CN112992730B - Semi-closed eutectic chip mounting device and eutectic chip mounting method - Google Patents
Semi-closed eutectic chip mounting device and eutectic chip mounting method Download PDFInfo
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- CN112992730B CN112992730B CN202110158487.6A CN202110158487A CN112992730B CN 112992730 B CN112992730 B CN 112992730B CN 202110158487 A CN202110158487 A CN 202110158487A CN 112992730 B CN112992730 B CN 112992730B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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Abstract
The invention provides a semi-closed eutectic chip mounting device and a eutectic chip mounting method, wherein through the structural design of a suction head, the opening of an adsorption hole is gradually contracted along the direction from an adsorption end to a suction head rod, and when eutectic chip mounting is carried out, the suction head can be lifted subsequently, so that the adsorption end of the suction head is not in close contact with a chip, the lower end surface of the adsorption hole is not separated from the upper surface of the chip, the chip can be driven to carry out horizontal and transverse friction, in the horizontal and transverse friction process, the chip is only subjected to extremely small flat thrust, the surface and the whole are not stressed, the mounting pressure is controllable and consistent during eutectic chip mounting, and the fluctuation of the mounting pressure during eutectic chip mounting is reduced; the mounting pressure is smaller transverse thrust, the corresponding solder scattering degree is mainly determined by the friction motion amplitude of the transverse thrust, the solder scattering degree is controllable, and the solder after mounting is uniform in scattering distribution, neat in edge and bright in surface; the mounting pressure is low, so that the friction force applied to the chip during mounting is low, and the surface damage and edge breakage of the chip are reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a semi-closed eutectic chip mounting device and an eutectic chip mounting method.
Background
The single chip packaging process mainly comprises the steps of mounting the chip on a tube shell base, bonding a lead, sealing a cap in an airtight manner and the like. In the field of high-reliability packaging, a eutectic sintering chip mounting method is mainly adopted for mounting a chip on a tube shell base, and the shear strength of the chip after mounting, the X-ray voidage at the bottom of the chip, the surface state of a welding flux and the scattering degree of the welding flux are important requirements for military electronic component detection.
Currently, the major eutectic die attach methods in the industry include:
1) manually sintering the paster, but because of the fluctuation of manual operation, it is difficult to completely control the consistency of pressure of the paster and the scattering degree of the solder at the edge of the chip in the sintering process, and the problems of uncontrollable X-ray cavity, uncontrollable solder scattering degree, uncontrollable mounting precision and the like inevitably exist, especially for products with large tube shells, large chips and grounded peripheries of the bottom surfaces of the chips, the influence degree is higher, because the shape of the solder scattering is uncontrollable (mostly wave or semi-circular), the consistency of the paster precision is poor, the one-time identification passing rate of the subsequent bonding procedure is low, the lead and the grounding position are required to be adjusted one by one, and the bonding production efficiency is seriously influenced;
2) The semi-automatic sintering paster mainly comprises the steps of sequentially overlapping a chip/welding flux/tube shell, overlapping a protective silicon chip on the surface of the chip, and finally clamping the whole body by using a heavy hammer or a clamp and then carrying out backflow.
Therefore, a eutectic die bonding process capable of solving the problems of inconsistent bonding pressure, uncontrollable solder flow and the like is needed.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a eutectic die pad solution for solving the above-mentioned technical problems.
To achieve the above and other related objects, the present invention provides a semi-hermetic eutectic die attach device, comprising:
a semi-closed cavity;
the heating table is arranged in the semi-closed cavity;
vacuum suction means includes suction head pole and suction head at least, the suction head sets up on the suction head pole, the suction head is kept away from the one end of suction head pole is the absorption end, be equipped with the absorption hole on the absorption end, and be in at least the border position department of absorption end, the opening in absorption hole along the absorption end arrives the direction of suction head pole shrinks gradually.
Optionally, an opening is formed in the top of the semi-closed cavity, and a first pipeline communicated with the outside is arranged at the bottom of the semi-closed cavity.
Optionally, a second pipeline is arranged inside the suction head rod and communicated with the adsorption hole; the tip pole includes the rigidity tip pole, the tip includes the rigidity tip.
Optionally, the motion control portion of the pipette tip has a fine motion control capability of ± 5 μm in a direction from the suction end to the pipette tip.
Optionally, the suction head comprises at least: a horn-shaped suction head.
