CN112947730B - Automatic temperature control system and method for embedded coil radiation type server - Google Patents
Automatic temperature control system and method for embedded coil radiation type server Download PDFInfo
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- CN112947730B CN112947730B CN202110356046.7A CN202110356046A CN112947730B CN 112947730 B CN112947730 B CN 112947730B CN 202110356046 A CN202110356046 A CN 202110356046A CN 112947730 B CN112947730 B CN 112947730B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The invention discloses an automatic temperature control system of an embedded coil radiation type server, which comprises: the device comprises a temperature control module, a heat radiation module and a heat transfer module; the heat transfer module is respectively connected with the temperature control module and the heat radiation module; the temperature control module acquires temperature information of the server component, and generates control information according to the temperature information to control the heat radiation module and the heat transfer module; the heat transfer module comprises a coiled pipe and a liquid inlet, the liquid inlet is arranged at the port of the coiled pipe, and the coiled pipe is used for cooling the heat radiation module; the heat radiation module comprises an embedded coil and a coil main pipe, wherein the embedded coil is connected with the coiled pipe and is embedded into the server component, and the coil main pipe is in heat exchange with the coiled pipe and is displaced to the upper part of the server component according to a control signal, so that higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature are obtained, and the calculation density and performance are greatly improved.
Description
Technical Field
The invention relates to the technical field of server heat dissipation, in particular to an automatic temperature control system and method for an embedded coil radiation type server.
Background
The conventional server is generally provided with a plurality of groups of fan modules to exchange heat to the electronic components in a manner of accelerating heat convection, so as to reduce the temperature of the high Wen Yuan device in the server, and in order to improve the cooling efficiency, the fan modules with higher power are generally arranged in the server or the number of the fan modules is increased, but the increase of the power of the fan modules or the number of the fan modules occupies the space of the electronic components in the server and generates more noise.
Disclosure of Invention
The invention mainly solves the problems that the noise is increased or the space of electronic components of a server is occupied due to the increase of the power of the fan modules or the increase of the number of the fan modules.
In order to solve the technical problems, the invention adopts a technical scheme that: an automatic temperature control system of an embedded coil radiation type server is provided, which comprises: the device comprises a temperature control module, a heat radiation module and a heat transfer module;
the heat transfer module is respectively connected with the temperature control module and the heat radiation module;
the temperature control module acquires temperature information of a server component, and generates control information according to the temperature information to control the heat radiation module and the heat transfer module;
the heat transfer module comprises a coiled pipe and a liquid inlet, the liquid inlet is arranged at a port of the coiled pipe, and the coiled pipe is used for cooling the heat radiation module;
the heat radiation module comprises an embedded coil pipe and a coil pipe main pipe, wherein the embedded coil pipe is connected with a coiled pipe and embedded into the server component, and the coil pipe main pipe exchanges heat with the coiled pipe and moves to the upper part of the server component according to the control signal.
Further, the temperature control module comprises a control unit and a heat sensing unit;
the thermal sensing unit is applied to the server component, acquires the temperature of the server component, generates the temperature information and sends the temperature information to the control unit;
the control unit is provided with a heat dissipation strategy and on-site information of the server component, and is used for converting and displaying the temperature information and controlling the displacement of the coil pipe main pipe according to the heat dissipation strategy and the on-site information after the temperature information is acquired.
Further, the liquid inlet is used for obtaining cooling liquid, the liquid inlet is provided with a flow valve, and the flow valve controls the liquid inlet to obtain the degree of the cooling liquid.
Further, the heat radiation module further comprises a sliding groove and a heat insulation layer;
the sliding groove is used for fixing the coil pipe main pipe, a plurality of coil pipe main pipes are arranged in the heat preservation layer, and the coil pipe main pipes are insulated;
and the sliding groove displaces the coil pipe main pipe according to the control information.
Further, the heat radiation module further comprises a copper column and an expansion clamping groove;
the expansion card slot is used for fixing an expansion card;
the copper column is fixed on the expansion clamping groove, the copper column is connected with the coiled pipe, and the copper column is cooled after heat exchange with the coiled pipe.
Further, the heat transfer module further comprises a liquid outlet;
the liquid outlet is used for discharging the warmed cooling liquid.
Further, the server component comprises a hard disk, a memory and a chip.
The invention also provides an automatic temperature control method according to the embedded coil radiation type server, which comprises the following steps:
and (3) injecting a cooling liquid: when the server is electrified, cooling liquid is injected into the liquid inlet;
obtaining the temperature: the temperature control module generates a control signal according to the temperature information of the server component;
coil pipe main pipe displacement: and the temperature control module controls the displacement of the coil pipe main pipe and the conduction degree of the flow valve according to the in-place information and the heat dissipation strategy.
And (3) discharging the cooling liquid: and the liquid outlet discharges the warmed cooling liquid.
Further, the step of obtaining the temperature further includes: and the temperature control module converts the temperature information into numbers and displays the numbers.
The beneficial effects of the invention are as follows:
1. the automatic temperature control system of the embedded coil radiation type server can achieve the purposes of acquiring temperature information of a server component, automatically adjusting the flow rate of cooling liquid in a coil pipe and the position of a coil pipe main pipe according to the temperature information, embedding the heat radiation module of the server into a radiator or a heating element substrate by using the coil pipe to conduct radiation heat transfer, generating phase change heat exchange in the flowing process of a refrigerant in the coil pipe, and taking away a large amount of heat through the radiation heat exchange, so that higher equipment heat exchange efficiency, higher energy efficiency ratio and lower chip surface temperature are obtained, and the calculation density and performance are greatly improved.
2. The automatic temperature control method of the embedded coil radiation type server can realize injection of cooling liquid, strengthen phase change heat exchange of the cooling liquid under the action of the coil main pipe, the flow valve and the coil main pipe, and discharge the warmed cooling liquid.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of an automatic temperature control system for an embedded coil radiation server according to embodiment 1 of the present invention;
FIG. 2 is a side view of an embedded coil radiant server automatic temperature control system according to embodiment 1 of the present invention;
FIG. 3 is a cross-sectional view of an automatic temperature control system for an embedded coil radiation server according to embodiment 1 of the present invention;
fig. 4 is a schematic diagram of an automatic temperature control method for an embedded coil radiation server according to embodiment 2 of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it is to be noted that,
wherein, 1, a coiled pipe; 2. a hard disk; 3, a step of; memory, 4, chip; 5. copper columns; 6. a control unit; 7. a coil pipe is embedded; 8. a coiled pipe main pipe; 9. a sliding groove; 10. expanding the clamping groove; 11. a liquid inlet; 12. a liquid outlet; 13. and a heat preservation layer.
Example 1
The invention relates to an automatic temperature control system of an embedded coil radiation type server, referring to fig. 1 to 3, comprising: a temperature control module, a heat radiation module and a heat transfer module;
the temperature control module comprises a control unit 6 and a thermal sensing unit, wherein the thermal sensing unit is applied to all components in a server and can acquire the temperature of the server components, the thermal sensing unit can be a BMC, or can acquire the information of the server components through wiring on a board or external connection through other temperature sensing chips, the server components in the embodiment comprise a hard disk 2, a memory 3 and a chip 4, the thermal sensing unit converts the acquired temperature and generates a temperature signal to be output to the control unit 6.
The control unit 6 receives the temperature signal, the control unit 6 may be connected to a display device outside the server, the connection mode includes wired and wireless, the control unit 6 may also be designed integrally with the display device, after converting the temperature signal into a number, the control unit 6 may display itself, the control unit 6 stores therein a heat dissipation policy, the heat dissipation policy is set according to the actual heat dissipation requirement of the server, in this embodiment, the heat dissipation policy is a position of the control coil master 8, for example, 6 coil masters 8 are located inside the server, when performing big data calculation, since the chip 4 uses more, 3 coil masters 8 are located on the chip 4, and the hard disk 2 uses less, so the upper layer has 1 coil master 8, and therefore the memory 3 is displaced with 2 coil masters, meanwhile, the control unit 6 also stores in-place information of the server component, the in-place information indicates the position of the server component inside the server, and in-place information can be downloaded by the server network, so that the manufacturer does not need to be repeated.
The control unit 6 receives the temperature signal, controls the conduction size of the flow valve in the liquid inlet 11 of the serpentine tube 1 according to the heat dissipation strategy and the on-site information, the liquid inlet is connected with the external pump body of the server, and the pump body injects the cooling liquid into the liquid inlet, and it should be noted that the pump body is only the device capable of injecting the cooling liquid into the serpentine tube 1 in the server for more optimizing the embodiment, and the same is also within the protection scope, while the serpentine tube is only the storage capacity of the cooling water and the radiation heat exchange degree can be increased for the embodiment, so the same design principle should be included in the embodiment, and the description is omitted here for reasons of breadth.
The heat transfer module comprises a coiled pipe 1, a liquid inlet 11 and a liquid outlet 12, wherein the liquid inlet 11 is provided with a flow valve, the conduction size of the flow valve is controlled by a control unit 6, the coiled pipe 1 is clamped between a coiled pipe main pipe 8 and a server component, one side of the coiled pipe 1 is used for cooling the coiled pipe main pipe 8, the other side of the coiled pipe 1 is connected with an embedded coiled pipe 7, cooling liquid is conducted to the embedded coiled pipe 7, a sliding groove 9 is arranged on the upper part of the coiled pipe, the sliding groove 9 can enable the main pipe to slide, the sliding groove is controlled by the control unit 6, the coiled pipe is also used for cooling a copper column 5, and copper is used as a column material because the copper column 5 belongs to a good heat conductor and is not easy to corrode.
The heat radiation module comprises a copper column 5, an embedded coil pipe 7, a coil pipe main pipe 8, a sliding groove 9, an expansion clamping groove 10 and a heat preservation layer 13, wherein a plurality of coil pipe main pipes 8 are arranged in the heat preservation layer, the heat preservation layer is separated from a server component, the heat preservation layer has strong heat preservation energy, or one surface which is not contacted with the sliding groove 9 has strong heat preservation capacity, so that the heat radiation direction can aim at the server component, the coil pipe main pipe 8 has strong heat absorption and refrigeration capacity, the coil pipe main pipe 8 is connected with the sliding groove 9, the control unit 6 controls the sliding groove 9, controls the coil pipe main pipe 8 to move to the upper layer of the server component with high heat consumption, and after the temperature of the coil pipe main pipe 8 rises, the control unit controls the coil pipe main pipe 8 to the position with lower temperature in the server, and the coil pipe main pipe 8 with lower temperature is cooled through the coil pipe 1 to replace the coil pipe main pipe 8 with higher temperature.
The embedded coil 7 is arranged in the part of the high-power-consumption server, and the cooling liquid flows in the embedded coil 7, so that the temperature of the server part is reduced in two ways.
Because the in-place information of the server component of the control unit is recorded in advance, but the server possibly needs to be provided with an expansion card, one side connected with the coiled pipe 1 is provided with a copper column 5, the copper column 5 is covered on the upper part of the expansion card slot 10, when the expansion card is arranged on the expansion card slot 10, the copper column can cool the expansion card, but the cooling effect can only maintain the temporary requirement, and when the expansion card needs to be used for a long time or the in-place information of the control unit 6 needs to be updated, the coiled pipe main pipe 8 cools the expansion card, so that the better cooling effect can be ensured.
Example 2
The embodiment of the invention provides an automatic temperature control method of an embedded coil radiation type server, referring to fig. 4, comprising the following steps:
s21, when the server is powered on, the pump body is used for injecting the cooling liquid into the liquid inlet, and it should be noted that the pump body in the embodiment is not necessarily the pump body, and the device capable of injecting the cooling liquid can be included in the scope protected by the embodiment, and the cooling liquid should be cooled outside the server and lower than the temperature of the server component, and the server component includes the hard disk 2, the memory 3 and the chip 4.
S22, the thermal sensing unit acquires the temperatures of the hard disk 2, the memory 3 and the chip 4 and sends temperature signals to the control unit 6, the control unit 6 combines the internal stored heat dissipation strategy and the in-place information of the hard disk 2, the memory 3 and the chip 4, controls the coil pipe master 8 to slide on the sliding groove 9 according to the temperature signals, and the coil pipe master 8 is specified to move to the upper layers of the hard disk 2, the memory 3 and the chip 4 according to the temperature distribution conditions of the hard disk 2, the memory 3 and the chip 4, for example, 6 coil pipe master 8 are provided, when data calculation is performed, the chip 4 and the memory participate in work relatively more, and the hard disk 2 participates in work relatively less, then the upper layer of the chip 4 has 3 coil pipe masters 8, the upper layer of the memory 3 has 2 coil pipe masters 8, and the upper layer of the hard disk 2 has 1 coil pipe master 8.
S23, the control unit 6 adjusts the conduction size of a flow valve in the liquid inlet 11 according to a heat dissipation strategy, controls the flow of cooling liquid entering the server, controls the position of the coil pipe main 8 according to in-place information, controls the movement of the coil pipe main 8 in the sliding groove 9, keeps the temperature of the coil pipe main 8 in the heat preservation layer 13, and cools the server component after cooling through a coiled pipe.
S24, under the action of a pump body outside the server, the liquid outlet 12 discharges the warmed cooling liquid outside the server, a cooling liquid cooling device can be added outside the server according to requirements, and the cooling liquid is circularly injected into the liquid inlet 11 after being cooled.
The foregoing embodiment of the present invention has been disclosed with reference to the number of embodiments for the purpose of description only, and does not represent the advantages or disadvantages of the embodiments.
It will be appreciated by those of ordinary skill in the art that all or part of the steps of implementing the above embodiments may be implemented by hardware, or a program implemented by a program to instruct related hardware may be stored in a computer readable storage medium, where the storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (7)
1. An automatic temperature control system of an embedded coil radiation type server, which is characterized by comprising: the device comprises a temperature control module, a heat radiation module and a heat transfer module;
the heat transfer module is respectively connected with the temperature control module and the heat radiation module;
the temperature control module acquires temperature information of a server component, and generates control information according to the temperature information to control the heat radiation module and the heat transfer module;
the heat transfer module comprises a coiled pipe (1) and a liquid inlet (11), wherein the liquid inlet (11) is arranged at a port of the coiled pipe (1), and the coiled pipe (1) is used for cooling the heat radiation module;
the heat radiation module comprises an embedded coil pipe (7) and a coil pipe main pipe (8), wherein the embedded coil pipe (7) is connected with the coiled pipe (1) and embedded into the server component, and the coil pipe main pipe (8) exchanges heat with the coiled pipe (1) and moves to the position above the server component according to a control signal;
the temperature control module comprises a control unit (6) and a thermal sensing unit; the thermal sensing unit is applied to the server component, acquires the temperature of the server component, generates the temperature information and sends the temperature information to the control unit (6); the control unit (6) is provided with a heat dissipation strategy and on-site information of the server component, and the control unit (6) is used for converting and displaying the temperature information and controlling the displacement of the coil pipe main pipe (8) according to the heat dissipation strategy and the on-site information after acquiring the temperature information;
the heat radiation module further comprises a sliding groove (9) and an insulating layer (13); the sliding groove (9) is used for fixing the coil pipe main pipe (8), a plurality of coil pipe main pipes (8) are arranged in the heat preservation layer (13), and the heat preservation layer (13) is used for preserving heat of the coil pipe main pipes (8); the sliding groove (9) displaces the coil pipe main (8) according to the control information;
the control unit (6) controls the sliding groove (9) to control the coil pipe main pipe (8) to move to the upper layer of the server component with high heat consumption, when the temperature of the coil pipe main pipe (8) rises, the control unit (6) controls the coil pipe main pipe (8) to a position with low temperature in the server, the temperature is reduced through the coil pipe (1), and the coil pipe main pipe (8) with low temperature replaces the coil pipe main pipe (8) with high temperature.
2. The embedded coil radiant server automatic temperature control system as set forth in claim 1, wherein: the liquid inlet (11) is used for obtaining cooling liquid, the liquid inlet (11) is provided with a flow valve, and the flow valve controls the liquid inlet (11) to obtain the degree of the cooling liquid.
3. The embedded coil radiant server automatic temperature control system as set forth in claim 1, wherein: the heat radiation module further comprises a copper column (5) and an expansion clamping groove (10);
the expansion card slot (10) is used for fixing an expansion card;
the copper column (5) is fixed on the expansion clamping groove (10), the copper column (5) is connected with the coiled pipe (1), and the copper column (5) cools the expansion clamping after heat exchange with the coiled pipe (1).
4. The embedded coil radiant server automatic temperature control system as set forth in claim 2, wherein: the heat transfer module further comprises a liquid outlet (12);
the liquid outlet (12) is used for discharging the warmed cooling liquid.
5. The embedded coil radiant server automatic temperature control system as set forth in claim 1, wherein: the server component comprises a hard disk (2), a memory (3) and a chip (4).
6. A method of controlling temperature of an automatic temperature control system for an embedded coil radiation server according to any one of claims 1 to 5, comprising the steps of:
and (3) injecting a cooling liquid: when the server is electrified, cooling liquid is injected into the liquid inlet;
obtaining the temperature: the temperature control module generates a control signal according to the temperature information of the server component;
coil pipe main pipe displacement: the temperature control module controls the displacement of the coil pipe main pipe according to the in-place information and the heat dissipation strategy, and controls the conduction degree of the flow valve;
and (3) discharging the cooling liquid: and the liquid outlet discharges the warmed cooling liquid.
7. The temperature control method according to claim 6, wherein: the step of obtaining the temperature further comprises: and the temperature control module converts the temperature information into numbers and displays the numbers.
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| CN117193424B (en) * | 2023-10-18 | 2024-04-12 | 中诚华隆计算机技术有限公司 | 3D (three-dimensional) on-chip hybrid cooling control method and system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104735963A (en) * | 2015-03-31 | 2015-06-24 | 北京京东方多媒体科技有限公司 | Cooling device, work method thereof and display equipment |
| CN210630114U (en) * | 2019-07-05 | 2020-05-26 | 重庆工程学院 | Automatic cooling cloud storage server cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108337859B (en) * | 2018-02-08 | 2020-05-22 | 广东美的制冷设备有限公司 | Heat dissipation assembly, control method thereof, intelligent sound box, electronic equipment and storage medium |
| CN110471513B (en) * | 2018-05-09 | 2022-03-08 | 浙江盾安人工环境股份有限公司 | Radiator assembly, air-cooled radiator and air conditioning equipment |
| CN109683687A (en) * | 2018-12-25 | 2019-04-26 | 浪潮电子信息产业股份有限公司 | A kind of server and its control method for lowering temp, device, equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104735963A (en) * | 2015-03-31 | 2015-06-24 | 北京京东方多媒体科技有限公司 | Cooling device, work method thereof and display equipment |
| CN210630114U (en) * | 2019-07-05 | 2020-05-26 | 重庆工程学院 | Automatic cooling cloud storage server cabinet |
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