CN112956005A - 包含向内弯曲引线的集成电路封装 - Google Patents

包含向内弯曲引线的集成电路封装 Download PDF

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CN112956005A
CN112956005A CN201980070700.9A CN201980070700A CN112956005A CN 112956005 A CN112956005 A CN 112956005A CN 201980070700 A CN201980070700 A CN 201980070700A CN 112956005 A CN112956005 A CN 112956005A
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leads
housing
lead
distal
leadframe
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M·L·迈耶斯
S·F·艾森哈特
R·J·塞伊
S·K·科杜里
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Texas Instruments Inc
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Texas Instruments Inc
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Abstract

本发明提供一种封装式半导体装置(100)，其包含：半导体裸片(180)，其经安装在引线框上；壳体(120)，其用于所述半导体裸片，所述壳体界定水平面及水平方向。所述引线框包含引线(102、103、108、109)，每一引线具有在所述壳体内部的内引线部分及外引线部分，所述外引线部分包含从所述壳体的侧壁(120c、120d)中的一者沿所述水平方向延伸出的第一部分(102a、103a、108a、109a)、包含垂直方向组件的过渡部分(102b、103b、108b、109b)及远端部分(102c、103c、108c、109c)，其中所述引线的所述远端部分全部在所述水平面上。所述外引线部分在具有从所述壳体沿所述水平方向向外延伸的所述远端部分的鸥翼引线形状(103、109)与使其远端部分朝向所述壳体沿所述水平方向向内延伸的向内延伸引线(102、108)之间交替。所述引线框由单个引线框组成。

Description

包含向内弯曲引线的集成电路封装
技术领域
本发明涉及用于集成电路(IC)封装的引线布置。
背景技术
已知对至少一个IC裸片提供支撑，提供保护以免受环境影响，且使IC裸片能够被表面安装到印刷电路板(PCB)并与印刷电路板互连的多种半导体IC封装。一种常规封装配置包括具有裸片垫的引线框及围绕裸片垫的多个引线。对于塑料封装，在以顶侧朝上的方式进行IC裸片接合之后，通常后接导线接合，或在以顶侧朝下的方式进行倒装芯片安装之后，接着通过利用引线框来实行模制工艺以形成模制壳体，使得可通过切割及修整凸出到壳体外部的引线来获得半导体封装。
鸥翼引线从封装材料的侧壁表面大体上水平地延伸出壳体，接着朝下沿着具有水平及垂直分量的对角线路径延伸，且接着再次沿水平方向延伸出以提供适合于焊接到PCB的远端部分。鸥翼引线通常用于表面安装芯片上，例如四方扁平封装(QFP)及小外形集成电路(SOIC)。已知与扁平引线封装相比，鸥翼封装基于在客户的PCB上的封装安装期间熔融焊料的表面张力而提供优越的自对准性能，即使有一些位移也是如此。