In addition, to achieve the above and other related objects, the present invention also provides a eutectic die attach method, comprising the steps of:
providing a semi-closed eutectic chip mounting device, wherein the semi-closed eutectic chip mounting device comprises a semi-closed cavity, a heating table and vacuum suction equipment, the heating table is arranged in the semi-closed cavity, the vacuum suction equipment at least comprises a suction head rod and a suction head, the suction head is arranged on the suction head rod, one end, far away from the suction head rod, of the suction head is an adsorption end, an adsorption hole is formed in the adsorption end of the suction head, and at least at the edge position of the adsorption end, the opening of the adsorption hole gradually shrinks along the direction from the adsorption end to the suction head rod;
Picking up and placing a tube shell on the heating table, picking up and placing solder on the tube shell;
picking up a chip by using the suction head and placing the chip on the solder, and then lifting the suction head to ensure that the suction end of the suction head is not in close contact with the chip and the lower end surface of the suction hole is not separated from the upper surface of the chip;
and heating the heating table, and pushing the chip to horizontally rub by using the adsorption hole.
Optionally, the eutectic die attach method further comprises the steps of:
and continuously introducing nitrogen in the eutectic chip mounting process, wherein the flow rate of the nitrogen is more than or equal to 25L/min.
Optionally, the step of picking up the chip with the suction head and placing it on the solder comprises:
sucking the chip by using the suction head in a vacuum manner;
moving the suction head, carrying the chip into the semi-closed cavity and descending and approaching the chip to the solder;
and performing contact detection through the suction head, and stopping the descending movement of the suction head when the acting force of the solder on the suction head reaches 2N, wherein N is the gravity of the chip.
Optionally, after picking up the chip with the suction head and placing it on the solder, the step of lifting the suction head comprises:
Releasing the vacuum to the tip;
and vertically and upwards lifting the suction head by 20-40 mu m, so that the suction end of the suction head is not in close contact with the chip and the lower end surface of the suction hole is not separated from the upper surface of the chip.
Optionally, when the chip is pushed by the adsorption hole to horizontally and transversely rub, the track of the rubbing motion is rectangular, the amplitude of the rubbing motion is 0.1mm-0.5mm, and the chip returns to the central position of the patch after rubbing for 1 to 2 circles, wherein the amplitude of the rubbing motion can be adjusted and controlled according to the scattering degree requirement of the solder.
As described above, the semi-closed eutectic die bonding device and the eutectic die bonding method of the present invention have at least the following beneficial effects:
through the suction head structure design that the opening of the adsorption hole at least at the edge position of the adsorption end is gradually contracted along the direction from the adsorption end to the suction head rod, when solder is heated and melted, the suction head can be lifted to ensure that the adsorption end of the suction head is not in close contact with the chip and the lower end surface of the adsorption hole is not separated from the upper surface of the chip, so that the chip can be driven to carry out horizontal and transverse friction; meanwhile, the mounting pressure is lower transverse thrust, the corresponding solder scattering degree is mainly determined by the friction motion amplitude of the transverse thrust, the solder scattering degree is controllable, and the solder after mounting is uniform in scattering distribution, neat in edge and bright in surface; in addition, the mounting pressure is low, so that the friction force applied to the chip during mounting is low, and the surface damage and edge breakage of the chip are reduced.
Drawings
Fig. 1 is a schematic structural diagram of a semi-hermetic eutectic die attach device according to an embodiment of the present invention.
Fig. 2-6 show process flow diagrams of a eutectic die attach method in an embodiment of the invention.
Description of the reference numerals
1-semi-closed cavity, 2-heating table, 3-vacuum suction device, 31-suction head rod, 32-suction head, 4-first pipeline, 5-tube shell, 6-welding flux, 7-chip and A-adsorption hole.
Detailed Description
The inventor researches and discovers that: at present, when eutectic chip mounting is carried out by adopting a manual or semi-automatic process, mounting pressure comprises longitudinal extrusion force and transverse extrusion force, the extrusion force, particularly the longitudinal extrusion force, cannot be guaranteed to be consistent during multiple times of chip mounting, and the longitudinal extrusion force and the transverse extrusion force can cause larger transverse friction force when being applied to a chip, so that the surface of the chip is damaged, and solder flow is not uniform and controllable.
Based on the above, the invention provides a full-automatic eutectic chip mounting process, which comprises the following steps: and only small transverse thrust is applied when the eutectic paster solder is melted so as to ensure that the pasting pressure is consistent when the paster is pasted for many times, and the solder is uniformly dispersed and controllable.
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 6. It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated. The structures, proportions, sizes, and other dimensions shown in the drawings and described in the specification are for understanding and reading the present disclosure, and are not intended to limit the scope of the present disclosure, which is defined in the claims, and are not essential to the art, and any structural modifications, changes in proportions, or adjustments in size, which do not affect the efficacy and attainment of the same are intended to fall within the scope of the present disclosure. In addition, the terms such as "upper", "lower", "first", "second", "middle", and "edge" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.
As shown in fig. 1, the present invention provides a semi-hermetic eutectic die attach device, which includes:
a semi-closed cavity 1;
the heating table 2 is arranged in the semi-closed cavity 1;
the vacuum suction device 3 at least comprises a suction head rod 31 and a suction head 32, wherein the suction head 32 is arranged on the suction head rod 31, one end, away from the suction head rod 32, of the suction head 32 is an adsorption end, an adsorption hole A is formed in the adsorption end, and at least at the edge position of the adsorption end, the opening of the adsorption hole A gradually shrinks along the direction from the adsorption end to the suction head rod 31.
In detail, as shown in fig. 1, an opening is provided at the top of the semi-closed cavity 1, and a first pipeline 4 communicated with the outside is provided at the bottom of the semi-closed cavity.
In detail, as shown in fig. 1, a second pipe (not shown) is arranged inside the suction head rod 31, and the second pipe is communicated with the adsorption hole a; the suction head rod 31 comprises a rigid suction head rod, the suction head 32 comprises a rigid suction head, the suction head rod 31 and the suction head 32 are both rigid structures without elastic structures (such as made of tungsten steel materials), and the suction head 32 is fixed on the suction head rod 31.
In more detail, the movement control section of the tip bar 31 has a fine movement control capability of + -5 μm in the direction from the suction end to the tip bar 31 (i.e., vertical direction), and can control the up-and-down movement of the tip 32 in the vertical direction, and at the same time, the movement control section of the tip bar 31 can control the movement of the tip 32 in the horizontal direction.
Alternatively, as shown in FIG. 1, the suction head 32 includes a horn type suction head, and the suction holes A have a horn shape. It is understood that the adsorption holes a may have other shapes, and thus, will not be described in detail.
Optionally, the semi-closed eutectic die bonding device further comprises an automatic identification device, and the automatic identification device can automatically identify the tube shell, the solder and the chip which are used for the subsequent eutectic die bonding and feed back the tube shell, the solder and the chip to the vacuum suction device 3, so that the tube shell, the solder and the chip can be picked up and bonded conveniently.
Based on the semi-closed eutectic chip mounting device, the invention also provides an eutectic chip mounting method, which comprises the following steps:
s1, providing the semi-closed eutectic chip device;
s2, picking up and placing the package 5 on the heating stage 2, picking up and placing the solder 6 on the package 5;
s3, picking up the chip 7 by the suction head 32 and placing the chip on the solder 6, and then lifting the suction head 32 to ensure that the suction end of the suction head 32 is not in close contact with the chip 7 and the lower end surface of the suction hole A is not separated from the upper surface of the chip 7;
and S4, heating the heating table 2, and pushing the chip 7 to horizontally rub by using the adsorption hole A.
Specifically, as shown in fig. 2, steps S1 to S3 are performed, and the package 5, the solder 6, and the chip 7 are sequentially placed on the heating stage 2 from bottom to top, and the material preparation before eutectic die bonding is performed.
In more detail, the step S2 further includes:
s21, automatically identifying the pipe shell 5 placed in the tray through automatic identification equipment, and automatically picking up and placing the pipe shell on the heating table 2 through the vacuum suction equipment 3 after identification;
and S22, automatically identifying the solder 6 in the waffle box by an automatic identification device, and automatically picking up the solder by the vacuum suction device 3 after identification and placing the solder in the center of the welding surface of the tube shell 5.
In more detail, in step S3, the step of picking up the chip 7 with the suction head 32 and placing it on the solder 6 further includes:
automatically identifying the chip 7 placed in the wafer box by automatic identification equipment;
after the recognition, the chip 7 is vacuum-sucked by using the suction head 32 of the vacuum suction device 3;
moving the sucker 32, carrying the chip 7 into the semi-closed cavity 1 and slowly descending and approaching the solder 6;
the contact detection by the suction head 32 stops the descending movement of the suction head 32 when the force of the solder 6 to the suction head 32 reaches 2N, where N is the gravity of the chip 7.
In more detail, in step S3, after picking up the chip 7 with the suction head 32 and placing it on the solder 6, as shown in fig. 3, the step of lifting the suction head 32 further includes:
releasing the vacuum to the suction head 32;
the suction head 32 is vertically and upwards slowly lifted for 20-40 mu m, and the lifting height is stable and controllable, so that the suction end of the suction head 32 is not in close contact with the chip 7, and the lower end surface of the suction hole A is not separated from the upper surface of the chip 7.
Specifically, as shown in fig. 2, steps S1 to S3 are performed, and the package 5, the solder 6, and the chip 7 are sequentially placed on the heating stage 2 from bottom to top, and the material preparation before eutectic die bonding is performed.
In detail, as shown in fig. 4 to 5, step S4 is performed to heat the solder 6 and perform eutectic bonding process rubbing on the chip 7.
In more detail, in step S4, the chip 7 is pushed by the side of the suction hole a to perform horizontal transverse rubbing, the track of the rubbing motion is rectangular, the amplitude of the rubbing motion is 0.1mm-0.5mm, the chip returns to the central position of the chip after 1 to 2 times of rubbing, and the amplitude of the rubbing motion can be adjusted and controlled according to the requirement of the spreading degree of the solder 6.
During the process of friction, the chip 7 is only subjected to a tiny flat pushing force along the edge, and the surface and the whole body are not stressed.
In detail, the eutectic die attach method further comprises the steps of:
in the eutectic chip mounting process, nitrogen is continuously introduced into the semi-closed cavity 1 through the first pipeline 4, the flow rate of the nitrogen is more than or equal to 25L/min, the purity of the nitrogen is more than or equal to 99.999 percent, a local high-purity nitrogen environment of the semi-closed cavity 1 is realized, and in the process implementation process, the nitrogen is opened in the whole process.
More specifically, the heating stage 2 with a power of 1000W or more is used to heat the substrate, so that the heat loss caused by the nitrogen flow can be quickly compensated.
In detail, as shown in fig. 6, after the process rubbing process is finished, the eutectic die bonding method further includes the steps of:
the suction head 32 is moved directly upwards and no further pressing action is performed.
In summary, according to the semi-closed eutectic die attach device and the eutectic die attach method provided by the invention, through the suction head structure design that the opening of the suction hole at least at the edge position of the suction end is gradually contracted along the direction from the suction end to the suction head rod, the suction head can be lifted subsequently when the solder is heated and melted, so that the suction end of the suction head is not in close contact with the chip, and the lower end surface of the suction hole is not separated from the upper surface of the chip, so that the chip can be driven to horizontally rub in a transverse direction; meanwhile, the mounting pressure is smaller transverse thrust, the corresponding solder scattering degree is mainly determined by the friction motion amplitude of the transverse thrust, the solder scattering degree is controllable, and the solder after mounting is uniform in scattering distribution, neat in edge and bright in surface; in addition, the mounting pressure is low, so that the friction force applied to the chip during mounting is low, and the surface damage and edge breakage of the chip are reduced.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (10)
1. A semi-enclosed eutectic die attach device, comprising:
a semi-closed cavity;
the heating table is arranged in the semi-closed cavity;
the vacuum suction equipment at least comprises a suction head rod and a suction head, wherein the suction head is arranged on the suction head rod, one end, far away from the suction head rod, of the suction head is a suction end, a suction hole is formed in the suction end, and at least at the edge position of the suction end, the opening of the suction hole gradually shrinks along the direction from the suction end to the suction head rod;
the automatic identification device can automatically identify the tube shell, the welding flux and the chip and feed back to the vacuum suction device;
wherein, the absorption hole can be used for promoting the chip carries out horizontal transverse friction, when promoting the chip carries out horizontal transverse friction, the absorption end of suction head with the chip does not have in close contact with and the lower terminal surface in absorption hole does not break away from the upper surface of chip.
2. A semi-enclosed eutectic patch device as claimed in claim 1, wherein an opening is provided at the top of the semi-enclosed cavity, and a first conduit communicating with the outside is provided at the bottom of the semi-enclosed cavity.
3. The semi-closed eutectic patch device according to claim 1 or 2, wherein a second pipeline is arranged inside the suction head rod and communicated with the adsorption hole; the tip pole includes the rigidity tip pole, the tip includes the rigidity tip.
4. A semi-hermetic eutectic die device of claim 1, wherein the motion control portion of the tip stem has a fine motion control capability of ± 5 μ ι η in a direction from the suction end to the tip stem.
5. A semi-enclosed eutectic die attach device according to claim 1, wherein said suction head comprises at least: a horn-shaped suction head.
