CN112992755A - Mass transfer device and transfer method thereof - Google Patents
Mass transfer device and transfer method thereof Download PDFInfo
- Publication number
- CN112992755A CN112992755A CN202010463718.XA CN202010463718A CN112992755A CN 112992755 A CN112992755 A CN 112992755A CN 202010463718 A CN202010463718 A CN 202010463718A CN 112992755 A CN112992755 A CN 112992755A
- Authority
- CN
- China
- Prior art keywords
- solution
- temporary storage
- storage substrate
- led chip
- transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention relates to the technical field of mass transfer, in particular to a mass transfer device and a transfer method thereof, wherein the device comprises: a transfer container for containing solution, wherein a liquid inlet and a liquid outlet are respectively arranged at two opposite sides of the transfer container, and a circulating pump is connected between the liquid inlet and the liquid outlet; the bottom of the transfer container is provided with a target substrate which is arranged between the liquid inlet and the liquid outlet; the upper end of the transfer container is provided with an opening end for the temporary storage substrate to enter, and the temporary storage substrate is adhered with an LED chip; the camera is arranged towards the temporary storage substrate; the mobile equipment is used for vertically moving the temporary storage substrate; the processor is electrically connected with the camera, the mobile equipment and the circulating pump respectively; the solution contained in the massive transfer device can directionally flow in the massive transfer device, so that the LED chips entering the solution can be transferred to the target back plate along with the flow of the solution, and the transfer requirements of Micro LED chips with various sizes are greatly met.
Description
Technical Field
The present invention relates to the field of mass transfer technologies, and in particular, to a mass transfer apparatus and a mass transfer method using the same.
Background
With the development of science and technology, Light Emitting Diodes (LEDs) have become important display elements in display screens because of their good stability, long service life, low power consumption, high color saturation, fast response speed, and high contrast. A large number of LED chips are mounted on an existing LED display panel, and in the manufacturing process of a display screen, the LED chips need to be transferred from a growth substrate thereof to a display backplane of the display screen.
In the prior art, when the LED chip needs to be transferred from the growth substrate to the display backplane, the LED chip needs to be picked up by the vacuum nozzle on the first substrate and then placed on the second substrate, but this method is often affected by the size of the vacuum nozzle; with the further development of the LED display technology, the size of the LED chip is smaller and smaller, and since the size of the existing Micro LED (Micro light emitting diode) chip is already smaller than 50 micrometers, even up to several micrometers, and the existing vacuum nozzle cannot break through the technical limit of 80 micrometers, it is difficult to pick up the Micro LED chip, so the existing transfer mode based on the vacuum nozzle cannot meet the transfer requirement of the Micro LED chip gradually.
Disclosure of Invention
In order to overcome the above-mentioned drawbacks, the present invention provides a bulk transfer apparatus suitable for small-sized Micro LED chips and a bulk transfer method thereof.
The purpose of the invention is realized by the following technical scheme:
the present invention is a bulk transfer apparatus comprising:
the transfer container is used for containing a solution, a liquid inlet and a liquid outlet are respectively arranged on two opposite sides of the transfer container, and a circulating pump is connected between the liquid inlet and the liquid outlet through a pipeline, so that the solution in the transfer container flows from the liquid inlet to the liquid outlet; a target substrate is arranged at the bottom of the transfer container and is arranged between the liquid inlet and the liquid outlet; the upper end of the transfer container is provided with an opening end for the temporary storage substrate to enter, an LED chip is adhered on the temporary storage substrate through an adhesive layer, and the adhesive layer can be dissolved in the solution;
the camera is arranged towards the temporary storage substrate; the mobile device is used for vertically moving the temporary storage substrate; and the processor is electrically connected with the camera, the mobile equipment and the circulating pump respectively.
The transfer container is arranged in the mass transfer device, and the solution contained in the transfer container can flow directionally in the transfer container, so that in the mass transfer method, the LED chips entering the solution can fall to the preset position of the bottom target back plate along with the flow of the solution, and the vacuum suction nozzle is not used for picking up the LED chips, so that the transfer process is not limited by the sizes of the Micro LED chips, and the transfer requirements of the Micro LED chips with various sizes are greatly met.
