CN112963747A - LED light bar manufacturing method and LED light bar - Google Patents
LED light bar manufacturing method and LED light bar Download PDFInfo
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- CN112963747A CN112963747A CN202110310882.1A CN202110310882A CN112963747A CN 112963747 A CN112963747 A CN 112963747A CN 202110310882 A CN202110310882 A CN 202110310882A CN 112963747 A CN112963747 A CN 112963747A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000007639 printing Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 16
- 238000000576 coating method Methods 0.000 claims abstract description 16
- 238000001035 drying Methods 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims description 27
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 20
- 239000004332 silver Substances 0.000 claims description 20
- 239000003973 paint Substances 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 238000005530 etching Methods 0.000 abstract description 5
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 5
- 238000003912 environmental pollution Methods 0.000 abstract description 4
- 239000002351 wastewater Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 99
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 239000006071 cream Substances 0.000 description 6
- 238000005286 illumination Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000010814 metallic waste Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The invention relates to a manufacturing method of an LED light bar and the LED light bar, comprising the following steps: providing a substrate; printing an insulating heat-conducting coating on the surface of the substrate, and drying the insulating heat-conducting coating to form an insulating heat-conducting layer; printing an electric conduction paste on at least part of the surface of the insulating and heat conduction layer to form an electric conduction layer; and connecting an LED lamp on the surface of the conducting layer to form an LED lamp strip. According to the invention, a printing mode is adopted to replace the traditional copper etching process to manufacture the LED light bar, so that the problem of environmental pollution caused by the easy generation of heavy metal wastewater is avoided.
Description
Technical Field
The invention relates to the technical field of LED lamps, in particular to a manufacturing method of an LED lamp bar and the LED lamp bar.
Background
The LED light source has advantages of long service life, low power consumption, fast response, small size, etc., and is widely used in various illumination fields, especially in the backlight of the liquid crystal display. In the prior art, an LED light source is fixed on a circuit board to form a light bar, and then the light bar is fixed on an aluminum extrusion or aluminum plate. And the aluminum plate that current lamp strip adopted has three layer construction: aluminum plate, heat insulating layer and copper line layer generally need adopted hot pressing copper cortex, exposure etching twice step when preparation copper line layer, but adopt the technology of sculpture copper to produce heavy metal waste water easily to cause the pollution to the environment.
Disclosure of Invention
In order to solve the technical problems or at least partially solve the technical problems, the application provides a manufacturing method of an LED light bar and the LED light bar.
In a first aspect, an embodiment of the present application provides a method for manufacturing an LED light bar, including the following steps:
providing a substrate;
printing an insulating heat-conducting coating on the surface of the substrate, and drying the insulating heat-conducting coating to form an insulating heat-conducting layer;
printing an electric conduction paste on at least part of the surface of the insulating and heat conduction layer to form an electric conduction layer;
and connecting an LED lamp on the surface of the conducting layer to form an LED lamp strip.
Preferably, after the step of forming the conductive layer, the method further comprises the steps of:
placing an LED lamp on a surface of the conductive layer;
and curing the conductive layer to form the LED lamp strip.
Preferably, after the step of forming the conductive layer, the method further comprises the steps of:
curing the conductive layer;
printing solder paste on the surface of the solidified conducting layer to form a solder paste layer;
and connecting an LED lamp on the surface of the solder paste layer to form an LED lamp strip.
Preferably, the LED lamp is welded on the surface of the solder paste layer in a reflow soldering mode.
Preferably, the substrate is an aluminum plate.
Preferably, the insulating and heat-conducting paint is white oil paint.
Preferably, the conductive paste is silver paste.
Preferably, the insulating and heat-conducting coating is dried by heating or UV illumination.
In a second aspect, the embodiment of the present application manufactures an LED light bar according to the manufacturing method of the first aspect, the LED light bar comprising: a substrate, an insulating heat-conducting layer, a conducting layer and an LED lamp, wherein,
the insulating heat conduction layer is arranged on the surface of the substrate and used for conducting heat generated by the LED lamp to the substrate;
the conducting layer is arranged on at least part of the surface of the insulating and heat conducting layer and used for conducting the LED lamp;
the LED lamp is fixedly connected to the surface of the conducting layer.
Preferably, the LED lamp strip further comprises a solder paste layer located between the conductive layer and the LED lamp, the lower surface of the solder paste layer is connected with the conductive layer, and the upper surface of the solder paste layer is fixedly connected with the LED lamp.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
(1) the LED lamp strip is manufactured by adopting a printing mode instead of the traditional copper etching process, so that the problem of environmental pollution caused by easily generated heavy metal wastewater is avoided.
(2) Through selecting the base plate and the insulating heat-conducting layer that have good heat-conducting property, can give off the heat that the LED lamp produced fast, effectively protect LED lamp device, prolonged life.
(3) Through adopting the mode that the tin cream layer carries out welded fastening to the LED lamp, saved a large amount of costs of labor, promote production efficiency.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
In the drawings:
fig. 1 is a flowchart illustrating a method for manufacturing an LED light bar according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing an LED light bar according to a second embodiment of the present invention
Fig. 3 is a flowchart of another method for manufacturing an LED light bar according to a second embodiment of the present invention;
fig. 4 is a schematic structural diagram of an LED light bar according to a third embodiment of the present invention;
fig. 5 is a schematic structural diagram of another LED light bar according to a fourth embodiment of the present invention;
reference numerals: 1-a substrate; 2-insulating heat-conducting layer; 3-a conductive layer; 4-LED lamps; 5-solder paste layer.
Detailed Description
For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the following description, it is to be understood that the orientations and positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "lateral", "vertical", "horizontal", "top", "bottom", "inner", "outer", "leading", "trailing", and the like are configured and operated in specific orientations based on the orientations and positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate that the device or element referred to must have a specific orientation, and thus, are not to be construed as limiting the present invention.
It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the following description, for purposes of explanation and not limitation, specific details are set forth, such as particular system structures, techniques, etc. in order to provide a thorough understanding of the embodiments of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
Fig. 1 is a flowchart of a method for manufacturing an LED light bar according to an embodiment of the present invention, as shown in fig. 1, the method provided in this embodiment may include the following steps:
s101, providing a substrate.
It should be noted that the substrate not only supports and fixes the LED lamp, but also dissipates heat generated during operation of devices such as the LED lamp rapidly, and therefore, the substrate needs to have good heat conductivity. Since the aluminum plate has good electrical and thermal conductivity and oxidation resistance, and is low in cost, in the present embodiment, the aluminum plate is selected as the substrate.
S102, printing the insulating heat-conducting paint on the surface of the substrate, and drying the insulating heat-conducting paint to form an insulating heat-conducting layer.
After the substrate is selected, the insulating heat-conducting coating is printed on the surface of the substrate, and then the insulating heat-conducting coating is dried, so that the insulating heat-conducting layer is formed. This insulating heat-conducting layer had both played the effect of insulating LED lamp and base plate, avoided the LED lamp to cause the short circuit in the in-process of using to play again with the heat conduction that the LED lamp produced on the base plate, be convenient for give off the heat fast. In this embodiment, the selected insulating and heat-conducting paint is white oil paint, wherein the specific steps of forming the insulating and heat-conducting white oil layer are as follows: the liquid white oil is coated on the surface of the substrate in a printing or spraying mode, and then the white oil printed on the substrate is dried in a heating or UV illumination mode, so that the insulating heat-conducting white oil layer is formed.
And S103, printing the conductive paste on at least part of the surface of the insulating and heat-conducting layer to form a conductive layer.
It should be noted that, in order to have good conductivity, the conductive paste is selected as the conductive paste, since the particles of the metallic silver in the conductive paste are the main components for embodying the conductive performance, generally speaking, the higher the content of the silver is, it is beneficial to improve the conductivity, but when the content of the silver exceeds the critical volume concentration, the conductivity of the conductive paste cannot be improved, therefore, the silver content in the conductive paste is 50-95%, because when the content of the conductive paste exceeds the range value, the conductivity has reached the highest value, waste can be caused by continuously increasing the silver content, and when the content of the conductive paste is lower than the range value, the resistance is unstable, which results in unstable conductivity. In this embodiment, the silver content of the conductive silver paste is 85%.
S104, connecting the LED lamp on the surface of the conducting layer to form an LED lamp strip.
Further, fig. 2 is a flowchart of a manufacturing method of an LED light bar according to a second embodiment of the present invention, and as shown in fig. 2, after the step of forming the conductive layer, the method further includes the following steps:
s1041, placing an LED lamp on the surface of the conductive layer;
s1042, curing the conducting layer to form the LED lamp bar.
After the conductive silver paste is arranged on the surface of the heat conduction insulation layer in a printing or dispensing mode, the LED lamp is directly placed on the surface of the silver paste, and then the LED lamp is firmly attached to the conductive silver paste through solidification of the silver paste. It should be noted that, when the LED lamp is connected to the silver paste, the mounting operation is performed directly after the silver paste is printed, without waiting for the silver paste to solidify.
Specifically, the LED lamp is soldered to the surface of the conductive layer by a curing means of reflow soldering.
The LED lamp is placed on the surface of the conducting layer through the SMT paster technology, and then the conducting layer is heated and cured in a reflow soldering mode, so that the LED lamp is bonded on the surface of the conducting silver paste of the conducting coating, and the LED lamp strip is manufactured.
According to the technical scheme provided by the embodiment, the insulating heat conduction coating is coated on the surface of the substrate to form an insulating heat conduction layer, then the conductive paste is coated on the surface of the insulating heat conduction layer, and finally the LED lamp is fixed on the surface of the conductive paste, so that the LED lamp strip is manufactured. The method adopts a printing mode to replace the traditional copper etching process to manufacture the LED light bar, thereby avoiding the problem of environmental pollution caused by the easy generation of heavy metal wastewater. And meanwhile, the substrate with good heat conduction performance and the insulating heat conduction layer are selected, so that heat generated by the LED lamp can be quickly dissipated, and the LED lamp device is effectively protected.
Fig. 3 is a flowchart of another method for manufacturing an LED light bar according to a third embodiment of the present invention, as shown in fig. 2, the method provided in this embodiment may include the following steps:
s201, providing a substrate.
It should be noted that the substrate not only supports and fixes the LED lamp, but also dissipates heat generated during operation of devices such as the LED lamp rapidly, and therefore, the substrate needs to have good heat conductivity. Since the aluminum plate has good electrical and thermal conductivity and oxidation resistance, and is low in cost, in the present embodiment, the aluminum plate is selected as the substrate.
S202, printing the insulating heat-conducting paint on the surface of the substrate, and drying the insulating heat-conducting paint to form an insulating heat-conducting layer.
After the substrate is selected, the insulating heat-conducting coating is printed on the surface of the substrate, and then the insulating heat-conducting coating is dried, so that the insulating heat-conducting layer is formed. This insulating heat-conducting layer had both played the effect of insulating LED lamp and base plate, avoided the LED lamp to cause the short circuit in the in-process of using to play again with the heat conduction that the LED lamp produced on the base plate, be convenient for give off the heat fast. In this embodiment, the selected insulating and heat-conducting paint is white oil paint, wherein the specific steps of forming the insulating and heat-conducting white oil layer are as follows: the liquid white oil is coated on the surface of the substrate by means of printing or spraying, and then the white oil coated on the substrate is dried by means of heating or UV illumination, so that the insulating and heat-conducting white oil layer is formed.
And S203, printing the conductive paste on at least part of the surface of the insulating and heat conducting layer to form a conductive layer.
It should be noted that, in order to have good conductivity, the conductive paste is selected as the conductive paste, since the particles of the metallic silver in the conductive paste are the main components for embodying the conductive performance, generally speaking, the higher the content of the silver is, it is beneficial to improve the conductivity, but when the content of the silver exceeds the critical volume concentration, the conductivity of the conductive paste cannot be improved, therefore, the silver content in the conductive paste is 50-95%, because when the content of the conductive paste exceeds the range value, the conductivity has reached the highest value, waste can be caused by continuously increasing the silver content, and when the content of the conductive paste is lower than the range value, the resistance is unstable, which results in unstable conductivity. In this embodiment, the silver content of the conductive silver paste is 85%.
And S204, drying the conductive layer.
It should be noted that, the conductive layer may be dried by heating, may also be dried by UV light, and may even be dried by other drying methods, which is not limited in this embodiment.
And S205, printing solder paste on the surface of the dried conductive layer to form a solder paste layer.
After the conducting layer is dried and cured, the solder paste is printed on the surface of the conducting layer, so that a solder paste layer is formed, heat is transferred to a welding area, the surface tension of the solder paste layer is reduced, the welding surface of the solder paste layer and the LED lamp is prevented from being oxidized again during welding, and a protective layer and a safe residual layer are formed on the surface.
S206, connecting the LED lamp on the surface of the solder paste layer to form the LED lamp strip.
Specifically, the LED lamp is soldered to the surface of the solder paste layer by means of reflow soldering.
Connect the LED lamp on the surface on tin cream layer through SMT paster technique, then adopt reflow soldering's mode to add thermal cure to tin cream layer again for the LED lamp bonds on tin cream layer is surperficial, thereby accomplishes the preparation of LED lamp strip.
The technical scheme that this embodiment provided is through the insulating heat conduction coating of printing on the surface at the base plate to form insulating heat-conducting layer, then with the coating of conductive paste on insulating heat-conducting layer's surface again, and dry the conductive paste and form the conducting layer, at the surface coating tin cream layer on the conducting layer after that, fix the LED lamp on tin cream layer's surface again at last, thereby accomplish the preparation of LED lamp strip. According to the method, a printing mode is adopted to replace a traditional copper etching process to manufacture the LED lamp strip, so that the problem of environmental pollution caused by the fact that heavy metal wastewater is easy to generate is avoided, and meanwhile, the substrate with good heat conduction performance and the insulating heat conduction layer are selected, so that heat generated by the LED lamp can be quickly dissipated, and LED lamp devices are effectively protected; and the LED lamp is welded and fixed through the tin paste layer, so that a large amount of labor cost is saved, and the production efficiency is improved.
Fig. 4 is a schematic structural diagram of an LED light bar manufactured by the method for manufacturing an LED light bar according to the fourth embodiment of the present invention, and in the description of the present embodiment, referring to fig. 4, it should be noted that the direction a refers to the up-down direction, where the side pointed by the arrow is the up direction.
This LED lamp strip includes: a substrate 1, an insulating heat-conducting layer 2, a conducting layer 3 and an LED lamp 4, wherein,
the insulating heat conduction layer 2 is arranged on the surface of the substrate 1 and is used for conducting heat generated by the LED lamp to the substrate 1;
the conducting layer 3 is arranged on at least part of the surface of the insulating and heat conducting layer 2 and is used for conducting the LED lamp 4;
the LED lamp 4 is fixedly attached to the surface of the conductive layer 3.
Fig. 5 is a schematic structural view of another LED light bar of the manufacturing method of the LED light bar according to the fifth embodiment of the present invention, and in the description of the present embodiment, referring to fig. 5, it should be noted that the direction a refers to the up-down direction, where the side pointed by the arrow is the up direction.
This LED lamp strip includes: a substrate 1, an insulating heat-conducting layer 2, a conducting layer 3, an LED lamp 4 and a tin paste layer 5, wherein,
the insulating heat conduction layer 2 is arranged on the surface of the substrate 1 and is used for conducting heat generated by the LED lamp 4 to the substrate 1;
the conducting layer 3 is arranged on at least part of the surface of the insulating and heat conducting layer 2 and is used for conducting the LED lamp 4;
the solder paste layer 5 is positioned between the conductive layer 3 and the LED lamp 4, the lower surface of the solder paste layer 5 is connected with the conductive layer 3, and the upper surface of the solder paste layer 5 is fixedly connected with the LED lamp 4;
the LED lamp 4 is fixedly attached to the surface of the solder paste layer 5.
It is to be understood that the foregoing examples, while indicating the preferred embodiments of the invention, are given by way of illustration and description, and are not to be construed as limiting the scope of the invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several changes and modifications can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (10)
1. A manufacturing method of an LED lamp bar is characterized by comprising the following steps:
providing a substrate;
printing an insulating heat-conducting coating on the surface of the substrate, and drying the insulating heat-conducting coating to form an insulating heat-conducting layer;
printing an electric conduction paste on at least part of the surface of the insulating and heat conduction layer to form an electric conduction layer;
and connecting an LED lamp on the surface of the conducting layer to form an LED lamp strip.
2. The method for manufacturing the LED light bar of claim 1, wherein after the step of forming the conductive layer, the method further comprises the following steps:
placing an LED lamp on a surface of the conductive layer;
and curing the conductive layer to form the LED lamp strip.
3. The method for manufacturing the LED light bar of claim 1, wherein after the step of forming the conductive layer, the method further comprises the following steps:
curing the conductive layer;
printing solder paste on the surface of the solidified conducting layer to form a solder paste layer;
and connecting an LED lamp on the surface of the solder paste layer to form an LED lamp strip.
4. The method for manufacturing the LED lamp strip according to claim 3, wherein the LED lamp is welded on the surface of the solder paste layer by means of reflow soldering.
5. The method for manufacturing the LED light bar of claim 1, wherein the substrate is an aluminum plate.
6. The method for manufacturing the LED light bar of claim 1, wherein the insulating and heat-conducting paint is white oil paint.
7. The method for manufacturing the LED light bar of claim 1, wherein the conductive paste is silver paste.
8. The method for manufacturing the LED light bar of claim 1, wherein the heat-conducting and insulating layer is dried by heating or UV light.
9. An LED light bar manufactured based on the method of any one of claims 1 to 8,
the method comprises the following steps: a substrate, an insulating heat-conducting layer, a conducting layer and an LED lamp, wherein,
the insulating heat conduction layer is arranged on the surface of the substrate and used for conducting heat generated by the LED lamp to the substrate;
the conducting layer is arranged on at least part of the surface of the insulating and heat conducting layer and used for conducting the LED lamp;
the LED lamp is fixedly connected to the surface of the conducting layer.
10. The LED lamp strip of claim 9, further comprising a solder paste layer disposed between the conductive layer and the LED lamp, wherein a lower surface of the solder paste layer is connected to the conductive layer, and an upper surface of the solder paste layer is fixedly connected to the LED lamp.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110310882.1A CN112963747A (en) | 2021-03-23 | 2021-03-23 | LED light bar manufacturing method and LED light bar |
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| CN202110310882.1A CN112963747A (en) | 2021-03-23 | 2021-03-23 | LED light bar manufacturing method and LED light bar |
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Application publication date: 20210615 |