing grounding assemblies are all formed into a single conducting path, and if faults such as short circuit and open circuit occur, signal transmission is interrupted. Obviously, the current mobile phone has the problem of unstable grounding.

Of course, the same problem is present in other kinds of electronic devices, not limited to mobile phones.

Disclosure of Invention

The application discloses an electronic device and a preparation method of an elastic grounding assembly, which aim to solve the problem of influence on signal transmission.

In order to solve the above problems, the following technical solutions are adopted in the present application:

in a first aspect, the application discloses electronic equipment, including display screen, equipment casing and elasticity ground connection subassembly, the display screen is located on the equipment casing, elasticity ground connection subassembly includes elastomer and metal conducting strip, the metal conducting strip is including the first section, second section and the third section that link up in proper order, the second section is bent and is formed tubular structure portion, the elastomer is located in the tubular structure portion, the first section with the mutual superpose of third section and all link up in one side of tubular structure portion, tubular structure portion elastic support in the display screen with between the equipment casing, the equipment casing includes the ground connection region, the first section with the third section all with the regional electricity of ground connection is connected.

In a second aspect, the present application discloses a method of making an elastomeric grounding assembly, comprising:

and forming a gold plating layer on the substrate to obtain a metal conducting strip, wherein the metal conducting strip comprises a first section, a second section and a third section which are sequentially connected.

And wrapping the metal conductive sheet on an elastic body, so that the second section is bent to form a cylindrical structure part, and the first section and the third section are overlapped on one side of the cylindrical structure part.

The technical scheme adopted by the application can achieve the following beneficial effects:

this application sets up tubular structure portion, first section and third section through elastic grounding assembly to tubular structure portion forms two independent ground connection conduction paths each other with first section and third section respectively, can guarantee the stability of water conservancy diversion process like this, and then guarantees transmitting more steadily of signal.

Drawings

FIG. 1 is an exploded view of a resilient grounding assembly in one embodiment disclosed herein;

FIG. 2 is a block diagram of a conductive metal strip in one embodiment disclosed herein;

FIG. 3 is an exploded view of a resilient grounding assembly in an electronic device according to one embodiment of the present disclosure;

FIG. 4 is a schematic view of an embodiment of a resilient grounding assembly installed in an electronic device according to the present disclosure;

FIG. 5 is an enlarged view at I of FIG. 4 in one embodiment disclosed herein;

fig. 6 is a schematic diagram illustrating an electronic device performing ground conduction through an elastic ground component according to an embodiment of the disclosure.

Description of the reference numerals:

100-an elastic grounding component,

110-metal conducting strip,

111-the first section,

112-cylindrical structural part, 1121-first inner side wall, 1122-second inner side wall,

113-a third section,

120-first adhesive layer, 130-elastomer, 140-second adhesive layer, 150-third adhesive layer,

200-a display screen,

300-device case, 310-metal middle frame, 320-antenna radiator, 330-positioning slot, 331-first

Subslot, 332-second subslot.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

As shown in fig. 1 and 6, the electronic device disclosed herein includes a display screen 200, a device case 300, and a resilient ground assembly 100. Wherein, the display screen 200 is provided on the device case 300.

As shown in fig. 2 and 3, the elastic grounding assembly 100 includes an elastic body 130 and a metallic conductive sheet 110. The metal conducting strip 110 comprises a first section 111, a second section and a third section 113 which are connected in sequence. The second segment is bent to form a tubular structure portion 112, and the elastic body 130 is provided in the tubular structure portion 112. The first segment 111 and the third segment 113 are stacked on each other and are both connected to one side of the cylindrical structure portion 112, the cylindrical structure portion 112 is elastically supported between the display screen 200 and the device housing 300, the device housing 300 includes a ground area, and both the first segment 111 and the third segment 113 are electrically connected to the ground area.

Thus, two grounding conductive paths are formed among the display screen 200, the equipment housing 300 and the elastic grounding assembly 100, wherein one of the two grounding conductive paths is that the current on the display screen 200 is conducted to the equipment housing 300 through the tubular structure part 112 and the first section 111 in sequence, and the other is that the current on the display screen 200 is conducted to the equipment housing 300 through the tubular structure part 112 and the third section 113 in sequence so as to realize the electrical connection with a grounding area.

