CN112977949A - Automatic discharging device for silicon wafer inspection and control method thereof - Google Patents
Automatic discharging device for silicon wafer inspection and control method thereof Download PDFInfo
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- CN112977949A CN112977949A CN201911301663.6A CN201911301663A CN112977949A CN 112977949 A CN112977949 A CN 112977949A CN 201911301663 A CN201911301663 A CN 201911301663A CN 112977949 A CN112977949 A CN 112977949A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 131
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 131
- 239000010703 silicon Substances 0.000 title claims abstract description 131
- 238000007689 inspection Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000007599 discharging Methods 0.000 title abstract description 12
- 230000005540 biological transmission Effects 0.000 claims abstract description 156
- 238000004806 packaging method and process Methods 0.000 claims abstract description 64
- 235000012431 wafers Nutrition 0.000 claims description 119
- 238000012856 packing Methods 0.000 claims description 37
- 238000012546 transfer Methods 0.000 claims description 14
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 208000032370 Secondary transmission Diseases 0.000 claims 3
- 238000013461 design Methods 0.000 abstract description 3
- 230000033001 locomotion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/30—Arranging and feeding articles in groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/56—Orientating, i.e. changing the attitude of, articles, e.g. of non-uniform cross-section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B43/00—Forming, feeding, opening or setting-up containers or receptacles in association with packaging
- B65B43/42—Feeding or positioning bags, boxes, or cartons in the distended, opened, or set-up state; Feeding preformed rigid containers, e.g. tins, capsules, glass tubes, glasses, to the packaging position; Locating containers or receptacles at the filling position; Supporting containers or receptacles during the filling operation
- B65B43/46—Feeding or positioning bags, boxes, or cartons in the distended, opened, or set-up state; Feeding preformed rigid containers, e.g. tins, capsules, glass tubes, glasses, to the packaging position; Locating containers or receptacles at the filling position; Supporting containers or receptacles during the filling operation using grippers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides an automatic discharging device for silicon wafer inspection and a control method thereof, wherein the automatic discharging device comprises a fixed table, a transmission unit, a packaging unit and a positioning unit are arranged above the fixed table, an operation unit matched with the packaging unit is arranged on the side surface of the fixed table, one end of the transmission unit is connected with an outlet of the silicon wafer inspection, and the other end of the transmission unit is connected with the positioning unit; the packaging unit penetrates through one end, far away from the transmission unit, of the positioning unit, and the opening direction of the packaging unit is arranged towards one side, close to the transmission unit; one end of the operation unit is connected with the fixed table, the other end of the operation unit is connected with the packaging unit, and the operation unit can enable the packaging unit to vertically move up and down. The blanking device provided by the invention solves the technical problems of low working efficiency and large quality risk caused by manual blanking collection in the prior art, and has the advantages of high automation degree, reasonable structural design, good controllability and high working efficiency.
Description
Technical Field
The invention belongs to the technical field of solar silicon wafer inspection, and particularly relates to an automatic discharging device for silicon wafer inspection and a control method thereof.
Background
The existing silicon wafer inspection is that after the inspection of automatic detection equipment is finished, when qualified silicon wafers are placed into a collection bin, the silicon wafers are taken back manually, and then the silicon wafers are stacked in a packaging box arranged in another independent area. For the existing small-size silicon wafers with the diameters of 120-160mm, the blanking collection mode can also ensure normal operation, but the operation is often matched by multiple persons, so that the materials are easy to mix. And for the large-size silicon chip with the diameter of 200-300mm, the silicon chip is large and thin, the material is manually taken or placed, so that the silicon chip is easy to collide and damage, the large-size silicon chip increases the workload of personnel due to the increase of the area, the working efficiency is lower, and the risk of collision, damage and material mixing of the silicon chip is very high.
Disclosure of Invention
The invention provides an automatic discharging device for silicon wafer inspection and a control method thereof, in particular to an automatic discharging and collecting device for large-size silicon wafer inspection, which solves the technical problems of low working efficiency and high quality risk caused by manual discharging and collecting in the prior art.
