CN112936428A

CN112936428A - Automatic film pasting and die cutting process

Info

Publication number: CN112936428A
Application number: CN202110099185.6A
Authority: CN
Inventors: 赵红辉; 蔡安生; 刘炳林
Original assignee: Shenzhen Aside Technology Co ltd
Current assignee: Shenzhen Aside Technology Co ltd
Priority date: 2021-01-25
Filing date: 2021-01-25
Publication date: 2021-06-11
Anticipated expiration: 2041-01-25
Also published as: CN112936428B

Abstract

The invention relates to an automatic film-pasting and die-cutting process, which directly integrates the three processes of film pasting processing, punch forming processing and cutting of the existing finished product into three automatic integrated steps of film pasting, film cutting and punch forming, thereby omitting the reworking process after the film covering processing of the original finished product and saving the processing cost. Through using specific coolant liquid to spray the diaphragm surface before the cross cutting process, carry out reasonable cooling treatment, reduce the cross cutting temperature of diaphragm rationally, control below softening or vitrification temperature, can eliminate the stress concentration of lamella simultaneously, do benefit to going on of cross cutting process, produce deckle edge when reducing and cut, reduce the waste material rate.

Description

Automatic film pasting and die cutting process

Technical Field

The invention relates to the field of film preparation, in particular to an automatic film pasting and die cutting process.

Background

At present, with the increase of the scale of the demand for electronic consumer products, the demand for screen film products including digital products such as mobile phones, computers, and tablets is also increasing. The current film products of electronic products generally comprise a film and a substrate; the glued membrane only sets up some regions on the substrate, simultaneously because have trompil or irregular shape in the product of required pad pasting, mostly need mix with manual work in its die cutting method, its process flow: 1. compounding the base material with the strip-shaped adhesive tape; 2. stamping and forming; 3. cutting release paper; 4. and (5) manually transferring.

CN105487341A relates to a production process of a film, which is generally called a substrate-free mobile phone film, in particular to a production process of a mobile phone film, comprising the following steps of 1) adopting film production and printing according to actual requirements corresponding to the model and the size specification of a mobile phone; 2) spreading release paper, firstly printing non-setting adhesive water on the release paper, and then printing uv oil with a certain thickness on the non-setting adhesive water; 3) drying the semi-finished product in the step; 4) printing bright gold and bright silver oil on part or all of the needed pattern; 5) cutting for later use; the invention can be used for sticking mobile phones of different models on the rear surface of the mobile phone in a completely fit manner, and only needs to directly design the printing, thereby reducing the processes of cutting a knife die, die cutting, gilding, silver stamping and heat transfer printing, reducing the waste of manpower and resources and making the product more beautiful.

CN102040923A discloses a method for sticking a film on a tape-shaped adhesive tape, comprising the following steps: 1. discharging the adhesive tape; 2. pasting paper; 3. die cutting the adhesive tape; 4. attaching an opp adhesive tape; 5. pulling off the redundant part of the adhesive tape; 6. laminating the base material; 7. slitting the sheet; 8. and (5) secondary punch forming. The process of the invention overcomes the separate treatment of three steps of tape stamping, manual waste disposal and manual fitting, saves labor and saves operation time. In the prior art, the gluing and paper laminating, the tape stamping, the waste material removing and the composite base material are completed by a machine at one time; labor is reduced, the reject ratio is low, and the production efficiency is high; reduces the labor and reject ratio and has high production efficiency.

CN102040917A discloses a strip-shaped adhesive tape film pasting method, which comprises the following steps: 1. discharging the adhesive tape; 2. fixing the glue position; 3. the glue is adhered to the release paper; 4. pulling off the self-carrying paper of the adhesive; 5. laminating the base material; 6. and (6) die cutting and forming. The invention relates to a method for sticking a film on a strip-shaped adhesive tape, which overcomes the defects of the prior art. The release paper is also strip-shaped after the compound stamping of the adhesive tape (excluding liquid adhesive), and the stamping and the copying are completed at one time by utilizing a die cutting machine; the film pasting method saves materials; the labor is saved, and the one-step molding is realized; the glue position can be controlled; is convenient for customers to use.

Although an integrated film die-cutting process is developed in the prior art, the prior art has some defects, and for some films with better thermoplasticity or special material films with better toughness, such as some thermoplastic resin films or films with better toughness, such as graphene, carbon nanotubes, etc., the problems of irregular cutting edges, burr generation, waste material rate increase, etc. often occur during cutting, and additional procedures such as manual rework inspection, etc. are also needed. Therefore, it is urgently needed to provide a film-pasting die-cutting process technology with high automation degree, time saving and labor saving.

Disclosure of Invention

The invention aims to provide a film pasting and die cutting process technology which is high in automation degree, time-saving and labor-saving, and aims to solve the problems in the prior art.

In some thermoplastic film materials, a certain heating component is usually used for temperature control during film lamination for controlling the sticking effect, but if the temperature during the die cutting process is too high, the film may become sticky, i.e. the difficulty of die cutting is increased. Aiming at the problem that burrs are easily generated during die cutting in the prior art, the inventor reduces the plastic deformation capacity of the die cutting machine within a reasonable degree range before entering a die cutting process so as to facilitate the subsequent die cutting process. Meanwhile, the stress concentration degree of the diaphragm can be eliminated to a certain extent by selecting proper cooling liquid components, so that die cutting is facilitated, and the waste material rate is reduced.

Specifically, the invention provides an automatic film pasting and die cutting process, which comprises the following steps:

1) the method comprises the following steps of adhering an adhesive film layer on a base material strip, wherein the width of the adhesive film layer is controlled to be smaller than that of the base material strip, uniformly heating the adhesive film layer and the base material by using a heating member, and the heating temperature is lower than the melting temperature of an adhesive film layer material;

2) spraying cooling liquid on the base material belt after film pasting by using a high-speed spray head, wherein the cooling liquid is uniformly distributed on the adhesive film layer in a fine fog drop state;

3) carrying out die cutting operation on the base material belt subjected to cooling liquid treatment and film pasting in the step 2), and cutting the adhesive film belt into film units at equal intervals;

4) and 3), conveying the membrane unit obtained in the step 3) to a punch forming machine, adjusting the position of a punch, and ensuring that the punched membrane product falls into a groove of a die to obtain a final membrane product.

In some embodiments, the heating means of step 1) is selected as one or more of a metal roller, a metal resistance wire, or a thermocouple.

In some embodiments, the material of the adhesive film layer of step 1) comprises one or more of PU, TPU, PE, EVA, PVF, PVD, or PET.

In some embodiments, the thickness of the adhesive film layer of step 1) is 1 to 100 μm.

In some embodiments, the material of the metal substrate strip of step 1) comprises one or more of metal, plastic, resin.

In some embodiments, the size of the droplets of step 2) is controlled to be 0.1 to 10 μm.

In some embodiments, the composition of the cooling fluid of step 2) comprises 0.1 to 5 wt% triethanolamine, 1 to 10 wt% sodium or potassium hydroxide, 0.1 to 10 wt% ethylene glycol ethyl ether or butyl ether, and the balance water.

In some embodiments, the spraying speed in step 2) is controlled to be 100-500 ml/s.

Advantageous effects

Compared with the prior art, the invention has the following technical effects:

according to the invention, the specific cooling liquid is sprayed on the surface of the membrane before the die cutting process, so that the reasonable cooling treatment is carried out, the die cutting temperature of the membrane is reasonably reduced and controlled below the softening or vitrification temperature, meanwhile, the stress concentration of the sheet layer can be eliminated, the implementation of the die cutting process is facilitated, burrs generated during cutting are reduced, and the waste rate is reduced.

Detailed Description

The present invention is described in more detail below to facilitate an understanding of the present invention.

Those skilled in the art will recognize that: the chemical reactions described herein may be used to suitably prepare a number of other compounds of the invention, and other methods for preparing the compounds of the invention are considered to be within the scope of the invention. For example, the synthesis of those non-exemplified compounds according to the present invention can be successfully accomplished by those skilled in the art by modification, such as appropriate protection of interfering groups, by the use of other known reagents in addition to those described herein, or by some routine modification of reaction conditions. In addition, the reactions disclosed herein or known reaction conditions are also recognized as being applicable to the preparation of other compounds of the present invention.

In the embodiment, the die cutting machine used is a full-automatic high-speed die cutting machine F0350K, which includes one feeder, one main machine and one slicer. The host computer includes: a discharging shaft, a receiving shaft, a feeding frame, a fitting frame and the like. The punching forming machine is a common numerical control punching machine tool.

Example 1:

1) the PET film layer is adhered to the metal raw material belt, the width of the film layer is controlled to be smaller than that of the base material raw material belt, so that the resistance wire uniformly heats the film layer and the base material, and the heating temperature is lower than the melting temperature of the material of the film layer;

2) spraying cooling liquid on the base material belt after film pasting by using a high-speed spray head, wherein the cooling liquid is uniformly distributed on the PET film layer in a fog drop state with the size of less than 5 mu m; wherein the cooling liquid is water-based cooling liquid and comprises 3.0 wt% of triethanolamine, 5.0 wt% of sodium hydroxide and 6.4 wt% of ethylene glycol butyl ether;

Example 2:

1) the PU adhesive film layer is adhered to the resin raw material belt, the width of the adhesive film layer is controlled to be smaller than that of the base material raw material belt, so that the resistance wire uniformly heats the adhesive film layer and the base material raw material, and the heating temperature is lower than the melting temperature of the adhesive film layer material;

2) spraying cooling liquid on the base material belt after film pasting by using a high-speed spray head, wherein the cooling liquid is uniformly distributed on the PU adhesive film layer in a fog drop state with the size of less than 10 mu m; wherein the cooling liquid is water-based cooling liquid and comprises 6.3 wt% of triethanolamine, 6.0 wt% of sodium hydroxide and 4.3 wt% of ethylene glycol ethyl ether;

Example 3:

1) adhering an EVA (ethylene vinyl acetate) film layer on the metal raw material belt, wherein the width of the film layer is controlled to be smaller than that of the base material raw material belt, so that the resistance wire uniformly heats the film layer and the base material, and the heating temperature is lower than the melting temperature of the material of the film layer;

2) spraying cooling liquid on the base material belt after film pasting by using a high-speed spray head, wherein the cooling liquid is uniformly distributed on the EVA adhesive film layer in a fog drop state with the size of less than 4 mu m; wherein the cooling liquid is water-based cooling liquid and comprises 3.5 wt% of triethanolamine, 6.9 wt% of sodium hydroxide and 3.8 wt% of ethylene glycol butyl ether;

Example 4:

1) sticking a PVD (physical vapor deposition) film layer on the metal raw material belt, wherein the width of the film layer is controlled to be smaller than that of the base material raw material belt, so that the film layer and the base material are uniformly heated by a thermocouple, and the heating temperature is lower than the melting temperature of a material of the film layer;

2) spraying cooling liquid on the base material strip after film pasting by using a high-speed spray head, wherein the cooling liquid is uniformly distributed on the PVD glue film layer in a droplet state with the size smaller than 3 mu m; wherein the cooling liquid is water-based cooling liquid and comprises 2.0 wt% of triethanolamine, 3.7 wt% of sodium hydroxide and 2.7 wt% of ethylene glycol ethyl ether;

Example 5:

1) the PE adhesive film layer is adhered to the metal raw material belt, the width of the adhesive film layer is controlled to be smaller than that of the base material raw material belt, so that the resistance wire uniformly heats the adhesive film layer and the base material, and the heating temperature is lower than the melting temperature of the adhesive film layer material;

2) spraying cooling liquid on the base material belt after film pasting by using a high-speed spray head, wherein the cooling liquid is uniformly distributed on the PE adhesive film layer in a fog drop state with the size less than 2 mu m; wherein the cooling liquid is water-based cooling liquid and comprises 4.4 wt% of triethanolamine, 5.0 wt% of sodium hydroxide and 1.4 wt% of ethylene glycol butyl ether;

The invention sprays the specific cooling liquid on the surface of the membrane before the die cutting process to carry out reasonable cooling treatment, reasonably reduces the die cutting temperature of the membrane, reduces the plasticity of the membrane during the die cutting, simultaneously can eliminate the stress concentration of the sheet layer, is beneficial to the implementation of the die cutting process, reduces the raw edges generated during the cutting and reduces the waste material rate. The film pasting and die cutting process disclosed by the invention is high in automation degree, does not need manual operation, and can realize full automation.

The foregoing describes preferred embodiments of the present invention, but is not intended to limit the invention thereto. Modifications and variations of the embodiments disclosed herein may be made by those skilled in the art without departing from the scope and spirit of the invention.

Claims

1. An automatic film pasting and die cutting process comprises the following steps:

2. An automated film die-cutting process as claimed in claim 1, wherein the heating component of step 1) is selected from one or more of a metal roller, a metal resistance wire or a thermocouple.

3. An automated film die-cutting process according to claim 1, wherein the material of the adhesive film layer of step 1) comprises one or more of PU, TPU, PE, EVA, PVF, PVD or PET.

4. An automated film die-cutting process according to claim 1, wherein the thickness of the adhesive film layer of step 1) is 1-100 μm.

5. An automated film die-cutting process according to claim 1, wherein the material of the metal substrate strip of step 1) comprises one or more of metal, plastic and resin.

6. An automated film die cutting process according to claim 1, wherein the size of the droplets of step 2) is controlled to be 0.1-10 μm.

7. An automated film die-cutting process according to claim 1, wherein the composition of the cooling liquid of step 2) comprises 0.1-5 wt% of triethanolamine, 1-10 wt% of sodium hydroxide or potassium hydroxide, 0.1-10 wt% of ethylene glycol ethyl ether or ethylene glycol butyl ether, and the balance of water.

8. The automated film die-cutting process as claimed in claim 1, wherein in step 2), the spraying speed is controlled to be 100 ml/s and 500 ml/s.