Meanwhile, the grounding current circulates in the metal conducting strip 110, so that the impedance is uniform, and possible abnormalities such as noise waves, nonuniform impedance and the like in the multi-medium transmission process can be avoided, so that the grounding conduction efficiency is ensured. In contrast to the related art, the case where grounding is unstable due to aging or the like when grounding is performed through the conductive adhesive layer occurs.

It should be pointed out simultaneously that elastomer 130 plays the effect of supporting the design to tubular structure portion 112 in this application to prevent that collapse from appearing in its use, arouse and display screen 200 between the unusual that contact failure appears, in order to realize this effect, elastomer 130 chooses the cotton as the material for the preparation of bubble usually, and the insulating nature of bubble cotton can effectively ensure that the short circuit can not appear between two water conservancy diversion routes.

More specifically, as shown in fig. 1 and 6, the elastic grounding assembly 100 may include a first adhesive layer 120, the cylindrical structural portion 112 includes a first inner sidewall 1121 adjacent to the display panel 200, and the first adhesive layer 120 is adhered between the first inner sidewall 1121 and the elastic body 130, so that the structural stability between the elastic body 130 and the cylindrical structural portion 112 can be ensured. The first adhesive layer 120 may be made of an insulating double-sided adhesive tape, which has a better adhesive effect and can better ensure the insulation between the elastic body 130 and the tubular structure portion 112.

Furthermore, as shown in fig. 6, the elastic body 130 may be a square column, and the cylindrical structure portion 112 forms a square cylindrical structure to wrap the periphery of the elastic body 130, so that the metal conductive sheet 110 forms a "P" shaped structure, a first conductive path is formed between the display screen 200, the cylindrical structure portion 112, the first section 111 and the device housing 300, a second conductive path is formed between the display screen 200, the cylindrical structure portion 112, the third section 113 and the device housing 300, and the first conductive path and the second conductive path have different shapes, so that two different conductive paths can be better distinguished from each other in shape, and foolproof installation is realized. In addition, the arrangement enables the first inner sidewall 1121 to form a surface contact with the display panel 200, and the contact area between the cylindrical structure portion 112 and the display panel 200 can be increased by matching with the supporting effect of the elastic body 130, so that the efficiency of ground conduction is higher.

More specifically, as shown in fig. 6, the elastic ground assembly 100 may include a second adhesive layer 140. The cylindrical structure 112 may include a second interior sidewall 1122 adjacent the device housing 300.

The first end of the second adhesive layer 140 is adhered between the second inner sidewall 1122 and the elastic body 130, so that the elastic body 130 can be more stably arranged in the cylindrical structure portion 112 by matching the adhesion effect of the first adhesive layer 120; meanwhile, the second end of the second adhesive layer 140 is adhered between the first segment 111 and the third segment 113, so that the overall structure of the metal conductive sheet 110 is more stable. In this case, the connection between the elastic body 130 and the second inner sidewall 1122 and the connection between the first section 111 and the third section 113 can be achieved by using one second adhesive layer 140, and the structure is simple.

Meanwhile, the second adhesive layer 140 may be made of an insulating double-sided adhesive tape, so that the adhesive effect is better, the insulating properties between the elastic body 130 and the tubular structure portion 112 and between the first section 111 and the third section 113 can be improved, and abnormal phenomena such as short circuit can be better prevented.

In a more specific embodiment, the elastic grounding assembly 100 may further include a third adhesive layer 150, and the third adhesive layer 150 may be adhered between the cylindrical structure portion 112 and the device housing 300.

The third adhesive layer 150 may be made of an insulating double-sided tape, and a specific position of the third adhesive layer is located on a side of the second inner sidewall 1122 opposite to the first end of the second adhesive layer 140, so that the connection between the elastic grounding assembly 100 and the device case 300 is stable, and the insulating property of the third adhesive layer can better control the output of the current guiding path, so that the current flowing through the first section 111 is output from the end of the first section 111 close to the second end of the second adhesive layer 140, and the current flowing through the third section 113 is output from the end of the third section 113 close to the second end of the second adhesive layer 140, so as to prevent the circuit from being output to the device case 300 from a position outside the grounding region.

Further, the first segment 111 and the third segment 113 are electrically connected to the ground region by soldering. In this way, in the elastic grounding assembly 100, the end where the cylindrical structure portion 112 is located is bonded to the device case 300 through the third adhesive layer 150, and the ends where the first section 111 and the third section 113 are located are connected to the device case 300 by welding, so that the connection between the elastic grounding assembly 100 and the device case 300 is more stable.