In order to solve the technical problems, the invention adopts the technical scheme that:
an automatic discharging device for silicon wafer inspection comprises a fixed table, wherein a transmission unit, a packaging unit and a positioning unit are arranged above the fixed table, an operation unit matched with the packaging unit is arranged on the side surface of the fixed table, one end of the transmission unit is connected with an outlet of the silicon wafer inspection, and the other end of the transmission unit is connected with the positioning unit; the packaging unit penetrates through one end, far away from the transmission unit, of the positioning unit, and the opening direction of the packaging unit is arranged towards one side, close to the transmission unit; one end of the operation unit is connected with the fixed table, the other end of the operation unit is connected with the packaging unit, and the operation unit can enable the packaging unit to vertically move downwards.
Furthermore, the transmission unit includes main transmission section, a plurality of vice transmission sections and respectively with main transmission section with the supplementary transmission section that vice transmission section is connected, main transmission section with supplementary transmission section coaxial setting, vice transmission section is followed supplementary transmission section is kept away from main transmission section one end evenly distributed.
Furthermore, there are three auxiliary transmission sections, and the included angles between the auxiliary transmission sections and between the auxiliary transmission sections are both 90 °.
Furthermore, the auxiliary transmission section and the auxiliary transmission section are both positioned on the inner side of the fixed station, and the main transmission section is positioned on the outer side of the fixed station.
Furthermore, the positioning units are respectively arranged at one end of the auxiliary transmission section, which is far away from the auxiliary transmission section, and are positioned outside the fixed station, and the main transmission section, the auxiliary transmission section and the positioning units are all positioned on the same horizontal plane.
Furthermore, the packaging unit is vertically arranged through the thickness direction of the positioning unit, a plurality of parallel placing grooves are arranged in the length direction of the packaging unit, and the width of each placing groove is matched with the length of the silicon wafer; the width of the placing groove is smaller than that of the positioning unit, and the lower end face of the placing groove and the upper end face of the positioning unit are arranged at the same height.
Furthermore, the operating unit is a mechanical arm which can be arranged in a telescopic mode, each packaging unit is provided with the mechanical arm, one end of each mechanical arm is connected with a motor arranged in the fixing table, and the other end of each mechanical arm is connected with the packaging unit.
Furthermore, the device also comprises a connecting unit, wherein the connecting unit is perpendicular to the transmission unit and is respectively connected with the transmission unit and the fixed station.
A control method of an automatic discharging device for silicon wafer inspection is characterized in that horizontally arranged silicon wafers are conveyed to any one packaging unit penetrating through the positioning unit along the transmission unit, and when a stack of the silicon wafers are filled, the operation unit drives the packaging unit to vertically move downwards; and continuously transmitting the silicon wafer to the packaging unit through the transmission unit until the packaging unit is filled with the silicon wafer.
Further, after the packaging unit on one side is filled with the silicon wafers, the silicon wafers are rotated by 90 degrees or 180 degrees along the transmission unit and then are conveyed into another packaging unit until the packaging unit is filled with the silicon wafers.
The automatic discharging device for silicon wafer inspection and the control method thereof provided by the invention have the advantages of high automation degree, reasonable structural design, capability of ensuring the placing stability of the silicon wafers, improving the collection quantity of the silicon wafers, capability of ensuring the quality of the silicon wafers, good controllability and high working efficiency.
Drawings
FIG. 1 is a schematic structural diagram of an automatic blanking device for silicon wafer inspection according to an embodiment of the present invention;
FIG. 2 is a top view of a blanking device according to an embodiment of the present invention;
FIG. 3 is a side view of a blanking device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a packaging unit according to an embodiment of the present invention.
In the figure:
10. fixed station 20, transmission unit 21, main transmission section
22. Auxiliary transmission section 23, auxiliary transmission section 30, positioning unit
31. Through hole 32, detachable edge 40, packaging unit
41. Packing box 42, placing groove 50, operation unit
51. Horizontal frame 52, adjustable frame 53 and support frame
60. Connection unit
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments.
