CN112987814A - Semiconductor temperature control system and method - Google Patents
Semiconductor temperature control system and method Download PDFInfo
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- CN112987814A CN112987814A CN202110182182.9A CN202110182182A CN112987814A CN 112987814 A CN112987814 A CN 112987814A CN 202110182182 A CN202110182182 A CN 202110182182A CN 112987814 A CN112987814 A CN 112987814A
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
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- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
Abstract
The invention provides a temperature control system and a method for a semiconductor, wherein the temperature control system comprises a circulating cooling water system, a refrigeration system and a circulating liquid system, the refrigeration system comprises a compressor, a liquid storage tank, a main loop electronic expansion valve, a cold bypass electronic expansion valve, a hot gas electronic expansion valve, an evaporator and a gas-liquid heat exchanger, an outlet of the compressor is respectively communicated with an inlet of a condenser and a first interface of the hot gas electronic expansion valve, an outlet of the liquid storage tank is respectively communicated with a first interface of the cold bypass electronic expansion valve and a first interface of the gas-liquid heat exchanger, a second interface of the gas-liquid heat exchanger is communicated with an inlet of the compressor, a third interface of the gas-liquid heat exchanger and a second interface of the cold bypass electronic expansion valve are jointly connected with the first interface of the evaporator, a fourth interface of the gas-liquid heat exchanger is communicated with the first interface of the main loop electronic expansion valve, and the second interface of the main loop electronic expansion valve and .
Description
Technical Field
The invention relates to the field of semiconductor manufacturing equipment, in particular to a semiconductor temperature control system and a semiconductor temperature control method.
Background
The semiconductor temperature control device is used as important equipment in the manufacturing process of a semiconductor Integrated Circuit (IC), constant temperature output is required to be kept in the etching process of the IC manufacturing for controlling a process cavity of the etching equipment, and the requirement on temperature control precision is high. The semiconductor temperature control device accurately controls the temperature through refrigeration and heating links in actual use. The traditional PID control algorithm is adopted by the conventional semiconductor temperature control device to realize the consistency of the control target temperature and the given temperature, and the temperature control precision of the semiconductor temperature control device is difficult to guarantee when the load of etching process equipment fluctuates severely.
Disclosure of Invention
The invention provides a semiconductor temperature control system and a method thereof, which are used for solving the problems that a temperature control device in the prior art is low in temperature control precision, and a refrigeration system has no influence of a heat regenerator on a temperature control system and a compressor. The temperature control device needs to stably operate for a long time without stopping in the manufacturing process of the semiconductor chip, the operating temperature is in a wide temperature range, and the operating temperature is changed along with the manufacturing process.
The invention provides a semiconductor temperature control system, which comprises:
the circulating cooling water system comprises a circulating water pipeline and a condenser arranged on the circulating water pipeline;
the refrigeration system comprises a compressor, a liquid storage tank, a main loop electronic expansion valve, a cold bypass electronic expansion valve, a hot gas electronic expansion valve, an evaporator and a gas-liquid heat exchanger, wherein an outlet of the compressor is respectively communicated with an inlet of the condenser and a first interface of the hot gas electronic expansion valve, an outlet of the condenser is communicated with an inlet of the liquid storage tank, an outlet of the liquid storage tank is respectively communicated with a first interface of the cold bypass electronic expansion valve and a first interface of the gas-liquid heat exchanger, a second interface of the gas-liquid heat exchanger is communicated with an inlet of the compressor, a third interface of the gas-liquid heat exchanger and a second interface of the cold bypass electronic expansion valve are jointly connected with a first interface of the evaporator, a fourth interface of the gas-liquid heat exchanger is communicated with a first interface of the main loop electronic expansion valve, and a second interface of the main loop electronic expansion valve and a second interface of the hot gas electronic expansion valve are jointly connected with a A second interface of the evaporator;
the circulating liquid system comprises a heater, a circulating liquid tank and a circulating pump, wherein the heater is arranged in the circulating liquid tank, an inlet of the circulating liquid tank is communicated with a third interface of the evaporator, an outlet of the circulating liquid tank is communicated with an inlet of the circulating pump, an outlet of the circulating pump is communicated with an inlet of load equipment, and an outlet of the load equipment is communicated with a fourth interface of the evaporator.