Optionally, a groove for accommodating the LED chip is provided in the target substrate.
Optionally, the number of the groove positions is an integral multiple of three.
Optionally, the LED chip includes: the LED chip comprises a red LED chip, a green LED chip and a blue LED chip.
Based on the same inventive concept, the present application also provides a bulk transfer method using the bulk transfer apparatus as described above, which includes:
installing a target substrate at the bottom of a transfer container, and opening the circulating pump to enable the solution in the transfer container to flow from the liquid inlet to the liquid outlet;
providing a temporary storage substrate, wherein an LED chip is fixed on the temporary storage substrate through an adhesive layer;
vertically placing the temporary storage substrate into the solution from the upper end of the transfer container through the mobile device, so that the bonding layer on the temporary storage substrate is dissolved by the solution to release the LED chip on the temporary storage substrate;
the LED chip descends in the solution and horizontally moves along with the flowing direction of the solution; dropping it into a predetermined position of the target substrate.
In the mass transfer method, the LED chips entering the solution can fall to the preset position of the bottom target back plate along with the flow of the solution, and the vacuum suction nozzle is not used for picking up the LED chips, so that the transfer process is not limited by the sizes of the Micro LED chips, and the transfer requirements of the Micro LED chips with various sizes are greatly met.
Optionally, the turning on the circulation pump allows the solution in the transfer container to flow from the liquid inlet to the liquid outlet, including:
and opening and adjusting the circulating pump to enable the solution in the transfer container to flow from the liquid inlet to the liquid outlet at a preset horizontal speed.
Optionally, the turning off the circulation pump includes:
providing a new temporary storage substrate, wherein the type of the LED chip on the new temporary storage substrate is inconsistent with the type of the LED chip which is transferred last time; and restarting the circulation pump connected between the liquid inlet and the liquid outlet.
Optionally, placing a temporary storage substrate into the solution from an upper end of the transfer container further comprises:
and recording the putting time and the putting position of the temporary storage substrate in the solution.
Optionally, the restarting the circulation pump connected between the liquid inlet and the liquid outlet includes:
adding a preset time length to the putting time to update the putting time; and if the current moment is consistent with the putting moment, putting the temporary storage substrate into the solution in the putting position.
Optionally, the restarting the circulation pump connected between the liquid inlet and the liquid outlet includes:
adding a preset distance to the feeding position to update the feeding position, and if the current time is consistent with the feeding time, placing the temporary storage substrate into the solution in the feeding position.
Drawings
For the purpose of easy explanation, the present invention will be described in detail with reference to the following preferred embodiments and the accompanying drawings.
