CN112911798B - Motherboard structure and electronic equipment - Google Patents
Motherboard structure and electronic equipment Download PDFInfo
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- CN112911798B CN112911798B CN202110065759.8A CN202110065759A CN112911798B CN 112911798 B CN112911798 B CN 112911798B CN 202110065759 A CN202110065759 A CN 202110065759A CN 112911798 B CN112911798 B CN 112911798B
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- main board
- component
- board body
- support column
- glue
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Casings For Electric Apparatus (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The application discloses a main board structure and electronic equipment, wherein the main board structure comprises a main board body, a support column, a first component and fixing glue; the surface of the main board body is provided with a support column; the first component is fixed at one end of the support column far away from the main board body, and is electrically connected with the main board body through the support column; the fixing glue is arranged on the main board body and coats the periphery of the support column. The mainboard structure and the electronic equipment that this application provided, structural design is reasonable, fixes first components on the mainboard body through the support column, not only is showing the fixed knot of reducing components constructs the occupation of mainboard space, is convenient for arrange components more nimble on the mainboard moreover.
Description
Technical Field
The application belongs to the communication field, and in particular relates to a main board structure and electronic equipment.
Background
With more and more functions and more powerful performances of electronic devices, more and more components are integrated on a main board of the electronic device, wherein the electronic device is a mobile phone, a tablet computer and the like.
In order to meet the requirements of light and thin electronic equipment and the flexibility of the internal structural design of the electronic equipment, more components are required to be integrated on a motherboard with a smaller area.
At present, a main board is arranged on a main board, a subsidiary board is stacked on the main board, and then components are arranged on the subsidiary board, so that the layout area of the components of the main board is increased. However, the above-described method has the following drawbacks: firstly, the frame plate and the auxiliary plate occupy larger space in the electronic equipment, which is not beneficial to the internal layout of the electronic equipment and does not meet the requirements of lightening and thinning of the electronic equipment; secondly, the size of the frame plate and the size of the auxiliary plate are relatively large, layout is not easy to carry out on the main plate with a small area, and the flexibility of application is poor.
Disclosure of Invention
An objective of the embodiments of the present application is to provide a motherboard structure and an electronic device, which at least solve one of the problems of the background art.
In order to solve the technical problems, the application is realized as follows:
in a first aspect, an embodiment of the present application provides a motherboard structure, including:
the main board comprises a main board body and supporting columns, wherein the supporting columns are arranged on the surface of the main board body;
the first component is fixed at one end, far away from the main board body, of the supporting column and is electrically connected with the main board body through the supporting column;
and the fixing glue is arranged on the main board body and coats the periphery of the support column.
In a second aspect, an embodiment of the present application provides an electronic device, where the electronic device includes the above-mentioned motherboard structure.
In this embodiment of the application, first components pass through the support column to be fixed on the mainboard body, and the support column can show the occupation of reduction first components's fixed knot structure to electronic equipment inner space, is favorable to electronic equipment's internal layout, accords with electronic equipment's requirement of frivolous. Meanwhile, the support column is small in structure and convenient to lay out on the main board with smaller area, so that the first component is fixed, and the application flexibility is good.
In addition, the support column occupies smaller space when fixing the first component, and other components can be fixed on the main board below the first component, so that the number of component integration on the main board is increased, and the main board structure is convenient to further optimize.
Drawings
Fig. 1 is a schematic view of a first motherboard structure provided in the present application;
FIG. 2 is a top view of the motherboard structure provided herein;
fig. 3 is a schematic view of a motherboard body of the motherboard structure provided in the present application;
fig. 4 is a schematic diagram of a first component of the motherboard structure provided in the present application;
fig. 5 is a schematic view of a second motherboard structure provided in the present application;
fig. 6 is a schematic view of a third motherboard structure provided in the present application;
fig. 7 is a schematic view of a fourth motherboard structure provided in the present application;
in the figure: 1. a main board body; 11. a first bonding pad; 12. a third bonding pad; 2. a support column; 21. welding spots; 3. a first component; 31. a second bonding pad; 4. fixing glue; 41. a cofferdam glue; 42. encapsulating glue; 5. and a second component.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The motherboard structure and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 7, the present embodiment provides a motherboard structure, which can be applied to a mobile phone, a tablet computer, and electronic devices such as a notebook computer and a palm computer.
Specifically, the main board structure comprises a main board body 1, a support column 2, a first component 3 and a fixing adhesive 4. Wherein, the surface of mainboard body 1 is provided with support column 2, and support column 2 is used for supporting first components 3, simultaneously, support column 2 still is used for connecting first support piece and mainboard body 1 to realize that first support piece is connected with the electricity of mainboard body 1. The first component 3 is fixed at one end of the support column 2 far away from the main board body 1, and the first component 3 is electrically connected with the main board body through the support column 2, so that the first component 3 can be fixed on the main board body 1 through the support column 2.
As shown in fig. 1, referring to fig. 5 to 7, the fixing glue 4 is disposed on the main board body 1 and covers the periphery of the support column 2, and the fixing glue 4 can firmly fix the support column 2 on the main board body 1 to better protect the support column 2 and effectively prevent the support column 2 from being damaged in environments such as falling and vibration. The fixing glue 4 has the function of insulation, and can prevent other components arranged on the main board body 1 from being conducted with the support column 2, so that the stability of connection between the first component 3 and the main board body 1 is ensured.
In this embodiment, the support columns 2 are made of conductive materials, so as to realize conduction between the first component 3 and the main board body 1. The shape and the size of the support column 2 can be selected according to the requirements of the main board body 1 and the first component 3, and the thickness and the height of the fixing glue 4 can also be selected according to the height of the first component 3, so that the first component 3 can be flexibly fixed on the main board body 1, and the space of the main board body 1 is fully utilized, thereby better optimizing the main board structure.
In addition, the support column 2 makes the connection distance between the main board body 1 and the first component 3 shorter to ensure that the main board body 1 and the first component 3 have better electrical connection performance, and the support column 2 occupies smaller layout area of the main board, so that the support column 2 for fixing the first component 3 can be laid out even on the main board body 1 with smaller area or even on the main board body 1 with irregular shape. This makes the layout of components on the main board body 1 more flexible, and the space utilization of the main board body 1 is higher.
In the main board structure provided by the embodiment, the first component 3 is fixed on the main board body 1 through the support column 2, the support column 2 can obviously reduce the occupation of the fixed structure of the first component 3 to the internal space of the electronic equipment, the internal layout of the electronic equipment is facilitated, and the requirements of lightening and thinning of the electronic equipment are met. Meanwhile, the support column 2 is small in structure and convenient to lay out on a main board with a smaller area, so that the first component 3 is fixed, and the application flexibility is good.
In addition, the space occupied by the support column 2 when the first component 3 is fixed is smaller, and other components can be fixed on the main board below the first component 3, so that the number of component integration on the main board is increased, and the main board structure is convenient to further optimize.
Alternatively, as shown in fig. 3 and 4, the main board body 1 is provided with a first bonding pad 11, the first component 3 is provided with a second bonding pad 31, and two ends of the support column 2 are respectively provided with a welding spot 21.
The first bonding pad 11 is welded with the welding spot 21 at one end of the support column 2, and the second bonding pad 31 is welded with the welding spot 21 at the other end of the support column 2.
The solder joints 21 on the support columns 2 are formed by dispensing solder paste by a spray dispenser, wherein the solder paste can be high Wen Xigao or low-temperature solder paste.
Through with support column 2 welding on mainboard body 1, then with first components 3 welding on support column 2, not only effectively simplify the connected mode of support column 2 and mainboard body 1 and first components 3 and support column 2, the stability of connection is better moreover, also is convenient for realize the electricity between first components 3 and the mainboard body 1 simultaneously and is connected.
As shown in fig. 3, a third pad 12 is further provided on the main board body 1, and the third pad 12 is surrounded by a plurality of first pads 11. The third bonding pad 12 is used for soldering other components on the main board body 1.
Optionally, the main board structure includes a plurality of support columns 2, one ends of the support columns 2 are welded to the main board body 1, the other ends of the support columns are welded to the first component 3, and the support columns 2 are located on the periphery of the surface of the first component 3, which is close to the main board body 1.
The first component 3 can be firmly fixed to the main board body 1 by the plurality of support columns 2. Moreover, the support columns 2 are located at the periphery of the first component 3, which is close to the main board body 1, so that an accommodating space is formed between the first component 3 and the main board body 1, and other components can be arranged in the accommodating space, so that the number of layout of the components on the main board body 1 is increased, and the structure of the main board is optimized.
Optionally, referring to fig. 1, the fixing glue 4 includes a dam glue 41 and an encapsulation glue 42, the dam glue 41 is closed on the main board body 1, and the encapsulation glue 42 is located in a filling area surrounded by the dam glue 41, and the periphery of the support column 2 is covered by the encapsulation glue 42.
Wherein, the cofferdam glue 41 and the encapsulation glue 42 are arranged on the main board body 1 by a spot coating mode. Since the viscosity of the cofferdam glue 41 is very high, a stable dispensing height can be formed to precisely control the height of the support column 2 wrapped by the fixing glue 4, and meanwhile, since the flowability of the encapsulation glue 42 is very good, the encapsulation glue can well fill the filling area surrounded by the cofferdam glue 41 and well combine with the cofferdam glue 41. Therefore, the support columns 2 can be well wrapped by the encapsulation adhesive 42, so that the support columns 2 can be firmly fixed on the main board body 1.
In addition, the upper surface of the encapsulation adhesive 42 can be flattened by flowing, so that the main board structure is ensured to have a good appearance.
Optionally, the motherboard structure further comprises a second component 5. The second component 5 is welded to the main board body 1, the second component 5 and the first component 3 are located on the same side of the main board body 1, and the first component 3 covers the second component 5.
Because the first component 3 is fixed on the main board body 1 through the support column 2, a containing space is easily formed between the first component 3 and the main board, and the second component 5 positioned in the containing space can be directly welded on the main board, so that the number of components laid out on the main board body 1 is increased better, and the main board structure is also convenient to optimize.
Optionally, as shown in fig. 1, the second component 5 is located in the filling area, and the fixing glue 4 coats the outer surface of the second component 5. The fixing glue 4 can firmly fix the second component 5 on the main board body 1 and can realize insulation between the first component 3 and the second component 5, so that the stability of the functions of the first component 3 and the second component 5 is ensured, and the structure of the main board structure is more stable.
Optionally, as shown in fig. 5, the second component 5 is located in the filling area, and a height from the top surface of the second component 5 to the main board body 1 is greater than a height from the top surface of the fixing glue 4 to the main board body 1. The fixing adhesive 4 does not completely cover the second component 5, so that the second component 5 can be conveniently realized as a surface acoustic wave filter or the like.
Optionally, the second component 5 is located outside the filling area. As shown in fig. 6, a certain distance is reserved between the cofferdam glue 41 and the second component 5; as shown in fig. 7, the second component 5 is in contact with the dam glue 41. Both embodiments form cavities in the vicinity of the second component 5 to meet the requirements of components with cavities such as surface acoustic wave filters (i.e. SAW, surface acoustic wave) or surface acoustic wave filters (i.e. BAW, bulk acoustic wave) etc., thereby increasing the variety of components fixed on the main board body 1 and further increasing the application range of the main board structure.
Optionally, referring to fig. 7, the height of the top surface of the fixing glue 4 from the main board body 1 is smaller than the height of the top surface of the support column 2 from the main board body 1. The upper part of the support column 2 is not covered by the fixing glue 4, which makes it easy to form a solder joint 21 on top of the support column 2, thereby soldering the first component 3 to the support column 2. In addition, because the floating height of the welding spot 21 at the top of the support column 2 is often lower, the top of the support column 2 is not covered by the fixing glue 4, the capability of releasing environmental stress of the welding spot 21 at the leading-out end of the first component 3 is improved, and therefore the stability and reliability of welding the first component 3 and the support column 2 are improved.
Alternatively, the shape of the support column 2 may be a cylinder or the shape of the support column 2 may be a cuboid, which makes the structure of the support column 2 simple and easy to process.
In another embodiment, grooves are provided in the side walls of the support columns 2 to form the support columns 2 in the shape of a profile. The support column 2 with the shape of the special body reduces the stress between the first component 3 and the main board body 1, thereby improving the stability of the connection between the first component 3 and the main board body 1.
Optionally, the support column 2 is made of copper. Copper belongs to a conductive material with small resistivity, and the supporting column 2 made of copper can well realize the electric connection between the first component 3 and the main board body 1.
In addition, the support column 2 made of copper is convenient to process, can be processed into different shapes according to the requirements of the main board body 1 and the first component 3, and has higher application flexibility.
The embodiment also provides electronic equipment, which comprises the main board structure. The electronic equipment with the main board structure is lighter and thinner in appearance. Because more components can be laid out on the main board, and the layout structure is more reasonable, the functions of the electronic equipment are more powerful.
The processing procedure of the main board structure of this embodiment is as follows:
firstly, printing solder paste on the main board body 1 to form a first bonding pad 11 and a third bonding pad 12;
second, the second component 5 is fixed on the main board body 1 through a third bonding pad 12;
thirdly, the support column 2 is fixed on the main board body 1 through the first bonding pad 11;
fourthly, dispensing a cofferdam adhesive 41 on the periphery of the support column 2, and then dispensing an encapsulation adhesive 42 on the inner side of the cofferdam adhesive 41;
fifth, solder paste is applied to the top of the support column 2 to form a solder joint, and the first component 3 is soldered to the support column 2 through the solder joint.
The mainboard structure and the electronic equipment that this embodiment provided, structural design is reasonable, fixes first components 3 on mainboard body 1 through support column 2, not only is showing the fixed knot of reduction components constructs the occupation of mainboard space, is convenient for arrange components more nimble on the mainboard moreover.
In addition, the first component 3 is fixed on the main board body 1 through the support column 2, so that the cost of the main board structure can be further reduced, and the cost performance of the electronic equipment can be better improved.
The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those of ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are also within the protection of the present application.
Claims (8)
1. A motherboard structure, comprising:
the main board comprises a main board body and supporting columns, wherein a plurality of supporting columns are arranged on the surface of the main board body;
the first component is fixed at one ends of the support columns far away from the main board body, the first component is electrically connected with the main board body through the support columns, the support columns support the first component, and the support columns are all positioned on the periphery of the surface of the first component, which is close to the main board body, so that an accommodating space is formed between the first component and the main board body;
the second component is positioned in the accommodating space, welded to the main board body, positioned on the same side of the main board body, and covered by the first component;
the fixing glue is arranged on the main board body and coats the periphery of the support column;
the fixing glue comprises cofferdam glue and encapsulation glue, the main board body is provided with the closed cofferdam glue and the encapsulation glue positioned in a filling area surrounded by the cofferdam glue, and the second component is a surface acoustic wave filter or a surface acoustic wave filter;
when the second component is positioned in the filling area, the height from the top surface of the second component to the main board body is larger than the height from the top surface of the fixing glue to the main board body;
and under the condition that the second component is positioned outside the filling area, a cavity is formed between the second component and the fixing glue.
2. The main board structure according to claim 1, wherein the main board body is provided with a first bonding pad, the first component is provided with a second bonding pad, and both ends of the support column are respectively provided with welding spots;
the first bonding pad is welded with a welding spot at one end of the supporting column, and the second bonding pad is welded with a welding spot at the other end of the supporting column.
3. The motherboard structure of claim 1, wherein a plurality of said support posts are each welded at one end to said motherboard body and at the other end to said first component.
4. The motherboard structure of claim 1, wherein the outer perimeter of the support post is covered by the encapsulation glue.
5. The motherboard structure of claim 4, wherein said second component is located within said fill area and said fixing glue encapsulates an outer surface of said second component.
6. The motherboard structure of claim 1, wherein a height of a top surface of the fixing glue from the motherboard body is less than a height of a top surface of the support post from the motherboard body.
7. The motherboard structure of claim 1, wherein said support posts are copper.
8. An electronic device, characterized in that it comprises a motherboard structure according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110065759.8A CN112911798B (en) | 2021-01-18 | 2021-01-18 | Motherboard structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110065759.8A CN112911798B (en) | 2021-01-18 | 2021-01-18 | Motherboard structure and electronic equipment |
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| CN112911798A CN112911798A (en) | 2021-06-04 |
| CN112911798B true CN112911798B (en) | 2023-04-25 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210607223U (en) * | 2019-09-17 | 2020-05-22 | 苏州捷研芯电子科技有限公司 | Packaging structure suitable for SAW/BAW filter |
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| JP2001085815A (en) * | 1999-09-17 | 2001-03-30 | Tdk Corp | Surface mounted module parts |
| TWI411075B (en) * | 2010-03-22 | 2013-10-01 | Advanced Semiconductor Eng | Semiconductor package and manufacturing method thereof |
| JP2020512688A (en) * | 2017-03-09 | 2020-04-23 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | Consumer electronics mainboards and terminals |
| CN208402122U (en) * | 2018-06-22 | 2019-01-18 | Oppo广东移动通信有限公司 | A kind of terminal of microphone device and integrated microphone device |
| CN110335859B (en) * | 2019-07-29 | 2024-04-05 | 上海先方半导体有限公司 | Multi-chip packaging structure based on TSV and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN210607223U (en) * | 2019-09-17 | 2020-05-22 | 苏州捷研芯电子科技有限公司 | Packaging structure suitable for SAW/BAW filter |
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