According to the semiconductor temperature control system provided by the invention, the circulating liquid system further comprises a first temperature sensor, a second temperature sensor and a third temperature sensor, the first temperature sensor is arranged at the outlet of the circulating pump, the second temperature sensor is arranged at the outlet of the load equipment, and the third temperature sensor is arranged at a third interface of the evaporator.
According to the semiconductor temperature control system provided by the invention, the circulating liquid system further comprises a flow sensor and a pressure sensor, the flow sensor is arranged at the third interface of the evaporator, and the pressure sensor is arranged at the outlet of the circulating pump.
According to the semiconductor temperature control system provided by the invention, the refrigeration system further comprises a fourth temperature sensor and a fifth temperature sensor, the fourth temperature sensor is arranged at the outlet of the compressor, and the fifth temperature sensor is arranged at the inlet of the compressor.
According to the semiconductor temperature control system provided by the invention, the refrigeration system further comprises a sixth temperature sensor, and the sixth temperature sensor is arranged at the first interface of the evaporator.
According to the semiconductor temperature control system provided by the invention, the refrigeration system further comprises an evaporator outlet pressure sensor, and the evaporator outlet pressure sensor is arranged at a first interface of the evaporator.
According to the semiconductor temperature control system provided by the invention, the refrigerating system further comprises a dryer, and the dryer is arranged at the outlet of the liquid storage tank.
According to the semiconductor temperature control system provided by the invention, the refrigerating system further comprises a liquid viewing mirror, and the liquid viewing mirror is arranged at the outlet of the liquid storage tank.
The invention also provides a temperature control method for the semiconductor, which comprises the following steps:
step a10, acquiring a temperature parameter and a flow parameter;
step a20, comparing the actual temperature of the liquid at the inlet of the load equipment with a first target temperature to obtain a first temperature difference PID 1; comparing the actual liquid temperature at the inlet of the circulating liquid tank with a second target temperature to obtain a second temperature difference PID 2; comparing the actual liquid flow at the inlet of the circulating liquid tank with a target flow value to obtain a flow difference value PID 3;
step a30, controlling the heating quantity of the heater according to the first temperature difference PID1, controlling the opening degree of the electronic expansion valve of the main loop according to the second temperature difference PID2
The flow difference PID3 controls the frequency of the circulating pump so that the actual temperature value of the liquid at the inlet of the load device is controlled within a target range.
According to the semiconductor temperature control method provided by the invention, the following steps are further executed before the step a20 is executed:
and judging whether the temperature switch, the liquid level sensor and the circuit breaker are normal, if so, starting the circulating pump and the compressor, and if not, not starting the circulating pump and the compressor.
According to the semiconductor temperature control system provided by the invention, the gas-liquid heat exchanger is arranged on the gas suction pipeline of the compressor, so that the refrigerant liquid condensed by the condenser firstly passes through the gas-liquid heat exchanger and then passes through the electronic expansion valve of the main loop; the refrigerant vapor absorbed and gasified by the evaporator firstly passes through the gas-liquid heat exchanger and then returns to the compressor, the gas-liquid heat exchanger is arranged on the two pipelines to achieve the purpose of supercooling and overheating, and the liquid refrigerant in the evaporator and the refrigerant vapor in the suction pipeline exchange heat, so that the harmful overheating in the suction pipeline can be reduced, and simultaneously the purpose of supercooling the liquid refrigerant in front of the electronic expansion valve of the main loop can be achieved. Meanwhile, the circulation characteristic of the refrigerant is improved, the refrigeration coefficient of the refrigeration cycle is improved, the supercooling degree of the high-pressure liquid refrigerant before throttling is increased, the suction superheat degree of the compressor is improved, and the compressor is prevented from generating liquid impact.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a semiconductor temperature control system according to the present invention;
FIG. 2 is a flow chart of a method for semiconductor temperature control provided by the present invention;
FIG. 3 is a schematic diagram of the temperature control effect provided by the present invention;
fig. 4 is a schematic diagram of the connection between the electronic expansion valve and the system controller according to the present invention.