And the welding points formed by welding can also be conductive media between the first section 111 and the equipment shell 300 and between the third section 113 and the equipment shell 300, so that the current in the two current-conducting paths is guided to be output to the equipment shell 300 from the welding point positions, and the output of the current in the grounding process is better controlled to be in the grounding area on the equipment shell 300.

More specifically, the first section 111 and the third section 113 are both planar sections, the device housing 300 has a welding plane, and the first section 111 and the third section 113 are welded on the welding plane by ultrasonic welding, so that the first section 111, the third section 113 and the device housing 300 have better solubility in the welding manner, and are more beneficial to conducting current. Meanwhile, due to the design of the welding plane and the plane section, the first section 111, the third section 113 and the equipment shell 300 can be ensured to have larger contact area, so that the welding is more stable, and the welding operation is easier to perform.

In a more specific embodiment, as shown in fig. 3 to 5, the device housing 300 may be formed with a positioning groove 330, the positioning groove 330 includes a first sub-groove 331 and a second sub-groove 332, the first sub-groove 331 is communicated with the second sub-groove 332, the tubular structure portion 112 is elastically supported between the bottom wall of the first sub-groove 331 and the display screen 200, and the first section 111 and the third section 113 are disposed in the second sub-groove 332. Thus, the elastic grounding assembly 100 and the device housing 300 are embedded, so that the connection of the elastic grounding assembly 100 can be ensured to be stable, and the elastic grounding assembly 100 is prevented from being dislocated.

In some embodiments, the metallic conductive sheet 110 may include a copper foil and a gold plating disposed on the copper foil, the gold plating being located on an outer side surface of the elastic grounding assembly 100. The design of the gold plating layer can reduce the surface contact resistance between the metal conducting strip 110 and the elastic body 130, and the copper foil is soft and has small resistance, so that the metal conducting strip 110 can form good coating on the elastic body 130 and can improve the efficiency of grounding and flow guiding.

Further, the copper foil may be annealed prior to use, resulting in a more ductile material that is less prone to cracking when wrapped around the elastomer 130.

More specifically, in order to enable the gold plating layer to be smoothly coated on the copper foil, the metal conductive sheet 110 further includes a nickel plating layer, and the nickel plating layer is located between the gold plating layer and the copper foil. In the actual surface treatment process, a copper foil with the thickness of 10-25 um can be selected, nickel with the thickness of 0.5-2 um is electroplated by adopting an electroplating process, and then gold with the thickness of 0.05-0.5 um is electroplated after a nickel-plated layer is formed, so as to form a gold-plated layer.

In some embodiments, the device housing 300 may include a metal middle frame 310, and the outer side edge of the metal middle frame 310 is an antenna radiator 320. The display panel 200 includes a curved edge, the curved edge is connected to the antenna radiator 320, and the cylindrical structure portion 112 is disposed between the curved edge and the metal middle frame 310.

This can shorten the distance between the cylindrical structure portion 112 and the antenna radiator 320, so as to avoid an excessively long distance therebetween, which may cause a parasitic capacitance to be formed during the grounding current guiding process, thereby reducing the performance of the antenna radiator 320.

The electronic device disclosed in the embodiment of the present application may be a mobile phone, a computer, an electronic book reader, a medical device, a wearable device (e.g., a smart watch), and the like, and the embodiment of the present application does not limit the specific kind of the electronic device.

The present application further provides a method for manufacturing the elastic grounding assembly 100, which includes:

step 101, forming a gold plating layer on a substrate to obtain a metal conducting strip 110.

In step 101, the substrate may be a copper foil. The metal conducting strip 110 formed in this step includes a first section 111, a second end and a third section 113 which are connected in sequence.

Step 102, wrapping the metal conductive sheet 110 on the elastic body 130, so that the second section is bent to form a cylindrical structure part 112, and the first section 111 and the third section 113 are overlapped on one side of the cylindrical structure part 112.

In a specific implementation process, the elastic body 130 may be placed on the conductive metal sheet 110, and then the elastic body 130 is wrapped by winding, while the two ends of the conductive metal sheet 110 are overlapped during the winding process.

Of course, in an alternative solution, the first adhesive layer 120 and the second adhesive layer 140 described above may be disposed on the conductive metal sheet 110 at corresponding positions before step 102.

In an optional scheme, step 101 may specifically include the following steps:

step 201, forming a nickel plating layer on a substrate.

Optionally, in this step, nickel with a thickness of 0.5 to 2um may be electroplated on the substrate to form a nickel-plated layer.

Step 201, forming a gold plating layer on the nickel plating layer to obtain the metal conductive sheet 110.

Optionally, gold with a thickness of 0.05-0.5 um can be electroplated to form a gold-plated layer.

In the optional scheme, a nickel plating layer can be arranged in advance before the base material is plated with gold, and then gold is plated on the nickel plating layer, so that the gold plating layer is easier to form, and the gold plating effect can be improved.

In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.

The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims (13)

1. An electronic device is characterized by comprising a display screen, a device shell and an elastic grounding assembly, wherein the display screen is arranged on the device shell, the elastic grounding assembly comprises an elastic body and a metal conducting strip, the metal conducting strip comprises a first section, a second section and a third section which are sequentially connected, the second section is bent to form a cylindrical structure part, the elastic body is arranged in the cylindrical structure part, the first section and the third section are mutually superposed and are both connected to one side of the cylindrical structure part, the cylindrical structure part is elastically supported between the display screen and the device shell, the device shell comprises a grounding area, and the first section and the third section are both electrically connected with the grounding area.

2. The electronic device of claim 1, wherein the resilient grounding assembly comprises a first adhesive layer, wherein the tubular structure portion comprises a first inner sidewall adjacent to the display screen, and wherein the first adhesive layer is adhered between the first inner sidewall and the resilient body.

3. The electronic device of claim 1, wherein the resilient grounding assembly comprises a second adhesive layer, wherein the cylindrical structure portion comprises a second inner sidewall adjacent to the device housing, wherein a first end of the second adhesive layer is adhered between the second inner sidewall and the elastic body, and wherein a second end of the second adhesive layer is adhered between the first segment and the third segment.

4. The electronic device of claim 1, wherein the resilient grounding assembly further comprises a third adhesive layer adhered between the cylindrical structure and the device housing.

5. The electronic device of claim 1, wherein the first segment and the third segment are electrically connected to the ground region by soldering.

6. The electronic device of claim 5, wherein the first segment and the third segment are both planar segments, the device housing having a soldering plane on which the first segment and the third segment are ultrasonically soldered.

7. The electronic device of claim 1, wherein the device housing defines a positioning slot, the positioning slot includes a first sub-slot and a second sub-slot, the first sub-slot is communicated with the second sub-slot, the tubular structure portion is elastically supported between a bottom wall of the first sub-slot and the display screen, and the first segment and the third segment are disposed in the second sub-slot.

8. The electronic device of claim 1, wherein the metallic conductive strip comprises a copper foil and a gold-plating layer disposed on the copper foil, the gold-plating layer being located on an outer side surface of the elastic grounding assembly.

9. The electronic device of claim 8, wherein the metallic conductive sheet further comprises a nickel plating layer, the nickel plating layer being located between the gold plating layer and the copper foil.

10. The electronic device of claim 1, wherein the device housing comprises a metal middle frame, an outer edge of the metal middle frame is an antenna radiator, the display screen comprises a curved edge, the curved edge is engaged with the antenna radiator, and the cylindrical structure portion is disposed between the curved edge and the metal middle frame.

11. The electronic apparatus according to claim 1, wherein the cylindrical structure portion is a square cylindrical structure.

12. A method for preparing an elastic grounding assembly, wherein the method for preparing an elastic grounding assembly is used for preparing the elastic grounding assembly of any one of claims 1 to 11, and the method for preparing the elastic grounding assembly comprises the following steps:

forming a gold plating layer on a substrate to obtain a metal conducting strip, wherein the thickness of the gold plating layer is 0.05-0.5 um, the metal conducting strip comprises a first section, a second section and a third section which are sequentially connected, and the first section and the second section are both used for being electrically connected with a grounding area;

and wrapping the metal conductive sheet on an elastic body, so that the second section is bent to form a cylindrical structure part, and the first section and the third section are overlapped on one side of the cylindrical structure part.

13. The method for manufacturing according to claim 12, wherein the forming of the gold plating layer on the substrate to obtain a metallic conductive sheet comprises:

forming a nickel plating layer on a substrate;

and forming a gold plating layer on the nickel plating layer to obtain the metal conducting strip.

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