CN115332145A - Core particle transfer device and method - Google Patents

Core particle transfer device and method Download PDF

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Publication number
CN115332145A
CN115332145A CN202210729159.1A CN202210729159A CN115332145A CN 115332145 A CN115332145 A CN 115332145A CN 202210729159 A CN202210729159 A CN 202210729159A CN 115332145 A CN115332145 A CN 115332145A
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Prior art keywords
base
core
assembly
core particle
core particles
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CN202210729159.1A
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Chinese (zh)
Inventor
陈张笑雄
龚逸品
李鹏
王江波
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HC Semitek Suzhou Co Ltd
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HC Semitek Suzhou Co Ltd
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Priority to CN202210729159.1A priority Critical patent/CN115332145A/en
Publication of CN115332145A publication Critical patent/CN115332145A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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Abstract

The disclosure provides a core particle transfer device and a core particle transfer method, and belongs to the field of display panel manufacturing. The core grain transfer device comprises a base, a material conveying assembly and an optical tweezers assembly; the base is provided with a supporting surface for placing the driving panel, and an electromagnetic coil is arranged in the base; a material conveying opening of the material conveying assembly faces the supporting surface of the base; the optical tweezers assembly and the material conveying assembly are positioned on the same side of the base, and the optical tweezers assembly is configured to drive core particles output by the material conveying assembly to enter corresponding hole positions of the driving panel. The present disclosure enables efficient completion of bulk transfers.

Description

Core particle transfer device and method
Technical Field
The disclosure belongs to the field of display panel manufacturing, and particularly relates to a core particle transfer device and method.
Background
Micro light emitting diodes (Micro LEDs) are a new type of display technology, which refers to a display technology that uses self-luminous micron-scale LEDs as light emitting pixel units, and transfers them onto a driving panel, thereby forming a high-density LED array.
Since the size of the light emitting pixel cell, i.e., the light emitting diode core particle, in this display technology is very small, the number of core particles that need to be transferred to the driving panel is large. This process of transferring core particles is called bulk transfer.
Since the amount of work for mass transfer is very large, a lot of time and material costs are consumed.
Disclosure of Invention
The embodiment of the disclosure provides a core particle transfer device and a core particle transfer method, which can efficiently complete massive transfer. The technical scheme is as follows:
in one aspect, the embodiment of the present disclosure provides a core particle transfer device, including a base, a material conveying assembly, and an optical tweezers assembly;
the base is provided with a supporting surface for placing a driving panel, and an electromagnetic coil is arranged in the base;
a material conveying opening of the material conveying assembly faces the supporting surface of the base;
the optical tweezers assembly and the material conveying assembly are positioned on the same side of the base, and the optical tweezers assembly is configured to drive the core particles output by the material conveying assembly to enter the corresponding hole position of the driving panel.
In one implementation of the present disclosure, the base includes a pedestal, a tilt mechanism, and a base;
the pedestal and the base are spaced from each other;
the tilting mechanism is located between the pedestal and the base and is respectively connected with the pedestal and the base, and the tilting mechanism is used for driving the pedestal to tilt relative to the base.
In another implementation of the present disclosure, the tilt mechanism includes at least two sets of first telescoping cylinders;
at least two groups of the first telescopic cylinders are mutually spaced and close to the edge of the pedestal.
In yet another implementation manner of the present disclosure, the supporting surface has at least two limiting members thereon;
each locating part all with the holding surface links to each other, and encloses and establish and form the space that is used for holding drive panel, each locating part is used for with drive panel offsets.
In yet another implementation of the disclosure, an orthographic projection of the space on the plane of the support surface is located within an orthographic projection of the electromagnetic coil on the plane of the support surface.
In yet another implementation of the present disclosure, the core particle transfer apparatus further comprises a vibrating assembly;
the vibration assembly is located on one side of the base, which is far away from the supporting surface, and the vibration assembly and the supporting surface are spaced.
In yet another implementation of the present disclosure, the vibration assembly includes an oscillating device and a second telescoping cylinder;
the second telescopic cylinder is connected with the oscillating device to drive the oscillating device to be close to or far away from the supporting surface.
In yet another implementation of the present disclosure, the core particle transfer apparatus further comprises an automated optical inspection device;
the camera of the automatic optical detection equipment faces the supporting surface of the base.
In another aspect, the present disclosure provides a core particle transferring method, based on the core particle transferring apparatus described above, the core particle transferring method includes:
providing a plurality of the core particles, wherein the core particles of three colors are included in the plurality of the core particles, and the sizes of the core particles of the colors are different from each other;
providing said driver panel having three sizes of said holes in one face thereof, one size of said holes corresponding to one size of said core particles;
placing the driving panel on a supporting surface of the base, wherein one surface where the hole positions is located is away from the base;
soaking the core grain transfer device in a transfer liquid;
and the core particles output by the material conveying assembly are driven to enter the corresponding hole positions through the optical tweezers assembly, and are adsorbed in the corresponding hole positions through the electromagnetic coil.
In one implementation manner of the present disclosure, a cross-sectional area of one end of the core particle is smaller than a cross-sectional area of the other end, and the end with the smaller cross-sectional area of the core particle is inserted into the corresponding hole.
The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure at least comprise:
the supporting surface of the base is used for placing the driving panel, so that the hole position of the driving panel faces upwards, namely deviates from the supporting surface. The core particles are output from the material conveying opening of the material conveying assembly, so that the core particles fall to the surface, provided with the hole positions, of the driving panel. The optical tweezers assembly drives the core particles output by the material conveying assembly, so that the core particles can move on the driving panel and enter the corresponding hole positions. And then, the core particles are adsorbed in the corresponding hole positions through the electromagnetic coils, so that efficient mass transfer is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is apparent that the drawings in the description below are only some embodiments of the present disclosure, and it is obvious for those skilled in the art that other drawings may be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a core particle transfer device provided by an embodiment of the present disclosure;
FIG. 2 is a top view of a core particle provided by embodiments of the present disclosure;
FIG. 3 is a front view of a core particle provided by embodiments of the present disclosure;
fig. 4 is a front view of a drive panel provided by an embodiment of the present disclosure;
fig. 5 is a flowchart of a core particle transfer method provided by an embodiment of the present disclosure.
The symbols in the figures represent the following:
10. a base;
110. a support surface; 120. an electromagnetic coil; 130. a pedestal; 140. a tilting mechanism; 141. a first telescopic cylinder; 150. a base; 160. a limiting member;
20. a material conveying component;
30. an optical tweezer assembly;
40. a vibrating assembly;
410. an oscillation device; 420. a second telescoping cylinder;
50. an automated optical inspection device;
100. a driving panel; 1100. hole site; 200. a core particle; 300. and transferring the liquid.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
As a Liquid Crystal Display (LCD) occupying the market of the consumer electronics Display field, the Liquid Crystal Display cannot effectively achieve a high refresh rate and contrast due to physical limitations such as the polarization rate of Liquid Crystal molecules under voltage and the photo-resistance after the Liquid Crystal molecules are arranged. Meanwhile, the device has inherent disadvantages in the aspects of volume, energy consumption and bending. In contrast, the Organic light emitting semiconductor (OLED) in the current mobile Display field has the bottleneck of heat resistance, brightness, light attenuation and limited picture size. The GaN-based Mini and Micro LEDs, especially the Micro LEDs, which are regarded as next-generation display devices, have the advantages of high brightness, high contrast, high refresh rate, high resolution, high reliability, heat resistance, long service life, low energy consumption, light weight, thinness, large-area display and the like due to the fact that the GaN-based Mini and the Micro LEDs are extremely small and can independently drive the LED self-luminous units, and the display devices can easily achieve local display and special-shaped display and are ideal display devices in the future.
The manufacture of Micro LED mainly depends on epitaxial growth of III-V group compound semiconductor to form an epitaxial structure with functional layers such as a nucleating layer, a filling layer, an n-type layer, a U-AlGaN layer, an n-type contact layer, an electron storage layer, a strain buffer layer, a multi-quantum well active layer, an electron blocking layer, a p-type layer and a p-layer contact layer. And thinning and photoetching the epitaxial wafer by a subsequent chip process, preparing a Distributed Bragg Reflector (DBR), a current expansion area and an electrode, and performing special-shaped cutting on the core grains. Compared with the conventional industrial manufacturing process of GaN-based LED chips, when the size of Micro LED chips is reduced and a large number of core particles are matrixed, especially when the size of light-emitting units is smaller than 100 μm, a series of problems are brought to the current industrial manufacturing process.