Reference numerals: 101. a compressor; 102. a condenser; 103. a liquid storage tank; 104. a main loop electronic expansion valve; 105. a cold bypass electronic expansion valve; 106. a hot gas electronic expansion valve; 107. an evaporator; 108. a gas-liquid heat exchanger; 109. an evaporator outlet pressure sensor; 110. a fourth temperature sensor; 111. a fifth temperature sensor; 112. a sixth temperature sensor; 113. a first temperature sensor; 114. a second temperature sensor; 115. a third temperature sensor; 116. a flow sensor; 117. a pressure sensor; 118. a heater; 119. a circulating liquid tank; 120. a circulation pump; 121. a dryer; 122. a liquid viewing mirror.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
The invention is described below with reference to fig. 1-2 for semiconductor temperature control systems and methods.
Fig. 1 illustrates a schematic structural diagram of a semiconductor temperature control system, which includes a circulating cooling water system, a refrigeration system and a circulating liquid system as shown in fig. 1. The circulating cooling water system includes a circulating water line and a condenser 102 provided on the circulating water line.
The refrigeration system includes a compressor 101, a receiver tank 103, a main circuit electronic expansion valve 104, a cold bypass electronic expansion valve 105, a hot gas electronic expansion valve 106, an evaporator 107, and a gas-to-liquid heat exchanger 108. The outlet of the compressor 101 is respectively communicated with the inlet of the condenser 102 and the first interface of the hot gas electronic expansion valve 106, the outlet of the condenser 102 is communicated with the inlet of the liquid storage tank 103, and the outlet of the liquid storage tank 103 is respectively communicated with the first interface of the cold bypass electronic expansion valve 105 and the first interface of the gas-liquid heat exchanger 108. A second port of the gas-liquid heat exchanger 108 is communicated with an inlet of the compressor 101, a third port of the gas-liquid heat exchanger 108 and a second port of the cold bypass electronic expansion valve 105 are commonly connected with a first port of the evaporator 107, a fourth port of the gas-liquid heat exchanger 108 is communicated with a first port of the main circuit electronic expansion valve 104, and a second port of the main circuit electronic expansion valve 104 and a second port of the hot gas electronic expansion valve 106 are commonly connected with a second port of the evaporator 107. As shown in fig. 4, the system controller is electrically connected to the main circuit electronic expansion valve 104, the cold bypass electronic expansion valve 105, and the hot gas electronic expansion valve 106, respectively.
The circulating liquid system comprises a heater 118, a circulating liquid tank 119 and a circulating pump 120, the heater 118 is arranged in the circulating liquid tank 119, an inlet of the circulating liquid tank 119 is communicated with a third interface of the evaporator 107, an outlet of the circulating liquid tank 119 is communicated with an inlet of the circulating pump 120, an outlet of the circulating pump 120 is communicated with an inlet of load equipment, and an outlet of the load equipment is communicated with a fourth interface of the evaporator 107.
According to the semiconductor temperature control system provided by the invention, the gas-liquid heat exchanger 108 is arranged on the gas suction pipeline of the compressor 101, so that refrigerant liquid condensed by the condenser 102 firstly passes through the gas-liquid heat exchanger 108 and then passes through the main loop electronic expansion valve 104; the refrigerant vapor which absorbs heat and is gasified in the evaporator 107 firstly passes through the gas-liquid heat exchanger 108 and then returns to the compressor 101, the gas-liquid heat exchanger 108 is arranged on the two pipelines, the purpose of supercooling and overheating is achieved, the liquid refrigerant in the evaporator 107 and the refrigerant vapor in the suction pipeline are subjected to heat exchange, the harmful overheating in the suction pipeline can be reduced, and the purpose of supercooling the liquid refrigerant before the electronic expansion valve 104 of the main loop can be achieved. Meanwhile, the circulation characteristic of the refrigerant is improved, the refrigeration coefficient of the refrigeration cycle is improved, the supercooling degree of the high-pressure liquid refrigerant before throttling is increased, the suction superheat degree of the compressor 101 is improved, and the compressor 101 is prevented from liquid slugging.
Here, the control of the inverter INV1 of the compressor 101 is as follows: PID (0-100) is output through temperature change of an outlet of the circulating liquid tank 119, wherein 0-50 corresponds to 39Hz, and 50-100 corresponds to 39-60 Hz. Control of heating amount of the heater 118: the first temperature sensor 113 outputs a PID1 to control the amount of heating of the heater 118 as compared to the TS1SV target temperature.
According to the embodiment of the present invention, the circulating liquid system further includes a first temperature sensor 113, a second temperature sensor 114 and a third temperature sensor 115, the first temperature sensor 113 is disposed at the outlet of the circulating pump 120, and the first temperature sensor 113 is used for detecting the temperature value of the liquid refrigerant at the outlet of the circulating pump 120. The second temperature sensor 114 is disposed at an outlet of the load device, and the second temperature sensor 114 is configured to detect a temperature value of the liquid refrigerant at the outlet of the load device. The third temperature sensor 115 is disposed at the third interface of the evaporator 107, and the third temperature sensor 115 is configured to detect a temperature value of the liquid refrigerant at the third interface of the evaporator 107.
Here, it should be noted that the control of the outlet temperature of the circulating liquid tank 119: the PID of the difference between the target temperature value TS1SV and the actual value measured by the first temperature sensor 113 is output to PID 1. Control of the third temperature sensor 115 at the inlet of the circulation tank 119: the PID of the difference between the target temperature value TS3SV and the actual value measured by the third temperature sensor 115 outputs PID 2.
The specific control logic for accurately controlling the outlet temperature of the circulating liquid tank 119 is as follows: the difference PID (0-100) between the target temperature TS3SV and the actual value of the third temperature sensor 115 controls the main loop electronic expansion valve 104 and the frequency control of the inverter INV1 of the compressor 101; the difference PID (0-100) between the target temperature TS1SV and the actual value of the first temperature sensor 113 controls the amount of heating by the heater 118, and the difference PID (0-100) between the target flow rate value FS1SV and the actual value of the flow sensor 116 controls the inverter INV2 of the circulation pump 120.
According to the embodiment of the present invention, the circulating fluid system further includes a flow sensor 116 and a pressure sensor 117, the flow sensor 116 is disposed at the third interface of the evaporator 107, and the flow sensor 116 is used for detecting the flow rate of the liquid refrigerant at the third interface of the evaporator 107. A pressure sensor 117 is provided at the outlet of the circulation pump 120, and the pressure sensor 117 is used to detect the pressure of the liquid refrigerant at the outlet of the circulation pump 120.
Flow control at the outlet of the circulating liquid tank 119: the PID of the difference between the target flow rate FS1SV and the actual value of the flow sensor 116 outputs PID3, the actual flow rate PV of the flow sensor 116 is compared with the target flow rate value to output INV2 frequency for controlling the circulation pump 120, and the inverter INV2 for controlling the circulation pump 120: PID (0-100) corresponds to 35-50 Hz.
According to the embodiment of the present invention, the refrigeration system further includes a fourth temperature sensor 110, a fifth temperature sensor 111 and a sixth temperature sensor 112, the fourth temperature sensor 110 is disposed at the outlet of the compressor 101, and the fourth temperature sensor 110 is used for detecting the temperature value of the refrigerant at the outlet of the compressor 101. The fifth temperature sensor 111 is disposed at an inlet of the compressor 101, and the fifth temperature sensor 111 is used for detecting a temperature value of the refrigerant at the inlet of the compressor 101. The sixth temperature sensor 112 is disposed at the first interface of the evaporator 107, and the sixth temperature sensor 112 is configured to detect a temperature value of the refrigerant at the first interface of the evaporator 107.
According to an embodiment of the present invention, the refrigeration system further comprises an evaporator outlet pressure sensor 109, a dryer 121 and a sight glass 122, the evaporator outlet pressure sensor 109 is disposed at the first interface of the evaporator 107, and the evaporator outlet pressure sensor 109 is configured to detect a pressure value of the refrigerant at the first interface of the evaporator 107. The dryer 121 is disposed at an outlet of the liquid storage tank 103, and the liquid viewing mirror 122 is disposed at the outlet of the liquid storage tank 103.
The refrigerant flow direction for the semiconductor temperature control system has the following three flow directions:
1. the outlet of the compressor 101, the condenser 102, the liquid storage tank 103, the dryer 121, the liquid viewing mirror 122, the gas-liquid heat exchanger 108, the main loop electronic expansion valve 104, the evaporator 107, the gas-liquid heat exchanger 108 and the inlet of the compressor 101;
2. the outlet of the compressor 101, the condenser 102, the liquid storage tank 103, the dryer 121, the liquid sight glass 122, the cold bypass electronic expansion valve 105, the gas-liquid heat exchanger 108 and the inlet of the compressor 101;
3. compressor 101 outlet-hot gas electronic expansion valve 106-evaporator 107-liquid-to-gas heat exchanger 108-compressor 101 inlet.
As shown in fig. 3, by properly controlling the opening degrees of the main circuit electronic expansion valve 104, the hot gas electronic expansion valve 106, and the cold bypass electronic expansion valve 105, and controlling the operating frequency of the compressor 101, the heating amount of the heater 118, the operating frequency of the circulation pump 120, and the system heat regenerator (the gas-liquid heat exchanger 108), effective control of the refrigeration system can be satisfied. And finally, accurately controlling the temperature and the flow of the circulating liquid outlet by balancing related variables, comprehensively controlling and self-balancing, and actually checking that the temperature control precision can reach +/-0.1 ℃. By performing variable frequency control on the compressor 101 and the circulation pump 120, an energy saving effect can be achieved. By adopting two-stage closed-loop control, the dynamic control performance is improved, the advanced process requirement is met, the efficient control is realized, the energy consumption is reduced, and a heat regenerator technology is adopted; by increasing the supercooling degree and the superheat degree, the liquid return of the compressor 101 is reduced, and the reliability of the compressor 101 is improved. The heat of the compressor 101 is effectively utilized by adopting a special electronic hot gas bypass design, the heating power is improved, the power of the heater 118 is reduced, and the energy consumption is reduced.
The heat regenerator technology comprises the following steps: in the refrigeration system matched with the gas-liquid heat exchanger 108, on the premise of ensuring that no liquid enters the compressor 101, the outlet superheat degree of the gas-liquid heat exchanger 108 is reduced, so that the outlet enthalpy of the evaporator 107 can be reduced, the refrigeration working medium is positioned in a steam drying area or a two-phase flow area instead of a superheat area, and the refrigeration working medium has higher heat exchange capacity, thereby reducing the size of the evaporator 107.
Fig. 2 illustrates a flowchart of a semiconductor temperature control method, and as shown in fig. 2, the present invention further provides a semiconductor temperature control method, which includes the following steps:
step a10, acquiring a temperature parameter and a flow parameter;
it should be noted here that the temperature parameter includes a temperature value of the first temperature sensor 113, a temperature value of the second temperature sensor 114, a temperature value of the third temperature sensor 115, a temperature value of the fourth temperature sensor 110, a temperature value of the fifth temperature sensor 111, and a temperature value of the sixth temperature sensor 112; the flow parameter includes a flow value of the flow sensor 116.
Step a20, comparing the actual temperature of the liquid at the inlet of the load equipment with a first target temperature to obtain a first temperature difference PID 1; comparing the actual temperature of the liquid at the inlet of the circulating liquid tank 119 with a second target temperature to obtain a second temperature difference PID 2; comparing the actual liquid flow at the inlet of the circulating liquid tank 119 with a target flow value to obtain a flow difference PID 3;
step a30, controlling the heating quantity of the heater 118 according to the first temperature difference PID1, controlling the opening degree of the main loop electronic expansion valve 104 according to the second temperature difference PID2, and controlling the frequency of the circulating pump 120 according to the flow difference PID3, so that the actual temperature value of the liquid at the inlet of the load device is controlled within a target range.
The opening degree of the main loop electronic expansion valve 104 is controlled according to the second temperature difference PID2, so that the operation in the high and low temperature regions is satisfied. Meanwhile, the running requirements of the high-low temperature interval on different refrigerating output of the return load can be met. In addition, the control of the electronic expansion valve 104 of the main loop can also realize the control of the suction temperature and the exhaust temperature, and ensure that the suction temperature and the exhaust temperature are in a proper range, thereby ensuring the reliable operation of the system.
Main loop electronic expansion valve 104 controls:
the output percentage of the refrigerating capacity (the main loop electronic expansion valve 104) is determined according to the actual temperature value and the target temperature value of the controlled object, the PID (0-100) corresponds to EXP-LO to EXP-HI (the table 1 shows that the EXP-LO corresponds to the temperature table of the EXP-HI), and the opening degree of the main loop electronic expansion valve 104 can be automatically controlled to meet the operation in a high-temperature and low-temperature range. Meanwhile, the running requirements of different refrigerating capacities output by the return load equipment in a high-temperature and low-temperature interval can be met. In addition, the control of the electronic expansion valve 104 of the main loop can also realize the control of the suction temperature and the exhaust temperature, and ensure that the suction temperature and the exhaust temperature are in a proper range, thereby ensuring the reliable operation of the system.
| TEMP | EXP-HI | EXP-LO | TEMP | EXP-HI | EXP-LO |
| -20.00 | 0.00 | 0.00 | 40.00 | 0.00 | 0.00 |
| -15.00 | 0.00 | 0.00 | 45.00 | 0.00 | 0.00 |
| -10.00 | 0.00 | 0.00 | 50.00 | 0.00 | 0.00 |
| -5.00 | 0.00 | 0.00 | 55.00 | 0.00 | 0.00 |
| 0.00 | 0.00 | 0.00 | 60.00 | 0.00 | 0.00 |
| 5.00 | 0.00 | 0.00 | 65.00 | 0.00 | 0.00 |
| 10.00 | 0.00 | 0.00 | 70.00 | 0.00 | 0.00 |
| 15.00 | 0.00 | 0.00 | 75.00 | 0.00 | 0.00 |
| 20.00 | 0.00 | 0.00 | 80.00 | 0.00 | 0.00 |
| 30.00 | 0.00 | 0.00 | 90.00 | 0.00 | 0.00 |
| 35.00 | 0.00 | 0.00 | 100.00 | 0.00 | 0.00 |
TABLE 1
Hot gas electronic expansion valve 106 control (BYGASMAX):
the output percentage of the hot gas electronic expansion valve 106 is determined according to the actual temperature value and the target temperature value of the controlled object, the PID (0-100) corresponds to EXPBY-HI to L0 (the table 2 is an EXPBY-HI corresponding temperature table), and the opening degree of the electronic expansion valve can be automatically controlled.
Cold bypass electronic expansion valve 105 control (INJ-EXP): the adjustment was made by the base temperature value + adjustment amount, as shown in table 2.
| TEMP | DIFF | INJ-EXP | BYGASMAX | TEMP | DIFF | INJ-EXP | BYGASMAX |
| -20.00 | 0.00 | 0.00 | 0.00 | 40.00 | 0.00 | 0.00 | 0.00 |
| -15.00 | 0.00 | 0.00 | 0.00 | 45.00 | 0.00 | 0.00 | 0.00 |
| -10.00 | 0.00 | 0.00 | 0.00 | 50.00 | 0.00 | 0.00 | 0.00 |
| -5.00 | 0.00 | 0.00 | 0.00 | 55.00 | 0.00 | 0.00 | 0.00 |
| 0.00 | 0.00 | 0.00 | 0.00 | 60.00 | 0.00 | 0.00 | 0.00 |
| 5.00 | 0.00 | 0.00 | 0.00 | 65.00 | 0.00 | 0.00 | 0.00 |
| 10.00 | 0.00 | 0.00 | 0.00 | 70.00 | 0.00 | 0.00 | 0.00 |
| 15.00 | 0.00 | 0.00 | 0.00 | 75.00 | 0.00 | 0.00 | 0.00 |
| 20.00 | 0.00 | 0.00 | 0.00 | 80.00 | 0.00 | 0.00 | 0.00 |
| 30.00 | 0.00 | 0.00 | 0.00 | 90.00 | 0.00 | 0.00 | 0.00 |
| 35.00 | 0.00 | 0.00 | 0.00 | 100.00 | 0.00 | 0.00 | 0.00 |
TABLE 2
According to an embodiment of the present invention, the following steps are also performed before performing step a 20:
and judging whether the temperature switch, the liquid level sensor and the circuit breaker are normal or not, if so, starting the circulating pump 120 and the compressor 101, and if not, not starting the circulating pump 120 and the compressor 101.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A temperature control system for a semiconductor, comprising:
the circulating cooling water system comprises a circulating water pipeline and a condenser arranged on the circulating water pipeline;
the refrigeration system comprises a compressor, a liquid storage tank, a main loop electronic expansion valve, a cold bypass electronic expansion valve, a hot gas electronic expansion valve, an evaporator and a gas-liquid heat exchanger, wherein an outlet of the compressor is respectively communicated with an inlet of the condenser and a first interface of the hot gas electronic expansion valve, an outlet of the condenser is communicated with an inlet of the liquid storage tank, an outlet of the liquid storage tank is respectively communicated with a first interface of the cold bypass electronic expansion valve and a first interface of the gas-liquid heat exchanger, a second interface of the gas-liquid heat exchanger is communicated with an inlet of the compressor, a third interface of the gas-liquid heat exchanger and a second interface of the cold bypass electronic expansion valve are jointly connected with a first interface of the evaporator, a fourth interface of the gas-liquid heat exchanger is communicated with a first interface of the main loop electronic expansion valve, and a second interface of the main loop electronic expansion valve and a second interface of the hot gas electronic expansion valve are jointly connected with a A second interface of the evaporator;
the circulating liquid system comprises a heater, a circulating liquid tank and a circulating pump, wherein the heater is arranged in the circulating liquid tank, an inlet of the circulating liquid tank is communicated with a third interface of the evaporator, an outlet of the circulating liquid tank is communicated with an inlet of the circulating pump, an outlet of the circulating pump is communicated with an inlet of load equipment, and an outlet of the load equipment is communicated with a fourth interface of the evaporator.
2. The semiconductor temperature control system according to claim 1, wherein the circulating fluid system further comprises a first temperature sensor, a second temperature sensor and a third temperature sensor, the first temperature sensor is disposed at an outlet of the circulating pump, the second temperature sensor is disposed at an outlet of the load device, and the third temperature sensor is disposed at a third interface of the evaporator.
3. The semiconductor temperature control system according to claim 2, wherein the circulating liquid system further comprises a flow sensor and a pressure sensor, the flow sensor is disposed at the third interface of the evaporator, and the pressure sensor is disposed at an outlet of the circulating pump.
4. The semiconductor temperature control system according to any one of claims 1 to 3, wherein the refrigeration system further comprises a fourth temperature sensor and a fifth temperature sensor, the fourth temperature sensor is disposed at an outlet of the compressor, and the fifth temperature sensor is disposed at an inlet of the compressor.
5. The semiconductor temperature control system according to claim 4, wherein the refrigeration system further comprises a sixth temperature sensor, and the sixth temperature sensor is disposed at the first interface of the evaporator.
6. The semiconductor temperature control system according to claim 4, wherein the refrigeration system further comprises an evaporator outlet pressure sensor, the evaporator outlet pressure sensor being disposed at the first interface of the evaporator.
7. The semiconductor temperature control system according to claim 6, wherein the refrigeration system further comprises a dryer, and the dryer is disposed at an outlet of the liquid storage tank.
8. The semiconductor temperature control system according to claim 7, wherein the refrigeration system further comprises a liquid observation mirror, and the liquid observation mirror is disposed at an outlet of the liquid storage tank.
9. A temperature control method for a semiconductor is characterized by comprising the following steps:
step a10, acquiring a temperature parameter and a flow parameter;
step a20, comparing the actual temperature of the liquid at the inlet of the load equipment with a first target temperature to obtain a first temperature difference PID 1; comparing the actual liquid temperature at the inlet of the circulating liquid tank with a second target temperature to obtain a second temperature difference PID 2; comparing the actual liquid flow at the inlet of the circulating liquid tank with a target flow value to obtain a flow difference value PID 3;
step a30, controlling the heating quantity of the heater according to the first temperature difference PID1, controlling the opening degree of the electronic expansion valve of the main loop according to the second temperature difference PID2, and controlling the frequency of the circulating pump according to the flow difference PID3, so that the actual temperature value of the liquid at the inlet of the load equipment is controlled within a target range.
10. The method for semiconductor temperature control according to claim 9, further performing the following steps before performing the step a 20:
and judging whether the temperature switch, the liquid level sensor and the circuit breaker are normal, if so, starting the circulating pump and the compressor, and if not, not starting the circulating pump and the compressor.
Priority Applications (1)
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6729151B1 (en) * | 1999-09-24 | 2004-05-04 | Peter Forrest Thompson | Heat pump fluid heating system |
| CN102889704A (en) * | 2011-07-19 | 2013-01-23 | 东普雷股份有限公司 | Gas-liquid separated type freezing plant |
| CN106268202A (en) * | 2016-08-31 | 2017-01-04 | 杭州日盛净化设备有限公司 | A kind of freezing type drying system and control method thereof |
| CN109032201A (en) * | 2017-06-09 | 2018-12-18 | 北京京仪自动化装备技术有限公司 | Semiconductor production temperature control device |
| CN111538360A (en) * | 2020-07-07 | 2020-08-14 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method |
| CN111750566A (en) * | 2019-03-27 | 2020-10-09 | 上海微电子装备（集团）股份有限公司 | Temperature control system |
-
2021
- 2021-02-09 CN CN202110182182.9A patent/CN112987814A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6729151B1 (en) * | 1999-09-24 | 2004-05-04 | Peter Forrest Thompson | Heat pump fluid heating system |
| CN102889704A (en) * | 2011-07-19 | 2013-01-23 | 东普雷股份有限公司 | Gas-liquid separated type freezing plant |
| CN106268202A (en) * | 2016-08-31 | 2017-01-04 | 杭州日盛净化设备有限公司 | A kind of freezing type drying system and control method thereof |
| CN109032201A (en) * | 2017-06-09 | 2018-12-18 | 北京京仪自动化装备技术有限公司 | Semiconductor production temperature control device |
| CN111750566A (en) * | 2019-03-27 | 2020-10-09 | 上海微电子装备（集团）股份有限公司 | Temperature control system |
| CN111538360A (en) * | 2020-07-07 | 2020-08-14 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method |
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