CN112951348A - Manufacturing method of AlSc target for improving chip manufacturing yield - Google Patents
Manufacturing method of AlSc target for improving chip manufacturing yield Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- LUKDNTKUBVKBMZ-UHFFFAOYSA-N aluminum scandium Chemical compound [Al].[Sc] LUKDNTKUBVKBMZ-UHFFFAOYSA-N 0.000 claims abstract description 252
- 239000013077 target material Substances 0.000 claims abstract description 165
- 230000007547 defect Effects 0.000 claims abstract description 122
- 238000000034 method Methods 0.000 claims abstract description 56
- 238000000227 grinding Methods 0.000 claims description 46
- 238000004140 cleaning Methods 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 14
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 12
- 238000001513 hot isostatic pressing Methods 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 239000011812 mixed powder Substances 0.000 claims description 6
- 230000001902 propagating effect Effects 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000008439 repair process Effects 0.000 abstract description 25
- 230000008569 process Effects 0.000 abstract description 19
- 239000000047 product Substances 0.000 description 19
- 238000003754 machining Methods 0.000 description 14
- 239000000843 powder Substances 0.000 description 8
- 239000004576 sand Substances 0.000 description 8
- 238000001514 detection method Methods 0.000 description 6
- 238000005498 polishing Methods 0.000 description 6
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- 238000003672 processing method Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000542 Sc alloy Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16C—COMPUTATIONAL CHEMISTRY; CHEMOINFORMATICS; COMPUTATIONAL MATERIALS SCIENCE
- G16C60/00—Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/0006—Industrial image inspection using a design-rule based approach
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/90—Determination of colour characteristics
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- G—PHYSICS
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10132—Ultrasound image
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- Life Sciences & Earth Sciences (AREA)
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- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
The invention relates to the field of targets, in particular to a method for manufacturing an AlSc target for improving the yield of chips, which is characterized in that an ultrasonic flaw detector is used for obtaining an internal image of an aluminum scandium target, whether the inside of the aluminum scandium target has a defect can be definitely known, and three results that the aluminum scandium target is a qualified product and an unqualified product, but meets a repair standard and an unqualified product and does not meet the repair standard can be definitely obtained by comparing size information of the obtained defect with preset size information; through the subsequent target repairing step, the defect part of the unqualified aluminum scandium target meeting the repairing standard can be removed, so that the originally unqualified aluminum scandium target can be converted into a qualified product; the yield of the aluminum scandium target material is improved, and the manufacturing cost of the aluminum scandium target material is reduced; in addition, the yield of the aluminum scandium target material is ensured, and the phenomena of arcing and the like in the process flow of actually applying the aluminum scandium target material to manufacturing the chip are correspondingly reduced.
Description
Technical Field
The invention relates to the field of targets, in particular to a method for manufacturing an AlSc target for improving the yield of chips.
Background
In the fabrication of high performance chip filters, an aluminum scandium material (AlSc) is essential, and is commonly referred to as an aluminum scandium target (AlSc target).
In the prior art, the aluminum scandium target has a high reject ratio, and is prone to have bad phenomena such as arcing and the like in the process of manufacturing a chip, so that the chip is scrapped. The fundamental reason is that in the manufacturing process of the aluminum scandium target material, the aluminum scandium target material contains impurities or a gap exists in the powder die casting process, so that pores exist on the surface and inside of the aluminum scandium target material when the aluminum scandium target material is finally finished, and the defect of the aluminum scandium target material is caused.
However, in the prior art, although an image of the inside of the aluminum scandium target material can be obtained by the ultrasonic flaw detector, and whether a defect exists in the image or not can be judged, the specific size of the defect cannot be obtained, and whether the defect satisfies the subsequent processing premise cannot be determined, so that after the image of the inside of the aluminum scandium target material is obtained by the ultrasonic flaw detector, if the defect is judged, the aluminum scandium target material with the defect is directly judged as an unqualified aluminum scandium target material; the unqualified aluminum scandium target material can only be re-manufactured by returning to the furnace, which leads to the great increase of the manufacturing cost of the aluminum scandium target material.
Therefore, how to improve the yield of the aluminum scandium target material in the prior art is a technical problem to be solved.
Disclosure of Invention
In order to solve the technical problem of how to improve the yield of the aluminum scandium target material in the prior art, the invention provides a method for manufacturing an AlSc target material, which is used for improving the yield of chips in manufacturing.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for manufacturing an AlSc target material for improving the chip manufacturing yield comprises the following steps:
a step of obtaining a target, namely sintering and pressing the aluminum-scandium mixed powder mixed according to preset conditions by adopting a hot isostatic pressing method to obtain an aluminum-scandium target;
a step of detecting a target, in which an ultrasonic flaw detector is used for obtaining an internal image of the aluminum scandium target, and size information of a defect is compared with preset size information under the condition that the defect in the internal image is identified, so that a first judgment result, a second judgment result or a third judgment result is obtained;
a step of repairing the target, wherein the defect part is removed in a grinding mode under the condition of obtaining a second judgment result;
and a step of cleaning the target, namely cleaning the ground target.
Further, the step of obtaining the target material comprises:
and uniformly mixing the aluminum powder and the scandium powder which meet preset conditions by adopting three-dimensional mixing equipment, wherein the diameter of the aluminum powder and the diameter of the scandium powder respectively meet 50-120 micrometers.
Further, the step of obtaining the target material further comprises:
when the hot isostatic pressing method is adopted to sinter and press the aluminum-scandium mixed powder mixed according to the preset conditions, the sintering temperature is limited to 500-1500 ℃, and the sintering pressure is limited to 200-600 Mpa.
Further, the step of inspecting the target includes:
taking an internal image of the aluminum scandium target obtained by the ultrasonic flaw detector as a previous image, taking an internal image of the aluminum scandium target obtained by the ultrasonic flaw detector as a subsequent image, and enabling the previous image and the subsequent image to meet a preset distance;
obtaining a subsequent image under the condition that the previous image has a defect;
and when the subsequent images meet the condition of a preset number, stopping obtaining the subsequent images, wherein in the two surface planes of the aluminum scandium target, the surface plane which the ultrasonic wave firstly reaches is a first surface plane, the surface plane which the ultrasonic wave reaches after propagating in the aluminum scandium target is a second surface plane, and the distance between the prior image and the first surface plane is smaller than the distance between the subsequent image and the first surface plane.
Further, the step of inspecting the target further includes:
obtaining a digital image of an internal image, wherein if the internal image obtained by the ultrasonic flaw detector is an analog image, the analog image is converted into the digital image through an analog-to-digital converter, or the internal image directly obtained by the ultrasonic flaw detector is the digital image;
carrying out gray level processing on the image under the condition that the internal image is a digital image to obtain a gray level image;
obtaining gray values of all pixel points of the gray image;
and comparing the gray value of any pixel point with a preset gray value threshold, and identifying the pixel points of which the gray values do not meet the preset gray value threshold as defects.
Further, the step of inspecting the target further includes:
acquiring size information of a defect, wherein the size information of the defect is acquired by performing binarization processing and edge processing on the image under the condition that the internal image is a digital image;
comparing the size information with a first size threshold and a second size threshold respectively to obtain a first judgment result, a second judgment result or a third judgment result;
if the size information does not satisfy the first size threshold and the second size threshold at the same time, outputting a first judgment result;
if the size information meets the first size threshold but does not meet the second size threshold, outputting a second judgment result;
and if the size information does not meet the first size threshold value but meets the second size threshold value, outputting a third judgment result.
Further, the step of inspecting the target further includes:
firstly, scaling the internal image according to a preset proportion to enable the size of the aluminum scandium target material in the scaled internal image to be the same as the actual size of the aluminum scandium target material, and then carrying out gray processing on the image to obtain a gray image.
Further, the method also comprises the following steps:
before the internal image is subjected to scaling processing according to a preset proportion, setting a reference object in the internal image;
and when the internal image is subjected to scaling processing according to a preset proportion, scaling the size of the aluminum scandium target material in the internal image to the actual size of the aluminum scandium target material according to the reference object.
Further, the target repairing step includes:
and (3) along the direction from the first surface plane to the second surface plane, adopting polishing equipment to perform rough polishing and fine polishing on the aluminum scandium target material in sequence, wherein the sum of the grinding amount of the rough polishing and the grinding amount of the fine polishing meets the preset grinding amount.
Further, the step of cleaning the target includes:
firstly, cleaning the surface of the aluminum scandium target material by using alcohol, and then cleaning the surface of the aluminum scandium target material by using ultrasonic waves, wherein the frequency of the ultrasonic waves for cleaning is 50-200 khz, and the cleaning time is 3-5 h.
The technical scheme has the following advantages or beneficial effects:
according to the processing method of the aluminum scandium target material, the internal image of the aluminum scandium target material is obtained by using the ultrasonic flaw detector, whether the inside of the aluminum scandium target material has the defect or not can be definitely known, and three results that the aluminum scandium target material is a qualified product and an unqualified product, but meets the repair standard and the unqualified product and does not meet the repair standard can be definitely obtained by comparing the size information of the obtained defect with the preset size information; except that the qualified aluminum scandium target material is directly used as an aluminum scandium target material finished product, the unqualified aluminum scandium target material is divided into an aluminum scandium target material which meets the repair standard and an aluminum scandium target material which does not meet the repair standard, and the defect part of the unqualified aluminum scandium target material which meets the repair standard can be removed through the subsequent target material repair step, so that the originally unqualified aluminum scandium target material can be converted into the qualified product; the yield of the aluminum scandium target material is improved, and the manufacturing cost of the aluminum scandium target material is reduced; in addition, the yield of the aluminum scandium target material is ensured, and the phenomena of arcing and the like in the process flow of actually applying the aluminum scandium target material to manufacturing the chip are correspondingly reduced.
Drawings
Fig. 1 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 2 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 3 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 4 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 5 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 6 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 7 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 8 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 9 is a partial flowchart of a method for processing an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 10 is a partial flowchart of a method for processing an aluminum scandium target according to embodiment 1 of the present invention;
fig. 11 is an internal image of an aluminum scandium target provided in embodiment 1 of the present invention;
fig. 12 is an internal image of the aluminum scandium target provided in embodiment 1 of the present invention.
Detailed Description
Example 1:
referring to fig. 1, a method for manufacturing an AlSc target for improving chip manufacturing yield includes:
and S1, obtaining a target, namely sintering and pressing the aluminum-scandium mixed powder mixed according to the preset conditions by adopting a hot isostatic pressing method to obtain the aluminum-scandium target.
The Hot Isostatic Pressing (HIP) method is to place the product in a closed container, apply equal pressure to the product and apply high temperature at the same time, and under the action of high temperature and high pressure, the product is sintered and densified. In the processing method of the aluminum scandium target material, high-purity aluminum powder and scandium powder are fully mixed according to a preset proportion, the mixed aluminum scandium powder mixture is filled in a die (a sheath), nitrogen or argon and the like are used as an adding medium, and the aluminum scandium powder mixture can be heated by a heating furnace, so that the aluminum scandium powder mixture is directly heated, pressurized and sintered and molded. In addition, the castings of the aluminum scandium target materials can be treated by a hot isostatic pressing method, so that the densification and the overall mechanical property of the castings can be improved.
It should be understood that the aluminum scandium target material in the present embodiment actually includes the aluminum scandium target material blank manufactured by the hot isostatic pressing method, and also includes the finished aluminum scandium target material after the aluminum scandium target material blank is formed. For convenience of description, the aluminum scandium target blank and the aluminum scandium target finished product are collectively referred to as an aluminum scandium target.
Preferably, referring to fig. 2, the step of obtaining the target material in S1 includes: s101, uniformly mixing aluminum powder particles and scandium powder particles which meet preset conditions by adopting three-dimensional mixing equipment, wherein the diameters of the aluminum powder and the scandium powder respectively meet 50-120 micrometers.
The aluminum scandium target may have defects, which are not only cracks or blisters appearing on the surface of the aluminum scandium target (pores can be regarded as one type of blisters, but are formed due to the crystallization process of the target and the density of the target), but also cracks or blisters appearing inside the aluminum scandium target. Just these cracks and blisters make the aluminum scandium target material in the process flow of manufacturing the chip (pulse Laser Deposition, also called Pulse Laser Ablation (PLA), which is a means of bombarding an object with Laser and then depositing the bombarded substance on different substrates to obtain a precipitate or a thin film), both the cracks and the blisters can affect the electric field acting on the target material area, causing the electric field to be irregular, thereby increasing the occurrence rate of arcing.
The three-dimensional mixing equipment can adopt a three-dimensional motion mixer in the prior art, aluminum powder and scandium powder are respectively placed into the three-dimensional motion mixer, and the aluminum powder and the scandium powder can be fully mixed by utilizing the motions of translation, rotation, overturning and the like of the three-dimensional motion mixer.
In order to facilitate the definition of the aluminum powder and the scandium powder by those skilled in the art, the aluminum in a granular or powdery state having a particle diameter of 50 to 120 μm is defined as the aluminum powder, and the scandium in a granular or powdery state having a particle diameter of 50 to 120 μm is defined as the scandium powder.
And the aluminum powder and the scandium powder are mixed by adopting three-dimensional mixing equipment, so that the mixing effect is more uniform. The uniform aluminum-scandium powder mixture can reduce the probability of generating defects (such as sand holes (pores)) in the pressing process of aluminum powder and scandium powder, the internal crystallization of the aluminum-scandium target material is more uniform, so that the density is greatly improved, the probability of generating the sand holes (pores) in the pressing process of the aluminum-scandium target material is reduced, and furthermore, the aluminum-scandium target material manufactured under the conditions is adopted.
Preferably, referring to fig. 3, the step of obtaining the target material in S1 further includes: and S102, when sintering and pressing the aluminum-scandium mixed powder mixed according to the preset conditions by adopting a hot isostatic pressing method, limiting the sintering temperature to 500-1500 ℃, and limiting the sintering pressure to 200-600 Mpa.
The density of the aluminum scandium target material can be directly influenced by the pressure and the pressing time, the sintering pressure is limited to 200-600 Mpa, and the sintering pressure range is good.
Referring to fig. 1, in the step of inspecting the target, S2, obtaining an internal image of the aluminum scandium target by using an ultrasonic flaw detector, and comparing size information of a defect with preset size information under the condition that the defect in the internal image is identified, so as to obtain a first judgment result, a second judgment result, or a third judgment result.
In this embodiment, an ultrasonic flaw detector is used to obtain an internal image of the aluminum scandium target, and the image is analyzed to identify whether a defect exists in the internal image. The internal defects of the aluminum scandium target material are identified by the ultrasonic flaw detector, so that the aluminum scandium target material with the defects can be prevented from being actually applied to the process flow of manufacturing the chip, and the yield of the manufactured chip is improved better.
In the actual inspection of the target, defects of the aluminum scandium target (which, unless otherwise specified, should be understood as corresponding to actual defects, such as blisters or cracks, inside the aluminum scandium target at the defects of the internal image) are not completely indelible; for example, if the actual position of the defect and the distance between the surfaces of the aluminum scandium target satisfy the requirement of the machining allowance, the repair process may be performed by a subsequent means (e.g., grinding in the embodiment described later). Therefore, judging whether the defect part meets the repair standard becomes an important precondition for subsequent repair means.
In this embodiment, the internal image may be identified by an image processing method using a computer and professional software, and when the internal image has a defect, the size information of the defect may be obtained, so that the size information of the defect is compared with the preset size information to obtain a conclusion whether the defect meets the repair standard. After comparing the size information of the defect with the preset size information, three results can be obtained: the first judgment result shows that the aluminum scandium target material is a qualified product, that is, the inside of the aluminum scandium target material has no cracks and/or sand holes, the second judgment result shows that the aluminum scandium target material is a unqualified product but meets the repair standard, that is, although the inside of the aluminum scandium target material has cracks and/or sand holes, the aluminum scandium target material can be repaired by the subsequent means, and the third judgment result shows that the aluminum scandium target material is a unqualified product but does not meet the repair standard, that is, the inside of the aluminum scandium target material has relatively large cracks and/or sand holes, and even if the aluminum scandium target material is repaired by the subsequent means, two negative effects can be caused: firstly, excessive repair treatment, that is, because cracks or sand holes are large, the aluminum scandium target material repaired by using a subsequent means may not meet the requirements (such as size, thickness and smoothness) of a specific aluminum scandium target material, thereby causing excessive repair treatment; secondly, in order to ensure the requirements (such as size, thickness and smoothness) of the aluminum scandium target material, even if the aluminum scandium target material is repaired by subsequent means, cracks and/or sand holes cannot be completely eliminated, so that the ineffective repair treatment is caused.
By adopting the target inspection step, in addition to obtaining an internal image of whether the inside of the aluminum scandium target has a defect, the internal image can be processed to obtain size information of the defect, and the size information of the defect is compared with preset size information to obtain a result of whether the aluminum scandium target meets the repair standard, so that a basis is provided for subsequently repairing the aluminum scandium target.
Preferably, referring to fig. 4, the step of inspecting the target material in S2 includes:
s201, taking an internal image of the aluminum scandium target obtained by the ultrasonic flaw detector as a previous image, taking an internal image of the aluminum scandium target obtained by the ultrasonic flaw detector as a subsequent image, and enabling the previous image and the subsequent image to meet a preset distance;
s202, obtaining a subsequent image under the condition that the prior image has a defect;
and S203, when the subsequent images meet the preset number, stopping obtaining the subsequent images, wherein in the two surface planes of the aluminum scandium target, the surface plane where the ultrasonic wave firstly reaches is a first surface plane, the surface plane where the ultrasonic wave reaches after propagating in the aluminum scandium target is a second surface plane, and the distance between the prior image and the first surface plane is smaller than the distance between the subsequent image and the first surface plane.
It should be understood that if a defect is present inside the aluminum scandium target, the defect may extend not only in the direction of each layer of the aluminum scandium target (e.g., horizontal direction), but also in the direction between the layers (e.g., vertical direction); in other words, the internal image of the aluminum scandium target obtained by the ultrasonic flaw detector is only the image of one layer of the internal of the aluminum scandium target, and if the internal image of one layer has a defect, the internal image of the adjacent other layer may have a defect. Therefore, after detecting that one of the layers has a defect, an internal image of the other layer adjacent to the one layer should be obtained in order to determine whether the defect extends in a direction between the layers. Therefore, if a defect is included in the previous image, the subsequent image should be obtained by the ultrasonic flaw detector, and a result of whether the defect actually located inside the aluminum scandium target material extends in the direction between the multiple layers should be obtained by making a judgment on whether the subsequent image has the defect.
It should be understood that there are various types of aluminum scandium targets, so that the thickness of the aluminum scandium targets is different; if the thickness of the aluminum scandium target material is relatively thin, the position distance of the obtained internal images of the aluminum scandium target material should be measured according to the machining allowance, that is, internal images of a plurality of aluminum scandium target materials can be obtained within the range of the machining allowance, wherein one internal image is an internal image under the condition that the internal image is close to or reaches the extreme value of the machining allowance and is defined as a limit internal image; if the limit internal image still has a defect, the internal defect of the aluminum scandium target material cannot be completely eliminated even if the aluminum scandium target material is repaired by adopting a subsequent repairing method within the range of the machining allowance. Therefore, under the condition that the internal image of the aluminum scandium target can be obtained and whether the multilayer internal image has a defect or not can be determined, in order to improve the efficiency of target inspection, the selection of the prior image and the subsequent image should be explicitly specified, namely the actual positions of the obtained prior image and the obtained subsequent image should be the position limited by the machining allowance of the aluminum scandium target; the actual position of the previous image and the actual position of the subsequent image are respectively located in the range of the machining allowance of the aluminum scandium target material.
In practical application of the step of inspecting the target material according to the embodiment, one layer of the aluminum-scandium target material can be selected at will within the range of the machining allowance of the aluminum-scandium target material, an internal image is obtained through an ultrasonic detector, if the internal image has a defect, the internal image is defined as a previous image, and within the range of the machining allowance of the aluminum-scandium target material, an internal image of another layer of the aluminum-scandium target material is obtained again through the ultrasonic flaw detector, and the obtained internal image is defined as a next image; and if the subsequent image still has the defect, defining the subsequent image as the previous image again, and obtaining an internal image of another layer of the aluminum scandium target again by using the ultrasonic flaw detector within the range of the machining allowance of the aluminum scandium target, and so on.
If any aluminum scandium target material is respectively processed according to the internal image of only one layer, the result of whether the defect extends along the direction among the multiple layers cannot be obtained; on the contrary, if any aluminum-scandium target material is processed according to the selected preset number of layers of internal images, the number of the obtained internal images is large, and all the internal images need to be processed respectively, so that the target material detection efficiency is reduced.
In the embodiment, by obtaining the subsequent image based on the defect in the previous image, the number of the internal images actually obtained for the aluminum scandium target by the ultrasonic flaw detector can be reduced, and the result of whether the defect extends along the direction between the multiple layers can be clearly obtained, so that the overall target inspection efficiency of the aluminum scandium target can be improved.
In practical application of the target inspection step of the present embodiment, an extreme case is that even if the multilayer image is obtained in the above-mentioned 'manner of obtaining the subsequent image based on the defect in the previous image', the multilayer image may be within the range of the machining allowance of the aluminum-scandium target, and the obtained images are relatively large, thereby affecting the detection efficiency. In the face of this situation, the distance between the preceding image and the subsequent image (i.e. the distance between the actual position of the preceding image and the actual position of the subsequent image in the inside of the aluminum scandium target material and in the range of the machining allowance of the aluminum scandium target material) should be reasonably set within the range of the machining allowance of the aluminum scandium target material, so that the sum of the number of the preceding image and the number of the subsequent image is within the range of a reasonable preset number, for example: 3 or 4 or 5, and the total distance between all the previous images and the subsequent images cannot exceed the machining allowance of the aluminum scandium target. In this way, two effects may occur: firstly, the prior image has a defect, and one of the subsequent images has no defect, and for the situation, the defect can be judged to be processed by a subsequent repairing method, so that the target inspection efficiency of the aluminum scandium target is improved, and meanwhile, the yield of the aluminum scandium target is improved; secondly, all the previous images and the subsequent images respectively have defects, and in this case, the defects can be clearly obtained to be larger and are not suitable for subsequent repair means to process, so that the target inspection efficiency of the aluminum scandium target is improved.
Further, referring to fig. 5, the step of inspecting the target at S2 further includes:
s204, obtaining a digital image of the internal image, wherein if the internal image obtained by the ultrasonic flaw detector is an analog image, the analog image is converted into a digital image by an analog-to-digital converter, or the internal image directly obtained by the ultrasonic flaw detector is a digital image (see fig. 11 and 12);
s205, carrying out gray processing on the image under the condition that the internal image is a digital image to obtain a gray image;
s206, obtaining gray values of all pixel points of the gray map;
and S207, comparing the gray value of any pixel with a preset gray value threshold, and identifying the pixel with the gray value not meeting the preset gray value threshold as a defect.
In the current market, from the viewpoint of imaging, there are ultrasonic probes that generate analog images, and also ultrasonic probes that generate digital images. In order to facilitate processing of the internal image of the aluminum scandium target obtained by the ultrasonic detector, the internal image should be converted into a gray-scale image, however, the basis for the conversion into the gray-scale image is the internal image in a digital image state. Therefore, if an ultrasonic probe that generates an analog image is used, the analog image needs to be converted into a digital image by an analog-to-digital converter, and the digital image needs to be used as a basis for conversion into a grayscale map.
Under the condition that the internal image is a digital image, the digital image can be subjected to gray level processing by adopting the prior art; in this embodiment, MATLAB is preferably used to perform gray scale processing on the digital image; in other embodiments, other software may be employed, such as AI, PS, and so forth.
In this embodiment, the MATLAB is preferably used to obtain the gray values of all the pixels in the gray map. The gray scale refers to the extension depth of a pixel point in a black-and-white image, the range is 0-255, white is 255, and black is 0. The gray image is a color image as compared to an RGB image, which has no color but has a color difference in gray itself, thereby forming a difference in gray value. The RGB image may be converted to a grayscale image by, for example: the gray image is obtained after conversion by a floating point algorithm, an integer algorithm, an average algorithm, or the like. MATLAB can very easily convert a digital image into a gray-scale map and obtain the gray-scale values of the gray-scale map.
It should be understood that one pixel corresponds to only one gray value, for example: 115, obtaining the gray values of all the pixels of the gray map by using MATLAB should be regarded as a set of multiple gray values, for example: 0 to 255.
When an internal image of an aluminum scandium target without defects is obtained, if the internal image is defined as a standard image, the gray value of the standard image is relatively small after the standard image is converted into a gray scale image, for example: 115-255, because the ultrasonic wave does not encounter 'obstruction' when propagating inside the aluminum scandium target material, the obstruction should be actually a crack or a sand hole, and the gray value of the standard image is relatively small. However, when an internal image of an aluminum scandium target with defects is obtained, if the internal image is defined as a defect image, the gray value of the defect image is relatively large after the defect image is converted into a gray scale image, for example: 0-255, because the ultrasonic waves encounter obstacles when propagating in the aluminum scandium target material, the ultrasonic waves generate irregular reflection, and the 'obstacles' in the defect image form a defect position with a darker color; that is, the single gray value of the 'obstructing' pixel in the defect image is much smaller than that of the non-obstructing pixel, generally speaking, the 'obstructing' pixel in the defect image is black, the corresponding single gray value is 0, while the non-obstructing pixel is gray or white, and the corresponding single gray value is close to or 255.
The MATLAB is adopted to directly obtain the gray values of all the pixel points of the internal image, and all the gray values are formed into a gray value interval, for example: 0 to 255; then, comparing the gray value interval with a corresponding preset gray value threshold, wherein the preset gray value threshold is 115-255 for example, and the 0' gray value in the preset gray value threshold obviously does not accord with the interval of 115-255; MATLAB identifies the gray value of one pixel point or a plurality of pixel points at one position of the internal image definitely, and the gray value obviously does not accord with the preset gray value threshold value, so that one or a plurality of pixel points of the internal image which do not accord with the gray value threshold value can be defined as the defect position.
When the internal image is actually processed by MATLAB, the internal image can be output to a display, so that the human eye can observe the defect on the internal image conveniently.
Further, referring to fig. 6, the step of inspecting the target at S2 further includes:
s208, acquiring size information of the defect, wherein the image is subjected to binarization processing and edge processing under the condition that the internal image is a digital image, so as to acquire the size information of the defect;
s209, comparing the size information with a first size threshold and a second size threshold respectively to obtain a first judgment result, a second judgment result or a third judgment result;
step S291, if the size information does not satisfy the first size threshold and the second size threshold at the same time, outputting a first determination result;
s292, if the size information meets the first size threshold but does not meet the second size threshold, outputting a second judgment result;
and S293, if the size information does not meet the first size threshold but meets the second size threshold, outputting a third judgment result.
The size information of the defect can be calculated by using MATLAB. Under the condition that the internal image is a digital image, carrying out binarization processing and edge processing on the image to obtain contour information of a defect, and obtaining dimension information from any obtained contour information through MATLAB; specifically, binarization processing and edge processing are performed on an internal image in a digital image state, so that pixels at a defect in the internal image form a contour, and contour information is formed, and specific information of the contour information, for example, the contour information includes an area of the contour, a maximum length and a minimum length of the contour, and the area, the maximum length, or the minimum length of the contour may be used as size information.
The binarization processing and edge processing of the internal image using MATLAB are common knowledge known to those skilled in the art of image processing. The binarization processing may process the internal image pixel by pixel to determine the pixel contour constituting the defect, but the pixel contour may not be a closed contour, for example: the average gray value of the defect can be obtained through the self-adaptive threshold, and the average gray value is used as a set threshold, so that the gray value of the defect (including the gray value of any pixel inside the defect and any pixel outside the defect) is respectively compared with the set threshold, and the binarization processing is completed; the pixel contour after the binarization processing is in a broken curve shape or a plurality of point shapes, and the like, and at this time, the broken curve shape or the plurality of point shapes of the pixel contour need to be converted into a closed curve shape through edge processing, so that a complete contour is formed; the edge processing needs to perform gray level transformation again on the image, compare gray level (also called brightness) differences between adjacent pixels, and connect the pixels at the edge of the defect together to form contour information when the position where the gray level is suddenly changed is the pixel at the edge of the defect.
In this embodiment, the preferred way to process the internal image is: first, binarization processing is performed, and then edge processing is performed. In other embodiments, the edge processing may be performed on the internal image first, and then the binarization processing may be performed.
The first size threshold and the second size threshold should correspond to attributes of the size information, respectively; for example: the first size threshold and the second size threshold should be areas, respectively, if the size information is an area of the outline, or lengths, respectively, if the size information is a maximum length or a minimum length of the outline.
The size information is compared with the corresponding first size threshold and second size threshold respectively, so as to obtain the first judgment result, the second judgment result or the third judgment result.
Assuming that the first size threshold S1 and the second size threshold S2 are area thresholds, respectively, the first size threshold is 0 < S1 and is not more than 0.1, and the second size threshold is S2 > 0.1, when the size information S (area) is 0, it does not satisfy S1 and S2, respectively, and thus a first determination result is output, which indicates that the aluminum-scandium target corresponding to the current internal image is a good product; alternatively, when the size information S (area) is 0.05, it satisfies S1, which indicates that the aluminum scandium target corresponding to the current internal image has a defect, but it does not satisfy S2, which indicates that the defect of the aluminum scandium target corresponding to the current internal image can be repaired by a subsequent means; alternatively, when the size information S (area) is 0.2, it does not conform to S1, but conforms to S2, thereby indicating that the aluminum scandium target corresponding to the current internal image has a defect, and the defect cannot be repaired by a subsequent means.
Similarly, the first size threshold L1 and the second size threshold L2 may be the maximum length or the minimum length at the same time, and the comparison between the size information L (length) and L1 and L2 is the same as or similar to the comparison between the size information S (area) and S1 and S2, respectively, and will not be described herein again.
Further, referring to fig. 7, the step of inspecting the target at S2 further includes:
and S210, firstly, scaling the internal image according to a preset proportion to enable the size of the aluminum scandium target in the scaled internal image to be the same as the actual size of the aluminum scandium target, and then carrying out gray processing on the image to obtain a gray image.
When the internal image of the aluminum scandium target obtained by the ultrasonic flaw detector is actually processed by image processing software (e.g., MATLAB), the image processing software can only obtain the size information of the internal image itself, however, the size information of the aluminum scandium target in the internal image may be greater than or less than or equal to the size information of the actual aluminum scandium target. This causes a dimensional deviation of the defect when the image processing software processes the internal image. For example: the actual size of the aluminum scandium target material is 300mm × 300mm, the size of the internal image of the aluminum scandium target material obtained by the ultrasonic flaw detector is 800mm × 800mm, when the image processing software processes the internal image, the aluminum scandium target material in the internal image can only be converted into the overall outline size of the aluminum scandium target material in the internal image according to the size of the internal image of 800mm × 800mm, and the overall outline size may be larger than or smaller than or equal to the actual 300mm × 300mm, so that the image processing software can only obtain the outline size of the defect in the internal image, but cannot obtain the size of the defect of the actual aluminum scandium target material.
The method comprises the steps of performing zooming processing (alternatively using zooming processing and zooming processing) on an internal image obtained by an ultrasonic flaw detector to enable the overall outline size of the aluminum scandium target in the internal image to be zoomed to the actual size of the aluminum scandium target, wherein the size (originally 800mm to 800mm) of the internal image changes (is larger than or smaller than 800mm to 800mm) along with the zooming processing, and obtaining the size information of the defect position in the internal image as the size information of the defect in the actual aluminum scandium target after performing the target checking step through image processing software.
Preferably, referring to fig. 8, in step S211, before the internal image is scaled according to the preset scale, a reference object is set in the internal image;
and S212, scaling the size of the aluminum scandium target in the internal image to the actual size of the aluminum scandium target according to the reference object when scaling the internal image according to the preset proportion.
In general, an ultrasonic flaw detector does not have a function of setting a reference object, and in this case, a process of setting a reference object in an internal image can be realized by the following means.
The method comprises the steps that a solid scale is arranged near an actual aluminum scandium target material, and the solid scale has a fixed length; when the ultrasonic flaw detector detects the flaw of the aluminum scandium target, the solid scale is subjected to flaw detection operation, so that the internal image of the aluminum scandium target output by the ultrasonic flaw detector comprises the image of the solid scale.
Secondly, the first size and the second size can be recorded and converted into proportional data respectively under the condition that the second size of an output image of the ultrasonic flaw detector can be obtained by actually detecting the first size of the aluminum scandium target material; the scale data is set as a reference in a scale of image processing software, and before an internal image obtained by an ultrasonic flaw detector is actually processed, the image is scaled on the scale.
S3, repairing the target, namely removing the defect in a grinding mode under the condition of obtaining a second judgment result;
in the foregoing, it has been proposed: when the internal picture of the aluminum scandium target has a defect, and the size information of the defect is compared with the preset size information, a first judgment result, a second judgment result or a third judgment result can be obtained.
And under the condition of obtaining a second judgment result, transferring the corresponding aluminum scandium target material to a grinding device, and grinding the aluminum scandium target material by using the grinding device, so that one layer of the aluminum scandium target material with the defects is removed.
According to the target material inspecting step, the actual detection positions of the multiple layers of internal images can be obtained, and if a certain layer of image contains a defect, the actual depth of the aluminum scandium target material to be machined (ground) can be obtained through the actual detection positions of the certain layer of image.
It should be understood that when the ultrasonic flaw detector actually detects the inside of the aluminum-scandium target material, the flaw detection depth can be adjusted; conversely, it is common knowledge known to those skilled in the art that an internal image of an aluminum scandium target obtained by an ultrasonic flaw detector can be obtained by the ultrasonic flaw detector as to the actual position (depth) of the internal image in the aluminum scandium target.
The multilayer internal images are respectively arranged according to the direction from the surface plane to the internal center of the aluminum scandium target material, the direction is defined as a grinding direction, so that all the transition positions of the internal images with the defects and the internal images without the defects in the grinding direction are obtained, the transition position located at the deepest position in the grinding direction is used as a grinding target in the grinding direction, and the position (depth) of the internal image without the defects in the grinding target in the actual aluminum scandium target material is used as a preset grinding amount. And removing a part of the aluminum scandium target material with the defects by adopting polishing equipment according to a preset grinding amount, so that the defects of the polished aluminum scandium target material are removed.
Preferably, referring to fig. 9, the step of repairing the target in S3 includes:
and S301, performing rough grinding and fine grinding on the aluminum scandium target material in sequence by adopting grinding equipment along the direction from the first surface plane to the second surface plane, wherein the sum of the grinding amount of the rough grinding and the grinding amount of the fine grinding meets the preset grinding amount.
After confirming that the inside of the aluminum scandium target has the defect, and before adopting the grinding process, confirming that the side of the aluminum scandium target should be used as the processing side can be realized by adopting the following scheme:
aluminum scandium targets typically have two surface planes, for example: if the aluminum scandium target material is arranged in the horizontal direction, the surface plane positioned at the top of the aluminum scandium target material is a first surface plane, the surface plane positioned at the bottom of the aluminum scandium target material is a second surface plane, and if the defect position of the internal image of a layer is close to the first surface plane and far away from the second surface plane, the first surface plane is ground through grinding equipment when the aluminum scandium target material is actually ground, so that the defect position is eliminated; on the contrary, if the defect position of the internal image of a certain layer is close to the second surface plane and is far away from the first surface plane, the second surface plane should be ground by the grinding equipment when the aluminum scandium target material is actually ground, so that the defect position is eliminated.
By adopting a rough grinding mode, the thickness of the aluminum scandium target material can be quickly reduced (ground off), but a margin can be reserved, so that the target material is prevented from being scrapped due to the fact that the target material is not in accordance with standards (for example, the size of the thickness is not in accordance) due to excessive grinding; meanwhile, the allowance after the rough grinding can be removed by adopting a fine grinding mode, so that the total grinding amount of the rough grinding and the fine grinding is not more than the preset grinding amount.
And S4, cleaning the target material, namely cleaning the ground target material.
One of the purposes of cleaning the target is to avoid that the surface of the aluminum scandium target after grinding has powder (aluminum scandium alloy powder or impurities) so as to influence the roughness of the surface of the aluminum scandium target, and then when the aluminum scandium target is actually applied to the process flow of manufacturing a chip, the powder causes the change of an electric field to cause the irregularity of the electric field, thereby improving the occurrence rate of the arcing phenomenon.
By cleaning the ground aluminum scandium target material, the roughness of the surface of the aluminum scandium target material can be detected after cleaning, if the roughness reaches the standard, for example: if the surface roughness reaches Ra0.8a, the roughness is judged to be qualified, and the polished aluminum scandium target material can be applied to the process flow for manufacturing the chip.
Preferably, referring to fig. 10, the step of cleaning the target at S4 includes:
s401, cleaning the surface of the aluminum scandium target material by using alcohol, and then cleaning the surface of the aluminum scandium target material by using ultrasonic waves, wherein the frequency of the ultrasonic waves for cleaning is 50-200 khz, and the cleaning time is 3-5 h.
In the prior art, although a means for obtaining an internal image of an aluminum scandium target by using an ultrasonic flaw detector and further obtaining whether the inside of the aluminum scandium target is defective is provided, the aluminum scandium target with the defect is completely used as a defective product, so that the aluminum scandium target in the prior art is generated, the yield is low, and the economic cost of an aluminum scandium target manufacturer is increased.
In the embodiment, the internal image of the aluminum scandium target material is obtained by using the ultrasonic flaw detector, whether the inside of the aluminum scandium target material has a defect or not can be definitely known, and three results that the aluminum scandium target material is a qualified product and an unqualified product but meets the repair standard and the unqualified product but does not meet the repair standard can be definitely obtained by comparing the size information of the obtained defect with the preset size information; except that the qualified aluminum scandium target material is directly used as an aluminum scandium target material finished product, the unqualified aluminum scandium target material is divided into an aluminum scandium target material which meets the repair standard and an aluminum scandium target material which does not meet the repair standard, and the defect part of the unqualified aluminum scandium target material which meets the repair standard can be removed through the subsequent target material repair step, so that the originally unqualified aluminum scandium target material can be converted into the qualified product; the yield of the aluminum scandium target material is improved, and the manufacturing cost of the aluminum scandium target material is reduced; in addition, the yield of the aluminum scandium target material is ensured, and the phenomena of arcing and the like in the process flow of actually applying the aluminum scandium target material to manufacturing the chip are correspondingly reduced.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or any other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method for manufacturing an AlSc target for improving the yield of chips in manufacturing is characterized by comprising the following steps:
s1, a step of obtaining a target, wherein a hot isostatic pressing method is adopted to sinter and press the aluminum-scandium mixed powder mixed according to preset conditions to obtain an aluminum-scandium target;
s2 a target material inspection step, namely acquiring an internal image of the aluminum scandium target material by using an ultrasonic flaw detector, and comparing size information of a defect with preset size information under the condition that the defect in the internal image is identified to acquire a first judgment result, a second judgment result or a third judgment result;
s3, repairing the target, namely removing the defect in a grinding mode under the condition of obtaining a second judgment result;
and S4, cleaning the target material, namely cleaning the ground target material.
2. The method for processing an aluminum scandium target material according to claim 1, wherein the step of obtaining a target material in S1 includes:
and S101, uniformly mixing aluminum powder and scandium powder meeting preset conditions by using three-dimensional mixing equipment, wherein the diameters of the aluminum powder and the scandium powder respectively meet 50-120 micrometers.
3. The method for processing an aluminum scandium target material according to claim 1 or 2, wherein the step of obtaining a target material in S1 further includes:
and S102, when sintering and pressing the aluminum-scandium mixed powder mixed according to the preset conditions by adopting a hot isostatic pressing method, limiting the sintering temperature to 500-1500 ℃, and limiting the sintering pressure to 200-600 Mpa.
4. The method for processing an aluminum scandium target material according to claim 1, wherein the step of inspecting the target material by S2 includes:
s201, taking an internal image of the aluminum scandium target obtained by the ultrasonic flaw detector as a previous image, taking an internal image of the aluminum scandium target obtained by the ultrasonic flaw detector as a subsequent image, and enabling the previous image and the subsequent image to meet a preset distance;
s202, obtaining a subsequent image under the condition that the prior image has a defect;
and S203, when the subsequent images meet the preset number, stopping obtaining the subsequent images, wherein in the two surface planes of the aluminum scandium target, the surface plane where the ultrasonic wave firstly reaches is a first surface plane, the surface plane where the ultrasonic wave reaches after propagating in the aluminum scandium target is a second surface plane, and the distance between the prior image and the first surface plane is smaller than the distance between the subsequent image and the first surface plane.
5. The method for processing an aluminum scandium target material according to claim 4, wherein the step of inspecting the target material by S2 further includes:
s204, obtaining a digital image of the internal image, wherein if the internal image obtained by the ultrasonic flaw detector is an analog image, the analog image is converted into the digital image by an analog-to-digital converter, or the internal image directly obtained by the ultrasonic flaw detector is the digital image;
s205, carrying out gray processing on the image under the condition that the internal image is a digital image to obtain a gray image;
s206, obtaining gray values of all pixel points of the gray map;
and S207, comparing the gray value of any pixel with a preset gray value threshold, and identifying the pixel with the gray value not meeting the preset gray value threshold as a defect.
6. The method for processing an aluminum scandium target material according to claim 5, wherein the step of S2 inspecting the target material further includes:
s208, acquiring size information of the defect, wherein the image is subjected to binarization processing and edge processing under the condition that the internal image is a digital image, so as to acquire the size information of the defect;
s209, comparing the size information with a first size threshold and a second size threshold respectively to obtain a first judgment result, a second judgment result or a third judgment result;
step S291, if the size information does not satisfy the first size threshold and the second size threshold at the same time, outputting a first determination result;
s292, if the size information meets the first size threshold but does not meet the second size threshold, outputting a second judgment result;
and S293, if the size information does not meet the first size threshold but meets the second size threshold, outputting a third judgment result.
7. The method for processing an aluminum scandium target material according to claim 5, wherein the step of S2 inspecting the target material further includes:
and S210, firstly, scaling the internal image according to a preset proportion to enable the size of the aluminum scandium target in the scaled internal image to be the same as the actual size of the aluminum scandium target, and then carrying out gray processing on the image to obtain a gray image.
8. The method for processing the aluminum scandium target material according to claim 7, further comprising:
s211, before scaling the internal image according to a preset proportion, setting a reference object in the internal image;
and S212, scaling the size of the aluminum scandium target in the internal image to the actual size of the aluminum scandium target according to the reference object when scaling the internal image according to the preset proportion.
9. The method for processing the aluminum scandium target material according to claim 4, wherein the step of S3 repairing the target material includes:
and S301, performing rough grinding and fine grinding on the aluminum scandium target material in sequence by adopting grinding equipment along the direction from the first surface plane to the second surface plane, wherein the sum of the grinding amount of the rough grinding and the grinding amount of the fine grinding meets the preset grinding amount.
10. The method of processing an aluminum scandium target material according to claim 9, wherein the step of S4 cleaning the target material includes:
s401, cleaning the surface of the aluminum scandium target material by using alcohol, and then cleaning the surface of the aluminum scandium target material by using ultrasonic waves, wherein the frequency of the ultrasonic waves for cleaning is 50-200 khz, and the cleaning time is 3-5 h.
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