From the basic structure, the Micro LED has a small core particle size, and the requirement on the brightness of the light is lower than that of the traditional LED, so that the structure of the Micro LED can be simpler. However, as a basic unit of a micron-sized display device, micro LEDs have extremely high requirements on wavelength and brightness uniformity. The challenge is that core particle bonding techniques that are otherwise suitable for conventional LEDs increase exponentially as the core particle (200) size is reduced to below 100 μm. The Micro LED has a core size smaller than 50 μm, the pixel unit spacing is only less than 50 μm, and the pixel density Per square foot (Pixels Per inc, PPI) is greatly increased, so that the number of cores used by the Micro LED with the same size is also increased exponentially. For each 1/2 reduction in the size of the core particles, the number of the core particles in a unit area is increased by four times, for example, in a display device with 4K resolution, the number of micron-sized Micro LED chips easily exceeds 2400 ten thousand, and the consumption of time cost and material cost is unacceptable for consumer-grade electronic products due to the existing core particle transfer and bonding technology for migrating and fixing the number of the core particles. Also, there are physical limits to the operable core size of conventional core transfer devices, beyond which the core size of Micro LEDs currently exceeds.
In order to solve the problem of massive core particle transfer of Micro LEDs, an embodiment of the present disclosure provides a core particle transfer device, fig. 1 is a schematic structural diagram of the core particle transfer device, and referring to fig. 1, in the embodiment, the core particle transfer device includes a base 10, a material delivery assembly 20, and an optical tweezers assembly 30. The base 10 has a supporting surface 110 for placing the driving panel 100, the base 10 has an electromagnetic coil 120 therein, a feeding port of the feeding assembly 20 faces the supporting surface 110 of the base 10, the optical tweezers assembly 30 and the feeding assembly 20 are located on the same side of the base 10, and the optical tweezers assembly 30 is configured to drive the core particles 200 output by the feeding assembly 20 to enter into the corresponding hole sites 1100 of the driving panel 100.
Support surface 110 of base 10 is used to position drive panel 100 such that aperture location 1100 of drive panel 100 is facing upward, i.e., away from support surface 110. The core grain transfer device is soaked in the transfer liquid 300, and the transfer liquid 300 mixed with the core grains 200 is output from the material delivery port of the material delivery assembly 20, so that the core grains 200 fall to the surface of the driving panel 100 having the hole position 1100. The core particles 200 output from the feeding module 20 are driven by the optical tweezers 30, so that the core particles 200 can move on the driving panel 100 and enter the corresponding hole sites 1100. Thereafter, the core particles 200 are adsorbed in the corresponding hole sites 1100 by the electromagnetic coil 120, thereby realizing efficient bulk transfer.
In the present embodiment, the electromagnetic coil 120 is used to attract the core particles 200 in the corresponding hole sites 1100, and it is easily understood that the electrode of the electromagnetic coil 120 should be opposite to the electrode of the core particles 200 when the core particles 200 are attracted by the electromagnetic coil 120. Illustratively, the magnetic field range of the electromagnetic coil 120 is 0.0001-0.01T, and the magnitude of the magnetic field generated by the electromagnetic coil 120 is selected according to actual requirements.
In this embodiment, one feed module 20 and one optical tweezers module 30 are in a group, and the same group of feed module 20 and optical tweezers module 30 can move synchronously with respect to the supporting surface 110, so as to realize the cooperative work of the two. The core grain transfer device can have multiple sets of the feed delivery assembly 20 and the optical tweezers assembly 30, thereby further improving the transfer efficiency of the core grains 200.
Moreover, in order to better realize the cooperative work between the feeding assembly 20 and the optical tweezers assembly 30, the feeding rate of the feeding assembly 20 should be proportional to the guiding range of the optical tweezers assembly 30. For example, the feeding rate of a feeding unit 20 is about 20 particles/second, and the guiding range of an optical tweezers unit 30 is 50-100 μm.
Fig. 2 is a top view of a core particle 200. In this embodiment, the core particle 200 has three colors, red (leftmost in fig. 2), blue (middle in fig. 2), and green (rightmost in fig. 2). Fig. 3 is a front view of the core particle 200, and in conjunction with fig. 3, the sizes of the respective colors are different, for example, the red core particle 200 (leftmost in fig. 3) has the largest size, the blue core particle 200 (middle in fig. 3) has the next largest size, which is 75 to 85% of the red core particle 200, and the green core particle 200 (rightmost in fig. 3) has the smallest size, which is 75 to 85% of the blue core particle 200. Fig. 4 is a front view of the driving panel 100, wherein the viewing angle is the same as that of fig. 3, and in conjunction with fig. 4, correspondingly, three holes 1100 are formed in the driving panel 100, the size of each hole 1100 is different, and the sizes of the three holes 1100 respectively correspond to the sizes of the three core particles 200.
Since the core particles 200 of each color fall into the hole sites 1100 of the corresponding size, the positions of the core particles 200 of each color can be arranged by arranging the positions of the hole sites 1100 of different sizes.
Of course, in the process of transferring the core particles 200, in order to prevent the small-sized core particles 200 from falling into the large-sized hole sites 1100, the core particles 200 of different sizes are transferred in sequence. For example, the largest size core particle 200 is transferred first, then the next largest size core particle 200 is transferred, and finally the smallest size core particle 200 is transferred.
Referring again to fig. 1, in the present embodiment, the base 10 includes a pedestal 130, a tilt mechanism 140, and a base 150. The pedestal 130 and the base 150 are spaced apart from each other, and the tilt mechanism 140 is located between the pedestal 130 and the base 150 and is connected to the pedestal 130 and the base 150, respectively, and the tilt mechanism 140 is used to drive the pedestal 130 to tilt relative to the base 150.
In the above implementation, the base 150 is a supporting base of the base 10, and is used for realizing stable support for the tilting mechanism 140 and the pedestal 130. The stand 130 is a support base of the driving panel 100 for achieving stable support of the driving panel 100. The tilting mechanism 140 is disposed between the base 150 and the pedestal 130, and can drive the pedestal 130 to tilt relative to the base 150, thereby feeding the material in cooperation with the feeding module 20.
Before the feeding of the feeding module 20, the pedestal 130 is driven to tilt relative to the base 150 by the tilting mechanism 140, so that the high point of the pedestal 130 corresponds to the feeding port of the feeding module 20. In this way, the core particles 200, after being delivered from the delivery assembly 20, will fall to the high position of the driving panel 100 first, and gradually move toward the low position of the driving panel 100 under the action of gravity. That is, the gravitational potential energy of the core particle 200 itself can be utilized to make the core particle 200 gradually spread over the driving panel 100 from high to low, thereby further improving the transfer efficiency of the core particle 200.
Illustratively, the tilt mechanism 140 includes at least two sets of first telescoping cylinders 141, and the at least two sets of first telescoping cylinders 141 are spaced apart from each other and are located near the edge of the pedestal 130.
In the above implementation, one set of the first telescopic cylinders 141 is located at one side of the base 130, and the other set of the first telescopic cylinders 141 is located at the opposite side of the base 130. By extending a set of telescopic cylinders, tilting of the stand 130 can be achieved.
In other embodiments, the tilting mechanism 140 includes a motor and a rotating shaft, an output shaft of the motor is connected to the rotating shaft, the rotating shaft is connected to the pedestal 130, and the rotating shaft is parallel to the supporting surface 110. In this way, the motor drives the rotation shaft to rotate, and the rotation shaft can drive the pedestal 130 to rotate by taking the rotation shaft as a rotation axis, thereby realizing the tilting movement of the pedestal 130.
For example, the tilt angle of the pedestal 130 relative to the base 150 is 0 to 45 ° driven by the tilt mechanism 140. In this range of inclination angle, not only can the core particle 200 smoothly move from high to low, but also the core particle 200 can be prevented from moving too fast and falling into the hole site 1100.
Referring to fig. 1, in the present embodiment, the supporting surface 110 has at least two limiting members 160, each limiting member 160 is connected to the supporting surface 110 and encloses a space for accommodating the driving panel 100, and each limiting member 160 is used for abutting against the driving panel 100.
In the above implementation, the position-limiting members 160 are sequentially spaced along the outer edge of the supporting surface 110, so as to form a space for accommodating the driving panel 100. After the driving panel 100 is placed in the space, each of the stoppers 160 can abut against the outer edge of the driving panel 100, so that the driving panel 100 is clamped and fixed in the space, and unnecessary shaking of the driving panel 100 is avoided.
Illustratively, the position-limiting element 160 has a certain elasticity, so that the driving panel 100 can be better clamped and fixed.
In other embodiments, the limiting member 160 can also be a buckle with a barb, and the buckle clamps the driving panel 100 in the space through the barb, so as to fix the driving panel 100.
In the present embodiment, the orthographic projection of the space on the plane of the supporting surface 110 is located in the orthographic projection of the electromagnetic coil 120 on the plane of the supporting surface 110.
In the above implementation, by defining the position of the space relative to the electromagnetic coil 120, it can be ensured that the entire drive panel 100 can be located within the range of action of the electromagnetic coil 120 when the drive panel 100 is snapped into the space. In this way, each core particle 200 falling on the driving panel 100 can be influenced by the electromagnetic coil 120, and thus can be stably adsorbed in the corresponding hole 1100.
In the present embodiment, the core particle transferring device further includes a vibration component 40, the vibration component 40 is located on a side of the base 10 facing away from the supporting surface 110, and the vibration component 40 is spaced apart from the supporting surface 110.
The vibration unit 40 is configured to output a transverse vibration wave having a certain frequency to the periphery, and the core particle 200 is vibrated to accelerate the movement of the core particle 200 in the transverse direction, thereby further improving the transfer efficiency of the core particle 200.
Illustratively, the vibration assembly 40 includes an oscillation device 410 and a second telescopic ram 420, the second telescopic ram 420 being coupled to the oscillation device 410 to drive the oscillation device 410 toward or away from the support surface 110.
By the second telescopic cylinder 420, the oscillation device 410 can be driven close to or away from the support surface 110, that is, the vibration source is made close to or away from the driving panel 100, thereby adjusting the vibration to which the core particle 200 on the driving panel 100 is subjected.
After the transfer of one type of the core particle 200 is completed, it is necessary to remove the excess core particle 200 on the driving panel 100 in order to facilitate the transfer of another type of the core particle 200. In the present embodiment, the pedestal 130 is driven to tilt to the maximum tilt angle by the tilt mechanism 140, and then the oscillation device 410 is brought close to the pedestal 130 as much as possible by the second telescopic cylinder 420. As such, the core particle 200 can be rapidly slid off the driving panel 100 by using the gravitational potential energy of the core particle 200 itself and the vibration applied by the oscillation device 410. The fallen core particles 200 can be uniformly recovered and reused. It is worth noting that in the process of removing the excess core particles 200, it is necessary to ensure that the vibration applied by the oscillation device 410 does not cause the core particles 200 already assembled in place in the hole sites 1100 to slip out.
Illustratively, the first telescopic cylinder 141 and the second telescopic cylinder 420 are both hydraulic cylinders, so that stable driving and supporting of the pedestal 130 and the oscillation device 410 can be ensured.
Illustratively, the oscillation device 410 is a MEMS (Micro-Electro-Mechanical System) oscillator, which has the features of small volume and precise control.
In this embodiment, the core grain transfer device further comprises an automatic optical inspection device 50, and the camera of the automatic optical inspection device 50 faces the supporting surface 110 of the base 10.
In the above implementation, the automatic Optical Inspection apparatus 50 is an AOI (Automated Optical Inspection) apparatus for inspecting the driving panel 100 on the supporting surface 110. Before the transfer of the core particles 200 is started, the entire driving panel 100 is visually judged, and the start area and the transfer path are determined to guide the movement start point and the movement path of the feeding unit 20 and the optical tweezers unit 30. During the transfer of the core particle 200, the vacant hole sites 1100 are marked, i.e., the hole sites 1100 corresponding to the core particle 200 are not normally assembled, and the vacant hole sites 1100 are scribed into the subsequent transfer path. After the transfer of the core particles 200 is completed, it is determined that all the hole sites 1100 are equipped with the corresponding core particles 200 to start the subsequent processes.
The working process of the core grain transfer device is described as follows:
first, the core transfer device is immersed in the transfer liquid 300, and the entire driving panel 100 is visually judged by the automatic optical inspection device 50, and the start area and the transfer path are determined to guide the movement start point and the movement path of the feeding unit 20 and the optical tweezers unit 30.
Next, the driving panel 100 is clamped on the supporting surface 110 of the base 130 through the stopper 160, and the tilting mechanism 140 tilts the base 130 with respect to the base 150 such that the higher side of the base 130 faces the material feeding port of the material feeding assembly 20.
Then, the feeding unit 20 outputs the transfer liquid 300 with the core particles 200 of one color, so that the core particles 200 fall onto the driving panel 100 and move toward the lower side of the pedestal 130 by its own weight. Also, the oscillation device 410 outputs a transverse vibration wave of a certain frequency, so that the core particle 200 can move more rapidly. Meanwhile, the optical tweezers assembly 30 and the feeding assembly 20 move together to guide the core particles 200 into the corresponding hole sites 1100, and the core particles 200 entering the hole sites 1100 are fixed in the hole sites 1100 by the electromagnetic coil 120. In the process of moving the optical tweezers assembly 30 and the feeding assembly 20 together, the automatic optical detection device 50 marks the vacant hole sites 1100 and marks the vacant hole sites 1100 into the subsequent transfer path.
Finally, after the automatic optical inspection device 50 confirms that the hole sites 1100 corresponding to the color core particles 200 are completely and correctly filled with the core particles 200, the inclination angle of the pedestal 130 is increased by the inclination mechanism 140, and the oscillating device 410 is driven to approach the pedestal 130 by the second telescopic cylinder 420, so that the redundant core particles 200 on the driving panel 100 slide down, thereby preparing for transferring the core particles 200 of the next color.
Fig. 5 is a flowchart of a core particle transferring method according to an embodiment of the disclosure, where the core particle transferring method is based on the core particle transferring apparatus shown in fig. 1. Referring to fig. 5, in the present embodiment, the core transfer method includes:
step 401: a plurality of core particles 200 are provided, the core particles 200 of three colors are included in the plurality of core particles 200, and the sizes of the core particles 200 of the respective colors are different from each other.
Fig. 3 is a front view of core particle 200, and referring to fig. 3, in this embodiment, the cross-sectional area of one end of core particle 200 is smaller than that of the other end, and the smaller end of core particle 200 is inserted into corresponding hole site 1100. By adopting the design, the core particles 200 can conveniently enter the hole site 1100, and the core particles 200 are prevented from being placed outside the hole site 1100 and cannot enter the hole site 1100.
Illustratively, the longitudinal cross-section of the core particle 200 is trapezoidal, and the upper base of the trapezoid corresponds to the end of the core particle 200 having a smaller cross-sectional area. In other embodiments, the longitudinal cross-section of the core particle 200 is frustoconical, conical, etc., which the present disclosure is not limited thereto.
Step 402: drive panel 100 is provided, with three sizes of apertures 1100 on one side of drive panel 100, one size of aperture 1100 corresponding to one size of core particle 200.
Referring to fig. 4, in the present embodiment, the longitudinal section of the hole site 1100 is a trapezoid corresponding to the core particle 200, and the upper bottom of the trapezoid corresponds to the hole bottom of the hole site 1100. In other embodiments, the hole 1100 may have another shape in its longitudinal section, and may correspond to the core particle 200.
It should be noted that the inner contour of the hole site 1100 has substantially the same shape as the outer contour of the core particle 200, except that the inner contour of the hole site 1100 is slightly larger than the outer contour of the corresponding core particle 200, so that the core particle 200 enters the hole site 1100. Illustratively, the inner contour of hole site 1100 is slightly larger than the outer contour of corresponding core particle 200 by 6-9%.
Step 403: the drive panel 100 is placed on the support surface 110 of the base 10 with the side where the hole locations 1100 are located facing away from the base 10.
In the above implementation, the driving panel 100 is placed in the space surrounded by the limiting members 160, and the locking of the driving panel 100 on the supporting surface 110 is achieved by the limiting members 160.
Step 404: the core pellet transfer apparatus is immersed in the transfer fluid 300.
In the above implementation, the transfer liquid 300 has the characteristics of low conductivity (sigma < 0.1 mS/cm), no corrosiveness, easy subsequent cleaning, and transparency.
Step 405: the core particles 200 output by the feeding assembly 20 are driven to enter the corresponding hole sites 1100 through the optical tweezers assembly 30, and the core particles 200 are adsorbed in the corresponding hole sites 1100 through the electromagnetic coil 120, so that the mass transfer of the core particles 200 is realized.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," "third," and the like, as used in the description and in the claims of the present disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, which may also change accordingly when the absolute position of the object being described changes.
The above description is intended to be exemplary only and not to limit the present disclosure, and any modification, equivalent replacement, or improvement made without departing from the spirit and scope of the present disclosure is to be considered as the same as the present disclosure.

Claims (10)

1. The core particle transfer device is characterized by comprising a base (10), a material conveying assembly (20) and an optical tweezers assembly (30);
the base (10) is provided with a supporting surface (110) for placing a driving panel (100), and an electromagnetic coil (120) is arranged in the base (10);
the material conveying opening of the material conveying component (20) faces to the supporting surface (110) of the base (10);
the optical tweezers assembly (30) and the feeding assembly (20) are located on the same side of the base (10), and the optical tweezers assembly (30) is configured to drive the core particles (200) output by the feeding assembly (20) to enter the corresponding hole positions (1100) of the driving panel (100).
2. The core transfer device according to claim 1, wherein the base (10) comprises a stand (130), a tilt mechanism (140) and a seat (150);
said stand (130) and said base (150) being spaced from one another;
the tilting mechanism (140) is located between the pedestal (130) and the base (150) and is connected to the pedestal (130) and the base (150), respectively, and the tilting mechanism (140) is used for driving the pedestal (130) to tilt relative to the base (150).
3. The core transfer device according to claim 2, wherein the tilting mechanism (140) comprises at least two sets of first telescopic cylinders (141);
at least two groups of the first telescopic cylinders (141) are spaced from each other and close to the edge of the pedestal (130).
4. The core transfer device according to any of claims 1 to 3, wherein the support surface (110) is provided with at least two stoppers (160);
each limiting piece (160) is connected with the supporting surface (110) and encloses to form a space for accommodating the driving panel (100), and each limiting piece (160) is used for abutting against the driving panel (100).
5. The core particle transfer device according to claim 4, wherein an orthographic projection of the space on the plane of the support surface (110) is located within an orthographic projection of the electromagnetic coil (120) on the plane of the support surface (110).
6. The core particle transfer arrangement according to any of the claims 1-3, further comprising a vibration assembly (40);
the vibration component (40) is located on the side of the base (10) facing away from the supporting surface (110), and the vibration component (40) is spaced apart from the supporting surface (110).
7. The core transfer device according to claim 5, wherein the vibration assembly (40) comprises an oscillating means (410) and a second telescopic cylinder (420);
the second telescopic cylinder (420) is connected with the oscillating means (410) to drive the oscillating means (410) towards or away from the support surface (110).
8. The core particle transfer arrangement according to any of claims 1-3, further comprising an automated optical inspection device (50);
the camera of the automatic optical detection device (50) faces the support surface (110) of the base (10).
9. A core particle transfer method based on the core particle transfer apparatus according to any one of claims 1 to 8, comprising:
providing a plurality of the core particles (200), wherein the core particles (200) of three colors are included in the plurality of the core particles (200), and the sizes of the core particles (200) of the colors are different from each other;
providing said driver panel (100), one side of said driver panel (100) having three sizes of said apertures (1100), one size of said apertures (1100) corresponding to one size of said core particles (200);
placing the driving panel (100) on a supporting surface (110) of the base (10) with the surface where the hole sites (1100) are located facing away from the base (10);
immersing the core particle transfer device in a transfer liquid (300);
the core particles (200) output by the material conveying assembly (20) are driven to enter the corresponding hole positions (1100) through the optical tweezers assembly (30), and the core particles (200) are adsorbed in the corresponding hole positions (1100) through the electromagnetic coil (120).
10. The core grain transfer method according to claim 9, wherein a cross-sectional area of one end of the core grain (200) is smaller than that of the other end, and the end of the core grain (200) having the smaller cross-sectional area is inserted into the corresponding hole site (1100).
CN202210729159.1A 2022-06-24 2022-06-24 Core particle transfer device and method Pending CN115332145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210729159.1A CN115332145A (en) 2022-06-24 2022-06-24 Core particle transfer device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210729159.1A CN115332145A (en) 2022-06-24 2022-06-24 Core particle transfer device and method

Publications (1)

Publication Number Publication Date
CN115332145A true CN115332145A (en) 2022-11-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210729159.1A Pending CN115332145A (en) 2022-06-24 2022-06-24 Core particle transfer device and method

Country Status (1)

Country Link
CN (1) CN115332145A (en)

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