CN112928596A - Packaging base and optical semiconductor device thereof - Google Patents
Packaging base and optical semiconductor device thereof Download PDFInfo
- Publication number
- CN112928596A CN112928596A CN202110188198.0A CN202110188198A CN112928596A CN 112928596 A CN112928596 A CN 112928596A CN 202110188198 A CN202110188198 A CN 202110188198A CN 112928596 A CN112928596 A CN 112928596A
- Authority
- CN
- China
- Prior art keywords
- input
- flat plate
- output terminal
- frame body
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The invention relates to the technical field of electronic packaging, and particularly discloses a packaging base and an optical semiconductor device thereof, wherein the packaging base comprises a substrate, a frame body, a through hole, an optical fiber fixing component, a mounting part, an input/output terminal and a lead terminal; a mounting part for mounting an optical semiconductor element is arranged on the upper surface of the substrate; the frame body is arranged on the upper surface of the substrate; the through hole is formed in one side wall of the frame body; the optical fiber fixing member is inserted and fixed on the through hole; the two mounting parts are arranged on the two side walls of the frame body respectively in a groove form; the number of the input/output terminals is two, and each input/output terminal is embedded in one mounting part; the lead terminals are connected to input/output terminals located outside the housing. The packaging base reduces the cracking possibility of the input and output terminal and ensures good air tightness of the packaging base.
Description
Technical Field
The present invention relates to the field of electronic packaging technologies, and in particular, to a package base and an optical semiconductor device thereof.
Background
In recent years, optical fiber communication data tend to be informationized and integrated, and the field of microelectronic packaging develops at a high speed; in the optical fiber communication technology, a semiconductor laser is usually used as a signal source for optical fiber communication, and an electrical signal is converted into an optical signal and transmitted; in order to guide laser light generated by a semiconductor laser into an optical fiber, the semiconductor laser needs to be coupled and packaged in a certain packaging base. The butterfly-shaped packaging base is used as a typical microelectronic multi-pin packaging form, has the characteristics of electrical communication and air tightness packaging, and is widely applied to the field of optical communication.
The frame and the substrate for mounting the tube semiconductor in the butterfly-shaped packaging base are generally made of metal materials, the input and output terminals are mainly made of ceramic materials, the thermal expansion coefficients of the two materials are not matched, excessive thermal stress is easily generated under the condition of temperature change, the ceramic body of the input and output terminals is cracked due to the excessive thermal stress, the sealing performance of the packaging base is poor, and the performance of the optical semiconductor device is affected.
Disclosure of Invention
The invention aims to provide a packaging base and an optical semiconductor device thereof, which have simple and compact structures, reduce the cracking possibility of input and output terminals and ensure good air tightness of the packaging base.
In order to solve the above technical problem, the present invention provides a package base including a substrate, a frame, a through hole, an optical fiber fixing member, a mounting portion, an input/output terminal, and a lead terminal; the substrate is provided with an upper surface and a lower surface, and the upper surface of the substrate is provided with a loading part for loading an optical semiconductor element; the frame is mounted on the upper surface of the substrate in a manner of surrounding the mounting part; the through hole is formed in one side wall of the frame body; the optical fiber fixing member is inserted and fixed on the through hole; the two mounting parts are arranged on the two side walls of the frame body respectively in a groove form; the number of the input/output terminals is two, and each input/output terminal is embedded in one mounting part and used for transmitting electric signals; the lead terminals are connected to input/output terminals located outside the housing.
Preferably, the input/output terminal has a flat plate portion and a vertical wall portion in a rectangular parallelepiped shape; wherein: the flat plate part is embedded on the mounting part, the upper surface of the flat plate part is provided with a pad electrode, and the pad electrode extends from one long side to the other long side of the upper surface of the flat plate part; a lower surface of the standing wall portion is provided at a middle position of an upper surface of the flat plate portion, and the standing wall portion crosses over the pad electrode along a longitudinal direction of the flat plate portion; the pad electrodes positioned on two sides of the vertical wall part are respectively used as external connecting ends of the pad electrodes and internal connecting ends of the pad electrodes, wherein the distance between the external connecting ends and the carrying part is larger than the distance between the internal connecting ends and the carrying part; the lead terminal is connected to the external connection terminal.
Preferably, the ratio of the width of the flat plate part to the width of the mounting part is (4-5): 1.
preferably, the package base further includes a sealing ring, and the sealing ring is disposed on an upper surface of the frame and clamps the input/output terminal with the frame.
Preferably, a ratio of the length of the mounting portion to the length of the input-output terminal is 1: (0.990-0.995).
Preferably, the mounting portion is joined to the input/output terminal by solder, and the solder at the joint of the front side surface and/or the rear side surface of the input/output terminal extends in the direction of the side surface of the input/output terminal located outside the housing and in the direction of the outer side surface of the housing to form a solder extending portion.
Preferably, the ratio of the width of the input/output terminal to the length of the solder extension is 1: (0.05-0.2).
Preferably, the input/output terminal has a flat plate portion and a vertical wall portion in a rectangular parallelepiped shape; the flat plate part is embedded on the mounting part, the lower surface of the vertical wall part is vertically arranged in the middle of the upper surface of the flat plate part, and the long side of the vertical wall part is parallel to the long side of the flat plate part; the solder extending part comprises a first extending part arranged corresponding to the flat plate part and a second extending part arranged corresponding to the vertical wall part; wherein: the ratio of the width of the flat plate part to the length of the first extending part is 1: (0.05-0.2); the ratio of the width of the standing wall part to the length of the second extension part is 1: (0.05-0.2).
Preferably, the front side and the back side of the input/output terminal are respectively provided with a metal layer.
Preferably, a nickel layer and a gold layer are formed on the surface of the metal layer by electroplating in sequence.
In order to solve the above problem, the present invention provides an optical semiconductor device including the package base described above, an optical semiconductor element disposed in the mounting portion, an optical fiber member connected to the optical fiber fixing member, and a lid body covering an upper surface of the housing.
The invention has the following beneficial effects:
the packaging base is convenient to produce, reduces the production cost and improves the production efficiency by adopting the splicing mode of all parts, the installation part is arranged on the frame body, the input and output terminals are fixed in the installation part in an embedding mode, namely, the maintenance and the replacement of the input and output terminals are convenient, a proper gap is formed between the input and output terminals and the frame body, the phenomenon that the thermal stress of the packaging base is overlarge due to the fact that the thermal expansion coefficients of the input and output terminals and the frame body are not matched is relieved, the cracking possibility of the input and output terminals is reduced, and the good air tightness of the packaging base is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a package base according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a frame structure of a package base according to an embodiment of the present invention;
fig. 3 is a schematic diagram of an input/output terminal structure of a package base according to an embodiment of the invention;
FIG. 4 is a top view of a package base provided by an embodiment of the present invention;
FIG. 5 is an enlarged view at H of FIG. 4;
FIG. 6 is a schematic view of another angle of the package base according to the embodiment of the present invention;
fig. 7 is an enlarged view at I of fig. 6.
Reference numerals: 1. a substrate; 2. a frame body; 201. a front side wall; 202. a left side wall; 203. a right side wall; 3. a through hole; 4. an optical fiber fixing member; 5. an installation part; 6. an input/output terminal; 601. a flat plate portion; 602. a standing wall portion; 603. a pad electrode; 604. a first extension portion; 605. a second extension portion; 7. a wire terminal; 8. and (5) sealing rings.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Referring to fig. 1 and 2, a preferred embodiment of the present invention provides a package base including a substrate 1, a frame 2, a through-hole 3, an optical fiber fixing member 4, a mounting portion 5, an input-output terminal 6, and a lead terminal 7; the substrate 1 has an upper surface and a lower surface, and a mounting portion for mounting an optical semiconductor element is arranged on the upper surface of the substrate 1; the frame body 2 is mounted on the upper surface of the substrate 1 so as to surround the mounting portion; the through hole 3 is formed in one side wall of the frame body 2; the optical fiber fixing member 4 is inserted and fixed on the through hole 3; two mounting parts 5 are arranged, and the two mounting parts 5 are respectively arranged on two side walls of the frame body 2 in a groove form; the number of the input/output terminals 6 is two, and each input/output terminal 6 is embedded in one of the mounting parts 5 and used for transmitting an electrical signal; the lead terminal 7 is connected to an input/output terminal 6 located outside the housing 2.