FIG. 1 is a schematic diagram of a bulk transfer apparatus according to one embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a temporary storage substrate according to the present invention;
FIG. 3 is a schematic view of another embodiment of the bulk transfer apparatus according to the present invention;
FIG. 4 is a flowchart illustrating an embodiment of a bulk transfer method according to the present invention;
FIG. 5 is a flowchart illustrating a mass transfer method according to another embodiment of the present invention;
FIG. 6 is a flowchart illustrating a mass transfer method according to another embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
A mass transfer device according to the present invention is described in detail with reference to fig. 1 to 3, which includes:
a transfer container 101, wherein the transfer container 101 is a place for mass transfer, and the transfer container 101 contains a solution 102, wherein the solution 102 is an organic solution or an inorganic solution; a liquid inlet 103 and a liquid outlet 104 are respectively arranged on two opposite sides of the transfer container 101, and when mass transfer is carried out, the solution 102 enters the transfer container 101 from the liquid inlet 103 and is output out of the transfer container 101 from the liquid outlet 104; causing the solution 102 to flow in the direction from the liquid inlet 103 to the liquid outlet 104 in the transfer vessel 101; in the present embodiment, the liquid inlet 103 is disposed on the left side of the transfer container 101, and the liquid outlet 104 is disposed on the right side of the transfer container 101; so that the solution 102 can flow from left to right within the transfer container 101; a target substrate 201 is arranged at the bottom of the transfer container 101, the target substrate 201 is used for accommodating the transferred LED chips 303, and a groove position 202 for accommodating the LED chips 303 is arranged in the target substrate 201; the transferred LED chip 303 is accommodated in the groove 202; the target substrate 201 is disposed between the liquid inlet 103 and the liquid outlet 104; an opening end for allowing a temporary storage substrate 301 to enter is arranged at the upper end of the transfer container 101, an LED chip 303 is adhered to the temporary storage substrate 301 through an adhesive layer 302, and the adhesive layer 302 is soluble in the solution 102; when transferring, the temporary storage substrate 301 is placed into the solution 102 from top to bottom, a plurality of LED chips 303 are disposed on the temporary storage substrate 301, and on the same temporary storage substrate 301, the types of the LED chips 303 are the same, as follows: on the same temporary storage substrate 301, all the LED chips 303 are red LED chips 303R; the plurality of LED chips 303 on the temporary storage substrate 301 enter the solution 102 in sequence, and the bonding layer 302 in the temporary storage substrate 301 is dissolved by the solution 102 in the transfer container 101, so that the LED chips 303 are separated from the temporary storage substrate 301 and move horizontally along the flowing direction of the solution 102; meanwhile, since the LED chip 303 itself receives a gravity force greater than a buoyancy force, it moves toward the predetermined groove 202 in the target substrate 201 at the bottom of the transfer container 101 and enters the predetermined groove.
A circulating pump 105 is connected between the liquid inlet 103 and the liquid outlet 104 through a pipeline, and the circulating pump 105 and the pipeline are arranged outside the transfer container 101. The solution 102 in the transfer container 101 enters the circulating pump 105 through the liquid outlet 104, and the solution 102 enters the transfer container 101 through the liquid inlet 103 under the pressurization of the circulating pump 105; the circulation pump 105 provides power for the flow of the solution 102 in the transfer vessel 101; in addition, within a certain predetermined time period immediately after the circulation pump 105 is started, the output power of the circulation pump 105 is linearly increased, so that the solution 102 in the transfer container 101 is also in an accelerated flow state; therefore, after the plurality of LED chips 303 under the same temporary storage substrate 301 enter the solution 102 at the same position in sequence, the LED chips can be brought to the groove positions 202 with different distances under the action of the solutions 102 with different flow rates, and the rapid transfer of the plurality of LED chips 303 is facilitated.
A camera 304, wherein the camera 304 is disposed toward the temporary storage substrate 301, and is used for acquiring a state that the temporary storage substrate 301 enters the transfer container 101; the moving device 305 is used for vertically moving the temporary storage substrate 301, so that the temporary storage substrate 301 enters the solution 102 at a preset speed; a processor 306, wherein the processor 306 is electrically connected to the camera 304, the mobile device 305 and the circulation pump 105 respectively, and is configured to control the operating states of the camera 304, the mobile device 305 and the circulation pump 105 respectively.
Preferably, the number of the groove positions 202 is an integral multiple of three; the temporary storage substrates 301 are of three types, and each temporary storage substrate 301 is provided with one type of LED chip 303; wherein, this LED chip 303 includes: red LED chip 303R, green LED chip 303G, blue LED chip 303B; in the present embodiment, 9 slots 202 are taken as an example, and after the transfer is completed, the red LED chips are disposed in the slots 1, 4, and 7, the green LED chips are disposed in the slots 2, 5, and 8, and the blue LED chips are disposed in the slots 3, 6, and 9. In the present invention, the bulk transfer apparatus can be used for transferring the LED chips 303 of three colors of red, green and blue, and in another embodiment, can be used for transferring the LED chips 303 of only one color.