6. A eutectic die attach method is characterized by comprising the following steps:
providing a semi-closed eutectic chip mounting device, wherein the semi-closed eutectic chip mounting device comprises a semi-closed cavity, a heating table and vacuum suction equipment, the heating table is arranged in the semi-closed cavity, the vacuum suction equipment at least comprises a suction head rod and a suction head, the suction head is arranged on the suction head rod, one end, far away from the suction head rod, of the suction head is an adsorption end, an adsorption hole is formed in the adsorption end of the suction head, and at least at the edge position of the adsorption end, the opening of the adsorption hole gradually shrinks along the direction from the adsorption end to the suction head rod;
Picking up and placing a tube shell on the heating table, picking up and placing solder on the tube shell;
picking up a chip by using the suction head and placing the chip on the solder, and then lifting the suction head to ensure that the suction end of the suction head is not in close contact with the chip and the lower end surface of the suction hole is not separated from the upper surface of the chip;
and heating the heating table, and pushing the chip to horizontally rub by using the adsorption hole.
7. The eutectic die attach method of claim 6, further comprising the steps of:
and continuously introducing nitrogen in the eutectic chip mounting process, wherein the flow rate of the nitrogen is more than or equal to 25L/min.
8. The eutectic die attach method of claim 6 or 7, wherein picking up the die and placing it on the solder with the suction head comprises:
sucking the chip by using the suction head in a vacuum manner;
moving the suction head, carrying the chip into the semi-closed cavity and descending and approaching the chip to the solder;
and performing contact detection through the suction head, and stopping the descending movement of the suction head when the acting force of the solder on the suction head reaches 2N, wherein N is the gravity of the chip.
9. The eutectic die attach method of claim 8, wherein after picking up the die with the tip and placing it on the solder, the step of raising the tip comprises:
releasing the vacuum to the tip;
and vertically and upwards lifting the suction head by 20-40 mu m, so that the suction end of the suction head is not in close contact with the chip and the lower end surface of the suction hole is not separated from the upper surface of the chip.
10. The eutectic die bonding method according to claim 9, wherein when the suction holes are used for pushing the chip to horizontally rub, the track of the rubbing motion is rectangular, the amplitude of the rubbing motion is 0.1mm-0.5mm, and the chip returns to the center position of the die after 1-2 times of rubbing, wherein the amplitude of the rubbing motion can be adjusted and controlled according to the scattering degree requirement of the solder.
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| CN113977028B (en) * | 2021-10-28 | 2023-04-25 | 恩纳基智能科技无锡有限公司 | Eutectic welding equipment |
| CN114429927B (en) * | 2022-01-26 | 2022-09-27 | 深圳市锐博自动化设备有限公司 | Automatic eutectic machine for semiconductor chip |
| CN115755823A (en) * | 2023-01-10 | 2023-03-07 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | Electrical control system applied to eutectic surface mounting equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE59708121D1 (en) * | 1997-01-08 | 2002-10-10 | Esec Trading Sa | Device for forming liquid portions of solder when soldering semiconductor chips |
| JP2000208540A (en) * | 1998-08-25 | 2000-07-28 | Texas Instr Inc <Ti> | Method for airtightly sealing thin semiconductor chip scale package |
| JP2006332529A (en) * | 2005-05-30 | 2006-12-07 | Optrex Corp | Crimping device |
| US8338266B2 (en) * | 2010-08-11 | 2012-12-25 | Soitec | Method for molecular adhesion bonding at low pressure |
| JP2012199358A (en) * | 2011-03-22 | 2012-10-18 | Nec Corp | Chip heating head |
| US20130127044A1 (en) * | 2011-11-22 | 2013-05-23 | Texas Instruments Incorporated | Micro surface mount device packaging |
| CN106992127B (en) * | 2017-04-19 | 2020-10-20 | 中国电子科技集团公司第二十四研究所 | Eutectic chip mounting method for extremely few generation of suspended oxide particles on surface of solder |
| KR101764244B1 (en) * | 2017-05-19 | 2017-08-03 | 박진동 | Transfer module for semiconductor chip having buffering function |
| CN107424951B (en) * | 2017-06-02 | 2023-08-18 | 广东瑞谷光网通信股份有限公司 | Chip rotary eutectic welding table |
| KR102439617B1 (en) * | 2017-06-27 | 2022-09-05 | 주식회사 미코세라믹스 | Bonding head and apparatus for bonding chips having the bonding head |
| CN111987010A (en) * | 2019-05-21 | 2020-11-24 | 上海航天电子通讯设备研究所 | Automatic eutectic welding method for power chip and picking suction head |
| CN112018017B (en) * | 2020-08-11 | 2023-04-25 | 四川旭茂微科技有限公司 | Chip placement device and method on jumper wire frame |
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