Based on the above scheme, the assembly method of the package base of the preferred embodiment of the present invention: soldering the frame 2 to the substrate 1 with solder so as to surround the mounting portion, thereby forming a semiconductor element accommodating chamber; the optical fiber fixing piece is brazed in the through hole 3 of the frame body 2 through solder; the lead terminal 7 is soldered to the land electrode 603, and the input/output terminal 6 is soldered to the mounting portion 5 of the housing 2.
Referring to fig. 3, the input/output terminal 6 preferably has a flat plate portion 601 having a rectangular parallelepiped shape and a vertical wall portion 602; wherein: the flat plate part 601 is embedded on the mounting part 5, the upper surface of the flat plate part 601 is provided with a pad electrode 603, and the pad electrode 603 extends from one long side to the other long side of the upper surface of the flat plate part 601; a lower surface of the standing wall portion 602 is provided at an intermediate position of an upper surface of the flat plate portion 601, and the standing wall portion 602 crosses over the pad electrode 603 along a longitudinal direction of the flat plate portion 601; the pad electrodes 603 positioned on both sides of the standing wall portion 602 serve as external connection terminals of the pad electrodes 603 and internal connection terminals of the pad electrodes 603, respectively, wherein the distance between the external connection terminals and the mounting portion is larger than the distance between the internal connection terminals and the mounting portion; the guide terminal is connected to the external connection terminal.
Specifically, with the flat plate portion 601 and the upright wall portion 602, the stress of the input/output terminal 6 can be dispersed, the overall stability of the input/output terminal 6 can be ensured, and the possibility of cracking can be reduced.
Preferably, the ratio of the width a of the flat plate portion 601 to the width b of the mounting portion 5 is (4-5): 1.
specifically, if the ratio of the width a of the flat plate portion 601 to the width b of the mounting portion 5 is too small, the sealing surface is too small, the solder is too much accumulated, the thermal expansion coefficient of the solder is poor in matching with the porcelain, and the porcelain is easily cracked when a reliability test is performed;
if the ratio of the two is too large, the sealing surface becomes too large and the stress is reduced, but the position becomes too large and the device mounting region mounting portion becomes small, which is disadvantageous in mounting the semiconductor element.
Preferably, the package base further includes a gasket 8, and the gasket 8 is disposed on an upper surface of the housing 2 and sandwiches the input/output terminal 6 with the housing 2. Specifically, the seal ring 8 is soldered to the upper surface of the housing 2 by solder, and the input/output terminal 6 is sandwiched between the seal ring 8 and the housing 2, thereby ensuring the sealing property in the housing 2.
Preferably, a ratio of the length c of the mounting portion 5 to the length d of the input/output terminal 6 is 1: (0.990-0.995).
Specifically, if the ratio of the length c of the mounting portion 5 to the length d of the input-output terminal 6 is greater than 1: 0.990, the gap between the input/output terminal 6 and the side wall of the mounting portion 5 is too large, and the amount of solder filled is large. When the packaging base is impacted by high temperature, the difference of the expansion amount of the solder and the metal frame body 2/the ceramic input/output terminal 6 is large, and the ceramic piece is easy to crack due to thermal stress;
if the ratio of the length c of the mounting portion 5 to the length d of the input-output terminal 6 is less than 1: 0.995, the gap between the input/output terminal 6 and the side wall of the mounting portion 5 is too small, so that the assembly of the input/output terminal 6 and the housing 2 is limited, and mechanical cracking is likely to occur during the operation.
Referring to fig. 4 to 7, preferably, the mounting portion 5 is joined to the input/output terminal 6 by solder, and the solder at the joint of the front side surface and/or the rear side surface of the input/output terminal extends in the direction of the side surface of the input/output terminal 6 located outside the housing 2 and in the direction of the outer side surface of the housing 2 to form solder extending portions.
Specifically, the solder extension portion can prevent cold joint from occurring between the mounting portion 5 and the input/output terminal 6, and ensure the airtightness of the package base.
Preferably, the ratio of the width of the input/output terminal 6 to the length of the solder extension is 1: (0.05-0.2). Specifically, if the ratio of the width of the input-output terminal 6 to the length of the solder extension is greater than 1: 0.05, the solder is not sufficiently infiltrated, the strength of a welding joint is reduced, a virtual welding layer is easily formed, and the welding strength is not sufficient, so that the air tightness is poor;
if the ratio of the width of the input-output terminal 6 to the length of the solder extension is less than 1: 0.2, the solder is excessively deposited, the size of the extending portion of the solder is excessively large, the package base receives high-temperature impact, and the ceramic body of the input/output terminal 6 is likely to generate micro-cracks at the position where the flat plate portion 601 and the standing wall portion 602 are joined due to the action of thermal stress, and the micro-cracks extend to cause a problem of poor air tightness of the package base.
Preferably, the input/output terminal 6 includes a flat plate portion 601 having a rectangular parallelepiped shape and a vertical wall portion 602; the flat plate portion 601 is embedded in the mounting portion 5, the lower surface of the standing wall portion 602 is vertically arranged at the middle position of the upper surface of the flat plate portion 601, and the long side of the standing wall portion 602 is parallel to the long side of the flat plate portion 601; the solder extending part comprises a first extending part 604 arranged corresponding to the flat plate part 601 and a second extending part 605 arranged corresponding to the vertical wall part 602; wherein: the ratio of the width a of the flat plate portion 601 to the length e of the first extending portion 604 is 1: (0.05-0.2); the ratio of the width f of the standing wall portion 602 to the length g of the second extension 605 is 1: (0.05-0.2).
Specifically, if the ratio of the width a of the flat plate portion 601 to the length e of the first extending portion 604 is greater than 1: 0.05, the solder is not sufficiently infiltrated, the strength of a welding joint is reduced, a virtual welding layer is easily formed, and the welding strength is not sufficient, so that the air tightness is poor;
if the ratio of the width a of the flat plate portion 601 to the length e of the first extension 604 is less than 1: 0.2, the solder is excessively accumulated, the size of the extending part of the solder is excessively large, the packaging base is impacted by high temperature, the ceramic body of the input/output terminal 6 is easy to generate micro-cracks at the joint position of the flat plate part 601 and the vertical wall part 602 due to the action of thermal stress, and the problem of poor air tightness of the packaging base is caused after the micro-cracks extend;
the relationship between the standing wall 602 and the second extending portion 605 is similar to that between the flat plate 601 and the first extending portion 604.
Preferably, the through hole 3 is provided in the front wall 201 of the frame 2; the mounting portions 5 are symmetrically provided on the left side wall 202 and the right side wall 203 of the frame body 2.
Preferably, the input/output terminal 6 has metal layers on a front side and a rear side thereof, respectively.
Preferably, a nickel layer and a gold layer are formed on the surface of the metal layer by electroplating in sequence.
Preferably, a metal layer is formed on the lower surface of the flat plate portion 601 and the upper surface of the upright wall portion 602.
Preferably, the through-hole 3 is provided in the front wall 201 of the frame 2; the mounting portions 5 are symmetrically provided on the left and right side walls of the frame body 2.
Preferably, a nickel layer and a gold layer are formed on the surface of the pad electrode 603 by electroplating in sequence.
Specifically, the materials of each part of the preferred embodiment of the present invention are shown in table one:
| |
Kovar alloys (iron cobalt nickel alloys), or copper-tungsten |
| Frame body | |
| 2 | Kovar alloys (iron cobalt nickel alloys), or copper-tungsten alloys |
| Optical |
Kovar alloys (iron cobalt nickel alloys), or copper-tungsten alloys |
| |
Selected from dielectric materials such as aluminum oxide, aluminum nitride, mullite, etc |
| |
Selected from dielectric materials such as aluminum oxide, aluminum nitride, mullite, etc |
| |
Selected from tungsten or |
| Conductor terminal | |
| 7 | Kovar alloys (iron cobalt nickel alloys), or copper-tungsten |
| Sealing ring | |
| 8 | Kovar alloys (iron cobalt nickel alloys), or copper-tungsten alloys |
| Solder | Silver solder or silver copper solder |
| Metal layer | Selected from tungsten or molybdenum or manganese |
A preferred embodiment of the present invention also provides an optical semiconductor device including the package base described above, an optical semiconductor element disposed in the mounting portion, an optical fiber member connected to the optical fiber fixing member, and a lid body covering the upper surface of the housing 2.
Based on the scheme, the index test is carried out on the packaging base, and the method specifically comprises the following steps:
testing indexes are as follows: air tightness;
the test method comprises the following steps: sealing and welding the cover body on the packaging base, performing a helium pressure experiment for 2 hours under 0.5Mpa, and detecting the gas leakage condition by using a helium leakage tester; when the detection result is less than 1 & lt10 & gt-9 Pa.m & lt 3 & gt/s, the product is qualified.
The test results are shown in table two:
watch two
From the test results in table two, it can be seen that when the ratio of the length of the input/output terminal 6 to the length of the mounting portion 5 is (0.990-0.995): 1. the ratio of the extending length of the solder extending part to the width of the vertical wall is (0.05-0.2): 1, the air tightness of the packaging base is stable and reliable.
The assembly process of the invention is as follows: soldering the frame 2 to the substrate 1 with solder so as to surround the mounting portion, thereby forming a semiconductor element accommodating chamber; the optical fiber fixing piece is brazed in the through hole 3 of the frame body 2 through solder; the lead terminal 7 is soldered to the land electrode 603, and the input/output terminal 6 is soldered to the mounting portion 5 of the housing 2.
In summary, the preferred embodiment of the present invention provides a package base, which is compared with the prior art:
the packaging base is spliced by all parts, so that the production of the base is facilitated, the production cost is reduced, the production efficiency is improved, the installation part 5 is arranged on the frame body 2, the input and output terminal 6 is fixed in the installation part 5 in an embedded mode, the maintenance and the replacement of the input and output terminal 6 are facilitated, a proper gap is formed between the input and output terminal 6 and the frame body 2, the phenomenon that the thermal stress of the packaging base is overlarge due to the fact that the thermal expansion coefficients of the input and output terminal 6 and the frame body 2 are not matched is relieved, the cracking possibility of the input and output terminal 6 is reduced, and the good air tightness of the packaging base is guaranteed.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A package base, comprising: the method comprises the following steps:
a substrate having an upper surface and a lower surface, the upper surface of the substrate being provided with a mounting portion for mounting an optical semiconductor element;
a frame body mounted on an upper surface of the substrate so as to surround a mounting portion;
the through hole is formed in one side wall of the frame body;
an optical fiber fixing member inserted and fixed to the through hole;
the two mounting parts are arranged on the two side walls of the frame body respectively in a groove form;
the input and output terminals are arranged in two numbers, and each input and output terminal is embedded in one mounting part and used for transmitting electric signals;
and the lead terminal is connected with the input and output terminal positioned outside the frame body.
2. The package base of claim 1, wherein: the input/output terminal has a flat plate portion and a vertical wall portion in a rectangular parallelepiped shape; wherein:
the flat plate part is embedded on the mounting part, the upper surface of the flat plate part is provided with a pad electrode, and the pad electrode extends from one long side to the other long side of the upper surface of the flat plate part;
a lower surface of the standing wall portion is provided at a middle position of an upper surface of the flat plate portion, and the standing wall portion crosses over the pad electrode along a longitudinal direction of the flat plate portion; the pad electrodes positioned on two sides of the vertical wall part are respectively used as external connecting ends of the pad electrodes and internal connecting ends of the pad electrodes, wherein the distance between the external connecting ends and the carrying part is larger than the distance between the internal connecting ends and the carrying part; the lead terminal is connected to the external connection terminal.
3. The package base of claim 2, wherein: the ratio of the width of the flat plate part to the width of the mounting part is (4-5): 1.
4. the package base of claim 1, wherein: the packaging base further comprises a sealing ring, the sealing ring is arranged on the upper surface of the frame body, and the sealing ring and the frame body clamp the input and output terminals.
5. The package base of claim 1, wherein: the ratio of the length of the mounting part to the length of the input/output terminal is 1: (0.990-0.995).
6. The package base of claim 1, wherein: the mounting part is jointed with the input/output terminal through solder, and the solder at the joint of the front side surface and/or the back side surface of the input/output terminal respectively extends towards the side surface direction of the input/output terminal outside the frame body and the outer side surface direction of the frame body to form a solder extension part.
7. The package base of claim 6, wherein: the ratio of the width of the input/output terminal to the length of the solder extension part is 1: (0.05-0.2).
8. The package base of claim 6, wherein: the input/output terminal has a flat plate portion and a vertical wall portion in a rectangular parallelepiped shape; the flat plate part is embedded on the mounting part, the lower surface of the vertical wall part is vertically arranged in the middle of the upper surface of the flat plate part, and the long side of the vertical wall part is parallel to the long side of the flat plate part; the solder extending part comprises a first extending part arranged corresponding to the flat plate part and a second extending part arranged corresponding to the vertical wall part; wherein:
the ratio of the width of the flat plate part to the length of the first extending part is 1: (0.05-0.2);
the ratio of the width of the standing wall part to the length of the second extension part is 1: (0.05-0.2).
9. The package base of claim 1, wherein: and metal layers are respectively arranged on the front side surface and the back side surface of the input/output terminal.
10. An optical semiconductor device, characterized in that: the package base according to any one of claims 1 to 9, an optical semiconductor element provided in the mounting portion, an optical fiber member connected to the optical fiber fixing member, and a lid body provided on an upper surface of the frame body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110188198.0A CN112928596A (en) | 2021-02-18 | 2021-02-18 | Packaging base and optical semiconductor device thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110188198.0A CN112928596A (en) | 2021-02-18 | 2021-02-18 | Packaging base and optical semiconductor device thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112928596A true CN112928596A (en) | 2021-06-08 |
Family
ID=76169854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110188198.0A Pending CN112928596A (en) | 2021-02-18 | 2021-02-18 | Packaging base and optical semiconductor device thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112928596A (en) |
-
2021
- 2021-02-18 CN CN202110188198.0A patent/CN112928596A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8008980B2 (en) | Surface mount type crystal oscillator | |
| CN112202046B (en) | Novel TO packaging structure | |
| JPH0364048A (en) | Package | |
| CN112072375A (en) | Micro-rectangular multi-core connector with air seal and manufacturing method thereof | |
| JPH1174396A (en) | Input/output terminal for high frequency and package for housing semiconductor element for high frequency | |
| CN214411758U (en) | Packaging base and optical semiconductor device thereof | |
| US11994440B2 (en) | High temperature protected wire bonded sensors | |
| CN112928596A (en) | Packaging base and optical semiconductor device thereof | |
| JP2000340876A (en) | Optical semiconductor element package and manufacture thereof | |
| US20040131318A1 (en) | Optical element housing package and optical module | |
| JP3145274B2 (en) | Pressure sensor | |
| JP4219524B2 (en) | Package for semiconductor devices | |
| CN213240598U (en) | Small-volume light emitting assembly and multichannel parallel optical device | |
| JP3555366B2 (en) | Manufacturing method of pressure sensor | |
| JP2004356391A (en) | Package for encasing semiconductor element and semiconductor device | |
| US6883978B2 (en) | Low cost package design for fiber coupled optical component | |
| JP3993774B2 (en) | Optical semiconductor element storage package | |
| CN115764535A (en) | Miniaturized high-reliability direct modulation laser packaging structure and packaging method | |
| KR20030004030A (en) | Hermetically sealing enclosure for housing photo-semiconductor devices and photo-semiconductor module incorporating the enclosure | |
| JP2002313973A (en) | Package for optical communication | |
| JP4142928B2 (en) | Optical semiconductor element storage package and optical semiconductor device | |
| JP4824063B2 (en) | Package for semiconductor devices | |
| JP2005217093A (en) | Storage package for photo-semiconductor element | |
| JP2003068903A (en) | Package for semiconductor element storage and semiconductor device | |
| JP3456805B2 (en) | Package for surface acoustic wave device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |