CN112951348B - Manufacturing method of AlSc target for improving chip manufacturing yield - Google Patents
Manufacturing method of AlSc target for improving chip manufacturing yield Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- LUKDNTKUBVKBMZ-UHFFFAOYSA-N aluminum scandium Chemical compound [Al].[Sc] LUKDNTKUBVKBMZ-UHFFFAOYSA-N 0.000 claims abstract description 242
- 230000007547 defect Effects 0.000 claims abstract description 116
- 239000013077 target material Substances 0.000 claims abstract description 102
- 238000000034 method Methods 0.000 claims abstract description 41
- 230000008439 repair process Effects 0.000 claims abstract description 29
- 230000002950 deficient Effects 0.000 claims abstract description 9
- 238000000227 grinding Methods 0.000 claims description 40
- 238000004140 cleaning Methods 0.000 claims description 22
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 15
- 238000005245 sintering Methods 0.000 claims description 11
- 238000001513 hot isostatic pressing Methods 0.000 claims description 10
- 238000007689 inspection Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- 239000011812 mixed powder Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000000644 propagated effect Effects 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 20
- 238000003754 machining Methods 0.000 description 15
- 238000003672 processing method Methods 0.000 description 12
- 239000000843 powder Substances 0.000 description 10
- 238000005498 polishing Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 230000033001 locomotion Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- -1 aluminium scandium Chemical compound 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000004576 sand Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000000608 laser ablation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000004549 pulsed laser deposition Methods 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 229910000542 Sc alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16C—COMPUTATIONAL CHEMISTRY; CHEMOINFORMATICS; COMPUTATIONAL MATERIALS SCIENCE
- G16C60/00—Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/90—Determination of colour characteristics
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10132—Ultrasound image
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computing Systems (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Quality & Reliability (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention relates to the field of targets, in particular to a manufacturing method of an AlSc target for improving the chip manufacturing yield, which comprises the steps of obtaining an internal image of the AlSc target by utilizing an ultrasonic flaw detector, clearly knowing whether the inside of the AlSc target has defects, comparing the obtained size information of the defects with preset size information, and clearly obtaining three results that the AlSc target is qualified and unqualified but meets repair standards and unqualified and does not meet repair standards; through the subsequent target repairing step, defective parts of the unqualified aluminum scandium target material meeting the repairing standard can be removed, so that the original unqualified aluminum scandium target material can be converted into qualified products; the yield of the aluminum scandium target material is improved, and the manufacturing cost of the aluminum scandium target material is reduced; in addition, the method ensures the yield of the aluminum scandium target material and correspondingly reduces the phenomena of arcing and the like in the process flow of actually applying the aluminum scandium target material to manufacturing chips.
Description
Technical Field
The invention relates to the field of targets, in particular to a manufacturing method of an AlSc target for improving the chip manufacturing yield.
Background
In the fabrication of high performance chip filters, aluminum scandium material (AlSc) is indispensable, commonly referred to as aluminum scandium target (AlSc target).
In the prior art, the reject ratio of the aluminum scandium target material is higher, and the reject ratio of the chip is caused by the fact that the chip is easy to generate bad phenomena such as arcing and the like in the process of manufacturing the chip. The root cause of the method is that in the manufacturing process of the aluminum scandium target, the aluminum scandium target contains impurities or gaps exist in the powder die casting process, so that pores exist on the surface and inside of the aluminum scandium target when the aluminum scandium target is finally manufactured, and the defect of the aluminum scandium target is caused.
However, in the prior art, although an image of the inside of the aluminum scandium target can be obtained through an ultrasonic flaw detector, and whether a defect exists in the image can be judged, the specific size of the defect cannot be obtained, and whether the defect meets the subsequent processing precondition cannot be clarified, so that after the image of the inside of the aluminum scandium target is obtained through the ultrasonic flaw detector in the prior art, if the defect exists, the defective aluminum scandium target is directly judged as a disqualified aluminum scandium target; the disqualified aluminum scandium target material can only be recycled for remanufacturing, so that the manufacturing cost of the aluminum scandium target material is greatly increased.
Therefore, in the prior art, how to improve the yield of the aluminum scandium target material becomes a technical problem to be solved.
Disclosure of Invention
In order to solve the technical problem of how to improve the yield of aluminum scandium targets in the prior art, the invention provides a manufacturing method of an AlSc target for improving the chip manufacturing yield.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
a manufacturing method of an AlSc target for improving the chip manufacturing yield comprises the following steps:
a step of obtaining a target, in which a hot isostatic pressing method is adopted to sinter and press aluminum scandium mixed powder mixed according to preset conditions to obtain an aluminum scandium target;
a target material checking step, namely obtaining an internal image of the aluminum scandium target material by utilizing an ultrasonic flaw detector, and comparing the size information of the defect position with preset size information under the condition of identifying the defect position in the internal image to obtain a first judging result or a second judging result or a third judging result;
repairing the target, namely removing the defect by adopting a grinding mode under the condition of obtaining a second judging result;
and a target cleaning step, namely cleaning the ground target.
Further, the step of obtaining the target material includes:
And uniformly mixing aluminum powder and scandium powder meeting preset conditions by adopting three-dimensional mixing equipment, wherein the diameter of the aluminum powder and the diameter of the scandium powder respectively meet 50-120 micrometers.
Further, the step of obtaining the target material further includes:
when the mixed powder of aluminum and scandium mixed according to the preset conditions is sintered and pressed by adopting a hot isostatic pressing method, the sintering temperature is limited to 500-1500 ℃, and the sintering pressure is limited to 200-600 Mpa.
Further, the step of inspecting the target includes:
taking an internal image of the aluminum scandium target obtained by utilizing an ultrasonic flaw detector as a preceding image, and taking an internal image of the aluminum scandium target obtained by utilizing an ultrasonic flaw detector as a following image, wherein a preset distance is met between the preceding image and the following image;
obtaining a subsequent image under the condition that the previous image has a defect;
and stopping obtaining the subsequent image under the condition that the subsequent image meets the preset quantity, wherein the surface plane reached by the ultrasonic wave after the ultrasonic wave propagates in the aluminum scandium target is a second surface plane, and the distance between the previous image and the first surface plane is smaller than the distance between the subsequent image and the first surface plane in the two surface planes of the aluminum scandium target along the ultrasonic wave transmitting direction of the ultrasonic detector.
Further, the step of inspecting the target further includes:
obtaining a digital image of the internal image, wherein if the internal image obtained by the ultrasonic flaw detector is an analog image, the analog image is converted into the digital image by an analog-to-digital converter, or the internal image directly obtained by the ultrasonic flaw detector is the digital image;
carrying out gray scale processing on the image under the condition that the internal image is a digital image to obtain a gray scale image;
obtaining gray values of all pixel points of a gray map;
and comparing the gray value of any pixel with a preset gray value threshold, and identifying the pixel with the gray value not meeting the preset gray value threshold as a defect.
Further, the step of inspecting the target further includes:
obtaining size information of the defect, wherein the image is subjected to binarization processing and edge processing under the condition that the internal image is a digital image, so that the size information of the defect is obtained;
comparing the size information with a first size threshold value and a second size threshold value respectively to obtain a first judgment result or a second judgment result or a third judgment result;
if the size information does not meet the first size threshold value and the second size threshold value at the same time, outputting a first judgment result;
Outputting a second judgment result if the size information meets the first size threshold but does not meet the second size threshold;
and outputting a third judgment result if the size information does not meet the first size threshold but meets the second size threshold.
Further, the step of inspecting the target further includes:
firstly, scaling the internal image according to a preset proportion to enable the size of an aluminum scandium target in the scaled internal image to be the same as the size of an actual aluminum scandium target, and then carrying out gray scale processing on the image to obtain a gray scale image.
Further, the method further comprises the following steps:
setting a reference object in the internal image before scaling the internal image according to a preset proportion;
when the internal image is scaled according to a preset proportion, the size of the aluminum scandium target in the internal image is scaled to the size of the actual aluminum scandium target according to the reference object.
Further, the target repairing step includes:
and carrying out rough grinding and fine grinding on the aluminum scandium target material in sequence by adopting grinding equipment along the direction from the first surface plane to the second surface plane, wherein the sum of the rough grinding amount and the fine grinding amount meets the preset grinding amount.
Further, the step of cleaning the target material includes:
firstly, alcohol is adopted to clean the surface of the aluminum scandium target material, and then ultrasonic waves are adopted to clean the surface of the aluminum scandium target material, wherein the frequency of the ultrasonic waves used for cleaning is 50-200 khz, and the cleaning time is 3-5 h.
The technical scheme has the following advantages or beneficial effects:
according to the processing method of the aluminum scandium target, the internal image of the aluminum scandium target is obtained by utilizing the ultrasonic flaw detector, so that whether the inside of the aluminum scandium target has defects or not can be clearly known, and three results that the aluminum scandium target is qualified and unqualified but meets repair standards and unqualified and does not meet repair standards can be clearly obtained by comparing the obtained size information of the defects with preset size information; except that the aluminum scandium target material of the qualified product is directly used as a finished product of the aluminum scandium target material, the aluminum scandium target material of the unqualified product is divided into an aluminum scandium target material which meets the repair standard and an aluminum scandium target material which does not meet the repair standard, and the defect part of the unqualified aluminum scandium target material which meets the repair standard can be removed through the subsequent target material repairing step, so that the original unqualified aluminum scandium target material can be converted into the qualified product; the yield of the aluminum scandium target material is improved, and the manufacturing cost of the aluminum scandium target material is reduced; in addition, the method ensures the yield of the aluminum scandium target material and correspondingly reduces the phenomena of arcing and the like in the process flow of actually applying the aluminum scandium target material to manufacturing chips.
Drawings
Fig. 1 is a partial flow chart of a processing method of an aluminum scandium target material according to embodiment 1 of the present invention;
fig. 2 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
FIG. 3 is a flow chart showing a part of the processing method of the aluminum scandium target material according to embodiment 1 of the present invention;
fig. 4 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
fig. 5 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
fig. 6 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
fig. 7 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
fig. 8 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
fig. 9 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
fig. 10 is a partial flow chart of a processing method of an aluminum scandium target according to embodiment 1 of the present invention;
FIG. 11 is an internal image of an aluminum scandium target provided in example 1 of the present invention;
fig. 12 is an internal image of the aluminum scandium target provided in example 1 of the present invention.
Detailed Description
Example 1:
referring to fig. 1, a method for manufacturing an AlSc target for improving a chip manufacturing yield includes:
s1, obtaining a target, namely sintering and pressing aluminum scandium mixed powder mixed according to preset conditions by adopting a hot isostatic pressing method to obtain the aluminum scandium target.
In the hot isostatic pressing (Hot IsostaticPressing, referred to as HIP) method, a product is placed in a closed container, the product is subjected to equal pressure in each direction, and simultaneously is subjected to high temperature and high pressure, so that the product is sintered and densified. In the processing method of the aluminum scandium target, high-purity aluminum powder and scandium powder are fully mixed according to a preset proportion, the mixed aluminum scandium powder mixture is filled in a die (sheath), nitrogen or argon is used as an increasing medium, and the aluminum scandium powder mixture can be heated through a heating furnace, so that the aluminum scandium powder mixture is directly heated, pressurized and sintered to be formed. In addition, the casting of the aluminum scandium target material can be treated by adopting a hot isostatic pressing method, so that the densification can be improved, and the overall mechanical property of the casting can be improved.
It should be understood that the aluminum scandium target in this embodiment actually includes an aluminum scandium target blank manufactured by the foregoing hot isostatic pressing method, and also includes an aluminum scandium target finished product after the aluminum scandium target blank is formed. For ease of description, the aluminum scandium target blank and the aluminum scandium target finish are collectively referred to as an aluminum scandium target hereinafter.
Preferably, referring to fig. 2, the step of obtaining a target in S1 includes: s101, uniformly mixing aluminum powder particles and scandium powder particles meeting preset conditions by adopting three-dimensional mixing equipment, wherein the aluminum powder diameter and the scandium powder diameter respectively meet 50-120 micrometers.
The aluminum scandium target may have defects, which are not only cracks or blisters occurring on the surface of the aluminum scandium target (pores may be regarded as one of the blisters, but the reason for forming the pores is due to the crystallization process of the target and the density of the target), but also cracks or blisters occurring inside the aluminum scandium target. It is these cracks and voids that make the aluminum scandium target in the process flow of manufacturing the chip (pulse laser deposition (Pulsed Laser Deposition, PLD), also called pulse laser ablation (pulsed laser ablation, PLA), which is a means of bombarding the object with laser and then depositing the bombarded material on different substrates to obtain a deposit or film), and both the cracks and voids can affect the electric field acting on the target area, causing electric field irregularities, and further increasing the incidence of arcing.
The three-dimensional mixing equipment can adopt a three-dimensional motion mixer in the prior art, aluminum powder and scandium powder are respectively put into the three-dimensional motion mixer, and the aluminum powder and scandium powder can be fully mixed by utilizing the motions of translation, rotation, overturning and the like of the three-dimensional motion mixer.
To facilitate the definition of the meaning of aluminum powder and scandium powder by the person skilled in the art, aluminum in the form of particles or powder having a particle diameter of 50 to 120 μm is defined as aluminum powder, and scandium in the form of particles or powder having a particle diameter of 50 to 120 μm is defined as scandium powder.
The three-dimensional mixing equipment is adopted to mix the aluminum powder and the scandium powder, so that the mixing effect is more uniform. The uniform aluminum scandium powder mixture can reduce the probability of generating defects (such as sand holes) in the pressing process of aluminum powder and scandium powder, and the internal crystallization of the aluminum scandium target is more uniform, so that the density is greatly improved, the probability of generating the sand holes (the fine holes) in the pressing process of the aluminum scandium target is reduced, and further, when the aluminum scandium target manufactured by adopting the conditions is practically applied to the process flow for manufacturing chips, the probability of generating the sand holes (the fine holes) is reduced in the crystallization process of the aluminum scandium target, so that the occurrence of the condition that the electric field affecting the target area is irregular is reduced, and the adverse phenomena such as arcing can be effectively reduced.
Preferably, referring to fig. 3, the step of obtaining a target in S1 further includes: s102, when sintering and pressing the aluminum scandium mixed powder mixed according to preset conditions by adopting a hot isostatic pressing method, the sintering temperature is limited to 500-1500 ℃, and the sintering pressure is limited to 200-600 Mpa.
The pressure and the pressing time can directly influence the density of the aluminum scandium target material, and the sintering pressure is limited to 200-600 Mpa, so that the sintering pressure range is good.
Referring to fig. 1, S2, a target material inspecting step, using an ultrasonic flaw detector to obtain an internal image of the aluminum scandium target material, and comparing the size information of the defect with the preset size information under the condition that the defect in the internal image is identified, so as to obtain a first judging result or a second judging result or a third judging result.
In this embodiment, an internal image of the aluminum scandium target material may be obtained by using an ultrasonic flaw detector, and the image may be analyzed to identify whether a defect exists in the internal image. The ultrasonic flaw detector is used for identifying the internal defects of the aluminum scandium target material, so that the aluminum scandium target material with the defects can be prevented from being practically applied to the process flow for manufacturing the chip, and the yield of the chip is improved better.
In the actual inspection of the target, defects of the aluminum scandium target (where not specifically indicated, it should be understood that the actual defects of the interior of the aluminum scandium target, such as blisters or cracks, corresponding to the defects of the interior image) are not completely indelible; for example, if the actual position of the defect and the pitch of one of the surfaces of the aluminum scandium target material satisfy the machining allowance requirement, the repair process may be performed by a subsequent means (such as grinding processing in the present embodiment, which will be described later). Therefore, judging whether the defect meets the repair standard becomes an important premise of the subsequent repair means.
In this embodiment, the internal image may be identified by using a computer and specialized software in an image processing manner, and after identifying that the internal image has a defect, the size information of the defect may be obtained, so as to compare the size information of the defect with the preset size information, and obtain a conclusion whether the repair standard is met. After comparing the size information of the defect with the preset size information, three results can be obtained: the first judgment result indicates that the aluminum scandium target is a qualified product, that is, the inside of the aluminum scandium target has no cracks and/or voids, the second judgment result indicates that the aluminum scandium target is a non-qualified product, but the repair standard is satisfied, that is, the inside of the aluminum scandium target has cracks and/or voids, but the repair treatment can be performed by a subsequent means, and the third judgment result indicates that the aluminum scandium target is a non-qualified product and the repair standard is not satisfied, that is, the inside of the aluminum scandium target has relatively large cracks and/or voids, even if the repair treatment is performed by a subsequent means, two negative effects are caused: first, the excessive repair process, that is, the aluminum scandium target material subjected to the repair process by adopting the subsequent means may not meet the requirements (such as size, thickness, smoothness) of the specific aluminum scandium target material due to the relatively large cracks or voids, thereby causing the excessive repair process; second, in order to ensure the requirements (such as size, thickness, and smoothness) of the aluminum scandium target, the ineffective repair process cannot completely eliminate cracks and/or voids even if the subsequent repair process is performed on the aluminum scandium target, thereby resulting in an ineffective repair process.
By adopting the target material inspection step, besides the internal image of whether the inside of the aluminum scandium target material has defects or not, the internal image can be processed to obtain the size information of the defect position, and the size information of the defect position is compared with the preset size information to obtain the result whether the aluminum scandium target material meets the repair standard or not, so that a basis is provided for whether the aluminum scandium target material needs to be repaired or not in the follow-up process.
Preferably, referring to fig. 4, the step of S2 inspecting the target includes:
s201, taking an internal image of the aluminum scandium target obtained by utilizing an ultrasonic flaw detector as a previous image, and taking an internal image of the aluminum scandium target obtained by utilizing the ultrasonic flaw detector as a subsequent image, wherein a preset distance is met between the previous image and the subsequent image;
s202, obtaining a subsequent image under the condition that the previous image has a defect;
and S203, terminating obtaining the subsequent image when the subsequent image meets the preset number of conditions, wherein the surface plane reached by the ultrasonic wave firstly is a first surface plane, the surface plane reached by the ultrasonic wave after the ultrasonic wave propagates in the aluminum scandium target is a second surface plane, and the distance between the previous image and the first surface plane is smaller than the distance between the subsequent image and the first surface plane along the direction of transmitting the ultrasonic wave by the ultrasonic detector.
It will be appreciated that if there is a defect inside the aluminium scandium target, the defect may extend not only in the direction of each layer of the aluminium scandium target (e.g. in the horizontal direction), but also possibly in the direction between the layers (e.g. in the vertical direction); in other words, the internal image of the aluminum scandium target obtained by the ultrasonic flaw detector, which is only an image of one layer of the interior of the aluminum scandium target, if one layer of the internal image has a defect, then the internal images of the adjacent other layers may have a defect. Therefore, after detecting that one of the layers has a defect, an internal image of the other layer adjacent to the layer should be obtained in order to determine whether the defect extends in a direction between the layers. Therefore, if there is a defect in the preceding image, the following image should be obtained by an ultrasonic flaw detector, and by judging whether there is a defect in the following image, a result of whether the defect actually located inside the aluminum scandium target extends in the direction between the layers is obtained.
It should be appreciated that there are a variety of types of aluminum scandium targets, such that the thickness of the aluminum scandium targets varies; if the thickness of the aluminum scandium target material is relatively thin, the position interval for obtaining the internal images of the aluminum scandium target material is calculated according to the machining allowance, that is, a plurality of internal images of the aluminum scandium target material can be obtained within the range of the machining allowance, wherein one internal image is an internal image under the condition that the extreme value of the machining allowance is close to or reached, and the internal image is defined as a limit internal image; if the limit internal image still has a defect, the defect can be clearly defined within the range of the machining allowance, and even if the subsequent repairing means is adopted to repair the aluminum scandium target, the internal defect of the aluminum scandium target can not be completely eliminated. Therefore, under the condition that the internal image of the aluminum scandium target material can be obtained and whether the multi-layer internal image has a defect or not can be clarified, in order to improve the efficiency of target material inspection, the selection of the previous image and the subsequent image should be clearly specified, namely, the actual positions of the obtained previous image and the subsequent image should be the positions limited by the machining allowance of the aluminum scandium target material; that is, the preset distance between the previous image and the subsequent image is satisfied, the preset distance should be smaller than the machining allowance, and the actual position of the previous image and the actual position of the subsequent image are respectively located in the machining allowance range of the aluminum scandium target material.
When the step of inspecting the target in this embodiment is actually applied, one layer of the aluminum scandium target may be arbitrarily selected within the range of the machining allowance of the aluminum scandium target, and an internal image may be obtained by an ultrasonic detector, if the internal image has a defect, the internal image is defined as a previous image, and within the range of the machining allowance of the aluminum scandium target, an internal image of another layer of the aluminum scandium target is obtained again by an ultrasonic detector, and the obtained internal image is defined as a subsequent image; if the subsequent image still has a defect, the subsequent image is defined as a previous image again, and an internal image of another layer of the aluminum scandium target is obtained again by using an ultrasonic flaw detector within the range of the machining allowance of the aluminum scandium target, and so on.
If any aluminum scandium target material is processed according to the internal image of only one layer, the result of whether the defect extends along the direction between the layers cannot be obtained; on the contrary, if any aluminum scandium target is processed according to the internal images with the selected preset layers, the number of the obtained internal images is relatively large, and all the internal images need to be processed respectively, so that the efficiency of detecting the target is reduced.
In this embodiment, the mode of obtaining the subsequent image based on the defect position of the previous image can reduce the number of internal images obtained by the ultrasonic flaw detector for the aluminum scandium target, and can clearly obtain the result of whether the defect extends along the direction between the multiple layers, so that the overall target inspection efficiency of the aluminum scandium target can be improved.
In practical application of the step of inspecting the target material in this embodiment, an extreme case is that even if a multi-layer image is obtained in the aforementioned manner of' obtaining a subsequent image by the previous image having a defect, it may occur that the obtained image is relatively large within the range of the machining allowance of the aluminum scandium target material, thereby affecting the detection efficiency. In this case, the distance between the preceding image and the following image (i.e., the distance between the actual position where the preceding image is located and the actual position where the following image is located within the range of the machining allowance of the aluminum scandium target) should be reasonably set within the range of the machining allowance of the aluminum scandium target, so that the sum of the numbers of the preceding image and the following image is within a reasonable preset number, for example: 3 or 4 or 5, and the total spacing between all preceding and following images cannot exceed the machining margin of the aluminium scandium target. In this way, two effects may occur: firstly, the previous image has a defect position, and one of the subsequent images does not have a defect position, so that the defect position can be judged to be processed by a subsequent repairing means, and the yield of the aluminum scandium target is improved while the target inspection efficiency of the aluminum scandium target is improved; secondly, all the previous images and the subsequent images respectively have defects, and in this case, the defects can be clearly obtained to be larger, and the defects are not suitable for processing by a subsequent repairing means, so that the target material inspection efficiency of the aluminum scandium target material is improved.
Further, referring to fig. 5, the step of S2 inspecting the target further includes:
s204, obtaining a digital image of the internal image, wherein if the internal image obtained by the ultrasonic flaw detector is an analog image, the analog image is converted into the digital image by an analog-to-digital converter, or the internal image directly obtained by the ultrasonic flaw detector is the digital image (see fig. 11 and 12);
s205, carrying out gray scale processing on the image under the condition that the internal image is a digital image to obtain a gray scale image;
s206, obtaining gray values of all pixel points of the gray map;
s207, comparing the gray value of any pixel with a preset gray value threshold, and identifying the pixel with the gray value not meeting the preset gray value threshold as a defect.
In the current market, from the imaging point of view, there are ultrasound probes that generate analog images, as well as ultrasound probes that generate digital images. In order to facilitate processing of the internal image of the aluminum scandium target obtained by the ultrasonic probe, the internal image should be converted into a gray scale, however, the basis of the conversion into a gray scale is the internal image to be in a digital image state. Therefore, if an ultrasonic probe that generates an analog image is employed, the analog image needs to be converted into a digital image by an analog-to-digital converter, thereby serving as a basis for conversion into a gray-scale image.
In the case that the internal image is a digital image, the digital image may be subjected to gray processing using the prior art; in this embodiment, MATLAB is preferably used to perform gray scale processing on the digital image; in other embodiments, other software may be employed, such as AI, PS, etc.
In this embodiment, the gray values of all the pixels of the gray map are obtained by MATLAB. The gray scale is the extension depth of the pixel point in the black-and-white image, and ranges from 0 to 255, white is 255, and black is 0. The gray image is a color image with respect to the RGB image, and the gray image has no color, but the gray itself has a color difference, thereby forming a difference in gray value. The RGB image can be converted into a gray scale image by, for example: the floating point algorithm, the integer algorithm, the average algorithm, or the like, to obtain a gray image. MATLAB can very easily convert a digital image into a gray-scale map and obtain gray-scale values of the gray-scale map.
It should be understood that one pixel point corresponds to only one gray value, for example: 115, while the MATLAB is used to obtain the gray values of all pixels of the gray map, it should be considered as a set of gray values, for example: 0 to 255.
When an internal image of an aluminum scandium target without defects is obtained, if it is defined as a standard image, the gray value of the standard image is smaller after the standard image is converted into a gray map, for example: 115-255, because the ultrasonic waves do not encounter 'obstructions' when propagating inside the aluminum scandium target, which obstructions should actually be cracks or voids, so that the gray values of the standard image are relatively small. However, when an internal image of an aluminum scandium target having a defect is obtained, if it is defined as a defective image, the gray value thereof is relatively large after the defective image is converted into a gray map, for example: 0-255, because the ultrasonic wave encounters a hindrance when propagating inside the aluminum scandium target, so that the ultrasonic wave generates irregular reflection, and further a deeper defect is formed by 'hindrance' in the defect image; that is, the single gray value of the 'blocked' pixel in the defect image is much smaller than the single gray value of the non-blocked 'pixel, and in general, the' blocked 'pixel in the defect image is black, the corresponding single gray value is 0, and the non-blocked' pixel is gray or white, and the corresponding single gray value is close to or 255.
The MATLAB can directly obtain the gray values of all pixels of the internal image, and form all gray values into one gray value interval, for example: 0 to 255; then, comparing the gray value interval with a corresponding preset gray value threshold, for example, 115-255, wherein the gray value of '0' obviously does not accord with the interval of 115-255; the MATLAB clearly identifies the gray value of one pixel point or a plurality of pixel points of one of the internal images, and obviously does not accord with the preset gray value threshold value, so that the position of one or a plurality of pixel points of the internal image, which does not accord with the gray value threshold value, can be defined as a defect position.
When the MATLAB is actually used for processing the internal image, the internal image can be output to a display, so that the human eyes can observe the defect on the internal image conveniently.
Further, referring to fig. 6, the step of S2 inspecting the target further includes:
s208, obtaining size information of the defect, wherein the image is subjected to binarization processing and edge processing under the condition that the internal image is a digital image, so as to obtain the size information of the defect;
s209, comparing the size information with a first size threshold and a second size threshold respectively to obtain a first judgment result or a second judgment result or a third judgment result;
Step S291, outputting a first judgment result if the size information does not meet the first size threshold and the second size threshold at the same time;
s292, outputting a second judgment result if the size information meets the first size threshold but does not meet the second size threshold;
and S293, outputting a third judgment result if the size information does not meet the first size threshold but meets the second size threshold.
Size information at the defect can be calculated using MATLAB. Under the condition that the internal image is a digital image, performing binarization processing and edge processing on the image to obtain contour information of a defect, and obtaining size information from any obtained contour information through MATLAB; specifically, binarization and edge processing are adopted for an internal image in a digital image state, so that pixels at a defect in the internal image form a contour, contour information is formed, specific information of the contour information can be obtained through MATLAB, for example, the contour information comprises the area of the contour, the maximum length, the minimum length and the like of the contour, and the area, the maximum length or the minimum length of the contour can be used as size information.
Binarization and edge processing of the internal image using MATLAB are well known to those skilled in the art of image processing. The binarization process may process the internal image pixel by pixel to determine the pixel contours that make up the defect, but the pixel contours may not be closed contours, such as: the average gray value of the defect position can be obtained through the self-adaptive threshold value, and the average gray value is used as a set threshold value, so that the gray value of the defect position (comprising the gray value of any pixel inside the defect position and the gray value of any pixel outside the defect position) is respectively compared with the set threshold value, and the binarization processing is completed; the pixel outline after binarization processing is in a broken curve or a multi-point shape, and the like, and at the moment, the broken curve or multi-point pixel outline needs to be converted into a closed curve through edge processing, so that a complete outline is formed; the edge processing needs to perform gray level transformation again on the image, and compares gray level (also called brightness) differences between adjacent pixels, and when gray level mutation occurs, the gray level is the pixel at the edge of the defect, so that the pixels at the edge of the defect are connected together to form contour information.
In the present embodiment, a preferable manner for processing the internal image is: firstly, binarization processing is carried out, and then edge processing is carried out. In other embodiments, the internal image may be first edge processed and then binarized.
The first size threshold and the second size threshold should correspond to attributes of the size information, respectively; for example: the first size threshold and the second size threshold should be areas, respectively, if the size information is the area of the contour, or the length, respectively, if the size information is the maximum length or the minimum length of the contour.
And comparing the size information with the corresponding first size threshold value and second size threshold value respectively, so as to obtain the first judgment result, the second judgment result or the third judgment result.
The first size threshold S1 and the second size threshold S2 are respectively area thresholds, the first size threshold is more than 0 and less than or equal to 0.1, and the second size threshold is more than 0.1, when the size information S (area) is 0, the size information S (area) does not meet the requirements of S1 and S2, and therefore a first judgment result is output, and the current aluminum scandium target corresponding to the internal image is indicated to be qualified; or when the size information S (area) is 0.05, it satisfies S1, which indicates that the aluminum scandium target corresponding to the current internal image has defects, but it does not satisfy S2, which indicates that the defects of the aluminum scandium target corresponding to the current internal image can be repaired by a subsequent means; or when the size information S (area) is 0.2, it does not conform to S1, but conforms to S2, so that it is indicated that the aluminum scandium target corresponding to the current internal image has a defect, and the defect cannot be repaired by the subsequent means.
Similarly, the first size threshold L1 and the second size threshold L2 may be the maximum length or the minimum length at the same time, and the comparison between the size information L (length) and the size information L1 and the size information L2 is the same as or similar to the comparison between the size information S (area) and the size information S1 and the size information S2, which are not described herein again.
Further, referring to fig. 7, the step of S2 inspecting the target further includes:
and S210, firstly scaling the internal image according to a preset proportion to enable the size of the aluminum scandium target in the scaled internal image to be the same as the size of the actual aluminum scandium target, and then carrying out gray scale processing on the image to obtain a gray scale image.
When the internal image of the aluminum scandium target material obtained by the ultrasonic flaw detector is actually processed by image processing software (for example, MATLAB), the image processing software can only obtain the size information of the internal image itself, however, the size information of the aluminum scandium target material in the internal image may be greater than or less than or equal to the size information of the actual aluminum scandium target material. This causes dimensional deviations in the defect when the image processing software processes the internal image. For example: the actual size of the aluminum scandium target is 300mm x 300mm, and the size of the internal image of the aluminum scandium target obtained by the ultrasonic flaw detector is 800mm x 800mm, when the image processing software processes the internal image, the aluminum scandium target in the internal image can only 'scale' the overall outline size of the aluminum scandium target in the internal image according to the size of the internal image of 800mm x 800mm, and the overall outline size is possibly greater than or equal to the actual size of 300mm x 300mm, so that the image processing software can only obtain the outline size of the defect in the internal image, but cannot obtain the size of the defect of the actual aluminum scandium target.
The whole outline size of the aluminum scandium target in the internal image can be scaled to the actual size of the aluminum scandium target by scaling (alternatively using the scaling and the shrinking) the internal image obtained by the ultrasonic flaw detector, at this time, the size of the internal image (originally 800mm x 800 mm) changes (is greater than or less than 800mm x 800 mm) along with the scaling, and after the step of inspecting the target by using the image processing software, the size information of the defect in the internal image is obtained as the size information of the defect inside the actual aluminum scandium target.
Preferably, referring to fig. 8, step S211, before the internal image is scaled according to a preset ratio, a reference object is set in the internal image;
and S212, when the internal image is scaled according to a preset proportion, scaling the size of the aluminum scandium target in the internal image to the size of the actual aluminum scandium target according to the reference object.
In general, an ultrasonic flaw detector does not have a function of setting a reference object, and in this case, a process of setting a reference object in an internal image can be realized by the following means.
A physical scale is arranged near an actual aluminum scandium target material, and the physical scale has a fixed length; when the ultrasonic flaw detector detects the aluminum scandium target, the solid scale is subjected to flaw detection operation, so that the image of the solid scale is included in the internal image of the aluminum scandium target output by the ultrasonic flaw detector.
Secondly, the first size and the second size can be recorded and converted into proportional data respectively under the condition that the second size of the output image of the ultrasonic flaw detector can be obtained by actually detecting the first size of the aluminum scandium target; the scale data is set as a reference in a scale of the image processing software, and the image is scaled according to the scale before the internal image obtained by the ultrasonic flaw detector is actually processed.
S3, repairing the target, namely removing the defect by adopting a grinding mode under the condition of obtaining a second judging result;
in the foregoing, it has been proposed that: when the internal picture of the aluminum scandium target material has a defect, and the size information of the defect is compared with the preset size information, a first judgment result, a second judgment result or a third judgment result can be obtained.
And under the condition that the second judgment result is obtained, transferring the corresponding aluminum scandium target material to polishing equipment, and performing grinding treatment on the aluminum scandium target material by using the polishing equipment, so that one layer of the defective aluminum scandium target material is removed.
According to the target material checking step, the actual detection position of the multilayer internal image can be obtained, and if a certain layer of image contains a defect, the actual depth of the aluminum scandium target material to be processed (ground) can be obtained through the actual detection position of the certain layer of image.
It should be understood that the ultrasonic flaw detector can adjust the flaw detection depth when actually detecting the inside of the aluminum scandium target; conversely, the internal image of the aluminum scandium target obtained by using the ultrasonic flaw detector, and the position (depth) of the internal image actually inside the aluminum scandium target can be obtained by using the ultrasonic flaw detector, which is known as the common knowledge of the person skilled in the art.
The multi-layer internal images are respectively arranged according to the direction from the surface plane of the aluminum scandium target material to the internal center, the direction is defined as a grinding direction, so that all the internal images with the defects and the transition positions of the internal images without the defects in the grinding direction are obtained, the transition position positioned at the deepest part in the grinding direction is taken as a grinding target in the grinding direction, and the position (depth) of the internal images without the defects in the grinding target, which are positioned in the actual aluminum scandium target material, is taken as a preset grinding amount. And (3) removing a part of the aluminum scandium target material with the defects by adopting polishing equipment according to a preset grinding amount, so that the polished aluminum scandium target material removes the defects.
Preferably, referring to fig. 9, the step of S3 repairing the target includes:
S301, carrying out rough grinding and fine grinding on the aluminum scandium target material sequentially by adopting grinding equipment along the direction from the first surface plane to the second surface plane, wherein the sum of the rough grinding amount and the fine grinding amount meets the preset grinding amount.
How to confirm the surface of the aluminum scandium target as the processing surface after confirming that the inside of the aluminum scandium target has defects and before adopting grinding processing can be realized by adopting the following scheme:
aluminum scandium targets typically have two surface planes, for example: if the aluminum scandium target is arranged in the horizontal direction, the surface plane at the top of the aluminum scandium target is a first surface plane, the surface plane at the bottom of the aluminum scandium target is a second surface plane, and if the defect of the internal image of a certain layer is close to the first surface plane and far from the second surface plane, the first surface plane is required to be ground through grinding equipment when the aluminum scandium target is actually ground, so that the defect is eliminated; on the contrary, if the defect of the internal image of a certain layer is close to the second surface plane and far from the first surface plane, when the aluminum scandium target material is actually ground, the second surface plane should be ground by a grinding device, so that the defect is eliminated.
The thickness of the aluminum scandium target material can be reduced (ground) rapidly by adopting a rough grinding mode, but a margin can be reserved at the same time, so that the target material is prevented from being scrapped due to the fact that excessive grinding is caused, and the size of the thickness is not in accordance with the standard (for example; meanwhile, by adopting a fine polishing mode, the allowance after rough polishing can be removed, so that the sum of the grinding amounts of rough polishing and fine polishing does not exceed a preset grinding amount.
S4, cleaning the target, namely cleaning the ground target.
One of the purposes of cleaning the target is to avoid powder (aluminum scandium alloy powder or impurities) on the surface of the aluminum scandium target after grinding, so that the roughness of the surface of the aluminum scandium target is affected, and further, when the aluminum scandium target is actually applied to a process flow for manufacturing a chip, the powder causes electric field variation to cause electric field irregularity, and further, the occurrence rate of arcing is improved.
Through cleaning the aluminum scandium target after grinding, the roughness of the surface of the aluminum scandium target can be detected after cleaning, if the roughness reaches the standard, for example: and if the surface roughness reaches Ra0.8a, judging that the roughness is qualified, and applying the polished aluminum scandium target material in the process flow of manufacturing the chip.
Preferably, referring to fig. 10, the step of S4 cleaning the target includes:
s401, cleaning the surface of an aluminum scandium target material by alcohol, and then cleaning the surface of the aluminum scandium target material by ultrasonic waves, wherein the frequency of the ultrasonic waves used for cleaning is 50-200 khz, and the cleaning time is 3-5 h.
In the prior art, although means for obtaining an internal image of an aluminum scandium target material by utilizing an ultrasonic flaw detector and further obtaining whether the inside of the aluminum scandium target material is defective or not are provided, the defective aluminum scandium target material is completely used as a defective product, so that the aluminum scandium target material in the prior art is generated, the yield is low, and the economic cost of an aluminum scandium target material manufacturer is increased.
In the embodiment, the internal image of the aluminum scandium target is obtained by utilizing an ultrasonic flaw detector, so that whether the inside of the aluminum scandium target has defects or not can be clearly known, and three results that the aluminum scandium target is qualified and unqualified but meets the repair standard and the unqualified and does not meet the repair standard can be clearly obtained by comparing the size information of the obtained defects with the preset size information; except that the aluminum scandium target material of the qualified product is directly used as a finished product of the aluminum scandium target material, the aluminum scandium target material of the unqualified product is divided into an aluminum scandium target material which meets the repair standard and an aluminum scandium target material which does not meet the repair standard, and the defect part of the unqualified aluminum scandium target material which meets the repair standard can be removed through the subsequent target material repairing step, so that the original unqualified aluminum scandium target material can be converted into the qualified product; the yield of the aluminum scandium target material is improved, and the manufacturing cost of the aluminum scandium target material is reduced; in addition, the method ensures the yield of the aluminum scandium target material and correspondingly reduces the phenomena of arcing and the like in the process flow of actually applying the aluminum scandium target material to manufacturing chips.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the present invention and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the present invention.
Claims (9)
1. The manufacturing method of the AlSc target for improving the chip manufacturing yield is characterized by comprising the following steps of:
s1, obtaining a target, namely sintering and pressing aluminum scandium mixed powder mixed according to preset conditions by adopting a hot isostatic pressing method to obtain an aluminum scandium target;
s2, checking the target, namely obtaining an internal image of the aluminum scandium target by utilizing an ultrasonic flaw detector, and comparing the size information of the defect with preset size information under the condition that the defect in the internal image is identified to obtain a first judging result or a second judging result or a third judging result;
s3, repairing the target, namely removing the defect by adopting a grinding mode under the condition of obtaining a second judging result;
s4, cleaning the target, namely cleaning the ground target;
the step of S2 testing the target material comprises the following steps:
s201, taking an internal image of the aluminum scandium target obtained by utilizing an ultrasonic flaw detector as a previous image, and taking an internal image of the aluminum scandium target obtained by utilizing the ultrasonic flaw detector as a subsequent image, wherein a preset distance is met between the previous image and the subsequent image;
S202, obtaining a subsequent image under the condition that the previous image has a defect;
s203, terminating obtaining the subsequent image when the subsequent image meets the preset number of conditions, wherein the surface plane reached by the ultrasonic wave firstly is a first surface plane, the surface plane reached by the ultrasonic wave after being propagated inside the aluminum scandium target is a second surface plane, and the distance between the previous image and the first surface plane is smaller than the distance between the subsequent image and the first surface plane along the direction of transmitting the ultrasonic wave by the ultrasonic detector;
after a first judging result is obtained, judging the aluminum scandium target material as a qualified product;
and after the third judging result is obtained, judging the aluminum scandium target material as a defective product, wherein the repairing standard is not met.
2. The method for processing an aluminum scandium target according to claim 1, wherein the step of S1 obtaining the target comprises:
and S101, uniformly mixing aluminum powder and scandium powder meeting preset conditions by adopting three-dimensional mixing equipment, wherein the diameter of the aluminum powder and the diameter of the scandium powder respectively meet 50-120 microns.
3. The method for processing an aluminum scandium target according to claim 1 or 2, wherein the step of S1 obtaining the target further comprises:
And S102, when the hot isostatic pressing method is adopted to sinter and press the aluminum scandium mixed powder mixed according to the preset conditions, the sintering temperature is limited to 500-1500 ℃, and the sintering pressure is limited to 200-600 Mpa.
4. The method of processing an aluminum scandium target according to claim 1, wherein the S2 inspection target step further comprises:
s204, obtaining a digital image of the internal image, wherein if the internal image obtained by the ultrasonic flaw detector is an analog image, the analog image is converted into the digital image by an analog-to-digital converter, or the internal image directly obtained by the ultrasonic flaw detector is the digital image;
s205, carrying out gray scale processing on the image under the condition that the internal image is a digital image to obtain a gray scale image;
s206, obtaining gray values of all pixel points of the gray map;
s207, comparing the gray value of any pixel with a preset gray value threshold, and identifying the pixel with the gray value not meeting the preset gray value threshold as a defect.
5. The method of processing an aluminum scandium target according to claim 4, wherein said S2 inspection target step further comprises:
s208, obtaining size information of the defect, wherein the image is subjected to binarization processing and edge processing under the condition that the internal image is a digital image, so as to obtain the size information of the defect;
S209, comparing the size information with a first size threshold and a second size threshold respectively to obtain a first judgment result or a second judgment result or a third judgment result;
step S291, outputting a first judgment result if the size information does not meet the first size threshold and the second size threshold at the same time;
s292, outputting a second judgment result if the size information meets the first size threshold but does not meet the second size threshold;
and S293, outputting a third judgment result if the size information does not meet the first size threshold value but meets the second size threshold value.
6. The method of processing an aluminum scandium target according to claim 4, wherein said S2 inspection target step further comprises:
and S210, firstly scaling the internal image according to a preset proportion to enable the size of the aluminum scandium target in the scaled internal image to be the same as the size of the actual aluminum scandium target, and then carrying out gray scale processing on the image to obtain a gray scale image.
7. The method of processing an aluminum scandium target according to claim 6, further comprising:
s211, setting a reference object in the internal image before scaling the internal image according to a preset proportion;
And S212, when the internal image is scaled according to a preset proportion, scaling the size of the aluminum scandium target in the internal image to the size of the actual aluminum scandium target according to the reference object.
8. The method for processing an aluminum scandium target according to claim 1, wherein the S3 repair target step includes:
s301, carrying out rough grinding and fine grinding on the aluminum scandium target material sequentially by adopting grinding equipment along the direction from the first surface plane to the second surface plane, wherein the sum of the rough grinding amount and the fine grinding amount meets the preset grinding amount.
9. The method of processing an aluminum scandium target according to claim 8, wherein the S4 cleaning target step comprises:
s401, cleaning the surface of an aluminum scandium target material by alcohol, and then cleaning the surface of the aluminum scandium target material by ultrasonic waves, wherein the frequency of the ultrasonic waves used for cleaning is 50-200 khz, and the cleaning time is 3-5 h.
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