CN112975028B - Semiconductor refrigerating piece welding device - Google Patents

Semiconductor refrigerating piece welding device Download PDF

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Publication number
CN112975028B
CN112975028B CN202110360207.XA CN202110360207A CN112975028B CN 112975028 B CN112975028 B CN 112975028B CN 202110360207 A CN202110360207 A CN 202110360207A CN 112975028 B CN112975028 B CN 112975028B
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China
Prior art keywords
welding
porcelain plate
pulling
tension
pulling component
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Active
Application number
CN202110360207.XA
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Chinese (zh)
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CN112975028A (en
Inventor
陈建民
赵丽萍
张文涛
惠小青
李永校
蔡水占
钱俊有
张建中
任保国
韩笑
冯玉洁
王军霞
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Henan Hongchang Electronics Co Ltd
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Henan Hongchang Electronics Co Ltd
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Publication date
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Priority to CN202110360207.XA priority Critical patent/CN112975028B/en
Publication of CN112975028A publication Critical patent/CN112975028A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating

Abstract

The invention relates to the technical field of production of semiconductor refrigerating pieces, and discloses a semiconductor refrigerating piece welding device and a semiconductor refrigerating piece welding method; the semiconductor refrigeration piece welding device is characterized in that a pulling component is respectively arranged on the left side and the right side of the welding platform, the left pulling component is arranged on the left side of the welding platform, and the right pulling component is arranged on the right side of the welding platform; the pulling part comprises a spring and a clamp connected with the spring, and the clamp is a part for clamping the side edge of the porcelain plate; a method for soldering semiconductor refrigerating element includes such steps as soldering semiconductor crystal grains to ceramic plate, and soldering while the side of ceramic plate has tension. The ceramic plate has the advantages that the crystal grains welded on the ceramic plate are not easy to fall off, the welding is firm, and the product quality is improved.

Description

Semiconductor refrigerating piece welding device
Technical Field
The invention relates to the technical field of production of semiconductor refrigerating pieces, in particular to a semiconductor refrigerating piece welding device and a semiconductor refrigerating piece welding method.
Background
The semiconductor refrigerating device comprises two ceramic insulating plates positioned on the upper surface and the lower surface, wherein the two ceramic insulating plates are an upper ceramic plate and a lower ceramic plate, a plurality of upper metal sheets are welded below the upper ceramic plate, a plurality of lower metal sheets are welded on the lower ceramic plate, and a plurality of grains are welded between the upper metal sheets and the lower metal sheets.
In the production process of semiconductor refrigerating piece, the welding of crystal grain on the porcelain plate is an important step, and the equipment used for welding crystal grain on the porcelain plate is the semiconductor refrigerating piece welding device.
The welding device for the semiconductor refrigerating piece is provided with a welding platform, the welding platform is a station for placing the porcelain plate, regular crystal grains are arranged on the porcelain plate during welding, a welding arm is arranged on the welding platform, the welding arm is provided with a welding head connected with a telescopic part, and the welding head can press the porcelain plate to finish welding of the semiconductor refrigerating piece during welding.
In the prior art, the semiconductor refrigeration piece welding device is not provided with a part for pulling the side face of the porcelain plate, and the welding method of the semiconductor refrigeration piece is also used for welding in a free state that the side face of the porcelain plate is not pulled, so that the defects that the crystal grains of the produced semiconductor refrigeration piece are not firmly welded and are easy to fall off are overcome, and the quality of products is influenced.
Disclosure of Invention
The invention aims at overcoming the defects, and provides a semiconductor refrigeration piece welding device and a semiconductor refrigeration piece welding method, wherein the crystal grains welded on a porcelain plate by crystal grain welding are not easy to fall off, are firmly welded and improve the product quality.
The technical scheme of the semiconductor refrigeration piece welding device is realized in such a way that the semiconductor refrigeration piece welding device comprises a bracket, wherein a welding platform is arranged on the bracket, the welding platform is a station for placing a porcelain plate, a welding arm is arranged on the welding platform, and the welding arm is provided with a welding head connected with a telescopic part; the method is characterized in that: the left side and the right side of the welding platform are respectively provided with a pulling component, the left pulling component is arranged on the left side of the welding platform, and the right pulling component is arranged on the right side of the welding platform; the pulling part comprises a spring and a clamp connected with the spring, and the clamp is a part for clamping the side edge of the porcelain plate.
Further, the front side and the rear side of the welding platform are respectively provided with a pulling component, the front pulling component is arranged on the front side of the welding platform, and the rear pulling component is arranged on the rear side of the welding platform.
Further, an adjusting mechanism for the relative position is arranged between the bracket and the pulling component.
Further, the support on install the slide, the part of pulling have the sliding block, the spring outer end connect on the sliding block, the sliding block install on the slide to there is locating part between sliding block and the slide.
Further, the clip has an engagement portion having a rubber lining.
Further, the clip engaging part is connected with an electric switch; when the electric switch is at one station, the clamp releases the side face of the clamped porcelain plate; the electric switch is arranged at the other station, and the clamp clamps the side surface of the porcelain plate; the sliding block is a trolley, and the trolley can run in the slideway.
Further, the trolley, the electric switch and the telescopic component are also connected with a control device.
The technical scheme of the welding method of the semiconductor refrigeration piece is realized by the method, which comprises the step of welding semiconductor crystal grains on a porcelain plate under the condition that the side surface of the porcelain plate has a tensile force.
Further, the condition that the side surface of the porcelain plate has a tensile force means that the left side surface, the right side surface, the front side surface and the back side surface have tensile forces.
Further, the welding process of the porcelain plate is 8-10 seconds, the condition that the side surface of the porcelain plate has tension force means that the tension force applied to the porcelain plate gradually rises along with the progress of welding, the tension force reaches a peak when the porcelain plate is welded to 4-5 seconds, then the peak tension force is kept until the welding is completed, and the tension force gradually drops after the welding is completed for 4-5 seconds.
Further, the peak value of the pulling force is 150-170N.
The beneficial effects of the invention are as follows: the semiconductor refrigeration piece welding device and the semiconductor refrigeration piece welding method have the advantages that crystal grains welded on the porcelain plate are not easy to fall off, the welding is firm, and the product quality is improved.
Drawings
Fig. 1 is a schematic top view of the present invention.
FIG. 2 is a schematic view of the cross-section in the direction A-A in FIG. 1.
FIG. 3 is a schematic view of an adjustment mechanism according to the present invention.
Fig. 4 is a schematic diagram of the connection of parts of the present invention.
The welding device comprises a bracket (1), a bracket (2), a welding platform (3), a station (4) for placing porcelain plates, a welding arm (5), a telescopic component (6), a welding head (7), a left pulling component (8), a right pulling component (9), a spring (10), a clip (11), a porcelain plate (12), a front pulling component (13), a rear pulling component (14), a slideway (15), a sliding block (16), a meshing part (17) and a rubber lining.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, the semiconductor refrigeration piece welding device comprises a bracket 1, wherein a welding platform 2 is arranged on the bracket, the welding platform is a station 3 for placing porcelain plates, a welding arm 4 is arranged on the welding platform, and the welding arm is provided with a welding head 6 connected with a telescopic part 5; the method is characterized in that: the left side and the right side of the welding platform are respectively provided with a pulling component, the left pulling component 7 is arranged on the left side of the welding platform, and the right pulling component 8 is arranged on the right side of the welding platform; the pulling part comprises a spring and a clamp 10 connected with the spring 9, wherein the clamp is a part for clamping the side edge of the porcelain plate 11.
The invention is arranged in such a way, when in use, the two sides of the welded porcelain plate can be clamped by the clamps, the porcelain plate is pulled towards the two sides, and meanwhile, the crystal grains on the porcelain plate are welded.
Further, the front side and the rear side of the welding platform are respectively provided with a pulling component, the front pulling component 12 is arranged on the front side of the welding platform, and the rear pulling component 13 is arranged on the rear side of the welding platform.
The invention can realize that the periphery of the porcelain plate has outward tension in the welding process, and the firmness of the welding crystal grains is higher.
Further, an adjusting mechanism for the relative position is arranged between the bracket and the pulling component.
The adjusting component is a component for adjusting the relative position between the bracket and the pulling component, and is shown in fig. 3 and is a schematic diagram of the adjusting component.
Further, a slide way 14 is installed on the support, the pulling component is provided with a sliding block 15, the outer end of the spring is connected to the sliding block, the sliding block is installed on the slide way, and a positioning component is arranged between the sliding block and the slide way.
The device is arranged in such a way, the position of the pulling part in the slideway can be adjusted, and the pulling force of the pulling part on the porcelain plate can be further adjusted. Adjustments may also be made as desired.
Further, the clip has an engagement portion 16 with a rubber lining 17.
The device can prevent the porcelain plate from being damaged when the meshing part clamps the porcelain plate.
Further, the clip engaging part is connected with an electric switch; when the electric switch is at one station, the clamp releases the side face of the clamped porcelain plate; the electric switch is arranged at the other station, and the clamp clamps the side surface of the porcelain plate; the sliding block is a trolley, and the trolley can run in the slideway.
Further, the trolley and the electric switch are also connected with a control device.
The device is arranged in such a way, can realize the joint operation of the electric switch and the trolley, and realizes numerical control according to the production process.
The method of soldering a semiconductor refrigeration member according to the present invention will be further described with reference to the following examples:
example 1
According to the conventional process, i.e., the porcelain plate is welded without tension, the first semiconductor refrigerating member 3000 is obtained.
Example 2
In the process of welding the porcelain plate, namely, the tensile force applied to the two sides of the porcelain plate is 100N, 3000 pieces of second semiconductor refrigerating piece are obtained.
Example 3
In the process of welding the porcelain plate, namely, the tensile force applied to the two sides of the porcelain plate is 120N, 3000 pieces of third semiconductor refrigerating piece are obtained.
Example 4
In the process of welding the porcelain plate, namely, the tensile force applied to the four sides (front, back, left and right) of the porcelain plate is 100N, a fourth semiconductor refrigerating element 3000 is obtained.
Example 5
In the process of welding the porcelain plate, the porcelain plate receives the tension of the side face, the welding process of the porcelain plate is 8-10 seconds, the condition that the left side face and the right side face of the porcelain plate have the tension means that the tension of the porcelain plate gradually rises along with the welding, the tension reaches a peak when the porcelain plate is welded to 4-5 seconds, then the peak tension is kept until the welding is completed, and the tension gradually drops after the welding is completed for 4-5 seconds, so that a fifth semiconductor refrigerating element 3000 is obtained.
Example 6
In the process of welding the porcelain plate, the porcelain plate receives the side tension, the welding process of the porcelain plate is 8-10 seconds, the condition that the front, back, left and right sides of the porcelain plate have the tension means that the tension received by the porcelain plate gradually rises along with the welding, the tension reaches a peak when the porcelain plate is welded to 4-5 seconds, then the peak tension is kept until the welding is completed, and the tension gradually drops after the welding is completed for 4-5 seconds, so that 3000 sixth semiconductor refrigerating pieces are obtained.
The following table is a statistical table of the number of damages to the semiconductor refrigeration components due to welding after a period of time
Conclusion: from the above embodiments, it can be seen that during the welding process, the porcelain plates are better welded when they are subjected to an outward pulling force, and in particular, the porcelain plates are more firmly welded when the four sides of the porcelain plates are all subjected to an outward pulling force.
And installing such process welds: the ceramic plate welding process is 8-10 seconds, the condition that the side face of the ceramic plate has tension force means that the tension force applied to the ceramic plate gradually rises along with the progress of welding, the tension force reaches a peak when the ceramic plate is welded to 4-5 seconds, then the peak tension force is kept until the welding is completed, and the tension force gradually drops after the welding is completed for 4-5 seconds. The effect is better.
Further, the peak value of the pulling force is 150-170N.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention, and they should be included in the scope of the present invention.

Claims (6)

1. The semiconductor refrigerating piece welding device comprises a bracket, wherein a welding platform is arranged on the bracket, the welding platform is a station for placing a porcelain plate, a welding arm is arranged on the welding platform, and the welding arm is provided with a welding head connected with a telescopic part; the method is characterized in that: the left side and the right side of the welding platform are respectively provided with a pulling component, the left pulling component is arranged on the left side of the welding platform, and the right pulling component is arranged on the right side of the welding platform; the pulling part comprises a spring and a clamp connected with the spring, and the clamp is a part for clamping the side edge of the porcelain plate;
the using method of the semiconductor refrigeration piece welding device comprises the following steps: the left pulling component is adopted to apply left pulling force of the side face to the porcelain plate, and the right pulling component is adopted to apply right pulling force of the side face to the porcelain plate; in the process of welding the porcelain plate, the porcelain plate receives the tension of the side face, the welding process of the porcelain plate is 8-10 seconds, the condition that the left side face and the right side face of the porcelain plate have the tension means that the tension of the porcelain plate gradually rises along with the welding, the tension reaches a peak when the porcelain plate is welded to 4-5 seconds, then the peak tension is kept until the welding is completed, and the tension gradually drops after the welding is completed for 4-5 seconds, so that the semiconductor refrigeration piece is obtained.
2. The semiconductor refrigeration piece bonding apparatus according to claim 1, wherein: the front side and the rear side of the welding platform are respectively provided with a pulling component, the front pulling component is arranged on the front side of the welding platform, and the rear pulling component is arranged on the rear side of the welding platform.
3. The semiconductor refrigeration member bonding apparatus according to claim 2, wherein: the support on install the slide, the part of pulling have the sliding block, the spring outer end connect on the sliding block, the sliding block install on the slide to there is locating part between sliding block and the slide.
4. A semiconductor refrigeration member bonding apparatus according to claim 3, wherein: the clip has an engagement portion having a rubber backing layer.
5. The semiconductor refrigeration piece welding device according to claim 4, wherein the engagement portion is connected with an electric switch; when the electric switch is at one station, the clamp releases the side face of the clamped porcelain plate; the electric switch is arranged at the other station, and the clamp clamps the side surface of the porcelain plate; the sliding block is a trolley, and the trolley can run in the slideway.
6. The semiconductor refrigeration piece bonding apparatus according to claim 5, wherein: the trolley, the electric switch and the telescopic component are also connected with a control device.
CN202110360207.XA 2021-04-02 2021-04-02 Semiconductor refrigerating piece welding device Active CN112975028B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110360207.XA CN112975028B (en) 2021-04-02 2021-04-02 Semiconductor refrigerating piece welding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110360207.XA CN112975028B (en) 2021-04-02 2021-04-02 Semiconductor refrigerating piece welding device

Publications (2)

Publication Number Publication Date
CN112975028A CN112975028A (en) 2021-06-18
CN112975028B true CN112975028B (en) 2023-09-26

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080090623A (en) * 2007-04-05 2008-10-09 현대중공업 주식회사 Un-deformed welded t-bar by pretension meth
CN103551766A (en) * 2013-10-30 2014-02-05 南车四方车辆有限公司 Metal box pre-stretching welding positioner and metal box pre-stretching welding method
CN104701450A (en) * 2013-12-06 2015-06-10 河南恒昌电子有限公司 Refrigeration member welding device
CN204644192U (en) * 2015-05-08 2015-09-16 河南鸿昌电子有限公司 A kind of samming cooling component welding machine
CN211347707U (en) * 2019-12-17 2020-08-25 大连保税区益照橡胶有限公司 Mechanical material tension testing device capable of adjusting tension

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080090623A (en) * 2007-04-05 2008-10-09 현대중공업 주식회사 Un-deformed welded t-bar by pretension meth
CN103551766A (en) * 2013-10-30 2014-02-05 南车四方车辆有限公司 Metal box pre-stretching welding positioner and metal box pre-stretching welding method
CN104701450A (en) * 2013-12-06 2015-06-10 河南恒昌电子有限公司 Refrigeration member welding device
CN204644192U (en) * 2015-05-08 2015-09-16 河南鸿昌电子有限公司 A kind of samming cooling component welding machine
CN211347707U (en) * 2019-12-17 2020-08-25 大连保税区益照橡胶有限公司 Mechanical material tension testing device capable of adjusting tension

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