An embodiment of a bulk transfer method according to the present invention is described in detail below, and please refer to fig. 4, which includes:
s101, mounting a target substrate and enabling the solution to flow directionally
Mounting a target substrate at the bottom of a transfer container, wherein the target substrate is the destination of the LED chip transfer; the transfer container is filled with a solution, wherein the solution is an organic solution or an inorganic solution; and opening the circulating pump to enable the liquid inlet to input the solution into the transfer container, and simultaneously outputting the solution from the liquid outlet to the outside of the transfer container, so that the solution flows in the transfer container in a directional manner.
S102, providing a temporary storage substrate
Providing a temporary storage substrate, wherein a plurality of LED chips are fixed on the temporary storage substrate through bonding layers; wherein the adhesive layer is soluble in a solution in the transfer container; in the temporary storage substrate, all the LED chips have the same color, namely the LED chips can be one of red LED chips, green LED chips and blue LED chips; in this embodiment, for example, all the LED chips in the temporary substrate are red LED chips.
S103. the LED chip is separated from the temporary storage substrate
The temporary storage substrate is perpendicular to the liquid level of the solution and placed into the solution at a preset speed through the mobile equipment, so that the LED chips on the temporary storage substrate sequentially enter the solution, the bonding layer on the temporary storage substrate is dissolved by the solution, and the LED chips are separated from the temporary storage substrate to release the LED chips on the temporary storage substrate.
S104, transferring the LED chip into a target substrate according to the flow direction of the solution
After the LED chip is separated from the temporary storage substrate, the LED chip descends in the solution because the LED chip is subjected to buoyancy and gravity in the vertical direction at the same time, and the LED chip is subjected to the horizontal thrust of the solution in the horizontal direction so as to horizontally move along with the flowing direction of the solution; dropping it into a predetermined position of the target substrate; the target substrate is provided with groove positions for accommodating the LED chips, and the number of the groove positions is an integral multiple of three; in this embodiment, taking 9 grooves as an example, the red LED chips in the solution will enter the grooves No. 1, No. 4, and No. 7 in sequence.
In another embodiment, a mass transfer method of the present invention is described in detail below with reference to fig. 5, which includes:
s201, mounting a target substrate and enabling solution to flow in an accelerated manner
Mounting a target substrate at the bottom of a transfer container, wherein the target substrate is the destination of the LED chip transfer; the transfer container is filled with a solution, wherein the solution is an organic solution or an inorganic solution; and starting a circulating pump connected between the liquid inlet and the liquid outlet, so that the solution flows from the liquid inlet to the liquid outlet at a preset acceleration, and because the output power of the circulating pump is in a linear rising state within a certain time period of starting, the solution can flow from the liquid inlet to the liquid outlet at an accelerated speed.
S202, providing a temporary storage substrate
Providing a temporary storage substrate, wherein a plurality of LED chips are fixed on the temporary storage substrate through bonding layers; wherein the adhesive layer is soluble in a solution in the transfer container; in the temporary storage substrate, all the LED chips have the same color, namely the LED chips can be one of red LED chips, green LED chips and blue LED chips; in this embodiment, for example, all the LED chips in the temporary substrate are red LED chips.
S203, recording the release time and the release position
Moving the temporary storage substrate to a putting position, and recording the putting time and the putting position of the temporary storage substrate in the solution; the method comprises the following steps: recording the starting duration of the circulating pump from starting to the current moment, such as: 1S, and taking the opening time length 1S as the putting time. And simultaneously recording the position coordinates of the temporary storage substrate entering the solution, such as: 0, and taking the position coordinate point 0 as a throwing position.
S204, placing the temporary storage substrate into a solution
The temporary storage substrate is perpendicular to the liquid level of the solution at a preset putting time and a preset putting position and is placed into the solution at a preset speed, so that the LED chips on the temporary storage substrate sequentially enter the solution, the bonding layer on the temporary storage substrate is dissolved by the solution, the LED chips are separated from the temporary storage substrate, and the LED chips on the temporary storage substrate are released.
S205. transferring the LED chip to a target substrate according to the flow direction of the solution
After the LED chip is separated from the temporary storage substrate, the LED chip descends in the solution because the LED chip is subjected to buoyancy and gravity in the vertical direction at the same time, and the LED chip is subjected to the horizontal thrust of the solution in the horizontal direction so as to horizontally move along with the flowing direction of the solution; dropping it into a predetermined position of the target substrate; the target substrate is provided with groove positions for accommodating the LED chips, and the number of the groove positions is an integral multiple of three; in this embodiment, taking 9 grooves as an example, the red LED chips in the solution will enter the grooves No. 1, No. 4, and No. 7 in sequence; the green light LED chips enter the groove positions No. 2, No. 5 and No. 8 in sequence; the blue light LED chip can enter the groove positions No. 3, No. 6 and No. 9 in sequence.
S206, detecting whether the current temporary storage substrate is transferred or not
Whether the LED chips on the current temporary storage substrate are completely transferred is detected, and the method specifically comprises the following steps: and detecting whether the LED chips on the current temporary storage substrate are separated from the temporary storage substrate or not and enter a target substrate.
S207, turning off the circulating pump
Whether the LED chips on the temporary storage substrate are completely transferred or not is judged, and if yes, the circulating pump is closed.
S208, detecting whether the target substrate is full of LED chips
Detecting whether the target substrate is filled with the LED chips or not, and if not, performing step S209 to provide a new temporary storage substrate; if so, the present round of transfer is terminated, and the step S201 is repeated to mount the target substrate on the bottom of the transfer container.
S209, providing a new temporary storage substrate and restarting a circulating pump
Providing a new temporary storage substrate, wherein the type of the LED chip on the new temporary storage substrate is inconsistent with the type of the LED chip which is transferred last time; and restarting a circulating pump connected between the liquid inlet and the liquid outlet; in this embodiment, since the red LED chip is provided on the temporary storage substrate that was transferred last time, the green LED chip or the blue LED chip is provided on the temporary storage substrate that is provided this time; in this embodiment, it selects a temporary storage substrate provided with green LED chips.
S210, adjusting the putting moment
Adding a predetermined time to the dosing time to update the dosing time, wherein in this embodiment, since the previous dosing time is 1S, and the predetermined time can be set according to the distance between the groove positions on the target substrate and the solution flowing speed, and in this embodiment, the predetermined time can be set to 2S, the updated dosing time is 3S, and the dosing position will remain unchanged. And S204, placing the temporary storage substrate into the solution. Therefore, in this embodiment, the position of the second temporary substrate placed in the solution is not changed, and only the placement time is adjusted, so that the green LED chip sequentially enters the grooves No. 2, No. 5, and No. 8 of the target substrate in the subsequent transfer process.
In another embodiment, a mass transfer method according to the present invention is described in detail below, with reference to fig. 6, which includes:
s301, mounting a target substrate and enabling solution to flow in an accelerated manner
Mounting a target substrate at the bottom of a transfer container, wherein the target substrate is the destination of the LED chip transfer; the transfer container is filled with a solution, wherein the solution is an organic solution or an inorganic solution; starting a circulating pump connected between the liquid inlet and the liquid outlet to enable the solution to flow from the liquid inlet to the liquid outlet at a preset acceleration, wherein the output power of the circulating pump is in a linear rising state within a certain time period after the circulating pump is started, so that the solution can flow from the liquid inlet to the liquid outlet at an accelerated speed; alternatively, the circulation pump is driven at a constant power, but since the solution has viscosity, the flow rate of the solution increases linearly at the initial start-up stage of the circulation pump, and the solution flows from the liquid inlet toward the liquid outlet at an accelerated rate.
S302, providing a temporary storage substrate
Providing a temporary storage substrate, wherein a plurality of LED chips are fixed on the temporary storage substrate through bonding layers; wherein the adhesive layer is soluble in a solution in the transfer container; in the temporary storage substrate, all the LED chips have the same color, namely the LED chips can be one of red LED chips, green LED chips and blue LED chips; in this embodiment, for example, all the LED chips in the temporary substrate are red LED chips.
S303, recording the releasing time and the releasing position
Moving the temporary storage substrate to a putting position, and recording the putting time and the putting position of the temporary storage substrate in the solution; the method comprises the following steps: recording the starting duration of the circulating pump from starting to the current moment, such as: 1S, and taking the opening time length 1S as the putting time. And simultaneously recording the position coordinates of the temporary storage substrate entering the solution, such as: 0, and taking the position coordinate point 0 as a throwing position.
S304, placing the temporary storage substrate into a solution
The temporary storage substrate is perpendicular to the liquid level of the solution at a preset putting time and a preset putting position and is placed into the solution at a preset speed, so that the LED chips on the temporary storage substrate sequentially enter the solution, the bonding layer on the temporary storage substrate is dissolved by the solution, the LED chips are separated from the temporary storage substrate, and the LED chips on the temporary storage substrate are released.
S305. transferring the LED chip into a target substrate according to the flow direction of the solution
After the LED chip is separated from the temporary storage substrate, the LED chip descends in the solution because the LED chip is subjected to buoyancy and gravity in the vertical direction at the same time, and the LED chip is subjected to the horizontal thrust of the solution in the horizontal direction so as to horizontally move along with the flowing direction of the solution; dropping it into a predetermined position of the target substrate; the target substrate is provided with groove positions for accommodating the LED chips, and the number of the groove positions is an integral multiple of three; in this embodiment, taking 9 grooves as an example, the red LED chips in the solution will enter the grooves No. 1, No. 4, and No. 7 in sequence; the green light LED chips enter the groove positions No. 2, No. 5 and No. 8 in sequence; the blue light LED chip can enter the groove positions No. 3, No. 6 and No. 9 in sequence.
S306, detecting whether the current temporary storage substrate is transferred or not
Whether the LED chips on the current temporary storage substrate are completely transferred is detected, and the method specifically comprises the following steps: and detecting whether the LED chips on the current temporary storage substrate are separated from the temporary storage substrate or not and enter a target substrate.
S307, closing the circulating pump
Whether the LED chips on the temporary storage substrate are completely transferred or not is judged, and if yes, the circulating pump is closed.
S308, detecting whether the target substrate is full of LED chips
Detecting whether the target substrate is filled with the LED chips or not, and if not, performing step S309 to provide a new temporary storage substrate; if yes, the target substrate is mounted at the bottom of the transfer container again, and the transfer of the current round is finished.
S309, providing a new temporary storage substrate and restarting the circulating pump
Providing a new temporary storage substrate, wherein the type of the LED chip on the new temporary storage substrate is inconsistent with the type of the LED chip which is transferred last time; and restarting a circulating pump connected between the liquid inlet and the liquid outlet; in this embodiment, since the red LED chip is provided on the temporary storage substrate that was transferred last time, the green LED chip or the blue LED chip is provided on the temporary storage substrate that is provided this time; in this embodiment, it selects a temporary storage substrate provided with green LED chips.
S310, adjusting the throwing position
Adding a predetermined distance to the feeding position to update the feeding position, wherein in this embodiment, the last feeding position is 0, and the predetermined distance can be set according to the distance between the groove positions on the target substrate and the solution flowing speed, and can be set to 1 in this embodiment, so the feeding time after updating is 1 point, and the feeding time will remain unchanged and still is 1S after the circulation pump is turned on. And S304, the temporary storage substrate is placed into the solution. Therefore, in this embodiment, the time for placing the second temporary substrate in the solution is not changed, and only the placement position is adjusted, so that the green LED chip sequentially enters the grooves No. 2, No. 5, and No. 8 of the target substrate in the subsequent transfer process.
In the description of the present specification, reference to the description of the terms "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A bulk transfer device, comprising:
the transfer container is used for containing a solution, a liquid inlet and a liquid outlet are respectively arranged on two opposite sides of the transfer container, and a circulating pump is connected between the liquid inlet and the liquid outlet through a pipeline, so that the solution in the transfer container flows from the liquid inlet to the liquid outlet; a target substrate is arranged at the bottom of the transfer container and is arranged between the liquid inlet and the liquid outlet; the upper end of the transfer container is provided with an opening end for the temporary storage substrate to enter, an LED chip is adhered on the temporary storage substrate through an adhesive layer, and the adhesive layer can be dissolved in the solution;
the camera is arranged towards the temporary storage substrate; the mobile device is used for vertically moving the temporary storage substrate; and the processor is electrically connected with the camera, the mobile equipment and the circulating pump respectively.
2. The bulk transfer device of claim 1, wherein the target substrate has a recessed slot therein for receiving the LED chip.
3. The mass transfer device of claim 2, wherein the number of slot positions is an integer multiple of three.
4. The bulk transfer device of claim 3, wherein the LED chip comprises: the LED chip comprises a red LED chip, a green LED chip and a blue LED chip.
5. A mass transfer method using the mass transfer apparatus according to any one of claims 1 to 4, comprising:
installing a target substrate at the bottom of a transfer container, and opening the circulating pump to enable the solution in the transfer container to flow from the liquid inlet to the liquid outlet;
providing a temporary storage substrate, wherein an LED chip is fixed on the temporary storage substrate through an adhesive layer;
vertically placing the temporary storage substrate into the solution from the upper end of the transfer container through the mobile device, so that the bonding layer on the temporary storage substrate is dissolved by the solution to release the LED chip on the temporary storage substrate; the LED chip descends in the solution and horizontally moves along with the flowing direction of the solution; dropping it into a predetermined position of the target substrate.
6. The bulk transfer method of claim 7, wherein said turning on the circulation pump to flow the solution in the transfer vessel from the liquid inlet to the liquid outlet comprises:
and opening and adjusting the circulating pump to enable the solution in the transfer container to flow from the liquid inlet to the liquid outlet at a preset horizontal speed.
7. The mass transfer method of claim 6, wherein said turning off said circulation pump comprises, after:
providing a new temporary storage substrate, wherein the type of the LED chip on the new temporary storage substrate is inconsistent with the type of the LED chip which is transferred last time; and restarting the circulation pump connected between the liquid inlet and the liquid outlet.
8. The bulk transfer method of claim 7, wherein placing a staging substrate into the solution from an upper end of the transfer container further comprises:
and recording the putting time and the putting position of the temporary storage substrate in the solution.
9. The mass transfer method of claim 8, wherein said restarting the circulation pump connected between said inlet port and said outlet port comprises, after:
adding a preset time length to the putting time to update the putting time; and if the current moment is consistent with the putting moment, putting the temporary storage substrate into the solution in the putting position.
10. The mass transfer method of claim 8, wherein said restarting the circulation pump connected between said inlet port and said outlet port comprises, after:
adding a preset distance to the feeding position to update the feeding position, and if the current time is consistent with the feeding time, placing the temporary storage substrate into the solution in the feeding position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463718.XA CN112992755B (en) | 2020-05-27 | 2020-05-27 | Mass transfer device and transfer method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010463718.XA CN112992755B (en) | 2020-05-27 | 2020-05-27 | Mass transfer device and transfer method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112992755A true CN112992755A (en) | 2021-06-18 |