已知小外形鸥翼IC封装在功能密度(即，其引脚计数)方面受标准化PCB焊盘图案间隔要求限制。在不增加PCB制造复杂性(引脚到引脚或引线到引线间隔)及封装总大小的情况下，在给定电路板面积中允许更多引脚(或引线)的需求日益增长。受影响的封装类型包含SOIC、小外形封装(SOP)、微小外形封装(MSOP)、收缩型小外形封装(SSOP)、薄型小外形封装TSOP)、薄型收缩型小外形封装(TSSOP)、小外形晶体管(SOT)及薄型小外形晶体管(TSOT)。常规SOP鸥翼封装具有为0.4mm(TSSOP)到0.95mm(SOT)的引脚间距及0.2mm到0.5mm的引脚宽度。出自所有此类封装的所有引线的延伸引线部分呈相同鸥翼形状。
发明内容
提供本发明内容以按简化形式介绍下文在包含所提供附图的具体实施方式中进一步描述的所揭示概念的简要选择。本发明内容并非意在限制所主张标的物的范围。
所揭示方面包含一种引线框设计，所述引线框设计具有与向内弯曲引线交替的鸥翼引线，所述向内弯曲引线使其远端扁平(水平)端部分朝向封装的壳体向内弯曲。已认识到使交替引线弯曲而其远端部分朝向壳体弯曲而非常规地像鸥翼引线那样全部向外弯曲，允许我们增加引线(或引脚)密度同时维持相同引线宽度及合理引线间距。向内弯曲引线可任选地在封装壳体下方延伸。
一种封装式半导体装置包含：半导体裸片，其安装在引线框上；壳体，其用于所述半导体裸片，所述壳体界定水平面及水平方向。所述引线框包含引线，每一引线具有在所述壳体内部的内引线部分及外引线部分，所述外引线部分包含从所述壳体的侧壁中的一者沿所述水平方向延伸出的第一部分、包含垂直方向组件的过渡部分及远端部分，其中所述引线的所述远端部分全部在所述水平面上。所述外引线部分在具有从所述壳体沿所述水平方向向外延伸的所述远端部分的鸥翼引线形状与使其远端部分朝向所述壳体沿所述水平方向向内延伸的向内延伸引线之间交替。所述引线框由单个引线框组成。
附图说明
现在将参考附图，所述附图不一定按比例绘制，其中：
图1是实例封装式半导体装置的横截面图，其具有与向内弯曲引线交替的鸥翼引线，所述向内弯曲引线使其远端朝向封装的壳体向内弯曲，其中IC上的接合垫被导线接合到所述引线。
图2A是图1中所展示的封装式半导体装置的仰视图，其具有再次任选地在壳体下方延伸的向内弯曲引线的远端。图2B是图1A中所展示的封装式半导体装置的侧视图。图2C是图1A中所展示的实例封装式半导体装置的俯视透视图。图2D是图1中所展示的实例封装式半导体装置的仰视透视图。
图3A是根据实例方面的封装式装置的仰视透视图，其使其向内弯曲的偶数引线在壳体下方弯曲且在每一侧上连接在一起以提供更好的热性能。图3B是根据实例方面的封装式装置的仰视透视图，其使其向内弯曲的偶数引线在裸片垫下方弯曲以提供更好的热性能。
图4是实例封装式半导体装置的部分露出的俯视透视图，其用以展示示出为引线上倒装芯片(FCOL)接合布置的焊料特征，其中半导体裸片的接合垫上的焊料特征接触包含与向内弯曲引线交替的鸥翼引线的相应。
图5A到5D展示用于形成所揭示封装式半导体装置的实例方法中的步骤，所述封装式半导体装置具有包含与向内弯曲引线交替的鸥翼引线的引线框。
图6A展示PCB的焊盘垫的占用面积，其具有用于安装常规8引脚TSSOP封装的引线的直插焊盘垫，其中展示一些实例间隔距离，而图6B展示另一PCB的焊盘垫的占用面积，其具有用于安装具有作为向内弯曲引线的交替引线的所揭示10引脚TSSOP封装的引线的交错焊盘垫，这表明我们可增加引线间隔同时增加引线计数。
图6C展示图2A到D中所展示的所揭示IC封装，其具有以图6B中所展示的PCB上的交错配置安装到焊盘垫上的交替向内弯曲引线。
具体实施方式
参考附图描述实例方面，其中类似参考数字用于指定类似或等效元件。所说明的动作或事件的排序不应被认为是限制性的，因为一些动作或事件可能以不同顺序发生及/或与其它动作或事件同时发生。此外，可能不需要一些所说明动作或事件来实施根据本发明的方法。
图1是实例封装式半导体装置100的横截面图，其具有与向内弯曲引线102及108交替的被展示为103及109的鸥翼引线，所述向内弯曲引线102及108使其远端部分102c、108c朝向封装的壳体120(展示一模制壳体)向内弯曲，其中半导体裸片180上的接合垫180a通过接合导线161被导线接合到相应引线。所述引线还在壳体120内部全部处于同一水平面上，这是因为其由同一金属片形成。下文所描述的图4展示替代FCOL接合布置。
半导体裸片180被展示为其底侧通过裸片附接材料181(例如，环氧树脂)附接到裸片垫121。半导体裸片180可为IC或离散装置裸片，例如功率晶体管。半导体裸片180可为多个裸片(堆叠式或侧向)，且可包含传感器或无源组件(例如，非半导体，例如电容器、电阻器、电感器)。尽管壳体120在图1中被展示为模制壳体，但更一般地，壳体120还可包括陶瓷壳体。壳体120具有各自界定水平面及水平平面内方向的顶表面120a及底表面120b，且在底表面120b与顶表面120a之间包含第一侧壁120c及与所述第一侧壁相对的至少第二侧壁120d。
外引线部分在使其远端部分103c及109c从壳体120沿水平方向向外延伸的鸥翼引线形状(被描述为奇数引线的引线103及109)与使其远端部分102c及108c朝向壳体材料120沿水平方向向内延伸的向内弯曲引线(被描述为偶数引线的102及108)之间交替。替代地，因为如本文中所使用，术语‘偶数’及‘奇数’可互换(只要所述引线交替地向内弯曲及向外弯曲即可)，所以鸥翼形引线可为偶数引线且向内弯曲引线可为奇数引线。
可见向内弯曲引线102、108是C形或J形的。向内弯曲引线102、108的远端部分102c、108c被展示为任选地在壳体120下方延伸。所述引线框由单个引线框组成。所揭示引线框是单个引线框表示它们是完全没有将原本分离的引线框块接合在一起的任何接头、粘合剂或接合材料的相同材料(例如，铜)的单个(或单一)块，使得所揭示引线框与其中两个堆叠式引线框通过粘合剂材料彼此粘合的接合式引线框布置明显不同。
所述引线各自具有在壳体120内的内引线部分及外引线部分，所述外引线部分包含从第一侧壁120c及第二侧壁120d中的一者沿水平方向延伸出的第一部分102a、103a、108a、109a，包含垂直方向组件的过渡部分102b、103b、108b及109b，及远端部分102c、103c、108c及109c。远端部分102c、103c、108c及109c全部在由壳体120的顶表面120a及底表面120b界定的相同水平面上。如本文中所使用，在相同水平面上表示沿正交于水平方向的z(高度)方向的大体上相同高度，在本文中被定义为距参考平面的平均高度全部不超过±0.1mm(约4密耳)。例如，远端部分102c、103c、108c及109c的顶表面具有零的最小距离(对于非裸露裸片垫来说接触壳体120的底部)到引线框材料的厚度(通常从4密耳到8密耳)的3/4的最大距离，其因此被计算为距壳体120的底表面120b最大为3密耳(0.076mm)到6密耳(0.152mm)。
在封装的底部上的裸露裸片垫的情况下，向内弯曲引线将不在裸片垫下方延伸，且裸片垫的底表面120b及向内弯曲引线的远端的底部的垂直偏移距离在底座平面上应接近于零，在本文中被定义为在1密耳(0.025mm)内。对于底部裸露裸片垫配置，裸片垫的底部与向内弯曲引线之间的这个接近于零的垂直偏移是为了确保可在向内弯曲引线与裸露裸片垫两者之间进行到PCB上的相应焊盘垫的可靠焊料互连。
对于整个封装式装置100仅使用一个引线框使得能够利用一个标准厚度引线框制造所有引线，所述引线在壳体内部位于相同水平面上(归因于由相同金属片形成)，在大体上相同的平面(高度)上水平地从封装的壳体120出来且一直到其远端部分102c、103c、108c及109c的端都保持在相同平面上。这个方面通过实现在相同高度施加焊料(通常将远端部分102c、103c、108c及109c焊接到PCB)来简化封装设计且降低组装成本。
图2A是图1中所展示的封装式半导体装置100的仰视图，其具有再次任选地在壳体120的底表面120b下方延伸的向内弯曲引线102、104、108及110的远端部分102c、103c、108c及109c。鸥翼引线被展示为101、103、105、107、109及111。图2B是图1中所展示的封装式半导体装置100的侧视图。图2C是图1A中所展示的实例封装式半导体装置100的俯视透视图，其展示远端部分101c、102c、103c、105c、107c、109c及111c。图2D是图1中所展示的实例封装式半导体装置100的仰视透视图，其展示远端部分101c、102c、103c、104c、105c、106、107c、108c、109c、110c及111c。
图3A是根据实例方面的封装式装置300的仰视透视图，其使其向内弯曲的偶数引线102及104与108及110在壳体120下方弯曲且在每一侧上连接在一起以提供更好的热性能。图3B是根据实例方面的封装式装置350的仰视透视图，其使其在裸片垫121下方弯曲的偶数引线102及104与108及110向内弯曲以提供更好的热性能。而且，可存在引线弯曲以通过利用常规拉杆或通过模制之前在引线弯曲之后添加金属连接器来使向内弯曲引线在模制之前接触裸片垫。
图4是实例封装式半导体装置400的部分露出的俯视透视图，其用以展示示出为FCOL接合布置的焊料特征418，其中半导体裸片180的接合垫上的焊料特征418接触展示为引线401、402、403、407、408及409的相应引线。所述焊料特征可包括焊料球或焊料封盖(例如，铜)柱。向内弯曲引线被展示为402及408且鸥翼引线被展示为401、403、407及409。
图5A到5D展示用于形成所揭示封装式半导体装置的实例方法中的步骤，所述封装式半导体装置具有包含与向内弯曲引线交替的鸥翼引线的引线框。通常，封装式装置组装过程将仅存在有限所需变化。所揭示方法通常可重复使用当前封装装置组装过程中的所有相同步骤，其中在形成期间的一个额外步骤是使偶数引线向内弯曲，如下文在图4C中所描述。引线弯曲可从常规布置开始，所述常规布置包括具有多个引线框的引线框片，每一引线框具有从展示为在IC封装的至少2侧上的IC封装模制壳体的封装材料的侧壁延伸出的多个线性引线。
图5A展示在引线弯曲之前的实例引线弯曲设备，其包含可为标准夹具的夹具510、包含砧座部分515a及515b(参见图5B中的砧座部分515b)的所揭示砧座515(图5D中所展示)与包含冲头1 520a及冲头2 520b(参见图5C中的冲头2 520b)的所揭示冲头。图5B展示引脚弯曲设备的夹具510、砧座515及冲头1 520a，其被展示为针对用于弯曲的第一弯曲步骤配置，其中奇数引线的外部引线部分意在为鸥翼引线且偶数引线的外部引线部分意在为向内弯曲引线。砧座515被展示为在接触交替的展示为砧座部分515a的奇数引脚与展示为砧座部分515b的偶数引脚之间进行修改，且冲头1 520a的方向如所展示那样均沿垂直方向向下移动。
砧座515因此被修改为接触交替引脚(偶数及奇数)，一个砧座部分515a经配置以处理奇数引线以提供鸥翼形状(两个90度曲线)，且另一砧座部分组515b经配置以提供仅一个大体上90度曲线。偶数引线包含第二弯曲步骤以使其朝向壳体120向内弯曲。在图5C中所展示的第二弯曲步骤中，引导冲头2 520b以使偶数引线的端在水平(xy)平面中朝向壳体120向内弯曲。图5D展示具有两个冲头(施加到所有引线的冲头1 520a及仅施加到意为向内弯曲引线的引线的冲头2 520b)的实例引线弯曲设备的另一视图。尽管砧座被展示为515，但是如上文所描述，砧座515在接触交替的展示为砧座515a的奇数引脚与展示为砧座515b的偶数引脚之间进行修改，且冲头1 520a的方向如所展示那样均沿垂直方向向下移动。
所揭示引线框引线弯曲可应用于多种引线框类型，包含冲压及蚀刻引线框、粗糙及光滑引线框以及具有或没有涂层/镀层的引线框。通常不需要对封装及运送介质或工艺(相同管、带/卷等)进行改变。
所揭示方面可经集成到多种组装流程中以形成多种不同半导体IC装置及相关产品。所述组合件可包括单个半导体裸片或多个半导体裸片，例如包括多个堆叠式半导体裸片的PoP配置。可使用多种封装衬底。半导体裸片可包含其中的各种元件及/或其上的层，包含势垒层、电介质层、装置结构、有源元件及无源元件，包含源极区、漏极区、位线、基极、发射极、集电极、导电线、导电通孔等。此外，可通过包含双极、绝缘栅双极晶体管(IGBT)、CMOS、BiCMOS及MEMS的多种工艺来形成半导体裸片。
实例
所揭示方面通过以下特定实例进一步说明，所述特定实例不应以任何方式解释为限制本发明的范围或内容。
图6A展示PCB的焊盘垫601到608的占用面积，其经配置有用于安装常规8引脚TSSOP封装的引线的直插焊盘垫，其中展示一些实例间隔距离。图6B展示另一PCB的焊盘垫651到655及657到661的占用面积，其经配置有用于安装具有作为向内弯曲引线的交替引线的所揭示10引脚TSSOP封装的引线的交错焊盘垫，这表明我们可增加引线间隔同时增加引线计数。如上文所描述，内焊盘垫可短接在一起以增强热或电性能。PCB上的焊盘垫通常经进一步布线以与PCB上的其它组件接触。
PCB可呈多种配置，包含多层、柔性或刚性、陶瓷或金属包层。焊料或其它导电附接材料(例如，焊料)通常将封装的引线电地及机械地连接到PCB的焊盘垫。结果表明，通过使用包含与向内弯曲引线交替的鸥翼引线的所揭示引线框，我们可将引线间隔从0.20mm增加到0.24mm，同时还将封装引线计数从8个引脚增加到10个引脚。图6C展示图2A到D中所展示的所揭示IC封装，其具有以图6B中所展示的交错配置安装到PCB 650的焊盘垫651到655及657到661上的交替向内弯曲引线。
与本发明相关的领域的技术人员将明白，在所主张发明的范围内，所揭示方面的许多变动是可能的，且可在不背离本发明的范围的情况下对上述方面进行进一步添加、删除、置换及修改。

Claims (20)

1.一种封装式半导体装置，其包括：
半导体裸片，其具有安装在引线框上的顶侧接合垫；
壳体，其用于所述半导体裸片，所述壳体具有界定水平面及水平方向的底表面及顶表面，在所述底表面与所述顶表面之间包含第一侧壁及与所述第一侧壁相对的至少第二侧壁；
其中所述引线框包括：
多个引线，每一引线具有在所述壳体内部的内引线部分及外引线部分，所述外引线部分包含从所述第一及第二侧壁中的一者沿所述水平方向延伸出的第一部分、包含垂直方向组件的过渡部分及远端部分，其中所述多个引线的所述远端部分全部在所述水平面上；
其中所述外引线部分在具有从所述壳体沿所述水平方向向外延伸的所述远端部分的鸥翼引线形状与具有朝向所述壳体沿所述水平方向向内延伸的所述远端部分的向内延伸引线之间交替，且
其中所述引线框由单个引线框组成。
2.根据权利要求1所述的封装式半导体装置，其中所述向内延伸引线的所述远端部分中的至少一者在所述壳体的每一侧上连接在一起。
3.根据权利要求1所述的封装式半导体装置，其中所述远端部分在所述壳体下方延伸。
4.根据权利要求1所述的IC封装，其中所述半导体裸片以引线上倒装芯片FCOL配置安装在所述多个引线上。
5.根据权利要求1所述的IC封装，其中所述壳体包括模制壳体。
6.根据权利要求1所述的IC封装，其中所述半导体裸片的所述接合垫被倒装芯片附接到所述内引线部分。
7.根据权利要求1所述的IC封装，其中所述引线框进一步包括裸片垫，且其中所述半导体裸片以其顶侧朝上的方式安装在所述裸片垫上，进一步包括在所述接合垫与所述内引线部分之间的接合导线。
8.根据权利要求1所述的IC封装，其中所述向内延伸引线是C形或J形的。
9.根据权利要求1所述的IC封装，其中所述远端部分的底表面全部在从所述壳体的所述底表面测量的固定距离±0.1mm内。
10.一种经配置用于封装式半导体装置的引线框，所述封装式半导体装置包含半导体裸片，所述半导体裸片包含具有第一侧壁及与所述第一侧壁相对的至少第二侧壁的壳体，其中至少一个半导体裸片在其中具有顶侧接合垫，所述引线框包括：
多个引线，每一引线具有在所述壳体内部的内引线部分及外引线部分，所述外引线部分包含从所述第一及第二侧壁中的一者沿水平方向延伸出的第一部分、包含垂直方向组件的过渡部分及远端部分，其中所述多个引线的所述远端部分全部在水平面上；
其中所述外引线部分在具有从所述壳体沿所述水平方向向外延伸的所述远端部分的鸥翼引线形状与具有朝向所述壳体沿所述水平方向向内延伸的所述远端部分的向内延伸引线之间交替，且
其中所述引线框由单个引线框组成。
11.根据权利要求10所述的引线框，其中所述向内延伸引线的所述远端部分中的至少一者在所述壳体的每一侧上连接在一起。
12.根据权利要求10所述的引线框，其中所述远端部分在所述壳体下方延伸。
13.根据权利要求10所述的引线框，其中所述半导体裸片的所述接合垫被倒装芯片附接到所述内引线部分。
14.根据权利要求10所述的引线框，其中所述引线框进一步包括裸片垫，且其中所述半导体裸片以其顶侧朝上的方式安装在所述裸片垫上，进一步包括在所述接合垫与所述内引线部分之间的接合导线。
15.根据权利要求10所述的引线框，其中所述向内延伸引线是C形或J形的。
16.根据权利要求10所述的引线框，其中所述远端部分的底表面全部在从所述壳体的底表面测量的固定距离±0.1mm内。
17.一种组装封装式半导体装置的方法，其包括：
在具有多个引线的引线框上安装具有顶侧接合垫的半导体裸片，每一引线具有在用于所述半导体裸片的壳体内部的内引线部分，所述壳体具有界定水平面及水平方向的底表面及顶表面，在所述底表面与所述顶表面之间包含第一侧壁及与所述第一侧壁相对的至少第二侧壁；
引线弯曲所述多个引线的远端引线部分以交替地形成鸥翼引线形状及具有朝向所述壳体向内弯曲的远端的向内延伸引线，
其中所述封装式IC由单个引线框组成且其中所述多个引线的远端部分全部在所述水平面上。
18.根据权利要求17所述的方法，其中所述引线弯曲包括使用包含夹具、砧座及冲头的引线弯曲设备，其中所述砧座可修改为接触交替引线，其中在第一引线弯曲步骤中使用一个砧座布置以提供所述鸥翼引线形状，且另一砧座布置经配置以对所述后来形成的向内延伸引线提供仅一个大体上90度曲线，进一步包括第二弯曲步骤以选择性地使具有所述大体上90度曲线的所述引线朝向所述壳体向内弯曲以完成所述向内延伸引线。
19.根据权利要求17所述的方法，其中所述向内延伸引线是C形或J形的。
20.根据权利要求17所述的方法，其进一步包括将所述多个引线连接到印刷电路板PCB的呈交错配置的焊盘垫。
CN201980070700.9A 2018-11-28 2019-11-21 包含向内弯曲引线的集成电路封装 Pending CN112956005A (zh)

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