The invention provides an automatic blanking device for silicon wafer inspection, which is used for blanking and packaging large-size silicon wafers with the diameter of 200 plus 300mm, as shown in figure 1, wherein the silicon wafers can be round silicon wafers or square silicon wafers, the automatic blanking device comprises a fixed table 10, a transmission unit 20 for transmitting the movement of the silicon wafers, a packaging unit 40 for collecting the blanked silicon wafers, a positioning unit 30 for clamping and fixing the packaging unit 40, an operation unit 50 for controlling the vertical up-and-down movement of the packaging unit 40 and a connecting unit 60 for fixedly connecting the transmission unit 20 and the fixed table 10, wherein the transmission unit 20, the positioning unit 30 and the packaging unit 40 are all positioned above the fixed table 10 and are fixed on the upper end face of the fixed table 10 through the connecting unit 60, the transmission unit 20 and the positioning unit 30 are all arranged in parallel with the upper end face of the fixed table 10, the operation unit 50 is arranged on the side face of the fixed table 10 and is matched with the packaging unit 40, one end of the transmission unit 20 is connected with a discharging outlet for silicon wafer inspection, and the other end is connected with the positioning unit 30; the packing unit 40 is arranged at one end of the positioning unit 30 far away from the transmission unit 20, and the opening direction of the packing unit 40 is arranged towards one side close to the transmission unit 20; the operation unit 50 has one end connected to the fixing table 10 and the other end connected to the packing unit 40, and the operation unit 50 can vertically move the packing unit 40 up and down.
Specifically, as shown in fig. 1 to 3, the transmission unit 20 includes a main transmission section 21, a plurality of auxiliary transmission sections 22, and auxiliary transmission sections 23 respectively connected to the main transmission section 21 and the auxiliary transmission sections 22, the main transmission section 21 and the auxiliary transmission sections 23 are coaxially disposed, and the auxiliary transmission sections 22 are uniformly distributed along one end of the auxiliary transmission section 23 away from the main transmission section 21. In this embodiment, there are three auxiliary transmission segments 22, the included angles between the auxiliary transmission segment 22 and the auxiliary transmission segment 23 and between adjacent auxiliary transmission segments 22 are both 90 °, that is, one of the auxiliary transmission segments 22 and the auxiliary transmission segment 23 are coaxially disposed, the other two auxiliary transmission segments 22 are both perpendicular to the auxiliary transmission segment 23 and symmetrically disposed with respect to the auxiliary transmission segment 23, one ends of the three auxiliary transmission segments 22 close to the auxiliary transmission segment 23 are connected to one end of the auxiliary transmission segment 23 in common phase, the lengths of the auxiliary transmission segments 22 and the auxiliary transmission segments 23 are the same and are both located on the inner side of the upper end surface of the fixed station 10, and the main transmission segment 21 is located on the outer side of the fixed station 10. That is, the silicon wafer bundle inspection outlet enters the main transmission section 21, flows into the auxiliary transmission section 23 after passing through the main transmission section 21, and then flows to each auxiliary transmission section 22 through the auxiliary transmission section 23, the silicon wafer can adjust the path of the silicon wafer rotating and flowing to the packaging unit 40 through the auxiliary transmission section 22, and the silicon wafer can rotate 90 degrees clockwise from the main transmission section 21 through the auxiliary transmission section 23 from the rightmost auxiliary transmission section 22 to the auxiliary transmission section 22 at the middle position, and can also rotate 180 degrees clockwise to the auxiliary transmission section 22 at the left side; of course, the silicon wafer can also be rotated from the left side auxiliary transmission section 22 to the middle position auxiliary transmission section 22 by 90 degrees in a counterclockwise direction, or rotated from the left side auxiliary transmission section 22 to the right side auxiliary transmission section 22 by 180 degrees in a counterclockwise direction; the silicon wafer can also be rotated clockwise by 90 ° from the middle sub-transfer section 22 to the right sub-transfer section 22, and then rotated counterclockwise by 180 ° from the right sub-transfer section 22 to the left sub-transfer section 22. When the silicon wafers are transferred to each auxiliary transmission section 22, the motion state of the belt is controlled by the external controller, when the controller controls the corresponding auxiliary transmission section 22 to move, the other auxiliary transmission sections 22 stop moving, and the silicon wafers move along the moving auxiliary transmission sections 22 until the silicon wafers are transferred into the packaging units 40 on the positioning unit 30; when the packing unit 40 corresponding to the moving secondary transfer section 22 is filled with silicon wafers, the secondary transfer section 22 does not move any more, and the silicon wafers flowing through the secondary transfer section 23 flow to other moving secondary transfer sections 22 again until the packing unit 40 corresponding to the moving secondary transfer section 22 is filled with silicon wafers and then stops moving. The main transmission section 21, the auxiliary transmission section 22 and the auxiliary transmission section 23 are all located on the same horizontal plane and are all belt transmission, the width of each belt is smaller than the maximum width of the silicon wafer and larger than half of the width of the silicon wafer, the belts are arranged symmetrically to the axis of the silicon wafer, the belt transmission is a common structure in the field, and detailed description is omitted here. The transmission unit 20 with the structure is flexible in linkage, easy to control and simple in structure, is suitable for silicon wafers of various sizes and shapes, especially for transmission of large-size silicon wafers, ensures stability of silicon wafer placement by using friction between the horizontal moving speed belt of the transmission belt and the silicon wafers, is easy to change control of the silicon wafer flowing direction, does not generate other fragment risks, and can ensure quality of the silicon wafers.
Referring to fig. 1 and 2, the positioning units 30 are respectively fixedly disposed at an end of the auxiliary transmission section 22 far away from the auxiliary transmission section 23 and located outside the fixed station 10, that is, the number of the positioning units 30 is the same as that of the auxiliary transmission section 22, the positioning units 30 are located at the same level as the main transmission section 21, the auxiliary transmission section 22 and the auxiliary transmission section 23, the positioning units 30 are positioning plates with a rectangular structure, a through hole 31 with a rectangular structure is disposed at a side of the positioning unit 30 far away from the auxiliary transmission section 22, the packaging unit 40 is disposed through the through hole 31, the through hole 31 is a structure with a single side opening, a detachable edge 32 is disposed at a side of the through hole 31, the detachable edge 32 is hinged to the positioning units 30, so that the through hole 31 is detachably fixed, the packaging unit 40 is conveniently and fixedly disposed on the positioning units 30, the width of the positioning unit 30 is greater than that of the packaging unit 40, the, so that the packing unit 40 can be moved up and down in the thickness direction of the positioning unit 30, i.e., in the height direction of the packing unit 40.
Further, all the positioning units 30 are provided with packaging units 40 on the side away from the secondary conveying section 22, the packaging units 40 are vertically arranged through the thickness direction of the positioning units 30, the packaging units 40 are packaging boxes 41, and as shown in fig. 4, the number of the packaging boxes 41 is the same as that of the positioning units 30. The packing box 41 is provided with a plurality of parallel placing grooves 42 in the length direction, and the width of the placing grooves 42 is matched with the length of the silicon wafer. The heights of the placing grooves 42 are the same, a plurality of silicon wafers can be placed in the placing grooves 42, the depth of the placing grooves 42 is larger than half of the diameter or the side length of each silicon wafer and smaller than 4/5 of the diameter or the side length of each silicon wafer, the width of each placing groove 42 is smaller than that of the positioning unit 30, the lower end face of each placing groove 42 and the upper end face of each positioning unit 30 are arranged at the same height, and therefore the silicon wafers can be conveniently and horizontally placed in the placing grooves 42. In the blanking and loading process, dust-free paper can be placed on the lower end face of the placing groove 42 and used for placing silicon wafers in a cushioning mode. The packaging box 41 with the structure can be provided with a plurality of placing grooves 42, and each blanking device is provided with three packaging boxes 41, so that the number of packaged silicon wafers is increased, and the finished product quantity of silicon wafer packaging is increased.
Further, the operating unit 50 is a robot arm which is telescopically arranged, as shown in fig. 3, one robot arm is provided at each packing box 41, one end of the robot arm is connected to a motor provided in the fixed stand 10, and the other end is connected to the packing box 41. Specifically, the manipulator comprises a horizontal frame 51 and an adjustable frame 52, wherein the horizontal frame 51 and the adjustable frame 52 are horizontally arranged, inclined support frames 53 are arranged on the horizontal frame 51 and the adjustable frame 52, the support frames 53 are hinged with the horizontal frame 51 and the adjustable frame 52, and the support frames 53 can fix the horizontal frame 51 and the adjustable frame 52 so as to improve the strength of the horizontal frame 51 and the adjustable frame 52 and can enable the adjustable frame 52 to move up and down along the vertical direction. The adjustable frame 52 is fixed on a side surface of the packing box 41 away from the placing groove 42, the adjustable frame 52 can drive the packing box 41 to vertically move downwards along the length direction, i.e. the height direction, of the packing box 41, and the adjustable frame 52 can be a spring control structure, an air cylinder control structure, a sliding control structure, or the like, which is not limited specifically herein. The blanking collection is initial, the placing groove 42 of the lowest layer in the packing box 41 is arranged in the same position as the positioning unit 30, the placing groove 42 of the lowest layer is filled with the silicon wafer, after the packing box is filled with the silicon wafer, the adjustable frame 52 drives the packing box 41 to vertically move downwards, the placing groove 42 of the penultimate layer is arranged in the same position as the positioning unit 30, and the like. When the uppermost one of the placing grooves 42 is filled with the silicon wafer, the packing box 41 is stopped to receive the silicon wafer, the detachable side 32 is detached to separate the packing box 41 from the positioning unit 30, the adjustable frame 52 is detached to separate the operating unit 50 from the packing box 41, and the packing box 41 filled with the silicon wafer is taken out.
As shown in fig. 1, the connection unit 60 is disposed on the central axis of the fixed stage 10, the connection unit 60 is disposed perpendicular to the transfer unit 20 and is located right below the connection position of the sub-transfer section 22 and the auxiliary transfer section 23, and the connection unit 60 is connected to the transfer unit 20 and the fixed stage 10, respectively. The connecting unit 60 has a cylindrical shaft structure, and may have other structures, which are not limited in particular.
The automatic blanking device is particularly suitable for conveying large-size silicon wafers, can automatically sort the silicon wafers for blanking and collection, is provided with a plurality of uniformly distributed packaging boxes for collecting the silicon wafers, and each packaging box is provided with a plurality of placing grooves, so that qualified silicon wafers can be directly fed into the placing grooves in the packaging boxes without manual collection operation of personnel; the whole packaging box can automatically vertically move up and down under the control of the manipulator, and the placing groove filled with the silicon wafers moves down under the control of the manipulator; after the silicon chip is filled in the unilateral packing box, the silicon chip can be collected to the packing box unloading of opposite side along the automatic transmission unit, and the linkage is nimble, and easily control and simple structure are fit for the silicon chip of various size shapes, and the stationarity is good, easily changes the control of silicon chip circulation direction, and can not produce other piece risks.
A control method of an automatic blanking device for silicon wafer inspection comprises the blanking device, and specifically comprises the following steps:
the method comprises the following steps: the lowermost-layer placing grooves 42 of the packing boxes 41 in all the packing units 40 are disposed in horizontal alignment with the upper end face of the positioning unit 30.
Step two: the horizontally arranged silicon wafers move from the inspected blanking outlet to the main transmission section 21 in the transmission unit 20, the silicon wafers horizontally move forward to the auxiliary transmission section 23 through the main transmission section 21, when the silicon wafers reach one end of the auxiliary transmission section 23 far away from the main transmission section 21, the silicon wafers stay once, the system controls the operation of the auxiliary transmission section 22 positioned on the right side of the auxiliary transmission section 23, at the moment, other auxiliary transmission sections 22 stop operating, the silicon wafers move along the auxiliary transmission section 22 on the right side, and the silicon wafers reach the placing groove 42 on the lowest layer in the packing box 41 on the right side after passing through the positioning unit 30 until the placing groove 42 on the lowest layer is filled with the silicon wafers, and in the embodiment, 100 silicon wafers can be placed in one placing groove 42.
Step three: after the placing groove 42 at the lowest layer is filled with 100 silicon wafers, the manipulator in the right operation unit 50 drives the packing box 41 to vertically move downwards and enables the placing groove 42 at the penultimate layer to be horizontally aligned with the upper end surface of the positioning unit 30; step two is repeated and the silicon wafer is filled with the placement groove 42 of the penultimate layer.
Step four: and the manipulator in the right operation unit 50 drives the packing box 41 to vertically move downwards, enables the placing groove 42 at the last but one layer to be horizontally aligned with the upper end surface of the positioning unit 30, and repeats the second step and the third step until the right packing box 41 is filled with silicon wafers.
Step five: after the right packing box 41 is filled with silicon wafers, the silicon wafers from the inspected blanking outlet sequentially pass through the main transmission section 21 and the auxiliary transmission section 23, when the silicon wafers reach one end of the auxiliary transmission section 23 far away from the main transmission section 21, the silicon wafers are stopped, the system controls the operation of the auxiliary transmission section 22 coaxial with the auxiliary transmission section 23, other auxiliary transmission sections 22 stop operating at the moment, the silicon wafers rotate by 90 degrees and turn to horizontal linear movement, namely move along the coaxial auxiliary transmission section 22, then reach the placing groove 42 of the lowest layer in the coaxial packing box 41 after passing through the positioning unit 30 until 100 silicon wafers are filled in the placing groove 42 of the lowest layer, and the collection of the placing groove 42 of the next layer is started to be circulated until all the placing grooves 42 are filled with silicon wafers.
Step six: after the coaxial packaging box 41 is filled with silicon wafers, the silicon wafers pass through the auxiliary transmission section 23 again and stay for 1-3s, then the silicon wafers rotate by 90 degrees and turn to the left auxiliary transmission section 22 to move, at the moment, other auxiliary transmission sections 22 stop operating, then the silicon wafers pass through the positioning unit 30 and reach the placing groove 42 at the lowest layer in the packaging box 41 at the left side until the placing groove 42 at the lowest layer is filled with 100 silicon wafers, and the collection of the placing groove 42 at the next layer is started to be circulated until all the placing grooves 42 are filled with silicon wafers.
The control method of the blanking device provided by the invention has the advantages of high automation degree, reasonable structural design, capability of ensuring the stability of placing the silicon wafers, improving the collection quantity of the silicon wafers, capability of ensuring the quality of the silicon wafers, good controllability and high working efficiency.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. The automatic blanking device for silicon wafer inspection is characterized by comprising a fixed table, wherein a transmission unit, a packaging unit and a positioning unit are arranged above the fixed table, an operation unit matched with the packaging unit is arranged on the side surface of the fixed table, one end of the transmission unit is connected with an outlet of the silicon wafer inspection, and the other end of the transmission unit is connected with the positioning unit; the packaging unit penetrates through one end, far away from the transmission unit, of the positioning unit, and the opening direction of the packaging unit is arranged towards one side, close to the transmission unit; one end of the operation unit is connected with the fixed table, the other end of the operation unit is connected with the packaging unit, and the operation unit can enable the packaging unit to vertically move up and down.
2. The automatic blanking device for silicon wafer inspection according to claim 1, wherein the transmission unit comprises a main transmission section, a plurality of auxiliary transmission sections and auxiliary transmission sections respectively connected with the main transmission section and the auxiliary transmission sections, the main transmission section and the auxiliary transmission sections are coaxially arranged, and the auxiliary transmission sections are uniformly distributed along one ends of the auxiliary transmission sections far away from the main transmission section.
3. The automatic blanking device for silicon wafer inspection according to claim 2, wherein there are three secondary transmission sections, and the included angles between the secondary transmission section and the auxiliary transmission section and between the secondary transmission sections are both 90 °.
4. The automatic blanking device for silicon wafer inspection as claimed in claim 3, wherein the auxiliary transmission section and the auxiliary transmission section are both located inside the fixed table, and the main transmission section is located outside the fixed table.
5. The automatic blanking device for silicon wafer inspection according to claim 4, wherein the positioning units are respectively arranged at one end of the auxiliary transmission section, which is far away from the auxiliary transmission section, and are positioned outside the fixed table, and the main transmission section, the auxiliary transmission section and the positioning units are all positioned on the same horizontal plane.
6. The automatic silicon wafer inspection blanking device according to any one of claims 2 to 5, wherein the packaging units are vertically arranged through the thickness direction of the positioning units, and the number of the packaging units is the same as that of the positioning units; a plurality of parallel placing grooves are formed in the length direction of the packaging unit, and the width of each placing groove is matched with the length of the silicon wafer; the width of the placing groove is smaller than that of the positioning unit, and the lower end face of the placing groove and the upper end face of the positioning unit are arranged at the same height.
7. The automatic blanking device for silicon wafer inspection according to claim 6, wherein the operation unit is a mechanical arm which can be telescopically arranged, each packaging unit is provided with the mechanical arm, one end of the mechanical arm is connected with a motor arranged in the fixed table, and the other end of the mechanical arm is connected with the packaging unit.
8. The automatic blanking device for silicon wafer inspection according to any one of claims 1 to 5 and 7, further comprising a connection unit, wherein the connection unit is arranged perpendicular to the transmission unit and is respectively connected with the transmission unit and the fixing table.
9. A control method of an automatic blanking device for silicon wafer inspection is characterized in that the blanking device comprises the blanking device as claimed in any one of claims 1 to 8, silicon wafers horizontally arranged are conveyed to any packing unit penetrating through the positioning unit along the conveying unit, and the packing unit is driven to vertically move downwards by the operating unit when each pile of the silicon wafers is filled; and continuously transmitting the silicon wafer to the packaging unit through the transmission unit until the packaging unit is filled with the silicon wafer.
10. The method as claimed in claim 9, wherein when the packing unit at one side is filled with the silicon wafers, the silicon wafers are rotated by 90 ° or 180 ° along the transfer unit and then transferred to another packing unit until the packing unit is filled with the silicon wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911301663.6A CN112977949A (en) | 2019-12-17 | 2019-12-17 | Automatic discharging device for silicon wafer inspection and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911301663.6A CN112977949A (en) | 2019-12-17 | 2019-12-17 | Automatic discharging device for silicon wafer inspection and control method thereof |
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| CN112977949A true CN112977949A (en) | 2021-06-18 |
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| CN201911301663.6A Pending CN112977949A (en) | 2019-12-17 | 2019-12-17 | Automatic discharging device for silicon wafer inspection and control method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120233967A1 (en) * | 2011-03-16 | 2012-09-20 | CAMA1 S.p.A | Machine and method for cartoning articles |
| CN209023225U (en) * | 2018-09-30 | 2019-06-25 | 厦门依码信息科技有限公司 | Stip cigarette packing device |
| CN110092036A (en) * | 2019-05-31 | 2019-08-06 | 广东荣诚食品有限公司 | A kind of moon cake packaging production line |
| TWM586709U (en) * | 2019-08-09 | 2019-11-21 | 張哲維 | Material sorting and preparation device dedicated to flexible paper materials such as household paper |
| CN211365099U (en) * | 2019-12-17 | 2020-08-28 | 内蒙古中环光伏材料有限公司 | Automatic unloader of silicon chip inspection |
-
2019
- 2019-12-17 CN CN201911301663.6A patent/CN112977949A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120233967A1 (en) * | 2011-03-16 | 2012-09-20 | CAMA1 S.p.A | Machine and method for cartoning articles |
| CN209023225U (en) * | 2018-09-30 | 2019-06-25 | 厦门依码信息科技有限公司 | Stip cigarette packing device |
| CN110092036A (en) * | 2019-05-31 | 2019-08-06 | 广东荣诚食品有限公司 | A kind of moon cake packaging production line |
| TWM586709U (en) * | 2019-08-09 | 2019-11-21 | 張哲維 | Material sorting and preparation device dedicated to flexible paper materials such as household paper |
| CN211365099U (en) * | 2019-12-17 | 2020-08-28 | 内蒙古中环光伏材料有限公司 | Automatic unloader of silicon chip inspection |
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