| CN112992755B CN112992755B (en) | 2022-09-27 |
Family
ID=76344342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010463718.XA Active CN112992755B (en) | 2020-05-27 | 2020-05-27 | Mass transfer device and transfer method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112992755B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353707A (en) * | 2004-06-09 | 2005-12-22 | Ishikawa Seisakusho Ltd | Method for parting semiconductor substrate, and method for transferring semiconductor chip selectively |
| JP2006220789A (en) * | 2005-02-09 | 2006-08-24 | Nikon Corp | Manufacturing method of micro-optical element |
| JP2006295049A (en) * | 2005-04-14 | 2006-10-26 | Seiko Epson Corp | Process for producing thin film device, electronic apparatus |
| CN101114597A (en) * | 2006-07-25 | 2008-01-30 | 财团法人工业技术研究院 | Micromodule contraposition assembled method and apparatus |
| WO2016060677A1 (en) * | 2014-10-17 | 2016-04-21 | Intel Corporation | Micro pick and bond assembly |
| CN110112090A (en) * | 2019-03-15 | 2019-08-09 | 泉州市盛维电子科技有限公司 | The method that unified micro-led component is orientated and the flood tide transfer method using it |
| WO2020087652A1 (en) * | 2018-10-31 | 2020-05-07 | 武汉华星光电技术有限公司 | Method for manufacturing backlight source |
-
2020
- 2020-05-27 CN CN202010463718.XA patent/CN112992755B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005353707A (en) * | 2004-06-09 | 2005-12-22 | Ishikawa Seisakusho Ltd | Method for parting semiconductor substrate, and method for transferring semiconductor chip selectively |
| JP2006220789A (en) * | 2005-02-09 | 2006-08-24 | Nikon Corp | Manufacturing method of micro-optical element |
| JP2006295049A (en) * | 2005-04-14 | 2006-10-26 | Seiko Epson Corp | Process for producing thin film device, electronic apparatus |
| CN101114597A (en) * | 2006-07-25 | 2008-01-30 | 财团法人工业技术研究院 | Micromodule contraposition assembled method and apparatus |
| WO2016060677A1 (en) * | 2014-10-17 | 2016-04-21 | Intel Corporation | Micro pick and bond assembly |
| WO2020087652A1 (en) * | 2018-10-31 | 2020-05-07 | 武汉华星光电技术有限公司 | Method for manufacturing backlight source |
| CN110112090A (en) * | 2019-03-15 | 2019-08-09 | 泉州市盛维电子科技有限公司 | The method that unified micro-led component is orientated and the flood tide transfer method using it |
Non-Patent Citations (1)
| Title |
|---|
| 吴懿平等: "新型微元件组装技术――流体自组装", 《电子工业专用设备》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112992755B (en) | 2022-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110998819B (en) | Electrical component transfer device | |
| US11616043B2 (en) | Chip transfer method, display device, chip and target substrate | |
| CN111129245B (en) | LED chip, display panel and display panel's equipment | |
| US11621183B2 (en) | Transfer device and transfer method for micro light-emitting diode (micro LED), and display device | |
| CN109671670B (en) | Method and system for massively arranging micro-elements | |
| CN111276438B (en) | Transfer method and transfer device of LED chip | |
| CN109637966B (en) | A kind of transfer method of Micro-LED | |
| CN108335638B (en) | L ED display module and L ED display screen | |
| CN112992755B (en) | Mass transfer device and transfer method thereof | |
| US20210005584A1 (en) | Method and apparatus for manufacturing led panel | |
| CN112017988B (en) | Transfer apparatus | |
| US7741774B2 (en) | Backlight module including at least one luminescence element, and method of fabricating the same | |
| WO2021237529A1 (en) | Mass transfer device and transfer method thereof | |
| CN111244011B (en) | Transfer device and transfer method for micro-component | |
| CN112992754B (en) | Mass transfer device and transfer method thereof | |
| WO2019035557A1 (en) | Electrical element transfer apparatus | |
| CN112967972B (en) | Device and method for transferring huge amount of micro light-emitting diodes | |
| US11646390B2 (en) | Device, method, and display device for transferring micro light-emitting diodes | |
| CN115050683A (en) | Chip transfer system | |
| CN113707768B (en) | Micro-element recovery method and system | |
| TWI829081B (en) | Micro-led, display, mass transfer system, and mass transfer method | |
| US20210366755A1 (en) | Mass transfer device and transfer method therefor | |
| CN211858613U (en) | Transfer device and display back plate | |
| WO2021109007A1 (en) | Mass transfer method and system for semiconductor element | |
| CN115332145A (en) | Core particle transfer device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |